Congatec COM Express conga-TS175 User manual

COM Express™ conga-TS175
7th Generation Intel® Core™ i7, i5, i3 and Xeon processor with either QM175, HM175, or CM238 Chipset
User’s Guide
Revision 1.6

Copyright © 2017 congatec AG TSKLm16 2/71
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2017-03-13 AEM •Preliminary release
1.0 2017-08-01 AEM •Updated sections 2.5 “Power Consumption” and 2.6 “Supply Voltage Battery Power”
•Updated sections 10 “Resource List” and 11 “BIOS Setup Description”
1.1 2018-05-07 AEM •Corrected the unit of measurement in table 5 “Power Consumption Values”
•Corrected a typographic error in section 6.1.11 “General Purpose Serial Interface”
•Corrected the pin numbers of USB ports 0 and 1 in table 16 “USB SignalDescriptions”
1.2 2018-08-24 AEM •Updated the cooling diagrams and heatspreader thermal imagery in section 4 “Cooling Solutions”
1.3 2018-10-12 AEM •Added note about recommended boot mode in section 2.2 “Supported Operating Systems”
•Changed Intel 100 series PCH to Intel PCH
1.4 2019-04-25 AEM •Updated all cross references
•Updated section 2.3 “Mechanical Dimensions”
•Updated sections 4 .1 “CSA Dimensions”, 4.2 “CSP Dimensions”, 4.3 “HSP Dimensions”
•Updated sections 11.3 “Updating the BIOS“ and 11.4 “Supported Flash Devices”
1.5 2020-05-08 AEM •Updated section 4 “Cooling Solutions”
•Corrected the resolutions for three independent displays in table 7 “Maximum Supported Resolutions”
•Updated the link for power supply implementation guidelines in section 6.1.13 “Power Control”
•Added note about the minimum pulse width required for proper button detection in table 24 “Power and System
Management Signal Descriptions”
•Added information about congatec MLF file to section 11 “BIOS Setup Description”.
•Corrected typographic error in section 11.5 “Supported Flash Devices”
•Deleted section 12 “Industry Specifications”
•Restructured the whole document
1.6 2021-04-19 AEM •Updated table 2 “conga-TS175 Variants, table 3 “Feature Summary”, table 8 “Maximum Supported Resolutions” and
table 16 “TMDS Signal Descriptions”
•Updated section 3 “Block Diagram” and section 6.1.3 “Display Interfaces
•Deleted section 6.1.3.2 “HDMI” and section 6.1.3.4 “DVI”
•Added note to table 16 “TMDS Signal Descriptions”

Copyright © 2017 congatec AG TSKLm16 3/71
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TS175. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™Design Guide
COM Express™Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.

Copyright © 2017 congatec AG TSKLm16 4/71
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2017 congatec AG TSKLm16 5/71
Copyright Notice
Copyright © 2017, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.

Copyright © 2017 congatec AG TSKLm16 6/71
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mb Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
DDI Digital Display Interface
HDA High Definition Audio
N.C Not connected
N.A Not available
TBD To be determined
C
E
R
T
I
F
I
C
A
T
I
O
N
I
S
O
9
0
0
1
TM

