Cypress Semiconductor NoBL CY7C1470BV25 User manual

72-Mbit (2M x 36/4M x 18/1M x 72)
Pipelined SRAM with NoBL™ Architecture
CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document #: 001-15032 Rev. *D Revised February 29, 2008
Features
■Pin-compatible and functionally equivalent to ZBT™
■Supports 250 MHz bus operations with zero wait states
❐Available speed grades are 250, 200, and 167 MHz
■Internally self-timed output buffer control to eliminate the need
to use asynchronous OE
■Fully registered (inputs and outputs) for pipelined operation
■Byte Write capability
■Single 2.5V power supply
■2.5V IO supply (VDDQ)
■Fast clock-to-output times
❐3.0 ns (for 250-MHz device)
■Clock Enable (CEN) pin to suspend operation
■Synchronous self-timed writes
■CY7C1470BV25, CY7C1472BV25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1474BV25
available in Pb-free and non-Pb-free 209-ball FBGA package
■IEEE 1149.1 JTAG Boundary Scan compatible
■Burst capability—linear or interleaved burst order
■“ZZ” Sleep Mode option and Stop Clock option
Functional Description
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
are 2.5V, 2M x 36/4M x 18/1M x 72 synchronous pipelined burst
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.
They are designed to support unlimited true back-to-back read
or write operations with no wait states. The CY7C1470BV25,
CY7C1472BV25, and CY7C1474BV25 are equipped with the
advanced (NoBL) logic required to enable consecutive read or
write operations with data beingtransferred on everyclock cycle.
This feature dramatically improves the throughput of data in
systems that require frequent read or write transitions. The
CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are
pin-compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. The clock
input is qualified by the Clock Enable (CEN) signal, which when
deasserted suspends operation and extends the previous clock
cycle. Write operations are controlled by the Byte Write Selects
(BWa–BWdfor CY7C1470BV25, BWa–BWbfor
CY7C1472BV25, and BWa–BWhfor CY7C1474BV25) and a
Write Enable (WE) input. All writes are conducted with on-chip
synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
Selection Guide
Description 250 MHz 200 MHz 167 MHz Unit
Maximum Access Time 3.0 3.0 3.4 ns
Maximum Operating Current 450 450 400 mA
Maximum CMOS Standby Current 120 120 120 mA
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 2 of 29
Logic Block Diagram – CY7C1470BV25 (2M x 36)
Logic Block Diagram – CY7C1472BV25 (4M x 18)
A0, A1, A
C
MODE
