Congatec conga-SBM2C User manual

conga-SBM²C
congatec Smart Battery Manager Module
User's Guide
Revision 1.1

Revision History
Revision Date (dd.mm.yy) Author Changes
1.0 05.03.08 AHE/GDA Official release
1.1 26.03.08 GDA Changed the 12V signal listed in the pti nal signal table in secti n 4.3
t 5V_VCC. 5V system p wer is the pti nal signal available, n t 12V
system p wer.
C pyright © 2008 c ngatec AG SBM2Cm11 2/24

Pre ace
This user's guide pr vides inf rmati n ab ut the c mp nents, features, and c nnect rs
available n the c nga-SBM²C. It is ne f three d cuments that sh uld be referred t
when designing a p rtable battery/p wer management s luti n. The ther reference
d cuments that sh uld be used include the f ll wing:
•c ngatec Battery Management Interface Specificati n
•Battery System Design Guide
The links t these d cuments can be f und n the c ngatec AG website at
www.c ngatec.c m
Disclaimer
The inf rmati n c ntained within this user's guide, including but n t limited t any
pr duct specificati n, is subject t change with ut n tice.
c ngatec AG pr vides n warranty with regard t this user's guide r any ther
inf rmati n c ntained herein and hereby expressly disclaims any implied warranties f
merchantability r fitness f r any particular purp se with regard t any f the f reg ing.
c ngatec AG assumes n liability f r any damages incurred directly r indirectly fr m
any technical r typ graphical err rs r missi ns c ntained herein r f r discrepancies
between the pr duct and the user's guide. In n event shall c ngatec AG be liable f r
any incidental, c nsequential, special, r exemplary damages, whether based n t rt,
c ntract r therwise, arising ut f r in c nnecti n with this user's guide r any ther
inf rmati n c ntained herein r the use there f.
Intended Audience
This user's guide is intended f r technically qualified pers nnel. It is n t intended f r
general audiences.
Symbols
The f ll wing symb ls are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
C pyright © 2008 c ngatec AG SBM2Cm11 3/24

Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHZ Gigahertz ( ne billi n hertz)
kB Kil byte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kil hertz ( ne th usand hertz)
MHz Megahertz ( ne milli n hertz)
SOH Battery state f health
SOC Battery state f charge
<x>S<y>P Battery pack t p l gy: <x> cells in series, <y> cells in parallel,
e.g. 4S1P: 4 cells in series, n cells parallel
SBSM Smart battery system manager
I/F Interface
N.C. N t c nnected
N.A. N t applicable
TBD T be determined
Copyright Notice
C pyright © 2008, c ngatec AG. All rights reserved. All text, pictures and graphics are
pr tected by c pyrights. N c pying is permitted with ut written permissi n fr m
c ngatec AG.
c ngatec AG has made every attempt t ensure that the inf rmati n in this d cument is
accurate yet the inf rmati n c ntained within is supplied “as-is”.
Trademarks
Intel and Pentium are registered trademarks f Intel C rp rati n. Expresscard is a
registered trademark f Pers nal C mputer Mem ry Card Internati nal Ass ciati n
(PCMCIA). COM Express™ is a registered trademark f PCI Industrial C mputer
Manufacturers Gr up. PCI Express is a registered trademark f Peripheral C mp nent
Interc nnect Special Interest Gr up (PCI-SIG). I²C is a registered trademark f Philips
C rp rati n. C mpactFlash is a registered trademark f C mpactFlash Ass ciati n.
Winb nd is a registered trademark f Winb nd Electr nics C rp. AVR is a registered
trademark f Atmel C rp rati n. ETX is a registered trademark f K ntr n AG.
AMICORE8 is a registered trademark f American Megatrends Inc. Micr s ft®,
Wind ws®, Wind ws NT®, Wind ws CE®, Wind ws XP® and Wind ws Vista® are
registered trademarks f Micr s ft C rp rati n. VxW rks is a registered trademark f
WindRiver. c nga, c ngatec and XTX are registered trademark f c ngatec AG. All
pr duct names and l g s are pr perty f their wners.
C pyright © 2008 c ngatec AG SBM2Cm11 4/24

