Congatec XTX conga-XLX User manual

XTX™
conga-XLX
AMD Geode™ LX processors with an AMD Geode™ CS5536
companion device
User's Guide
evision 1.2

Revision History
Revision Date (dd.mm.yy) Author Changes
1.0 20.02.06 GDA Initial release
1.1 20.09.06 GDA Updated Power Consumption Tables in section 1. . Added CMOS
backup battery information. Updated heatspreader drawing. Added
section .3.1 Simplified Overview of BIOS Setup Data Backup. Added
Note and Caution statement found below PCI Signal Description Table 4
in section 6.1. Updated BIOS Setup Description section section 8.
1.2 06.08.07 GDA Added Electrostatic Sensitive Device information. Changed all audio
codec references to ALC203. ALC6 8 is no longer used on conga-XLX.
Added section 1.4 Electrical Characteristics and 1.4.1 Supply Voltage
Ripple. Added description for PP_TPM pin 60 on X2 connector. Added
information about center mounting hole to 'Caution' statement in section
3 Heatspreader. Added information to 'Caution' statement in section
4.1.4 Onboard Generated Supply Voltage. Added note about floppy
cable to section 4.3.6 Parallel Port/Floppy Interface. Added section .
'congatec Battery Management Interface'. Added LVDS signal mapping
to table 17 LVDS Interface Pinout. Updated section 7 System Resources
and section 8 BIOS Setup Description.
Copyright © 2006 congatec AG X800m12 2/72

Pre ace
This user's guide provides information about the components, features, connectors and
BIOS Setup menus available on the conga-XLX. It is one of four documents that should
be referred to when designing an XTXTM application. The other reference documents
that should be used include the following:
XTX™ Design Guide XTX™ Specification
ETX® Design Guide
The links to these documents can be found on the congatec AG website at
www.congatec.com
Disclaimer
The information contained within this user's guide, including but not limited to any
product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user's guide or any other
information contained herein and hereby expressly disclaims any implied warranties of
merchantability or fitness for any particular purpose with regard to any of the foregoing.
congatec AG assumes no liability for any damages incurred directly or indirectly from
any technical or typographical errors or omissions contained herein or for discrepancies
between the product and the user's guide. In no event shall congatec AG be liable for
any incidental, consequential, special, or exemplary damages, whether based on tort,
contract or otherwise, arising out of or in connection with this user's guide or any other
information contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for
general audiences.
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright © 2006 congatec AG X800m12 3/72

Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHZ Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048, 76 bytes)
Mbit Megabit (1,048, 76 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
T.O.M. Top of memory = max. DRAM installed
SATA Serial ATA
PATA Parallel ATA
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined
Copyright Notice
Copyright © 2006, congatec AG. All rights reserved. All text, pictures and graphics are
protected by copyrights. No copying is permitted without written permission from
congatec AG.
congatec AG has made every attempt to ensure that the information in this document is
accurate yet the information contained within is supplied “as-is”.
Trademarks
AMD is a trademark of Advanced Micro Devices, Inc. Expresscard is a registered
trademark of Personal Computer Memory Card International Association (PCMCIA). PCI
Express is a registered trademark of Peripheral Component Interconnect Special
Interest Group (PCI-SIG). I²C is a registered trademark of Philips Corporation.
CompactFlash is a registered trademark of CompactFlash Association. Winbond is a
registered trademark of Winbond Electronics Corp. AVR is a registered trademark of
Atmel Corporation. ETX is a registered trademark of Kontron AG. XpressROM is a
registered trademark of Insyde Technology, Inc. Microsoft®, Windows®, Windows NT®,
Windows CE and Windows XP® are registered trademarks of Microsoft Corporation.
VxWorks is a registered trademark of WindRiver. conga, congatec and XTX are
registered trademark of congatec AG. All product names and logos are property of their
owners.
Copyright © 2006 congatec AG X800m12 4/72

