Congatec Compact COM Express conga-CLX User manual

Compact COM Express™
conga-CLX
AMD Geode™ LX800 processor and AMD Geode™ CS5536 companion device
User’s Guide
Revision 1.0

Copyright © 2006 congatec AG C800m10 2/65
Revision History
Revision Date (dd.mm.yy) Author Changes
0.1 11.04.06 GDA Preliminary release
1.0 06.08.07 GDA Ofcial release. Changed document format and updated throughout.

Copyright © 2006 congatec AG C800m10 3/65
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-CLX. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specication
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualied personnel. It is not intended for general audiences.

Copyright © 2006 congatec AG C800m10 4/65
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHZ Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PATA Parallel ATA
T.O.M. Top of memory = max. DRAM installed
HDA High Denition Audio
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2006 congatec AG C800m10 5/65
Copyright Notice
Copyright © 2006, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted without
written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Intel and Pentium are registered trademarks of Intel Corporation. Expresscard is a registered trademark of Personal Computer Memory
Card International Association (PCMCIA). COM Express™ is a registered trademark of PCI Industrial Computer Manufacturers Group. PCI
Express is a registered trademark of Peripheral Component Interconnect Special Interest Group (PCI-SIG). I²C is a registered trademark of
Philips Corporation. CompactFlash is a registered trademark of CompactFlash Association. Winbond is a registered trademark of Winbond
Electronics Corp. AVR is a registered trademark of Atmel Corporation. ETX is a registered trademark of Kontron AG. AMICORE8 is a registered
trademark of American Megatrends Inc. Microsoft®, Windows®, Windows NT®, Windows CE®, Windows XP® and Windows Vista® are registered
trademarks of Microsoft Corporation. VxWorks is a registered trademark of WindRiver. conga, congatec and XTX are registered trademark of
congatec AG. All product names and logos are property of their owners.

Copyright © 2006 congatec AG C800m10 6/65
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”). congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec AG’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged or
replaced product is shipped by congatec AG, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec AG’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec AG makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec AG shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec AG, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only
COM Express™ Concept
COM Express™ is an open industry standard dened specically for COMs (computer on modules). It’s creation provides the ability to make a
smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express™ modules
are available in following form factors:
• Compact 95mm x 95mm (not specied by PICMG®)
• Basic 125mm x 95mm
• Extended 155mm x 110mm

Copyright © 2006 congatec AG C800m10 7/65
The COM Express™ specication 1.0 denes ve different pinout types.
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
congatec AG modules utilize the Type 2 pinout denition. They are equipped with two high performance connectors that ensure stable data
throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specic carrier board. COM modules
are a legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 2 pinout provides the ability to offer 32-bit PCI, Parallel ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use of
different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.
Certication
congatec AG is certied to DIN EN ISO 9001:2000 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]

Copyright © 2006 congatec AG C800m10 8/65
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.
conga-CLX Options Information
The conga-CLX is a Com Express™ module based on the Com Express™ Compact size form factor, which is 95mm x 95mm. It is currently
available in two different optional variants. This user’s guide describes both of these options. Below you will nd an order table showing the
different congurations that are currently offered by congatec AG. Check the table for the Part no./Order no. that applies to your product. This
will tell you what options described in this user’s guide are available on your particular module.
Part-No. 022478 084639
CPU AMD Geode™ LX800 500MHz AMD Geode™ LX800 500MHz
Cache 128 kByte 128 kByte
SATA 2x 2x
USB 2.0 4x 4x
LVDS Yes Yes
Gigabit Ethernet Yes Yes
TV-Out Yes No
Suspend to RAM (S3) Yes Yes
AC’97 Digital Audio Interface Yes Yes