Warranty
c ngatec AG makes n representati n, warranty r guaranty, express r implied
regarding the pr ducts except its standard f rm f limited warranty ("Limited Warranty").
c ngatec AG may in its s le discreti n m dify its Limited Warranty at any time and fr m
time t time.
Beginning n the date f shipment t its direct cust mer and c ntinuing f r the
published warranty peri d, c ngatec AG represents that the pr ducts are new and
warrants that each pr duct failing t functi n pr perly under n rmal use, due t a defect
in materials r w rkmanship r due t n n c nf rmance t the agreed up n
specificati ns, will be repaired r exchanged, at c ngatec AG's pti n and expense.
Cust mer will btain a Return Material Auth rizati n ("RMA") number fr m c ngatec AG
pri r t returning the n n c nf rming pr duct freight prepaid. c ngatec AG will pay f r
transp rting the repaired r exchanged pr duct t the cust mer.
Repaired, replaced r exchanged pr duct will be warranted f r the repair warranty
peri d in effect as f the date the repaired, exchanged r replaced pr duct is shipped by
c ngatec AG, r the remainder f the riginal warranty, whichever is l nger. This
Limited Warranty extends t c ngatec AG's direct cust mer nly and is n t assignable
r transferable.
Except as set f rth in writing in the Limited Warranty, c ngatec AG makes n
perf rmance representati ns, warranties, r guarantees, either express r implied, ral
r written, with respect t the pr ducts, including with ut limitati n any implied warranty
(a) f merchantability, (b) f fitness f r a particular purp se, r (c) arising fr m c urse f
perf rmance, c urse f dealing, r usage f trade.
c ngatec AG shall in n event be liable t the end user f r c llateral r c nsequential
damages f any kind. c ngatec AG shall n t therwise be liable f r l ss, damage r
expense directly r indirectly arising fr m the use f the pr duct r fr m any ther
cause. The s le and exclusive remedy against c ngatec AG, whether a claim s und in
c ntract, warranty, t rt r any ther legal the ry, shall be repair r replacement f the
pr duct nly
Technical Support
c ngatec AG technicians and engineers are c mmitted t pr viding the best p ssible
technical supp rt f r ur cust mers s that ur pr ducts can be easily used and
implemented. We request that y u first visit ur website at www.c ngatec.c m f r the
latest d cumentati n, utilities and drivers, which have been made available t assist
y u. If y u still require assistance after visiting ur website then please c ntact ur
technical supp rt department by email at supp rt@c ngatec.c m
Certi ication
c ngatec AG is certified t DIN EN ISO 9001:2000 standard.
C pyright © 2008 c ngatec AG SBM2Cm11 5/24

Sa ety Warning
Warning
When the c nga-SBM²C is used in c njuncti n with the SBM²C Smart Battery
Management M dule starter kit, its use is intended f r ENGINEERING DEVELOPMENT
OR EVALUATION PURPOSE ONLY and is n t c nsidered by c ngatec AG t be fit f r
c mmercial use. As such, the g ds pr vided in the SBM²C Smart Battery Management
M dule starter kit may n t be c mplete in terms f required design-related pr tective
c nsiderati ns, including pr duct safety measures typically f und in the end pr duct
inc rp rating the g ds. As a pr t type, this starter kit d es n t fall within the sc pe f
the Eur pean Uni n directive n electr magnetic c mpatibility and theref re may n t
meet the technical requirements f the directive.
Pers ns handling the pr duct must have electr nics training and bserve g d
lab rat ry practice standards.
•The SBM²C Smart Battery Management M dule starter kit has n t been tested
t meet the FCC Rules and/ r UL certificati n and/ r CE c mpliance.
•D n t leave the c nga-SBM²C Smart Battery Management M dule starter kit
unattended. The battery may reach critical c nditi ns during perati n.
•Fire, expl si n and severe burn hazard c uld happen if abused.
•D n t crush, disassemble r sh rt circuit the battery.
If the actual c nga-SBM²C m dule is t be implemented in a carrier b ard design and
that carrier b ard design is used in a c mplete system f r series pr ducti n, then the
system designer/manufacturer must ensure that the system meets all safety,
certificati n, c mpatibility and/ r any ther regulati ns/requirements set f r f rth by the
g verning b dies f the jurisdicti n wherein said system will be made available f r
purchase and/ r use.
Electrostatic Sensitive Device
All c ngatec AG pr ducts are electr static sensitive devices and are packaged
acc rdingly. D n t pen r handle a c ngatec AG pr duct except at an
electr static-free w rkstati n. Additi nally, d n t ship r st re c ngatec AG pr ducts
near str ng electr static, electr magnetic, magnetic, r radi active fields unless the
device is c ntained within its riginal manufacturer's packaging. Be aware that failure t
c mply with these guidelines will v id the c ngatec AG Limited Warranty.
Lead-Free Designs (RoHS)
All c ngatec AG designs are created fr m lead-free c mp nents and are c mpletely
R HS c mpliant.
C pyright © 2008 c ngatec AG SBM2Cm11 6/24