Warranty
congatec AG makes no representation, warranty or guaranty, express or implied
regarding the products except its standard form of limited warranty ("Limited Warranty").
congatec AG may in its sole discretion modify its Limited Warranty at any time and from
time to time.
Beginning on the date of shipment to its direct customer and continuing for the
published warranty period, congatec AG represents that the products are new and
warrants that each product failing to function properly under normal use, due to a defect
in materials or workmanship or due to non conformance to the agreed upon
specifications, will be repaired or exchanged, at congatec AG's option and expense.
Customer will obtain a Return Material Authorization ("RMA") number from congatec AG
prior to returning the non conforming product freight prepaid. congatec AG will pay for
transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty
period in effect as of the date the repaired, exchanged or replaced product is shipped by
congatec AG, or the remainder of the original warranty, whichever is longer. This
Limited Warranty extends to congatec AG's direct customer only and is not assignable
or transferable.
Except as set forth in writing in the Limited Warranty, congatec AG makes no
performance representations, warranties, or guarantees, either express or implied, oral
or written, with respect to the products, including without limitation any implied warranty
(a) of merchantability, (b) of fitness for a particular purpose, or (c) arising from course of
performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential
damages of any kind. congatec AG shall not otherwise be liable for loss, damage or
expense directly or indirectly arising from the use of the product or from any other
cause. The sole and exclusive remedy against congatec AG, whether a claim sound in
contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only
Technical Support
congatec AG technicians and engineers are committed to providing the best possible
technical support for our customers so that our products can be easily used and
implemented. We request that you first visit our website at www.congatec.com for the
latest documentation, utilities and drivers, which have been made available to assist
you. If you still require assistance after visiting our website then contact our technical
support department by email at [e-mail]
Copyright © 2006 congatec AG X800m12 /72

ETX® Concept and XTXTM Extension
The ETX® concept is an off the shelf, multi vendor, Single-Board-Computer that
integrates all the core components of a common PC and is mounted onto an application
specific baseboard. ETX® modules have a standardized form factor of 9 mm x 114mm
and have specified pinouts on the four system connectors that remain the same
regardless of the vendor. The ETX® module provides most of the functional
requirements for any application. These functions include, but are not limited to,
graphics, sound, keyboard/mouse, IDE, Ethernet, parallel, serial and USB ports. Four
ruggedized connectors provide the baseboard interface and carry all the I/O signals to
and from the ETX® module.
Baseboard designers can utilize as little or as many of the I/O interfaces as deemed
necessary. The baseboard can therefore provide all the interface connectors required to
attach the system to the application specific peripherals. This versatility allows the
designer to create a dense and optimized package, which results in a more reliable
product while simplifying system integration. Most importantly ETX® applications are
scalable, which means once a product has been created there is the ability to diversify
the product range through the use of different performance class ETX® modules. Simply
unplug one module and replace it with another, no redesign is necessary.
XTX™ is an expansion and continuation of the well-established and highly successful
ETX® standard. XTX™ offers the newest I/O technologies on this proven form factor.
Now that the ISA bus is being used less and less in modern embedded applications
congatec AG offers an array of different features on the X2 connector than those
currently found on the ETX® platform. These features include new serial high speed
buses such as PCI Express™ and Serial ATA®. All other signals found on connectors
X1, X3, and X4 remain the same in accordance to the ETX® standard (Rev. 2.7) and
therefore will be completely compatible. If the embedded PC application still requires the
ISA bus then an ISA bridge can be implemented on the application specific baseboard
or the readily available LPC bus located on the XTX™ module may be used. Contact
congatec technical support for details.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely
RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged
accordingly. Do not open or handle a congatec AG product except at an
electrostatic-free workstation. Additionally, do not ship or store congatec AG products
near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the
device is contained within its original manufacturer's packaging. Be aware that failure to
comply with these guidelines will void the congatec AG Limited Warranty.
Copyright © 2006 congatec AG X800m12 6/72

Certi ication
congatec AG is certified to DIN EN ISO 9001:2000 standard.
conga-XLX Options In ormation
The conga-XLX is currently available in two different optional variants. This user's guide
describes both of these options. Below you will find an order table showing the different
configurations that are currently offered by congatec AG. Check the table for the Part
no./Order no. that applies to your product. This will tell you what options described in
this user's guide are available on your particular module.
Part-No. 057824 084267
CPU AMD Geode™ LX800 00MHz AMD Geode™ LX800 00MHz
Cache 128 kByte 128 kByte
SATA 2x 2x
USB 2.0 4x 4x
LVDS Yes No
TTL No Yes
TV-Out No Optional (see note below)
Suspend to RAM (S3) Yes Yes
AC'97 Digital Audio Inter ace Yes Yes
Note
TV- ut is optional only on the conga-XLX TTL variant. Ask your local congatec
representative about ordering information for the conga-XLX with the TV- ut feature.
Copyright © 2006 congatec AG X800m12 7/72