Copyright © 2006 congatec AG C800m10 9/65
Contents
1 Specications........................................................................... 11
1.1 Feature List .............................................................................. 11
1.2 Supported Operating Systems................................................. 12
1.3 Mechanical Dimensions ........................................................... 12
1.4 Supply Voltage Standard Power .............................................. 13
1.5 Power Consumption................................................................. 13
1.5.1 conga-CLX 500MHz with 128 kByte cache ............................. 14
1.5.2 conga-CLX 500MHz with 128 kByte cache ............................. 14
1.6 Supply Voltage Battery Power ................................................. 15
1.6.1 CMOS Battery Power Consumption ........................................ 15
1.7 Environmental Specications................................................... 16
2 Block Diagram.......................................................................... 17
3 Heatspreader ........................................................................... 18
3.1 Heatspreader Dimensions ....................................................... 19
4 Connector Subsystems Rows A, B, C, D ................................. 20
4.1 Primary Connector Rows A and B............................................ 21
4.1.1 Serial ATA™............................................................................. 21
4.1.2 USB 2.0.................................................................................... 21
4.1.3 AC’97 Digital Audio Interface ................................................... 21
4.1.4 Gigabit Ethernet ...................................................................... 21
4.1.5 LPC Bus................................................................................... 22
4.1.6 I²C Bus 400kHz........................................................................ 22
4.1.7 PCI Express™ ......................................................................... 22
4.1.8 ExpressCard™......................................................................... 22
4.1.9 Graphics Output (VGA/CRT) ................................................... 22
4.1.10 LCD.......................................................................................... 22
4.1.11 TV-Out (optional)...................................................................... 22
4.1.12 Power Control .......................................................................... 23
4.1.13 Power Management................................................................. 24
4.2 Secondary Connector Rows C and D ...................................... 24
4.2.1 PCI Bus.................................................................................... 24
4.2.2 IDE ........................................................................................... 24
5 Additional Features .................................................................. 25
5.1 Watchdog................................................................................. 25
5.2 Onboard Microcontroller .......................................................... 25
5.3 Embedded BIOS ...................................................................... 25
5.3.1 Simplied Overview of BIOS Setup Data Backup.................... 26
5.4 Suspend to Ram ...................................................................... 27
5.5 congatec Battery Management Interface ................................. 27
6 Signal Descriptions and Pinout Tables..................................... 28
6.1 A-B Connector Signal Descriptions.......................................... 29
6.2 A-B Connector Pinout .............................................................. 36
6.3 C-D Connector Signal Descriptions ......................................... 38
6.4 C-D Connector Pinout.............................................................. 42
6.5 Boot Strap Signals ................................................................... 44
7 System Resources................................................................... 45
7.1 System Memory Map ............................................................... 45
7.2 I/O Address Assignment........................................................... 46
7.3 Interrupt Request (IRQ) Lines.................................................. 47
7.4 Direct Memory Access (DMA) Channels.................................. 48
7.5 PCI Conguration Space Map ................................................. 49
7.6 PCI Interrupt Routing Map ....................................................... 49
7.7 PCI Bus Masters ...................................................................... 50
7.8 I²C Bus ..................................................................................... 50
7.9 SM Bus .................................................................................... 50
7.10 LPC Bus................................................................................... 50
8 BIOS Setup Description ........................................................... 51
8.1 Starting the BIOS setup program............................................. 51
8.2 Setup Menu and Navigation..................................................... 51
8.3 Main Setup............................................................................... 52
8.4 Board Information .................................................................... 52
8.5 Device Conguration................................................................ 53
8.5.1 Drive Conguration Submenu.................................................. 53
8.5.2 Graphics Conguration Submenu............................................ 54
8.5.3 Cache Conguration Submenu................................................ 55

