Congatec COM Express conga-TCA3 User manual

Copyright © 2014 congatec AG TA30m16 1/95
COM Express™ conga-TCA3
3rd Generation Intel®Atom™ and Intel®Celeron®SoC
User's Guide
Revision 1.6

Copyright © 2014 congatec AG TA30m16 2/95
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2014-01-09 AEM •Preliminary release
0.2 2014-07-04 AEM •Deleted the variant equipped with Intel Celeron N2920 (PN: 047306) from sections 1, 2.1 and 2.5
•Added industrial variant with PN: 047312 to conga-TCA3 Options Information in section 1 "Introduction"
•Updated the notes in section 2.1 "Feature List" and section 6.1.2 "Low Voltage Memory". Added note in section 2.2
"Supported OS"
•Updated caution notes in sections 2.7 “Environmental Specifications“ and 4 “Heatspreader”. Updated section 7.3
"USB Port Mapping"
•Deleted support for MIPI interfaces from the whole document
1.0 2014-09-23 AEM •Added UART interface to the block diagram and to section 2.1 "Feature List"
•Updated section 5.1.13 "General Purpose Serial Interface"
•Deleted the conga-TCA3 PWR_OK input circuitry in section 5.1.14 "Power Control" because the circuitry is not
implemented in conga-TCA3
•Added note about the configuration of fan_pwm pin as push-pull in section 6.1.3.3 “Fan Control” and table 14
“Miscellaneous Signal Description”
•Updated section 7.1.1.1 "Intel Virtualization Technology"
•Deleted the active cooling sub-section from section 7.1.1.3 “Thermal Management” because the BIOS does not
support this feature
•Added sections 9 "System Resources", 10 "BIOS Setup Description" and 11 "Additional BIOS Features"
•Official release
1.1 2015-04-15 AEM •Updated the note in section 2.2 "Supported Operating Systems"
•Added note about Intel's HSIC errata (USB ports 4-7 reset) to sections 5.1.4 "USB 2.0" and 7.3 "USB Port Mapping"
1.2 2017-02-21 AEM •Updated the notes in sections 2.1 "Feature List", 2.2 "Supported Operating Systems" and 6.1.2 "Low Voltage Memory
(DDR3L)"
•Updated section 2.7 "Environment Specifications" and added CSP dimensions to section 4
•Added note about UART limitations in section 5.1.13 " General Purpose Serial Interface (UART)"
•Deleted the statement that the fan_pwm signal was configured as push-pull in section 6.1.3.3 “Fan Control” and table
14 “Miscellaneous Signal Description”
•Deleted section 6.1.3.7 "Power Loss Control" because of duplication
•Corrected the statement that PWRBTN# signal is active on rising edge in table 16 “Power and System Management
Signal Descriptions”
•Corrected the description of pins D63 and D64 in table 28 “Connector C-D Pinout"
•Updated section 10 "BIOS Setup Description"
1.3 2018-12-07 AEM •Updated the information about handling electrostatic sensitive devices in preface section
•Updated the note in section 2.2 "Supported Operating Systems"
•Changed the reference in the note in tables 30, 31 and 32 to section 8.4
•Updated section 10 "BIOS Setup Description"

Copyright © 2014 congatec AG TA30m16 3/95
1.4 2020-04-22 AEM •Added note about the minimum pulse width required for proper button detection in table 23 “Power and System
Management Signal Descriptions”
•Updated section 4 "Cooling Solutions"
•Added information about congatec MLF file to section 11 "Additional BIOS Features"
•Updated sections 11.2 "Updating the BIOS" and 11.3 "Supported Flash Devices"
•Deleted section 12 "Industry Specifications"
1.5 2020-08-07 AEM •Updated section 7.1 "Intel SoC Features"
•Restructured the whole document
•Corrected typographical error in section 11 "Additional BIOS Features"
•Removed the capacity of optional eMMC from the manual
1.6 2021-04-19 AEM •Corrected the storage temperature for industrial variants in section 2.7 “Environmental Specifications”
•Updated table 2 “conga-TCA3 (commercial variants)", table 3 “conga-TCA3 (industrial variants)", table 4 “Feature
Summary”, table 9 “Display Combination” and table 17 “TMDS Signal Descriptions”
•Updated section 3 “Block Diagram” and section 5.1.2 “Display Interfaces"
•Deleted section 5.1.3 “HDMI” and section 5.1.4 “DVI”
•Added note to table 17 “TMDS Signal Descriptions”

Copyright © 2014 congatec AG TA30m16 4/95
Preface
This user's guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TCA3. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims any
implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes no liability
for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies
between the product and the user's guide. In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary
damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other information contained
herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.