Contents
1 Specifications............................................................................................................................. 11
1.1 Feature List............................................................................................................................. 11
1.2 Supported Operating Systems................................................................................................ 12
1.3 Mechanical Dimensions........................................................................................................... 12
1.4 Supply Voltage Standard Power.............................................................................................. 12
1.4.1 Supply Voltage Ripple.......................................................................................................... 13
1. Power Consumption................................................................................................................ 13
1. .1 conga-XLX 00MHz with 128 kByte cache........................................................................... 14
1. .2 conga-XLX 00MHz with 128 kByte cache........................................................................... 14
1.6 Supply Voltage Battery Power................................................................................................. 1
1.6.1 CMOS Battery Power Consumption..................................................................................... 1
1.7 Environmental Specifications.................................................................................................. 1
2 Block Diagram............................................................................................................................ 16
3 Heatspreader............................................................................................................................. 17
3.1 Heatspreader Dimensions....................................................................................................... 18
4 Connector Subsystems.............................................................................................................. 19
4.1 Connector X1.......................................................................................................................... 19
4.1.1 PCI Bus................................................................................................................................ 19
4.1.2 USB 2.0................................................................................................................................ 19
4.1.3 Audio.................................................................................................................................... 20
4.1.4 Onboard Generated Supply Voltage.................................................................................... 20
4.2 Connector X2 (XTX™ Extension)............................................................................................ 21
4.2.1 LPC...................................................................................................................................... 21
4.2.2 USB 2.0................................................................................................................................ 21
4.2.3 Serial ATA™ ....................................................................................................................... 21
4.2.4 PCI Express™ ..................................................................................................................... 21
4.2. ExpressCard™ .................................................................................................................... 21
4.2.6 AC'97 Digital Audio............................................................................................................... 22
4.2.7 Extended System Management........................................................................................... 22
4.3 Connector X3.......................................................................................................................... 23
4.3.1 Graphics............................................................................................................................... 23
4.3.2 LCD...................................................................................................................................... 23
4.3.3 TV-Out.................................................................................................................................. 23
4.3.4 Serial Ports (1 and 2)........................................................................................................... 23
4.3. Serial Infrared Interface........................................................................................................ 23
4.3.6 Parallel Port/Floppy Interface............................................................................................... 23
4.3.7 Keyboard/Mouse.................................................................................................................. 24
4.4 Connector X4.......................................................................................................................... 2
4.4.1 IDE....................................................................................................................................... 2
4.4.2 Ethernet................................................................................................................................ 2
4.4.3 I²C Bus 400kHz.................................................................................................................... 2
4.4.4 Power Control....................................................................................................................... 2
4.4. Power Management............................................................................................................. 27
Copyright © 2006 congatec AG X800m12 8/72