Copyright © 2017 congatec AG TSKLm16 7/71
Contents
1 Introduction ............................................................................. 10
1.1 COM Express™ Concept......................................................... 10
1.2 Options Information................................................................. 11
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics .......................................................... 14
2.4.2 Rise Time ................................................................................. 14
2.5 Power Consumption ................................................................ 15
2.6 Supply Voltage Battery Power ................................................. 16
2.7 Environmental Specifications................................................... 17
3 Block Diagram.......................................................................... 18
4 Cooling Solutions..................................................................... 19
4.1 CSA Dimensions ...................................................................... 20
4.2 CSP Dimensions....................................................................... 21
4.3 HSP Dimensions....................................................................... 22
4.4 Heatspreader Thermal Imagery ............................................... 23
5 Onboard Temperature Sensors................................................ 24
6 Connector Rows....................................................................... 26
6.1 Primary and Secondary Connector Rows................................. 26
6.1.1 PCI Express™........................................................................... 26
6.1.2 PCI Express Graphics (PEG) ..................................................... 26
6.1.3 Display Interfaces..................................................................... 27
6.1.3.1 DisplayPort (DP) ....................................................................... 28
6.1.3.2 LVDS/eDP................................................................................. 29
6.1.3.3 VGA.......................................................................................... 29
6.1.4 SATA™..................................................................................... 29
6.1.5 USB .......................................................................................... 30
6.1.6 Gigabit Ethernet ..................................................................... 30
6.1.7 High Definition Audio (HDA) Interface .................................... 30
6.1.8 LPC Bus.................................................................................... 30
6.1.9 I²C Bus ..................................................................................... 31
6.1.10 ExpressCard™ ......................................................................... 31
6.1.11 General Purpose Serial Interface ............................................. 31
6.1.12 GPIOs....................................................................................... 31
6.1.13 Power Control .......................................................................... 31
6.1.14 Power Management................................................................. 35
7 Additional Features.................................................................. 36
7.1 congatec Board Controller (cBC) ............................................. 36
7.1.1 Board Information.................................................................... 36
7.1.2 General Purpose Input/Output................................................ 36
7.1.3 Watchdog ................................................................................ 36
7.1.4 I2C Bus...................................................................................... 36
7.1.5 Power Loss Control.................................................................. 37
7.1.6 Fan Control .............................................................................. 37
7.2 OEM BIOS Customization........................................................ 37
7.2.1 OEM Default Settings .............................................................. 37
7.2.2 OEM Boot Logo....................................................................... 38
7.2.3 OEM POST Logo ..................................................................... 38
7.2.4 OEM BIOS Code/Data............................................................. 38
7.2.5 OEM DXE Driver...................................................................... 38
7.3 congatec Battery Management Interface ................................ 39
7.4 API Support (CGOS) ................................................................ 39
7.5 Security Features...................................................................... 39
7.6 Suspend to Ram....................................................................... 39
8 conga Tech Notes .................................................................... 40
8.1 Intel®Processor Features ......................................................... 40
8.1.1 Adaptive Thermal Monitor and Catastrophic Thermal Protection
40
8.1.2 Intel®Turbo Boost Technology ................................................ 41
8.1.3 Intel®Virtualization Technology ............................................... 41

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8.1.4 Thermal Management ............................................................. 42
8.1.5 Processor Performance Control ............................................... 42
8.2 ACPI Suspend Modes and Resume Events.............................. 43
8.3 DDR4 Memory ......................................................................... 43
9 Signal Descriptions and Pinout Tables..................................... 44
9.1 Connector Signal Descriptions ................................................ 45
9.2 Boot Strap Signals ................................................................... 66
10 System Resources .................................................................... 67
10.1 I/O Address Assignment.......................................................... 67
10.1.1 LPC Bus.................................................................................... 67
10.2 PCI Configuration Space Map ................................................. 68
10.3 I2C............................................................................................ 69
10.4 SM Bus..................................................................................... 69
11 BIOS Setup Description........................................................... 70
11.1 Navigating the BIOS Setup Menu ........................................... 70
11.2 BIOS Versions........................................................................... 70
11.3 Updating the BIOS................................................................... 71
11.4 Recovering from External Flash ............................................... 71
11.5 Supported Flash Devices ......................................................... 71