Copyright © 2014 congatec AG TA30m16 5/95
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2014, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2014 congatec AG TA30m16 6/95
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2014 congatec AG TA30m16 7/95
Contents
1 Introduction ............................................................................. 11
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSP Dimensions....................................................................... 21
4.2 HSP Dimensions....................................................................... 22
5 Connector Rows....................................................................... 23
5.1 Primary and Secondary Connector Rows................................. 23
5.1.1 PCI Express™........................................................................... 23
5.1.2 Display Interfacea .................................................................... 23
5.1.2.1 DisplayPort (DP) ....................................................................... 24
5.1.2.2 LVDS......................................................................................... 24
5.1.3 VGA.......................................................................................... 25
5.1.4 Serial ATA™ (SATA).................................................................. 25
5.1.5 USB 2.0 .................................................................................... 25
5.1.6 USB 3.0 .................................................................................... 26
5.1.7 Gigabit Ethernet ..................................................................... 26
5.1.8 HDA Interface .......................................................................... 26
5.1.9 UART........................................................................................ 26
5.1.10 ExpressCard™ ......................................................................... 26
5.1.11 SD Card ................................................................................... 27
5.1.12 LPC Bus.................................................................................... 27
5.1.13 I²C Bus ..................................................................................... 27
5.1.14 SPI............................................................................................ 27
5.1.15 Power Control .......................................................................... 27
5.1.16 Power Management................................................................. 29
6 Additional Features.................................................................. 30
6.1 Onboard Interfaces.................................................................. 30
6.1.1 Optional eMMC 4.5................................................................. 30
6.1.2 Low Voltage Memory (DDR3L)................................................. 30
6.1.3 congatec Board Controller (cBC) ............................................. 31
6.1.3.1 Board Information.................................................................... 31
6.1.3.2 General Purpose Input/Output................................................ 31
6.1.3.3 Fan Control .............................................................................. 31
6.1.3.4 Power Loss Control.................................................................. 31
6.1.3.5 Watchdog ................................................................................ 32
6.1.3.6 I2C Bus...................................................................................... 32
6.2 OEM BIOS Customization........................................................ 32
6.2.1 OEM Default Settings .............................................................. 32
6.2.2 OEM Boot Logo....................................................................... 33
6.2.3 OEM POST Logo ..................................................................... 33
6.2.4 OEM BIOS Code/Data............................................................. 33
6.2.5 OEM DXE Driver...................................................................... 33
6.3 congatec Battery Management Interface ................................ 34
6.4 API Support (CGOS) ................................................................ 34
6.5 Optional TPM........................................................................... 34
6.6 Suspend to Ram....................................................................... 34
7 conga Tech Notes .................................................................... 35
7.1 Intel SoC Features.................................................................... 35
7.1.1 Intel Virtualization Technology................................................. 35
7.1.2 Thermal Management ............................................................. 35
7.2 ACPI Suspend Modes and Resume Events.............................. 36
7.3 USB Port Mapping ................................................................... 37
8 Signal Descriptions and Pinout Tables..................................... 38
8.1 Connector Signal Descriptions ................................................ 39
8.2 Boot Strap Signals ................................................................... 61