Additional Features.................................................................................................................... 28
.1 Watchdog................................................................................................................................ 28
.2 Onboard Microcontroller.......................................................................................................... 28
.3 Embedded BIOS..................................................................................................................... 28
.3.1 Simplified Overview of BIOS Setup Data Backup................................................................. 29
.4 Security Feature...................................................................................................................... 30
. congatec Battery Management Interface................................................................................. 30
6 Signal Descriptions and Pinout Tables....................................................................................... 31
6.1 X1 Connector Signal Descriptions........................................................................................... 31
6.2 Connector X1 Pinout............................................................................................................... 34
6.3 X2 Connector Signal Descriptions (XTX™ extension)............................................................. 3
6.4 X2 Connector Pinout............................................................................................................... 39
6. X3 Connector Signal Descriptions........................................................................................... 41
6.6 X4 Connector Signal Descriptions........................................................................................... 47
6.7 X4 Connector Pinout............................................................................................................... 49
6.8 Boot Strap Signals................................................................................................................... 0
7 System Resources..................................................................................................................... 1
7.1 System Memory Map............................................................................................................... 1
7.2 I/O Address Assignment.......................................................................................................... 2
7.3 Interrupt Request (IRQ) Lines................................................................................................. 3
7.4 Direct Memory Access (DMA) Channels................................................................................. 4
7. PCI Configuration Space Map................................................................................................. 4
7.6 PCI Interrupt Routing Map.......................................................................................................
7.7 PCI Bus Masters.....................................................................................................................
7.8 I²C Bus....................................................................................................................................
7.9 SM Bus....................................................................................................................................
7.10 LPC Bus................................................................................................................................
8 BIOS Setup Description............................................................................................................. 6
8.1 Starting the BIOS setup program............................................................................................ 6
8.1.1 Manufacturer Default Settings.............................................................................................. 6
8.2 Setup Menu and Navigation.................................................................................................... 6
8.3 Main Menu............................................................................................................................... 7
8.4 Board Information.................................................................................................................... 7
8. Device Configuration............................................................................................................... 8
8. .1 Drive Configuration Submenu.............................................................................................. 9
8. .2 Graphics Configuration Submenu........................................................................................ 60
8. .3 Cache Configuration Submenu............................................................................................ 60
8. .4 PCI Configuration Submenu................................................................................................. 61
8. . I/O Interface Configuration Submenu................................................................................... 62
8. .6 External Super I/O Configuration Submenu......................................................................... 63
8. .7 USB Configuration Submenu............................................................................................... 64
8. .8 Watchdog Configuration Submenu...................................................................................... 6
8. .9 Hardware Monitoring Submenu............................................................................................ 66
8. .10 Boot Screen Configuration Submenu................................................................................. 66
8.6 Performance Control............................................................................................................... 67
8.7 Power Management................................................................................................................ 68
8.8 Boot Device Priority................................................................................................................. 70
Copyright © 2006 congatec AG X800m12 9/72

9 Additional BIOS Features........................................................................................................... 71
9.1 Updating the BIOS.................................................................................................................. 71
10 Industry Specifications............................................................................................................. 72
Copyright © 2006 congatec AG X800m12 10/72

1 Speci ications
1.1 Feature List
Table 1 Feature Summary
Form Factor ETX® standard (Rev. 2.7) with XTXTM extension
Processor AMD Geode™ LX800 00MHz with 128 kByte cache
Memory SO-DIMM DDR (up to PC2700) maximum 1-GByte
Chipset AMD Geode™ CS 36 companion device
Audio Realtek ALC203 AC'97 Rev. 2.2 compatible.
Ethernet Realtek RTL8100C
Graphics Options Similar to GX graphics core but with strong improvements. Unified Memory Architecture
(UMA) with a maximum of 16MB hardware frame buffer compression. 2-2 4MB graphics
memory space.
•CRT Interface
3 0 MHz RAMDAC
Resolutions up to 1920x1440 @ 8 Hz
•Flat panel Interface
External LVDS Transmitter
Supports 1x18Bit TFT configurations
Automatic Panel Detection via EPI
(Embedded Panel Interface based on
VESA EDID™ 1.3)
Resolutions 640x480 up to 1024x768
(XGA)
Optional direct TTL interface, max.
resolution 1024x768 1x18Bit
•Motion Video Support
Hardware Up- and Downscaling
High definition digital video support
Alpha blending and color keying
•TV Out (optional)
External TV encoder
Supports component + S-Video
Supports HDTV (420p, 720p & 1080i)
Super I/O Winbond 83627HG
Peripheral Inter aces •2x Serial ATA®
•PCI Bus Rev. 2.2
•LPC Bus (no ISA Bus)
•2x EIDE (UDMA-66/100)
•4x USB 2.0 (EHCI)
•AC'97 Digital Audio Interface
•I2C Bus, Fast Mode (400 kHz)
•Floppy (shared with LPT)
•LPT (EEP/ECP, shared with floppy)
•2 x COM Ports, TTL Level
•1 x IrDA Port
•PS/2 Keyboard, Mouse
BIOS Based on Insyde XpressROM 1MByte Flash BIOS with congatec Embedded BIOS
features
Power Management ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3).
Note
Some of the features mentioned in the above Feature Summary are optional. Check the
article number of your module and compare it to the option information list on page 7 of
this user's guide to determine what options are available on your particular module.
Copyright © 2006 congatec AG X800m12 11/72