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List of Tables
Table 1 COM Express™ 2.1 Pinout Types ............................................ 10
Table 2 conga-TS175 Variants .............................................................. 11
Table 3 Feature Summary..................................................................... 12
Table 4 Measurement Description........................................................ 15
Table 5 Power Consumption Values ..................................................... 16
Table 6 CMOS Battery Power Consumption ........................................ 16
Table 7 Cooling Solution Variants......................................................... 19
Table 8 Maximum Supported Resolutions............................................ 28
Table 9 Wake Events............................................................................. 43
Table 10 Signal Tables Terminology Descriptions .................................. 44
Table 11 Connector A–B Pinout ............................................................. 45
Table 12 Connector C–D Pinout............................................................. 47
Table 13 PCI Express Signal Descriptions (general purpose) ................. 49
Table 14 PCI Express Signal Descriptions (x16 Graphics)....................... 50
Table 15 DDI Signal Description............................................................. 52
Table 16 TMDS Signal Descriptions ....................................................... 54
Table 17 DisplayPort (DP) Signal Descriptions ....................................... 55
Table 18 Embedded DisplayPort Signal Descriptions............................ 56
Table 19 CRT Signal Descriptions........................................................... 57
Table 20 LVDS Signal Descriptions......................................................... 57
Table 21 Serial ATA Signal Descriptions ................................................. 58
Table 22 USB 2.0 Signal Descriptions..................................................... 58
Table 23 USB 3.0 Signal Descriptions..................................................... 59
Table 24 Gigabit Ethernet Signal Descriptions....................................... 60
Table 25 Intel®High Definition Audio Link Signals Descriptions............ 60
Table 26 ExpressCard Support Pins Signal Descriptions........................ 61
Table 27 LPC Signal Descriptions........................................................... 61
Table 28 SPI BIOS Flash Interface Signal Descriptions........................... 61
Table 29 Miscellaneous Signal Descriptions........................................... 62
Table 30 General Purpose I/O Signal Descriptions ................................ 62
Table 31 Power and System Management Signal Descriptions ............. 63
Table 32 General Purpose Serial Interface Signal Descriptions.............. 64
Table 33 Module Type Definition Signal Description ............................. 64
Table 34 Power and GND Signal Descriptions....................................... 65
Table 35 Boot Strap Signal Descriptions ................................................ 66
Table 36 PCI Configuration Space Map ................................................. 68

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1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 2.1 Pinout Types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TS175 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™

Copyright © 2017 congatec AG TSKLm16 11/71
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 Options Information
The conga-TS175 is currently available in seven variants. The table below shows the different configurations available.
Table 2 conga-TS175 Variants
Part-No. 045950 045951 045952 045953 045954
Processor Intel®Core™ i7-7820EQ
3.0 GHz Quad Core™
Intel®Core™ i5-7440EQ
2.9 GHz Quad core
Intel®Core™ i5-7442EQ
2.1 GHz Quad Core™
Intel®Core™ i3-7100E
2.9 GHz Dual Core™
Intel®Core™ i3-7102E
2.1 GHz, Dual Core™
Max. Turbo Frequency 3.7 GHz 3.6 GHz 2.9 GHz N.A N.A
Chipset Intel® QM175 Intel® QM175 Intel® QM175 Intel® HM175 Intel® HM175
Intel®Smart Cache 8 MB 6 MB 6 MB 3 MB 3 MB
Processor Graphics Intel®HD Graphics 630
(GT2)
Intel®HD Graphics 630
(GT2)
Intel®HD Graphics 630
(GT2)
Intel®HD Graphics 630
(GT2)
Intel®HD Graphics 630
(GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 1 GHz 350 MHz / 1 GHz 350 MHz / 1 GHz 350 MHz / 950 MHz 350 MHz / 950 MHz
Memory (DDR4) 2400 MT/s Dual Channel 2400 MT/s Dual Channel 2400 MT/s Dual Channel 2400 MT/s Dual Channel 2400 MT/s Dual Channel
LVDS Yes Yes Yes Yes Yes
DP++ (DP/HDMI/DVI) Yes Yes Yes Yes Yes
Processor TDP (cTDP) 45 W (35 W) 45 W (35 W) 25 W (N.A) 35 W (N.A) 25 W (N.A)
Part-No. 045955 (ECC) 045956 (ECC)
Processor Intel®Xeon®E3-1505MV6
3.0 GHz Quad Core™
Intel®Xeon®E3-1505LV6
2.2 GHz Quad Core™
Max. Turbo Frequency 4.0 GHz 3.0 GHz
Chipset Intel® CM238 Intel® CM238
Intel®Smart Cache 8 MB 8 MB
Processor Graphics Intel®HD Graphics P630
(GT2)
Intel®HD Graphics P630
(GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 1.1 GHz 350 MHz / 1 GHz
Memory (DDR4) 2400 MT/s Dual Channel (ECC) 2400 MT/s Dual Channel (ECC)
LVDS Yes Yes
DP++ (DP/HDMI/DVI) Yes Yes
Processor TDP (cTDP) 45 W (35 W) 25 W (N.A)