BW a
BW b
WE
CE1
CE2
CE3
OE
READ LOGIC
DQ
s
DQ
P a
DQ
P
b
DQ
P c
DQ
P
d
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
MEMORY
ARRAY
E
E
INPUT
REGISTER 0
ADDRESS
REGISTER 0
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BURST
LOGIC
A0'
A1'
D1
D0
Q1
Q0
A0
A1
C
ADV/LD
ADV/LD
E
INPUT
REGISTER 1
S
E
N
S
E
A
M
P
S
E
C
LK
C
EN
WRITE
DRIVERS
BW c
BW d
ZZ
SLEEP
CONTROL
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
A0, A1, A
C
MODE
BW
a
BW b
WE
CE1
CE2
CE3
OE
READ LOGIC
DQ
s
DQ
P
a
DQ
P b
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
MEMORY
ARRAY
E
E
INPUT
REGISTER 0
ADDRESS
REGISTER 0
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BURST
LOGIC
A0'
A1'
D1
D0
Q1
Q0
A0
A1
C
ADV/LD
ADV/LD
E
INPUT
REGISTER 1
S
E
N
S
E
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
E
C
LK
C
EN
WRITE
DRIVERS
ZZ Sleep
Control
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 3 of 29
Logic Block Diagram – CY7C1474BV25 (1M x 72)
A0, A1, A
C
MODE
CE1
CE2
CE3
OE
READ LOGIC
DQ s
DQ Pa
DQ Pb
DQ Pc
DQ Pd
DQ Pe
DQ Pf
DQ Pg
DQ Ph
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
MEMORY
ARRAY
E
E
INPUT
REGISTER 0
ADDRESS
REGISTER 0
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
BURST
LOGIC
A0'
A1'
D1
D0
Q1
Q0
A0
A1
C
ADV/LD
ADV/LD
E
INPUT
REGISTER 1
S
E
N
S
E
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
E
CLK
CEN
WRITE
DRIVERS
BW a
BW b
WE
ZZ
Sleep
Control
BW
c
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BW d
BW
e
BW f
BW
g
BW
h
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 4 of 29
Pin Configurations
A A A A
A1
A0
VSS
VDD
A
A A A A
A
VDDQ
VSS
DQb
DQb
DQb
VSS
VDDQ
DQb
DQb
VSS
NC
VDD
DQa
DQa
VDDQ
VSS
DQa
DQa
VSS
VDDQ
VDDQ
VSS
DQc
DQc
VSS
VDDQ
DQc
VDD
VSS
DQd
DQd
VDDQ
VSS
DQd
DQd
DQd
VSS
VDDQ
A A
CE1
CE2 BWa CE3 VDD VSS
CLK WE CEN OE
A A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
AA
ADV/LD
ZZ
CY7C1470BV25
A
A A A
A1
A0
VSS
VDD
A
A
A A A
A
A
NC
NC
VDDQ
VSS
NC
DQPa
DQa
DQa
VSS
VDDQ
DQa
DQa
VSS
NC
VDD
DQa
DQa
VDDQ
VSS
DQa
DQa
NC
NC
VSS
VDDQ
NC
NC
NC
NC
NC
NC
VDDQ
VSS
NC
NC
DQb
DQb
VSS
VDDQ
DQb
DQb
VDD
VSS
DQb
DQb
VDDQ
VSS
DQb
DQb
DQPb
NC
VSS
VDDQ
NC
NC
NC
A A
CE1
CE2
NC NC
BWb
BWa CE3
VDD VSS
CLK WE CEN OE
A A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
AA
ADV/LD
ZZ
MODE
CY7C1472BV25
BWd
MODE
BWc
DQc
DQc
DQc
DQc
DQPc
DQd
DQd
DQd
DQPb
DQb
DQa
DQa
DQa
DQa
DQPa
DQb
DQb
(2M × 36) (4M × 18)
BWb
NC
NC
NC
DQc NC
NC(288)
NC(144)
NC(288)
NC(144)
DQPd
A
A
A
A
A
A
Figure 1. 100-Pin TQFP Pinout
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 5 of 29