1.2 Supported Operating Systems
The conga-XLX supports the following operating systems.
•Microsoft® Windows® XP/2000
•Microsoft® Windows ®XP Embedded
•Microsoft® Windows® CE .0 / 6.0
•Windriver VXWorks
•Linux
•QNX
1.3 Mechanical Dimensions
•9 .0 mm x 114.0 mm (3.7 ” x 4. ”)
•Height approx. 12mm (0.4”)
1.4 Supply Voltage Standard Power
Characteristics Min Typ Max Units Comment
5V Voltage +/- % 4.7 .00 .2 Vdc
Ripple - - 100 mVpp 0-20MHz
Current See section 1. 'Power Consumption' for supply current information.
5V_SB Voltage +/- % 4.7 .00 .2 Vdc
Current 2 0 mA
Copyright © 2006 congatec AG X800m12 12/72

1.4.1 Supply Voltage Ripple
•Maximum 100mV peak to peak 0-20Mhz
You must ensure that the dynamic range does not exceed the static range.
1.5 Power Consumption
The power consumption values listed in this document were measured under a
controlled environment. The XTX module was mounted into a special baseboard. This
baseboard has two Hirose connectors that connect to the corresponding X3 and X4
connectors on the module. The special baseboard does not have any power consuming
components mounted on it. It provides one connector for a CRT monitor connection, a
PS2 keyboard and mouse connection, and an IDE device connection. The baseboard is
powered by a Direct Current (DC) power supply that is set to output Volts and is
connected directly to the special baseboard. Additionally, positive and negative sense
lines are connected to the baseboard in order to measure the current consumption of
the module. This current consumption value is displayed by the DC power supply's
readout and this is the value that is recorded as the power consumption measurement.
All recorded values are approximate.
All external peripheral devices, such as the hard drive, are externally powered so that
they do not influence the power consumption value that is measured for the module.
This ensures the value measured reflects the true power consumption of the module
and only the module. A keyboard is used to configure the module and then it is
disconnected before the measurement is recorded. If the keyboard remained
connected, an additional current consumption of approximately 10 mA is noticed.
Each module was measured while running Windows XP Professional with SP2 (service
pack 2) and the “Power Scheme” was set to “Portable/Laptop”. The screen resolution
Copyright © 2006 congatec AG X800m12 13/72

was set to 800x600 32bit High Color. The “Performance Control” was set to the BIOS
default value “Manual Settings”, which is 00MHz CPU clock speed. The conga-XLX
was tested while using a swissbit® DDR PC2700 12MB memory module. Using
different sizes of RAM will cause slight variances in the measured results. Power
consumption values were recorded during the following stages:
Windows XP Pro essional SP2
•Desktop Idle
•100% CPU workload (see note below)
•Windows Standby (see note below)
•Suspend to RAM (requires setup node “Suspend Mode Control” in BIOS to be
configured to S3-State (suspend to RAM)).
Note
A software tool was used to stress the CPU to 100% workload.
ACPI S Standby = S1 = P S = CPU is in sleep mode (internal clocks stopped, no
snoops)
1.5.1 conga-XLX 500MHz with 128 kByte cache
With 512MB memory installed
conga-XLX Art. No. 057824
LVDS variant
AMD Geode™ LX800 500MHz with 128 kByte cache
Layout Rev. X800LA0 /BIOS Rev. X800R114
Memory Size 12MB
Operating System Windows XP Professional SP2
Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)
Power consumption (measured
in Amperes/Watts)
1.2 A/6 W 1.5 A/7.5 W 1.0 A/5 W 0.2 A/1 W
1.5.2 conga-XLX 500MHz with 128 kByte cache
With 512MB memory installed
conga-XLX Art. No. 084267
TTL variant
AMD Geode™ LX800 500MHz with 128 kByte cache
Layout Rev. X800LA0 /BIOS Rev. X800R114
Memory Size 12MB
Operating System Windows XP Professional SP2
Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)
Power consumption (measured
in Amperes/Watts)
1.3 A/6.5 W 1.7 A/8.5 W 1.1 A/5.5 W 0.2 A/1 W
Copyright © 2006 congatec AG X800m12 14/72