Copyright © 2014 congatec AG TA30m16 8/95
9 System Resources .................................................................... 62
9.1 I/O Address Assignment.......................................................... 62
9.1.1 LPC Bus.................................................................................... 62
9.2 PCI Configuration Space Map ................................................. 63
9.3 PCI Interrupt Routing Map....................................................... 64
9.4 I²C Bus ..................................................................................... 64
9.5 SM Bus..................................................................................... 64
10 BIOS Setup Description........................................................... 65
10.1 Entering the BIOS Setup Program........................................... 65
10.1.1 Boot Selection Popup.............................................................. 65
10.2 Setup Menu and Navigation.................................................... 65
10.3 Main Setup Screen................................................................... 66
10.4 Advanced Setup ...................................................................... 67
10.4.1 Watchdog Submenu ................................................................ 68
10.4.2 Graphics Submenu................................................................... 70
10.4.3 Hardware Health Monitoring Submenu ................................... 71
10.4.4 Hardware Health Monitoring Submenu ................................... 72
10.4.5 RTC Wake Submenu ................................................................ 72
10.4.6 Module Serial Ports Submenu ................................................. 73
10.4.7 Reserve Legacy Interrupt Submenu......................................... 73
10.4.8 ACPI Submenu......................................................................... 73
10.4.9 SIO Submenu........................................................................... 74
10.4.10 Serial Port 1 Submenu ............................................................. 74
10.4.11 Serial Port 2 Submenu ............................................................. 74
10.4.12 Parallel Port Submenu.............................................................. 75
10.4.13 PS2 Controller (KB&MS) Submenu .......................................... 75
10.4.14 Intel®Smart Connect Technology Submenu............................ 75
10.4.15 Serial Port Console Redirection Submenu............................... 76
10.4.15.1 Console Redirection Settings COM0 Submenu....................... 76
10.4.15.2 Console Redirection Settings Out-of-Band Management
Submenu 77
10.4.16 CPU Configuration Submenu................................................... 77
10.4.16.1 Socket 0 CPU Information Submenu ....................................... 78
10.4.16.2 CPU Thermal Configuration Submenu..................................... 79
10.4.17 PPM Configuration Submenu .................................................. 79
10.4.18 Thermal Configuration............................................................. 79
10.4.19 IDE Configuration Submenu.................................................... 80
10.4.20 Miscellaneous Configuration Submenu ................................... 81
10.4.21 SCC Configuration Submenu................................................... 81
10.4.22 PCI Subsystem Settings Submenu........................................... 82
10.4.23 PCI Express Settings ................................................................ 83
10.4.24 PCI Express GEN 2 Settings .................................................... 84
10.4.25 Network Stack.......................................................................... 85
10.4.26 CSM Submenu......................................................................... 85
10.4.27 SDIO Submenu ........................................................................ 86
10.4.28 USB Submenu.......................................................................... 86
10.4.29 Platform Trust Technology ....................................................... 86
10.4.30 Security Configuration ............................................................. 87
10.4.31 Intel®Ethernet Connection I210 Submenu.............................. 87
10.4.31.1 NIC Configuration Submenu ................................................... 88
10.4.32 Driver Health Submenu............................................................ 88
10.5 Chipset Setup .......................................................................... 88
10.5.1 North Bridge Submenu............................................................ 88
10.5.2 South Bridge Submenu............................................................ 89
10.5.2.1 Azalia HD Audio....................................................................... 89
10.5.2.2 USB Submenu.......................................................................... 90
10.5.2.3 PCI Express Configuration Submenu....................................... 91
10.6 Boot Setup............................................................................... 91
10.6.1 Boot Settings Configuration .................................................... 92
10.7 Security Setup.......................................................................... 93
10.7.1 Security Settings ...................................................................... 93
10.7.2 Hard Disk Security.................................................................... 93
10.8 Save & Exit Menu..................................................................... 93
11 Additional BIOS Features ........................................................ 94
11.1 BIOS Versions........................................................................... 94
11.2 Updating the BIOS................................................................... 94
11.2.1 Update from External Flash ..................................................... 95
11.3 Supported Flash Devices ......................................................... 95

