ConMed Sabre Genesis User manual

ElEctrosurgical gEnErator
Service Manual

LIMITED WARRANTY
For a period of two years following the date of delivery,
CONMED Corporation warrants the CONMED Sabre
Genesis™ Electrosurgical Generator against any defects
in material or workmanship and will repair or replace (at
CONMED’s option) the same without charge, provided
that routine maintenance as specified in this manual has
been performed using replacement parts approved by
CONMED. This warranty is void if the product is used in
a manner or for purposes other than intended.
© 2009 CONMED Corporation
525 French Road
Utica, NY 13502-5994 USA
U.S. Patent Numbers 6,830,569 - 6,875,210 - 6,948,503 -
7,540,871 and other patents pending.
For Technical Service or Return Authorization Phone:
303-699-7600 / 1-800-552-0138 Extension 5274
Fax [phone]
For Customer Service or to order parts phone:
1-800-448-6506 / 315-797-8375 / Fax [phone]
or contact your CONMED Representative.
European Authorized Representative
MDSS GmbH
Schiffgraben 41
D-30175 Hannover
Germany
The revision level of this manual is specified by the
highest revision letter found on either the inside front cover
or enclosed errata pages (if any).
Manual Number 60-8202-ENG Rev. A 05/10
Unit Serial Number_________________________________
MdSS GmbH
Schiffgraben 41
D-30175 Hannover
Germany
REPEC STERILE EO
STERILE R
STERILE A
20123
~
9083
LOT
CUT COAG
MdSS GmbH
Schiffgraben 41
D-30175 Hannover
Germany
REPEC STERILE EO
STERILE R
STERILE A
20123
~
9083
LOT
CUT COAG

Table of Contents
& List of Illustrations
Section Title Page
1.0 General Information .................. Refer to Operator’s Manual (60-8201)
2.0 Specifications ............................. Refer to Operator’s Manual (60-8201)
3.0 Theory of Operation ......................................................................... 3-1
3.1 Mode Descriptions ...................................................................................... 3-1
3.1.1 Cut Major Modes..............................................................................................................3-1
3.1.2 Coag Major Modes ...........................................................................................................3-1
3.1.3 Bipolar Major Modes ........................................................................................................3-1
3.2 System Overview......................................................................................... 3-1
3.2.1 RF Power Supply (RFPS).................................................................................................3-4
3.2.2 RF Amplifier and Transformer..........................................................................................3-4
3.2.3 Electrosurgical Outputs ...................................................................................................3-4
3.2.4 Activation Command Sensing .........................................................................................3-5
3.2.5 Automatic Return Monitor (A.R.M.)................................................................................3-5
3.2.6 System Controllers and Monitor .......................................................................................3-5
3.2.7 Low Voltage Power Monitoring........................................................................................3-5
3.2.8 Operator Control Panel .....................................................................................................3-6
3.2.9 Activation Tones................................................................................................................3-6
3.2.10 Activation Relay Connector...............................................................................................3-6
3.3 Optional System Configurations ................................................................. 3-6
4.0 Maintenance...................................................................................... 4-1
4.1 General Maintenance Information............................................................... 4-1
4.2 Maintenance Personnel................................................................................ 4-1
4.3 Cleaning...................................................................................................... 4-1
4.4 Periodic Inspection...................................................................................... 4-1
4.5 Periodic Performance Testing ...................................................................... 4-1
4.5.1 Chassis Ground Integrity ..................................................................................................4-1
4.5.2 Displays, Alarms and Commands......................................................................................4-1
4.5.3 Output Power ...................................................................................................................4-2
4.5.4 RF Leakage Measurement.................................................................................................4-3
4.5.5 Line Frequency Leakage....................................................................................................4-4
4.5.6 Automatic Return Monitor (A.R.M.) Check.....................................................................4-5
4.5.7 Output Coupling Capacitor Check....................................................................................4-5
4.6 System Calibration ...................................................................................... 4-6
4.6.1 Calibration Preliminaries ..................................................................................................4-6
4.6.2 Selecting the Mode to Calibrate ........................................................................................4-6
4.6.3 Calibrating a Monopolar Mode.........................................................................................4-8
4.6.4 Calibrating Bipolar Mode..................................................................................................4-8
4.6.5 Calibrating A.R.M. ...........................................................................................................4-8
4.6.6 Completing Calibration.....................................................................................................4-9
4.7 Last Fault Code Retrieval & Clear .............................................................. 4-9
4.7.1 Last Fault Code Retrieval..................................................................................................4-9
4.7.2 Clearing Last Fault Codes .................................................................................................4-9
4.8 Optional System Configuration ................................................................. 4-9