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2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Basic size 125 x 95 mm)
Processor 7th Generation Intel®Core i7,i5,i3, Celeron and Xeon mobile processors
Memory Two memory sockets (located on the top and bottom side of the conga-TS175). Supports
-SO-DIMM non-ECC DDR4 modules
-Data rates up to 2400 MT/s
-Maximum 32 GB capacity (16 GB each)
NOTE: Variants that feature the Intel CM238 chipset support ECC memory
Chipset Mobile Intel®100 Series Chipset QM175, HM175 and CM238 PCH
Audio High definition audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i219-LM controller) with AMT 11.6 support
Graphics Options Next Generation Intel® HD (610/620). Supports:
-API (DirectX 12, OpenGL 4.4, OpenCL 2.1)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Switchable/Hybrid graphics
-Up to 3 independent displays
3x DP++ (DP/HDMI/DVI)
1x LVDS
1x VGA
1x PEG x16 port (Gen 3)
Resolutions up to 4K
1x Optional eDP 1.4 (assembly option)
NOTE:
The conga-TS175 does not natively support TMDS. A DP++ to TMDS
converter (e.g. PTN3360D) needs to be implemented.
Peripheral Interfaces USB Interfaces:
-Up to 8x USB 2.0
-Up to 4x USB 3.0
4x SATA®(6 Gb/s with RAID 0/1/5 support)
8x PCI Express®Gen. 3 lanes *1
2x UART
GPIOs
LPC
I2C (fast mode, multi-master)
SMB
SPI
BIOS AMI Aptio®V UEFI 2.x firmware, 8 or 16 MB serial SPI with congatec Embedded BIOS features
Power Management ACPI 5.0 compliant with battery support. Also supports DeepSx and Suspend to RAM (S3)
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C
bus, power loss control
Security Optional discrete Trusted Platform Module “TPM 1.2/2.0”; AES Instructions
Note
Some features are optional.

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2.2 Supported Operating Systems
The conga-TS175 supports the following operating systems.
•Microsoft®Windows® 10
•WindRiver®VxWorks®(VX7 or later)
•Linux
Note
1. The processor supports only 64-bit operating systems.
2. The CSM (Compatibility Support Module) is disabled in the BIOS setup menu by default because we recommend to operate the system
in native UEFI mode.
2.3 Mechanical Dimensions
•125.0 mm x 95.0 mm
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5 mm (height)
carrier board connector is used, then approximate overall height is 18 mm. If the 8mm (height) carrier board connector is used, then
approximate overall height is 21 mm.
Heatspreader
All dimensions in millimeter
Module PCB
Carrier Board PCB
13.00
4.00
5.00
4.50
2.00±10%
7.00 18.00

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2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input
(Volts)
Input
Range
(Volts)
Derated
Input
(Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +12 V
•conga-TS175 COM
•modified congatec carrier board
•conga-TS175 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload.
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency
S0: Peak current Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

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Table 5 Power Consumption Values
The table below provides additional information about the conga-TS175 power consumption. The values are recorded at various operating
mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (A)
Variant Cores Freq /Max Turbo (GHz) S0: Min S0: Max S0:Peak S3 S5
045950 4 GB B.0 R004 Windows 10 Intel®Core™ i7-7820EQ 4 3.0 / 3.7 0.63 5.93 6.53 0.09 0.06
045951 4 GB B.0 R004 Windows 10 Intel®Core™ i5-7440EQ 4 2.9 / 3.6 0.63 5.66 5.91 0.09 0.06
045952 4 GB B.0 R004 Windows 10 Intel®Core™ i5-7442EQ 4 2.1 / 2.9 0.62 3.03 3.41 0.09 0.06
045953 4 GB B.0 R004 Windows 10 Intel®Core™ i3-7100E 2 2.9 / N.A 0.62 3.41 4.00 0.09 0.06
045954 4 GB B.0 R004 Windows 10 Intel®Core™ i3-7102E 2 2.1 / N.A 0.61 2.36 2.79 0.09 0.06
045955 4 GB B.0 R004 Windows 10 Intel®Xeon®E3-1505MV6 4 3.0 / 4.0 0.61 5.56 6.28 0.09 0.06
045956 4 GB B.0 R004 Windows 10 Intel®Xeon®E3-1505LV6 4 2.2 / 3.0 0.62 3.15 3.49 0.09 0.06
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.30 µA
20oC 3V DC 1.46 µA
70oC 3V DC 2.00 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TS175.