Copyright © 2006 congatec AG C800m10 10/65
8.5.4 PCI Conguration Submenu .................................................... 55
8.5.5 I/O Interface Conguration Submenu ...................................... 56
8.5.6 USB Conguration Submenu................................................... 57
8.5.7 Watchdog Conguration Submenu .......................................... 58
8.5.8 Hardware Monitoring Submenu ............................................... 59
8.5.9 Boot Screen Conguration Submenu ...................................... 59
8.6 Performance Control................................................................ 60
8.7 Power Management................................................................. 61
8.8 Boot Device Priority ................................................................. 63
9 Additional BIOS Features ........................................................ 64
9.1 Updating the BIOS ................................................................... 64
10 Industry Specications............................................................. 65

Copyright © 2006 congatec AG C800m10 11/65
1 Specications
1.1 Feature List
Table 1 Feature Summary
Form Factor Based on Com Express™ standard pinout Type 2 (Compact size 95 x 95mm)
Processor AMD Geode™ LX800 500MHz with 128 kbyte cache
Memory SO-DIMM DDR (up to PC2700) maximum 1-GByte
Chipset AMD Geode™ CS5536 companion device
Gigabit Ethernet Realtek RTL8110SCL
Graphics Options Unied Memory Architecture (UMA) with a maximum of 16MB hardware frame buffer compression. 2-254MB graphics memory space.
CRT Interface
350 MHz RAMDAC Resolutions up to 1920x1440 @ 85Hz
Flatpanel Interface
External LVDS Transmitter
Supports 1x18Bit TFT congurations
Automatic Panel Detection via EPI (Embedded Panel Interface based on VESA
EDID™ 1.3)
Resolutions 640x480 up to 1024x768 (XGA)
•
•
Motion Video Support
Hardware Up- and Downscaling
High denition digital video support
Alpha blending and color keying
TV Out
External TV encoder
Supports component + S-Video
Supports HDTV (420p, 720p & 1080i)
•
•
Peripheral Interfaces
COM Express™ Type 2
Pinout
2x Serial ATA®
PCI Bus Rev. 2.2
LPC Bus
1x EIDE (UDMA-66/100)
•
•
•
•
I²C Bus, Fast Mode (400 kHz)
4x USB 2.0 (EHCI)
AC’97 Digital Audio Interface
•
•
•
BIOS Based on Insyde XpressROM 1MByte Flash BIOS with congatec Embedded BIOS features.
Power Management ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3).
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 8 of this user’s guide to determine what options are available on your particular module.

Copyright © 2006 congatec AG C800m10 12/65
1.2 Supported Operating Systems
The conga-CLX supports the following operating systems.
Microsoft® Windows® XP/2000
Microsoft® Windows® XP Embedded
Microsoft® Windows® CE 5.0 / 6.0
•
•
•
Windriver VXWorks
Linux
QNX
•
•
•
1.3 Mechanical Dimensions
95.0 mm x 95.0 mm @ (3.75” x 3.75”)
Height approx. 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height) carrier board
connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used then approximate overall
height is 21mm.
•
•

Copyright © 2006 congatec AG C800m10 13/65
1.4 Supply Voltage Standard Power
12V DC ± 5%
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 2 (dual connector, 440 pins).
Power Rail Module Pin Current
Capability (Amps)
Nominal Input
(Volts)
Input Range
(Volts)
Derated Input
(Volts)
Max. Input
Ripple
(mV)
Max. Module Input Power
(w. derated input)
(Watts)
Assumed
Conversion
Efciency
Max. Load
Power
(Watts)
VCC_12V 16.5 12 11.4-12.6 11.4 +/- 100 188 85% 160
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
1.5 Power Consumption
The power consumption values listed in this document were measured under a controlled environment. The hardware used includes a conga-CLX
module, conga-CEVAL and conga-Cdebug carrier boards, CRT monitor, SATA drive, and USB keyboard. When using the conga-Cdebug, the
SATA drive was powered externally by an ATX power supply so that it does not inuence the power consumption value that is measured for
the module. The USB keyboard was detached once the module was congured within the OS. The module was rst inserted into the conga-
Cdebug, which was powered by a Direct Current (DC) power supply set to output 12V. The current consumption value displayed by the DC
power supply’s readout is the value that is recorded as the power consumption measurement for Desktop Idle, 100% Workload and Standby
modes. The power consumption of the conga-Cdebug (without module attached) was measured and this value was later subtracted from the
overall power consumption value measured when the module and all peripherals were connected. All recorded values are approximate.
The conga-Cdebug does not provide 5V Standby power therefore S3 mode was measured using the conga-CEVAL powered by an ATX power
supply with a multimeter attached to the 5V Standby power line. The 5V Standby power consumption of the conga-CEVAL (without module
attached) and all peripherals connected was rst measured and the resulting value was later subtracted from the overall S3 power consumption
value measured when the module was attached. All S3 recorded values are approximate.
The module was measured while running Windows XP Professional with SP2 (service pack 2) and the “Power Scheme” was set to “Portable/
Laptop”. The screen resolution was set to 800x600 32bit High Color. The conga-CLX was tested while using a swissbit® DDR PC2700 512MB
memory module. Using different sizes of RAM will cause slight variances in the measured results.
•