Section Title Page
4.9 DACview .................................................................................................. 4-12
4.10 Troubleshooting ........................................................................................ 4-12
4.10.1 HVPS Troubleshooting Hints.........................................................................................4-14
4.11 Parts Ordering Information ...................................................................... 4-14
4.12 Assembly Breakdown/Parts Access ............................................................ 4-15
4.12.1 Top Cover Removal & Replacement ...............................................................................4-15
4.12.2 Bezel Removal & Replacement .......................................................................................4-15
4.12.3 Control/Display Board Removal & Replacement ............................................................4-16
4.12.4 Power Board Removal & Replacement............................................................................4-16
4.12.5 RF Output Board Removal & Replacement....................................................................4-17
4.12.6 Power Transistor Replacement ........................................................................................4-17
4.13 Fault Codes ............................................................................................... 4-18
Appx. A Schematics & BOMs .........................................................................A-1
Bill of Material: Top Assembly & Chassis......................................................................... A-1
Bill of Material: Controller PCB Assembly....................................................................... A-7
Bill of Material: RF Output PCB Assembly ................................................................... A-12
Bill of Material: HV PCB Assembly............................................................................... A-15
Figure 3.2 System Block Diagram......................................................................................................3-3
Figure 4.1 Calibration Procedure Flow Chart.....................................................................................4-7
Figure 4.2 DIP Switch Positions ......................................................................................................4-11
Figure A.1a Controller PCB (Top) ...................................................................................................... A-7
Figure A.1b Controller PCB (Bottom) ................................................................................................ A-8
Figure A.2a RF Output PCB............................................................................................................. A-12
Figure A.3a HV PCB ........................................................................................................................ A-15
Table 4.1 Monopolar Cut Mode RF Output Power Accuracy...........................................................4-2
Table 4.2 Monopolar Coag Mode RF Output Power Accuracy ........................................................4-2
Table 4.3 Bipolar Mode RF Output Power Accuracy........................................................................4-2
Table 4.4 Allowable RF Leakage Current to Ground........................................................................4-3
Table 4.5 Allowable RF Leakage Current - Inactive Monopolar Outputs ........................................4-4
Table 4.6 Allowable RF Leakage Current - Inactive Bipolar Outputs ...............................................4-4
Table 4.7 Line Frequency Allowable Leakage - Inactive....................................................................4-4
Table 4.8 Line Frequency Allowable Leakage - Active ......................................................................4-5
Table 4.9 DIP Switch Settings........................................................................................................4-10
Table 4.10 DACview Channels .........................................................................................................4-12
Table 4.11 Troubleshooting ..............................................................................................................4-12
Table 4.12 Fault Codes .....................................................................................................................4-18
Schematic A.1a Controller PCB - Top Sheet........................................................................................ A-1
Schematic A.1b Controller PCB - Controller Sheet.............................................................................. A-2
Schematic A.1c Controller PCB - Monitor Sheet................................................................................. A-3
Schematic A.1d Controller PCB - FPGA Sheet.................................................................................... A-4
Schematic A.1e Controller PCB - DAC Sheet...................................................................................... A-5
Schematic A.1f Controller PCB - Display Sheet................................................................................... A-6
Schematic A.2a RF PCB - Output Amplifier ....................................................................................... A-9
Schematic A.2b RF PCB - Output / Arm Sense ................................................................................ A-10
Schematic A.2c RF PCB - Output / RS-232/Relay Drive.................................................................. A-11
Schematic A.2d RF PCB - RF Output .............................................................................................. A-12
Schematic A.3a HV PCB - HV-Power factor Correction ................................................................... A-13
Schematic A.3b HV PCB - Forward Converter ................................................................................. A-14
Figure/Title Page

3-1
Theory of Operation
Section 3.0
Sabre Genesis™ functions and essential circuit information are provided in this section. This section begins
with a description of the key parameters for each mode. This is followed by an overview of how the system
functions and some key operational information for the modules within the system.
3.1 Mode Descriptions
The key functional parameters for each mode are presented here. Nominal mode specifications are provided
in section 1.2.11 of the Sabre Genesis™ Operators Manual.
3.1.1 Cut Major Modes
Major Mode Minor Mode Nominal RF
Frequency
Modulation (Number of
Pulses, Nominal Time On/Off
Modulation (Normal
Frequency & Period)
Cut Pure 400 KHz None None
Pulsed 400 KHz 70µs / 600µs 670µs
Blend 400 KHz 9 pulses, 23µs / 17µs 25 KHz / 40µs
3.1.2 Coag Major Modes
Major Mode Minor Mode Nominal RF
Frequency
Modulation (Number of
Pulses, Nominal Time On/Off
Modulation (Normal
Frequency & Period)
Coag Standard 495 KHz Single pulse 40 KHz / 25µs
Standard mode is fundamentally different from the Cut mode in that the resonant circuit of the RF Amplifier
and Transformer combination is excited by the energy of a single pulse, causing the resonant circuit to ring
until the energy is dissipated.
3.1.3 Bipolar Major Modes
Major Mode Minor Mode Nominal RF
Frequency
Modulation (Number of
Pulses, Nominal Time On/Off
Modulation (Normal
Frequency & Period)
Bipolar Macro 400 KHz None None
3.2 System Overview
Mains power is converted to electrosurgical output power through the RF Power Supply (RFPS), the RF
Amplifier, and the Transformer and Output sections of the system.
Mains power is converted to high voltage direct current power in the RFPS to supply the RF Amplifier.
This is essentially a power transformer with a power factor corrected regulator. The power factor correction
can be enabled or disabled under software control.
Pulses generated in the RF Controller are amplified to electrosurgical power and voltage levels in the RF
Amplifier and Transformer portions of the power train. Three high-voltage bipolar transistors and a single
MOSFET make up the hybrid-cascode RF Amplifier. The hybrid-cascode amplifier is a fast, high-voltage
amplifier that can be controlled by the combination of DC voltage (VBASE_PWM) and a fixed ampli-
tude, variable pulse width signal (RFGATE). This amplifier is combined through a relay with either the
Monopolar output transformer or the Bipolar output transformer to generate electrosurgical power.
Electrosurgical power flows from the RF Amplifier / Transformer section to the Output section where the
power is switched to the specific electrosurgical outputs. The Output section also has circuitry to detect