Copyright © 2017 congatec AG TSKLm16 17/71
2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2017 congatec AG TSKLm16 18/71
3 Block Diagram
7
th
Gen. Intel® Core™ processor
CPU Platform
VT
HT Technology 64 Architecture
Turbo Boost 2.0 Technology TXT
AES-NI
AVX2 SSE 4.2 TSX
Hardware Graphics Accelerators
Video Codecs APIs
Vector Graphics
DXVA2
3D
2D
MPEG-2
HEVC/H.265
VC1/WMV9
OpenCL 2.1
OpenGL 4.4
DirectX 12
Integrated Intel HD Graphics
SATA USB 2.0
LPC BusPCIe
USB 3.0
HDA
Multimedia Features
ASRC
I/O Interfaces
DisplayPort 1.2
Display Interface
TMDS
Mobile Intel ® 100 Series PCH-H
MGMNT
PECI
PCIe Gen. 3
Aux Channel
*
1
PCIe Gen. 3
PECI
SM Bus
Dual Channel DDR4
eDP
PCIe Gen. 3
eDP to LVDS
Bridge
2x SO-DIMM (X1/X2)
SPI Flash 0
LVDS/eDP
TPM
XDP
LPC
SATA 6G
USB 2.0
HDA
DMI Gen3
UART0/1
DP to VGA
congatec System
Management
Controller
Ethernet 10/100/1000
Intel i219LM
Ethernet
VGA
LVDS/eDP
COM Express
Type 6
A-B Connector
LPC Bus
SM Bus
HDA I/F
I2C Bus
USB Port 0..7
SATA Port 0 - 3
SER0/1
GPIOs
SPI
SPI
LID#/SLEEP#
FAN control
PCIe lane 0 - 5
USB 3.0 Port 0 - 3
PCIe lane 6 - 7
(TX BC)
congatec custom
COM Express
Type 6
C-D Connector
DP++ (DP/TMDS)
DP++ (DP/TMDS)
DP++ (DP/TMDS)
PEG x16
Note:
*
1
Supports only TMDS if VGA is enabled

Copyright © 2017 congatec AG TSKLm16 19/71
4 Cooling Solutions
congatec AG offers the following cooling solutions for the conga-TS175 variants. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Table 7 Cooling Solution Variants
Cooling Solution Part No. Description
1 CSA 045930 Active cooling solution with integrated heat pipes and 2.7 mm bore-hole standoffs
045931 Active cooling solution with integrated heat pipes and M2.5 mm threaded standoffs
2 CSP 045932 Passive cooling solution with integrated heat pipes and 2.7 mm bore-hole standoffs
045933 Passive cooling solution with integrated heat pipes and M2.5 mm threaded standoffs
3 HSP 045934 Heatspreader with integrated heat pipes and 2.7 mm bore-hole standoffs
045935 Heatspreader with integrated heat pipes and M2.5 mm threaded standoffs
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.

Copyright © 2017 congatec AG TSKLm16 20/71
4.1 CSA Dimensions
7,3 ±0,2
F
28
F
7,3
M2.5 x 13 mm
threaded standoff
for threaded version
or
ø2.7 x 13 mm
non-threaded standoff
for borehole version
87
29
95
96.6
21
20
31 14.5
125
58.5
76
79
117
12.5
15
2.7
0.62°
1.24°
R0.3
R0.9
2.7