Copyright © 2014 congatec AG TA30m16 9/95
List of Tables
Table 1 COM Express™ 2.1 Pinout Types ........................................... 11
Table 2 conga-TCA3 (commercial variants) .......................................... 12
Table 3 conga-TCA3 (Industrial variants) .............................................. 12
Table 4 Feature Summary..................................................................... 13
Table 5 Measurement Description........................................................ 16
Table 6 Power Consumption Values ..................................................... 17
Table 7 CMOS Battery Power Consumption ........................................ 17
Table 8 Cooling Solution Variants......................................................... 20
Table 9 Display Combination ............................................................... 24
Table 10 Wake Events............................................................................. 36
Table 11 Signal Tables Terminology Descriptions .................................. 38
Table 12 Connector A–B Pinout ............................................................. 39
Table 13 Connector C–D Pinout............................................................. 41
Table 14 PCI Express Signal Descriptions (general purpose) ................. 43
Table 15 PCI Express Signal Descriptions (x16 Graphics)....................... 44
Table 16 DDI Signal Description............................................................. 46
Table 17 HDMI Signal Descriptions........................................................ 48
Table 18 DisplayPort (DP) Signal Descriptions ....................................... 49
Table 19 CRT Signal Descriptions........................................................... 51
Table 20 LVDS Signal Descriptions......................................................... 51
Table 21 Serial ATA Signal Descriptions................................................. 52
Table 22 USB 2.0 Signal Descriptions..................................................... 53
Table 23 USB 3.0 Signal Descriptions..................................................... 54
Table 24 Gigabit Ethernet Signal Descriptions....................................... 54
Table 25 Intel®High Definition Audio Link Signals Descriptions............ 55
Table 26 ExpressCard Support Pins Descriptions................................... 55
Table 27 LPC Signal Descriptions........................................................... 56
Table 28 SPI BIOS Flash Interface Signal Descriptions........................... 56
Table 29 Miscellaneous Signal Descriptions........................................... 56
Table 30 General Purpose I/O Signal Descriptions ................................ 57
Table 31 Power and System Management Signal Descriptions ............. 58
Table 32 General Purpose Serial Interface Signal Descriptions.............. 59
Table 33 Module Type Definition Signal Description ............................. 59
Table 34 Power and GND Signal Descriptions....................................... 60
Table 35 Boot Strap Signal Descriptions ................................................ 61
Table 36 PCI Configuration Space Map ................................................. 63
Table 37 PCI Interrupt Routing Map....................................................... 64

Copyright © 2014 congatec AG TA30m16 10/95
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected].
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
Gbe Gigabit Ethernet
eMMC Embedded Multi-media Controller
HDA High Definition Audio
cBC congatec Board Controller
N.C Not connected
N.A Not available
TBD To be determined

Copyright © 2014 congatec AG TA30m16 11/95
1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x110 mm
Table 1 COM Express™ 2.1 Pinout Types
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32-bit 1 1 8 / 0 VGA, LVDS,PEG/SDVO
Type 3 A-B C-D Up to 22 32-bit 3 8 / 0 VGA,LVDS,PEG/SDVO
Type 4 A-B C-D Up to 32 1 1 8 / 0 VGA,LVDS,PEG/SDVO
Type 5 A-B C-D Up to 32 3 8 / 0 VGA,LVDS,PEG/SDVO
Type 6 A-B C-D Up to 24 1 8 / 4 VGA,LVDS,PEG, 3x DDI
Type 10 A-B Up to 4 1 8 / 0 1x DDI
The conga-TCA3 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM
modules provide most of the functional requirements for any application. These functions include, but are not limited to a rich complement
of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides
the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding the range of potential peripherals. The robust thermal and
mechanical concept, combined with extended power-management capabilities, is perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.

Copyright © 2014 congatec AG TA30m16 12/95
Options Information
The conga-TCA3 is available in 10 variants (six commercial and four industrial).The table below shows the different configurations available.
Table 2 conga-TCA3 (commercial variants)
Part-No. 047302 047303 047305 047300 047301 047304
Processor Intel®Atom™ E3826
(Dual Core, 1.46 GHz)
Intel®Atom™ E3825
(Dual Core, 1.33 GHz)
Intel®Celeron®J1900
(Quad Core, 2.0 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3827
(Dual Core, 1.75 GHz)
Intel®Atom™ E3815
(Single Core, 1.46 GHz)
L2 Cache 1 MB 1 MB 2 MB 2 MB 1 MB 512kB
Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics
GFX Normal/Burst 533 / 667 533 / N.A 688 / 854 542 / 792 542 / 792 400 / N.A
LVDS Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit
DDI DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI)
Memory (DDR3L) 1066 MT/s dual
channel
1066 MT/s single
channel
1333 MT/s dual
channel
1333 MT/s dual
channel
1333 MT/s dual
channel
1066 MT/s single
channel
Max. TDP / SDP 7 W 6 W 10 W 10 W 8 W 5 W
Table 3 conga-TCA3 (Industrial variants)
Part-No. 047310 047311 047312 047314
Processor Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3827
(Dual Core, 1.75 GHz)
Intel®Atom™ E3826
(Dual Core, 1.46 GHz)
Intel®Atom™ E3815
(Single Core, 1.46 GHz)
L2 Cache 2 MB 1 MB 1 MB 512kB
Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics
GFX Normal/Burst 542 / 792 542 / 792 533 / 667 400 / N.A
LVDS Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit Single/Dual 18/24-bit
DDI DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI) DP++ (DP/HDMI/DVI)
Memory (DDR3L) 1333 MT/s dual
channel
1333 MT/s dual
channel
1066 MT/s dual
channel
1066 MT/s single
channel
Max. TDP 10 W 8 W 7 W 5 W