conga-SBM²C Options In ormation
The c nga-SBM²C is currently available in ne variant.
Part-No. 026571
Input Voltage 19 V
Output 1 12.0 V/6.0 A
Output 2 5.1 V/6.5 A
Output 3 5.1 V/0.5 A
C pyright © 2008 c ngatec AG SBM2Cm11 7/24

Contents
1 Specificati ns............................................................................................................................... 9
1.1 Feature List............................................................................................................................... 9
1.2 Supp rted Operating Systems.................................................................................................. 9
1.3 Mechanical Dimensi ns........................................................................................................... 10
1.4 Envir nmental Specificati ns................................................................................................... 11
1.5 Input Requirements................................................................................................................. 11
1.6 Output Characteristics............................................................................................................. 11
2 Bl ck Diagram............................................................................................................................ 12
3 C ling....................................................................................................................................... 13
4 Signal Descripti ns and Pin ut Tables....................................................................................... 14
4.1 C nnect r J1........................................................................................................................... 15
4.2 C nnect r J2........................................................................................................................... 16
4.3 C nnecting t a COM Express™ CPU M dule........................................................................ 17
4.4 Placement and Lay ut C nsiderati ns.................................................................................... 18
5 P wer Butt n, Beeper and I/O.................................................................................................... 19
5.1 P wer Butt n........................................................................................................................... 19
5.2 Beeper C ntr l........................................................................................................................ 19
5.3 I/O C ntr l............................................................................................................................... 19
6 c nga-SBM²C Register............................................................................................................... 21
6.1 S ftware C nsiderati ns......................................................................................................... 21
6.2 Interface.................................................................................................................................. 21
6.2.1 Opti nalMfgFuncti n3 Register (0x3D)................................................................................ 23
7 Industry Specificati ns................................................................................................................ 24
C pyright © 2008 c ngatec AG SBM2Cm11 8/24

1 Speci ications
1.1 Feature List
Table 1 Feature Summary
Dimensions 68 mm x 110 mm x 12.5 mm
Input 19 V, max. 4.5 A with l ad limiter/balancing
Outputs •Main P wer Rail: 12.0 V/6.0 A
•Standby Rail: 5.1 V/0.5 A
•Aux. Rail: 5.1 V/6.5 A
Batteries •Li-I n Battery Pack with 2 Stage Pr tecti n
must supp rt Smart Battery Specificati n (SBS) V1.1
•2S1P t 4S2P (f r inf rmati n ab ut alternative c nfigurati ns ther than 4SxP
c ntact y ur l cal c ngatec AG representative)
•rec mmended battery capacity/pack: 2.4 Ah
•rec mmended battery pack v ltage: n m. 14.4 V
Power Modes •S1: Sleep M de
•S3: Suspend t RAM
•S5: S ft Off
•G3: Mechanical Off
Supported Modules •c ngatec COM Express™ CPU M dules
Additional Features •supp rt f r I²C I/O PCA9555
1.2 Supported Operating Systems
The c nga-SBM²C supp rts the f ll wing ACPI Operating Systems.
•Micr s ft® Wind ws® XP/2000
•Micr s ft® Wind ws ®XP Embedded
•Linux
The c nga-SBM²C supp rts the f ll wing Operating Systems when using c ngatec
CGOS interface t c mmunicate t the c nga-SBM²C.
•Micr s ft® Wind ws® XP/2000
•Micr s ft® Wind ws ®XP Embedded
•Linux
•QNX
•VxW rks
C pyright © 2008 c ngatec AG SBM2Cm11 9/24

1.3 Mechanical Dimensions
•109.0 mm x 67.9 mm (4.3” x 2.6”)
•Height appr x. 9.7 mm (0.4”) excluding c nnect rs.
C pyright © 2008 c ngatec AG SBM2Cm11 10/24