1.6 Supply Voltage Battery Power
•2.4-3.6V
•Typical 3.0V
1.6.1 CMOS Battery Power Consumption
RTC @ 20ºC Voltage Current
Integrated in the
AMD Geode™ CS 36
companion device
3V DC 1. 3 µA
The CMOS battery power consumption value listed above should not be used to
calculate CMOS battery lifetime. You should measure the CMOS battery power
consumption in your customer specific application in worst case conditions, for example
during high temperature and high battery voltage. The self-discharge of the battery must
also be considered when determining CMOS battery lifetime. For more information
about calculating CMOS battery lifetime refer to application note
AN9_RTC_Battery_Lifetime.pdf, which can be found on the congatec AG website at
www.congatec.com.
1.7 Environmental Speci ications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: % to 9 %
Caution
The above operating temperatures must be strictly adhered to at all times. When using
a heatspreader the maximum operating temperature refers to any measurable spot on
the heatspreader's surface.
congatec AG strongly recommends that you use the appropriate congatec module
heatspreader as a thermal interface between the module and your application specific
cooling solution.
If for some reason it is not possible to use the appropriate congatec module
heatspreader, then it is the responsibility of the operator to ensure that all components
found on the module operate within the component manufacturer's specified
temperature range.
For more information about operating a congatec module without heatspreader contact
congatec technical support.
Humidity specifications are for non-condensing conditions.
Copyright © 2006 congatec AG X800m12 1 /72

2 Block Diagram
Copyright © 2006 congatec AG X800m12 16/72

3 Heatspreader
An important factor for each system integration is the thermal design. The heatspreader
acts as a thermal coupling device to the module. It is a 2mm thick aluminum plate.
The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some
modules it may also be thermally coupled to other heat generating components with the
use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by
the module is dissipated, it is not to be considered as a heatsink. It has been designed
to be used as a thermal interface between the module and the application specific
thermal solution. The application specific thermal solution may use heatsinks with fans,
and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions
may also require that the heatspreader is attached directly to the systems chassis
therefore using the whole chassis as a heat dissipater.
Caution
The center mounting hole on the heatspreader must be used to ensure that all
components that are required to make contact with heatspreader do so. Failure to utilize
the center mounting hole will result in improper contact between these components and
heatspreader thereby reducing heat dissipation efficiency.
Attention must be given to the mounting solution used to mount the heatspreader and
module into the system chassis. Do not use a threaded heatspreader together with
threaded carrier board standoffs. The combination of the two threads may be
staggered, which could lead to stripping or cross-threading of the threads in either the
standoffs of the heatspreader or carrier board.
For more information about this subject refer to Application Note
AN14_ETX_XTX_Mounting_Solutions.pdf that can be found on the congatec website.
Copyright © 2006 congatec AG X800m12 17/72

3.1 Heatspreader Dimensions
Note
All measurements are in millimeters. Torque specification for heatspreader screws is
0.5 Nm.
Copyright © 2006 congatec AG X800m12 18/72

4 Connector Subsystems
In this view the connectors are seen “through” the module.
4.1 Connector X1
The following subsystems can be found on connector X1.
4.1.1 PCI Bus
The implementation of the PCI bus complies with PCI specification Rev. 2.1 and ETX®
specification Rev. 2.7
4.1.2 USB 2.0
The conga-XLX offers one OHCI and one EHCI USB host controller via the AMD
Geode™ CS 36 companion device. These controllers comply with USB standard 1.1
and 2.0 and provide a total of four USB ports on the X1 connector that support the
connection of USB 2.0 compliant devices.
Copyright © 2006 congatec AG X800m12 19/72

4.1.3 Audio
The conga-XLX is equipped with a Realtek ALC203 PCI audio controller. It is AC'97 2.2
specification compliant.
Note
The USB and Audio controllers are PCI bus devices. The BI S allocates the necessary
system resources when configuring the PCI devices.
4.1.4 Onboard Generated Supply Voltage
Pins 12, 16 and 24 on the X1 connector provide the ability to connect external devices
to the modules onboard generated supply voltage (3.3V± %). 3.3V external devices can
be connected to these pins but must not exceed a maximum external load of 00mA.
For more information about this feature contact congatec AG technical support.
Caution
Do not connect pins 12, 16 and 24 to a 3.3V external power supply. This will cause a
current cross-flow and may result in either a system malfunction and/or damage to the
external power supply and the module.
Copyright © 2006 congatec AG X800m12 20/72