Copyright © 2014 congatec AG TA30m16 13/95
2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm)
Processor 3rd Generation Intel®Atom™ and Intel®Celeron®processors
Memory Single or dual channel memory interface (up to two memory sockets). Supports:
-SO-DIMM non-ECC DDR3L modules
-Data rates up to 1333 MT/s
-Maximum 8 GB capacity
NOTE: Variants equipped with Intel Atom E3815 and E3825 feature single channel memory interface and therefore support only one memory
socket. For more information, see "Options Information" table on page 12.
Chipset Integrated in SoC
Onboard Storage Optional eMMC 4.5 onboard flash (optional for only Intel®Atom™ variants)
Audio High Definition Audio (HDA)/digital audio interface with support for multiple codecs.
Ethernet Gigabit Ethernet via the onboard Intel®l210 Gigabit Ethernet controller.
Graphics Options Intel®HD Graphics Gen. 7, full hardware acceleration for MPEG2, H.264, DirectX11, OCL 1.2, OGL 3.2, WMV9 and VC1.
Dual simultaneous display support.
2x DP++ (DP/HDMI/DVI)
1x LVDS
1x VGA
Optional eDP interface
NOTE:
*1 The second DDI channel is only available if LVDS is disabled.
*2 Variants with optional eDP interface do not support LVDS
*3 The conga-TCA3 does not natively support TMDS. A DP++ to
TMDS converter (e.g. PTN3360D) needs to be implemented
Peripheral
Interfaces
2x SATA® up to 3 Gb/s
5x PCI Express®Gen2 links up to 5.0 GT/s per lane
8x USB 2.0 (with up to 1x USB 3.0)
2x UART
1x SD/MMC
GPIOs muxed with SD card
SPI Bus
LPC Bus
I²C Bus, multimaster
BIOS AMI Aptio®V UEFI 2.x firmware; 8 MB serial SPI with congatec Embedded BIOS features (OEM Boot Logo, OEM Default Settings, LCD Control,
Display Auto Detection, Backlight Control, Flash Update)
Power
Management
ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
congatec Board
Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus
(fast mode, 400 kHz, multi-master), Power Loss Control

Copyright © 2014 congatec AG TA30m16 14/95
Note
The conga-TCA3 supports only DDR3L memory modules. The memory modules in the sockets must be symmetrical - that is, same raw cards
and same memory sizes. Therefore, do not use different memory modules in the memory sockets. Doing so may cause system instability or
memory errors. Also make sure the memory modules support the data transfer rate of the particular variant.
In addition, when using one memory socket, insert the memory module only in the first memory slot on the conga-TCA3 (top side). If the first
memory slot is empty, the SoC will ignore the second memory socket (bottom side). When this happens, the conga-TCA3 will not turn on. See
the Intel's Bay Trail datasheet for more information.
2.2 Supported Operating Systems
The conga-TCA3 supports the following operating systems
•Microsoft®Windows®7, 8, 10 (64-bit)
•Microsoft® WES®7/8
•Microsoft®WEC®7/2013
•Linux (Timesys Fedora 18)
Note
The conga-TCA3 requires a minimum storage capacity of 16 GB (32-bit) or 20 GB (64-bit) for Windows 7/8/10 installation. congatec will not
offer installation support for systems that do not meet the minimum requirement.
2.3 Mechanical Dimensions
•95.0 mm x 95.0 mm (3.75” x 3.75”)
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used then
approximate overall height is 21 mm.