1.4 Environmental Speci ications
Temperature Operati n: 0° t 60°C St rage: -20° t +80°C
Humidity Operati n: 10% t 90% rel. St rage: 5% t 95% rel.
Note
Humidity specifications are for non-condensing conditions.
The above operating temperatures must be strictly adhered to at all times.
t is the responsibility of the operator to ensure that all components found on the module
operate within the component manufacturer's specified temperature range.
For more information about cooling the conga-SBM²C module see section 3 or contact
congatec technical support.
1.5 Input Requirements
Power Brick Input Battery
Voltage 19.0 V 14.4 V n m.
Tolerance +/-3% n.a.
Max. Current 4.5 A typ. 6.5 A
Standby Current (G3 Mode) 30 mA typ. < 3 mA typ.
Power (continuous) 85 W typ. n.a.
1.6 Output Characteristics
5V Regulator 5VSB Regulator 12V Regulator CC/CV Charger
Voltage 5.1 V 5.1 V 12.0 V max. 16.80 V
Tolerance +2.5 %/-5 % +2.5 %/-5 % +/-5 % +/- 1%
Voltage Ripple
@ 10Hz-20MHz
100 mVpp 100 mVpp n.a. n.a.
Max. Current 6.5 A 500 mA 6.0 A 3.0 A
Max. Current (t<10sec.) 7 A 500 mA 2.3 A n.a.
Power (continuous) 30 W 2.5 W 72 W 50 W
C pyright © 2008 c ngatec AG SBM2Cm11 11/24

2 Block Diagram
C pyright © 2007 c ngatec AG SBM2Cm11 12/24

3 Cooling
The c nga-SBM²C m dule is designed t meet the latest efficiency standards and
requirements theref re the pr duced p wer dissipati n is minimal. T be able t use the
m dule in a wide temperature range, it is rec mmended that y u attach s me f rm f a
c ling s luti n t the m dule.
The back f c nga-SBM²C d es n t c ntain any c mp nents and is designed s that
the m dule can be attached t the system chassis r a heatsink using thermal
c nductive gap filler pads.
Y u can use f r example:
•Ch merics THERM-A-GAP:
http://www.ch merics.c m
•T-Gl bal L37 series
http://www.tgl bal.c m.tw/
•Bergquist Gap-Pad
http://www.bergquistc mpany.c m
C pyright © 2008 c ngatec AG SBM2Cm11 13/24

4 Signal Descriptions and Pinout Tables
The f ll wing secti n describes the signals f und n the c nga-SBM²C l cated n the
left and right side f the m dule.
This table describes the termin l gy used in this secti n f r the Signal Descripti n
tables. The PU/PD c lumn indicates if an internal pull-up r pull-d wn resist r has been
used n the c nga-SBM²C, if the field entry area in this c lumn f r the signal is empty,
then n pull-up r pull-d wn resist r has been implemented.
The “#” symb l at the end f the signal name indicates that the active r asserted state
ccurs when the signal is at a l w v ltage level. When “#” is n t present, the signal is
asserted when at a high v ltage level.
Table 2 Signal Tables Terminology Descriptions
Term Description
PU SBM²C internally implemented pull-up resist r
PD SBM²C internally implemented pull-d wn resist r
I/O 3.3V Bi-directi nal signal 3.3V t lerant
I/O 5V Bi-directi nal signal 5V t lerant
I 3.3V Input 3.3V t lerant
I 5V Input 5V t lerant
I/O 3.3VSB Input 3.3V t lerant active in standby state
O 3.3V Output 3.3V signal level
O 5V Output 5V signal level
P P wer Input/Output
PP Push-Pull Output
OC Open C llect r
C pyright © 2008 c ngatec AG SBM2Cm11 14/24