Copyright © 2006 congatec AG C800m10 14/65
Power consumption values were recorded during the following stages:
Windows XP Professional SP2
Desktop Idle
100% CPU workload (see note below)
Windows Standby (see note below)
Suspend to RAM (requires setup node “Suspend Mode Control” in BIOS to be congured to S3-State (suspend to RAM)). Supply power for
S3 mode is 5V.
Note
ACPI OS Standby = S1 = POS = CPU is in sleep mode (internal clocks stopped, no snoops). A software tool was used to stress the CPU to
100% workload.
1.5.1 conga-CLX 500MHz with 128 kByte cache
With 512MB memory installed
conga-CLX Art. No.022478
TV-Out variant
AMD Geode™ LX800 500MHz with 128 kByte cache
Layout Rev. C800LB0 /BIOS Rev. C800R110
Memory Size 512MB
Operating System Windows XP Professional SP2
Power State Desktop Idle 100% workload Standby Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.6 A/7.2 W (12V) 0.8 A/9.6 W (12V) 0.3 A/3.6 W (12V) 0.4 A/2 W (5V)
1.5.2 conga-CLX 500MHz with 128 kByte cache
With 512MB memory installed
conga-CLX Art. No.084639 AMD Geode™ LX800 500MHz with 128 kByte cache
Layout Rev. /BIOS Rev.
Memory Size 512MB
Operating System Windows XP Professional SP2
Power State Desktop Idle 100% workload Standby Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) TBD (12V) TBD (12V) TBD (12V) TBD (5V)
•
•
•
•

Copyright © 2006 congatec AG C800m10 15/65
Note
All recorded power consumption values are approximate and only valid for the controlled environment described earlier. 100% workload refers
to the CPU workload and not the maximum workload of the complete module. Supply power for S3 mode is 5V while all other measured modes
are supplied with 12V power. Power consumption results will vary depending on the workload of other components such as graphics engine,
memory, etc.
1.6 Supply Voltage Battery Power
2.4-3.6V
Typical 3.0V
1.6.1 CMOS Battery Power Consumption
RTC @ 20ºC Voltage Current
Integrated in the
AMD Geode™ CS5536
companion device
3V DC 2.17 µA
The CMOS battery power consumption value listed above should not be used to calculate CMOS battery lifetime. You should measure the
CMOS battery power consumption in your customer specic application in worst case conditions, for example during high temperature and
high battery voltage. The self-discharge of the battery must also be considered when determining CMOS battery lifetime. For more information
about calculating CMOS battery lifetime refer to application note AN9_RTC_Battery_Lifetime.pdf, which can be found on the congatec AG
website at www.congatec.com.
•
•

Copyright © 2006 congatec AG C800m10 16/65
1.7 Environmental Specications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a heatspreader the maximum operating temperature
refers to any measurable spot on the heatspreader’s surface.
congatec AG strongly recommends that you use the appropriate congatec module heatspreader as a thermal interface between the module
and your application specic cooling solution.
If for some reason it is not possible to use the appropriate congatec module heatspreader, then it is the responsibility of the operator to ensure
that all components found on the module operate within the component manufacturer’s specied temperature range.
For more information about operating a congatec module without heatspreader contact congatec technical support.
Humidity specications are for non-condensing conditions.