Copyright © 2014 congatec AG TA30m16 15/95
2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module's connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250 V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2014 congatec AG TA30m16 16/95
2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +12 V
•conga-TCA3 COM
•modified congatec carrier board
•conga-TCA3 cooling solution
•Microsoft Windows 7 (64-bit)
Note
The CPU was stressed to its maximum workload.
Table 5 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle The CPU was stressed to its maximum frequency
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency
S0: Peak value Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2014 congatec AG TA30m16 17/95
Table 6 Power Consumption Values
The table below provides additional information about the conga-MA3/MA3E power consumption. The values are recorded at various operating
mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (A)
Variant Cores Freq/Turbo (GHz) S0:Min S0:Max S0: Peak S3
047300
047310
2 x 2 GB A.0 TA30R000 Windows 7 Intel®Atom™ E3845 4 1.91 / N.A 0.40 1.01 1.08 0.17
047301
047311
2 x 2 GB A.0 TA30R000 Windows 7 Intel®Atom™ E3827 2 1.75 / N.A 0.39 0.81 0.84 0.17
047302 2 x 2 GB A.0 TA30R000 Windows 7 Intel®Atom™ E3826 2 1.46 / N.A 0.38 0.75 0.75 0.17
047303 1 x 2 GB A.0 TA30R000 Windows 7 Intel®Atom™ E3825 2 1.33 / N.A 0.36 0.63 0.65 0.17
047304
047314
1 x 2 GB A.0 TA30R000 Windows 7 Intel®Atom™ E3815 1 1.46 / N.A 0.35 0.53 0.59 0.18
047305 1 x 2 GB A.0 TA30R000 Windows 7 Intel®Celeron®J1900 4 2.00 / 2.42 0.40 1.33 1.33 0.18
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC N.A µA
20oC 3V DC 1.85 µA
70oC 3V DC N.A µA
Note
1. Do not use the CMOS battery power consumption value listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TCA3.

Copyright © 2014 congatec AG TA30m16 18/95
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2014 congatec AG TA30m16 19/95
3 Block Diagram
Intel Bay Trail SoC
COMPUTE UNIT
Core #1 Core #2
Core #3 Core #4
Tri-gate 3-D 22nm Quad core SoC
1MB L2 cache shared by 2 cores
PROCESSOR CORE
SSE4.2 AES AVX VT-x
SoC TRANSACTION ROUTER
Interfaces

DisplayPort TMDS VGA LVDS
MPEG-2
H.264
DirectX 11 OpenGL 3.0 OpenGLES 2.0
OpenCL 1.2
WMV9 SVC
WMV
SAMU
MVC
DivX
low power
high performance
MEMORY CONTROLLER (1066 or 1333 MT/s)
DISPLAY & GRAPHICS
SATA USB 2.0
LPC BusPCIe
Integrated I/O Interfaces
GPIOs
SPIHD Audio PCU
USB 3.0
INTEGRATED I/O
PCIe1 x1
PCIe2 x1
PCIe3 x1
SD Card
PCIe0 x1
2x SATA 3G
4x USB 2.0
4x USB 2.0
1x SuperSpeed
X
X
X
X
X
X
X
X
X
LVDS/eDP
Second DDI
Dual Channel Non-ECC
DDR3L-1333 MT/s
NOTE:
1
The Bay Trail SoC does not support mixed raw cards or
mixed memory sizes. Therefore use only symmetrical
non-ecc memory modules.
2

Digital Display Port 2, but not both.
eMMC 4.5
eD
LPC
PCIe Switch
DP Switch
SSD
TPM
MUX
PCIe to GBE
Intel l210
USB HSIC
4 Port Hub
congatec
Board Controller
eDP to LVDS
NXP PTN3460 RES
Ethernet
LVDS/eDP
COM Express 2.1
Type 6
A-B Connector
LPC Bus
SPI Bus

USB 2.0 Port 0..3
USB 2.0 Port 4..7
CRT
SATA Port 0..1
SATA Port 2..3
I2C Bus
LID#/SLEEP#
SM Bus

SDCard/GPIOs
PCIe Port 5
PCIe Port 2
PCIe Port 3
PCIe Port 4
PCIe Port 1
PCIe Port 0
COM Express 2.1
Type 6
C-D Connector
USB 3.0 Port 0
USB 3.0 Port 1
USB 3.0 Port 2
USB 3.0 Port 3
(TX BC)
congatec custom
PCIe Port 6
PCIe Port 7
PEG x16
DP++ (DP/HDMI/DVI)
DP++ (DP/HDMI/DVI)
DDI3
2x UART

Copyright © 2014 congatec AG TA30m16 20/95
4 Cooling Solutions
congatec AG offers the following cooling solutions for the conga-TCA3. The dimensions of the cooling solutions are shown in the sub-sections.
All measurements are in millimeters.
Table 8 Cooling Solution Variants
Cooling Solution Part No. Description
1 HSP 047350 Standard heatspreader with M2.5 mm threaded standoffs
047351 Standard heatspreader with 2.7 mm bore-hole standoffs
2 CSP 047352 Standard passive cooling solution with M2.5 mm threaded standoffs
047353 Standard passive cooling solution with 2.7 mm bore-hole standoffs
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.