4.1 Connector J1
Connector Type
mates with
Table 2 J1 signals
Pin Signal Description I/O PU/PD
1 5V_VCC 5V system p wer utput P
2 5V_VCC 5V system p wer utput P
3 GND Gr und P
4 GND Gr und P
5 GND -> +12V 12V system p wer utput P
6 GND -> +12V 12V system p wer utput P
7 GND Gr und P
8 GND Gr und P
9 5VSB System standby p wer P
10 C_SCL I²C-bus cl ck line used f r c mmunicati n with the system h st I/O 5V
11 C_SDA I²C-bus cl ck line used f r c mmunicati n with the system h st I/O 5V
12 C_SLP_S5# Signal f r S5 state I 5V
13 Reset#
14 BPR Buzzer utput O 5V PP
15 I_OnBut# P wer butt n signal fr m fr nt panel I/O 5V PU 15k µC_VCC
16 C_BATLOW# Interrupt utput O 5V OC, 8 mA
17 C_PBTN# P wer butt n signal t the CPU m dule O 5V OC, 8 mA
18 C_PSON# P wer n/ ff request line fr m the CPU m dule I 5V
19 M_SCL Cl ck line f internal I²C-bus I/O 5V PU 15k µC_VCC
20 M_SDA Data line f internal I²C-bus I/O 5V PU 15k µC_VCC
C pyright © 2008 c ngatec AG SBM2Cm11 15/24

4.2 Connector J2
Connector Type
mates with
Table 2 J2 signals
Pin Signal Description I/O PU/PD
1 BAT1 Battery 1 p wer P
2 BAT1 Battery 1 p wer P
3 GND Gr und P
4 GND Gr und P
5 BAT2 Battery 2 p wer P
6 BAT2 Battery 2 p wer P
7 TDI JTAG interface I/O 5V PU 10k µC_VCC
8 TDO JTAG interface I/O 5V PU 10k µC_VCC
9 TCK JTAG interface I/O 5V PU 10k µC_VCC
10 TMS JTAG interface I/O 5V PU 10k µC_VCC
11 B2_SCL I²C-bus data line used f r c mmunicati n with battery 1 I/O 5V PU 15k µC_VCC
12 B2_SDA I²C-bus data line used f r c mmunicati n with battery 1 I/O 5V PU 15k µC_VCC
13 B2_TP Reserved
14 B1_TP Reserved
15 B1_SDA I²C-bus cl ck line used f r c mmunicati n with battery 2 I/O 5V PU 15k µC_VCC
16 B1_SCL I²C-bus cl ck line used f r c mmunicati n with battery 2 I/O 5V PU 15k µC_VCC
17 GND Gr und P
18 GND Gr und P
19 Uin P wer input 19V/4.5A P
20 Uin P wer input 19V/4.5A P
C pyright © 2008 c ngatec AG SBM2Cm11 16/24

4.3 Connecting to a COM Express™ CPU Module
The c nga-SBM²C signals listed in the f ll wing table must be c nnected t a COM
Express™ CPU m dule via the carrier b ard.
conga-SBM²C
Signal
COM Express™
Signal
+12V VCC_12V
5VSB VCC_5V_SBY
GND GND
C_SCL I2C_CK
C_SDA I2C_DAT
C_BATLOW# BATLOW#
C_PBTN# PWRBTN#
C_PSON# SUS_S3#
C_SLP_S5# SUS_S5#
The f ll wing table lists additi nal c nga-SBM²C signals that are mandat ry and must
be implemented n the COM Express™ carrier b ard in rder t ensure basic
functi nality.
SBM²C Signal Description
I_OnBut# Must be c nnected t a signal used t turn n the system such as a butt n n a fr nt panel
BAT1 Battery 1 p wer c nnecti n
B1_SDA, B1_SCL I²C-bus used f r c mmunicati n with battery 1
Uin C nnecti n t 19V/4.5A p wer s urce
The f ll wing table lists additi nal c nga-SBM²C signals that are pti nal and can be
implemented n the COM Express™ carrier b ard. Utilizing these signals will pr vide
additi nal functi nality.
SBM²C Signal Description
BPR Buzzer utput
µC_VCC Supply f r external I/O
TDI, TDO, TCK, TMS JTAG interface
M_SDA, M_SCL SBM²C internal I²C-bus
BAT2 Battery 2 p wer c nnecti n
B2_SDA, B2_SCL I²C-bus used f r c mmunicati n with battery 2
5V_VCC 5V system p wer
C pyright © 2008 c ngatec AG SBM2Cm11 17/24