Copyright © 2006 congatec AG C800m10 17/65
2 Block Diagram
C-D
A-B
CS5536
AMD GEODE™
Companion Device
RTC CPU
AMD GEODE™ LX800
500MHz
128kbyte L2 cache
FWH
(BIOS)
LVDS
National Semi.
DS90C363
SATA
VIA
VT6421
Realtek
RTL8110SCL
Gigabit Ethernet
TV
Focus
FS453
Board Controller
Atmel
ATmega168
Watchdog
H/W Monitor
and
GPIO Device
Windbond
W83627HG
DDR-SODIMM
Socket
Memory Bus
(200MHz)
TV-Out
LVDS
CRT
LPC Bus
USB 2.0 (4x)
AC’97 Digital Audio I/F
PCI Bus PCI Bus
PCI Bus
PCI Bus
SATA (2x)
LAN
Primary IDE
SPI
I²C
SM Bus
C-D
A-B
CS5536
AMD GEODE™
Companion Device
RTC CPU
AMD GEODE™ LX800
500MHz
128kbyte L2 cache
FWH
(BIOS)
LVDS
National Semi.
DS90C363
SATA
VIA
VT6421
Realtek
RTL8110SCL
Gigabit Ethernet
TV
Focus
FS453
Board Controller
Atmel
ATmega168
Watchdog
H/W Monitor
and
GPIO Device
Windbond
W83627HG
DDR-SODIMM
Socket
Memory Bus
(200MHz)
TV-Out
LVDS
CRT
LPC Bus
USB 2.0 (4x)
AC’97 Digital Audio I/F
PCI Bus PCI Bus
PCI Bus
PCI Bus
SATA (2x)
LAN
Primary IDE
SPI
I²C
SM Bus

Copyright © 2006 congatec AG C800m10 18/65
3 Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module. It
is a 3mm thick aluminum plate.
The heatspreader is thermally coupled to the CPU via a thermal gap ller and on some modules it may also be thermally coupled to other heat
generating components with the use of additional thermal gap llers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed to be used as a thermal interface between the module and the application specic thermal solution. The
application specic thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal
solutions may also require that the heatspreader is attached directly to the systems chassis therefore using the whole chassis as a heat
dissipater.
Caution
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.

Copyright © 2006 congatec AG C800m10 19/65
3.1 Heatspreader Dimensions
Note
All measurements are in millimeters. Torque specication for heatspreader screws is 0.5 Nm.

Copyright © 2006 congatec AG C800m10 20/65
4 Connector Subsystems Rows A, B, C, D
The conga-CLX is connected to the carrier board via two 220-pin connectors (COM Express Type 2 pinout) for a total of 440 pins connectivity.
These connectors are broken down into four rows. The primary connector consists of rows A and B while the secondary connector consists of
rows C and D.
In this view the connectors are seen “through” the module.
C-D
A-B
A-B
2x Serial ATA
4x USB 2.0
AC’97 Digital Audio I/F
Gigabit Ethernet
LPC Bus
I²C Bus 400 kHz
VGA (CRT)
LVDS
TV-Out
Power Control
Power Management
C-D
PCI Bus
IDE 1x (Primary)
top view
C-D
A-B
A-B
2x Serial ATA
4x USB 2.0
AC’97 Digital Audio I/F
Gigabit Ethernet
LPC Bus
I²C Bus 400 kHz
VGA (CRT)
LVDS
TV-Out
Power Control
Power Management
C-D
PCI Bus
IDE 1x (Primary)
top view