The f ll wing table lists signals which are imp rtant when designing a battery p wered
system that is in c mpliance with the c ngatec Battery Management Interface
Specificati n.
Signal
(COM Express™)
Description
BATLOW# This signal is used by the battery system t generate interrupts up n special events such as AC
p wer changes, attaching/detaching f batteries, battery l w c nditi ns, etc. A l w pulse f at
least ne micr sec nd is necessary t be rec gnized by the system h st.
PS_ON# A l w level n PS_ON# r high level n SUS_S3# indicates that the Battery Management
System sh uld turn n system p wer. Otherwise the Battery Management System must turn ff
system p wer.
PWRBTN# This signal is used t send a p wer- n request t the CPU m dule. The l w pulse sh uld be
ab ut 250 millisec nds l ng.
I2CLK I²C-bus cl ck line used f r c mmunicati n between Battery Management System c ntr ller and
system h st
I2DAT I²C-bus data line used f r c mmunicati n between Battery Management System c ntr ller and
system h st
SLP_S5# This signal is active l w when the system switches t the S5 (s ft ff) state.
4.4 Placement and Layout Considerations
The c nga-SBM²C is designed t minimize c mp nent c unt and lay ut c mplexity f
the carrier baseb ard but there is still the necessity t f ll w high p wer and n ise
separati n lay ut rules.
•Utilize en ugh trace width f r p wer rails such as 5V, battery rails, DC-in rails.
•Keep the trace length f the p wer rails sh rt.
•Keep p wer rails away fr m n ise sensitive COM Express™ signals (LVDS, IDE,
VGA, Ethernet, USB).
•Keep p wer rails away fr m n isy COM Express™ signals (PCICLK, etc.).
•Keep battery bus and COM Express™ I²C Bus away fr m n isy signals.
•R ute all I²C Buses and SMBuses CLK and DATA signals cl se t gether.
•Add ESD pr tective devices t signals where necessary
F r m re detailed inf rmati n ab ut high p wer lay ut rules c nsult literature f und n
the web.
C pyright © 2008 c ngatec AG SBM2Cm11 18/24

5 Power Button, Beeper and I/O
5.1 Power Button
The c nga-SBM²C is intended t be used t c ntr l the p wer f the c mplete system.
The signal is pulled-up internally s there is n need f r an external pull-up resist r n
the carrier baseb ard. Pull the signal l w by a pushbutt n t c ntr l the c nga-SBM²C
m dule. There is n need f r special deb unce c mp nents because the c ntr ller
nb ard the c nga-SBM²C will deb unce the pushbutt n signal via s ftware.
The pushbutt n behavi r is generally c mparable t the butt n in a standard ATX
system.
Button Down Time Functionality
120 ms < t < 4 s Turn n
Turn ff, shutd wn Wind ws
t > 4 s Instant ff
5.2 Beeper Control
The c nga-SBM²C pr vides an active high beeper utput signal. The maximum l ad n
this pin sh uld n t exceed 10mA. The utput v ltage level n this pin is 3.3V/5V and
f ll ws uC_VCC.
Beeper Functionality
3 beeps Warning level, c nfigurable
c ntinu us beep Alarm level, c nfigurable
5.3 I/O Control
The c nga-SBM²C supp rts the Philips/NXP PCA9555 I²C I/O c ntr ller
(http://www.nxp.c m). Y u can attach LEDs t indicate different m des and statuses.
The c nga-SBM²C addresses the PCA9555 using the addresses sh wn bel w.
I²C address HEX MSB LSB
7 bit 0x20 0 1 0 0 0 0 0
8 bit 0x40 0 1 0 0 0 0 0 R#/W
Make sure y u c nfigured the PCA9555 address jumpers t the specific address.
C pyright © 2008 c ngatec AG SBM2Cm11 19/24

The status LED utputs are c nfigured t be push utputs, theref re the LEDs sh uld
be c nnected with c mm n GND. Depending n the p wer supply v ltage f the
PCA9555, the selected series resistance t the LEDs must meet the LEDs' and
PCA9555's maximum current requirements.
The f ll wing table sh ws the behavi r f the different status LEDs that display
perating and battery status.
LED Functionality Port
LINE 18.0 V < Uin < 20 V
Flashing during charging
P0.5
PWRON All utput v ltages are n
Flashing in S3 m de
P0.4
GREEN2 SOC: 75% t 100% P0.0
GREEN1 SOC: 50% t 74% P0.1
YELLOW SOC: 25% t 49% P0.2
RED SOC: 0% t 24%
Flashing when SOC bel w c nfigurable level
P0.3
BAT1 EMPTY Flashing when SOC bel w c nfigurable level P0.6
BAT2 EMPTY Flashing when SOC bel w c nfigurable level P0.7
C pyright © 2008 c ngatec AG SBM2Cm11 20/24