Pin Configurations (continued)
165-Ball FBGA (15 x 17 x 1.4 mm) Pinout
CY7C1470BV25 (2M x 36)
CY7C1472BV25 (4M x 18)
2345671
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
TDO
NC/576M
NC/1G
DQPc
DQc
DQPd
NC
DQd
ACE1BWbCE3
BWcCEN
ACE2
DQc
DQd
DQd
MODE
NC
DQc
DQc
DQd
DQd
DQd
A
VDDQ
BWdBWaCLK WE
VSS VSS VSS VSS
VDDQ VSS
VDD VSS VSS
VSS
NC
VSS
VSS
VSS
VSS
VDDQ
VDDQ
NC
VDDQ
VDDQ
VDDQ
VDDQ
A
A
VDD VSS
VDD VSS VSS
VDDQ VDD VSS
VDD VSS
VDD VSS VSS
VSS
VDD
VDD VSS
VDD VSS VSS
NC
TCKA0
VSS TDI
A
A
DQcVSS
DQcVSS
DQc
DQcNC VSS VSS
VSS VSS
NC
VSS
A1
DQdDQd
NC/144M NC
VDDQ
VSS
TMS
891011
NC/288M
AAADV/LD NC
OE AANC
VSS VDDQ NC DQPb
VDDQ
VDD DQbDQb
DQb
NC
DQb
NC
DQa
DQa
VDD VDDQ
VDD VDDQ DQb
VDD NC
VDD DQa
VDD VDDQ DQa
VDDQ
VDD
VDD VDDQ
VDD VDDQ DQa
VDDQ
AA
VSS A
A
A
DQb
DQb
DQbZZ
DQaDQa
DQPa
DQa
A
VDDQ
A
A
2345671
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
TDO
NC/576M
NC/1G
NC
NC
DQPb
NC
DQb
ACE1CE3
BWbCEN
ACE2
NC
DQb
DQb
MODE
NC
DQb
DQb
NC
NC
NC
A
VDDQ
BWaCLK WE
VSS VSS VSS VSS
VDDQ VSS
VDD VSS VSS
VSS
NC
VSS
VSS
VSS
VSS
VDDQ
VDDQ
NC
VDDQ
VDDQ
VDDQ
VDDQ
A
A
VDD VSS
VDD VSS VSS
VDDQ VDD VSS
VDD VSS
VDD VSS VSS
VSS
VDD
VDD VSS
VDD VSS VSS
NC
TCKA0
VSS TDI
A
A
DQbVSS
NC VSS
DQb
NC NC VSS VSS
VSS VSS
NC
VSS
A1
DQbNC
NC/144M NC
VDDQ
VSS
TMS
891011
NC/288M
AA
ADV/LD A
OE AANC
VSS VDDQ NC DQPa
VDDQ
VDD NC DQa
DQa
NC
NC
NC
DQa
NC
VDD VDDQ
VDD VDDQ DQa
VDD NC
VDD NCVDD VDDQ DQa
VDDQ
VDD
VDD VDDQ
VDD VDDQ NC
VDDQ
AA
VSS A
A
A
DQa
NC
NC ZZ
DQaNC
NC
DQa
A
VDDQ
A
A
NC
NC
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 6 of 29
Pin Configurations (continued)
CY7C1474BV25 (1M × 72)
209-Ball FBGA (14 x 22 x 1.76 mm) Pinout
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
123456789 1110
DQg
DQg
DQg
DQg
DQg
DQg
DQg
DQg
DQc
DQc
DQc
DQc
NC
DQPg
DQh
DQh
DQh
DQh
DQd
DQd
DQd
DQd
DQPd
DQPc
DQc
DQc
DQc
DQc
NC
DQh
DQh
DQh
DQh
DQPh
DQd
DQd
DQd
DQd
DQb
DQb
DQb
DQb
DQb
DQb
DQb
DQb
DQf
DQf
DQf
DQf
NC
DQPf
DQa
DQa
DQa
DQa
DQe
DQe
DQe
DQe
DQPa
DQPb
DQf
DQf
DQf
DQf
NC
DQa
DQa
DQa
DQa
DQPe
DQe
DQe
DQe
DQe
AAAA
NC NC
NC/144M
A A NC/288M
AAA
AA AA1
A0
AAA
AA
A
NC/576M
NC
NC
NC NC
NC
BWSbBWSf
BWSeBWSa
BWScBWSg
BWSd BWSh
TMS TDI TDO TCK
NC
NC MODE NC
CEN VSS
NC
CLK NC VSS
VDD VDD VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VSS VSS
VSS
VSS
VSS
VSS VSS
VSS
NC/1G
VDD
NC
OE
CE3
CE1
CE2ADV/LD
WE
VSS
VSS
VSS
VSS VSS VSS VSS
ZZ
VSS VSS VSS VSS
NC
VDDQ
VSS
VSS NC VSS VSS
VSS VSS VSS VSS
NC
VSS
VDDQ VDDQ VDDQ VDDQ
VDDQ NC VDDQ VDDQ
VDDQ VDDQ NC VDDQ VDDQ
VDDQ VDDQ NC VDDQ VDDQ
VDDQ
VDDQ
VDDQ VDDQ
VDDQ VDDQ VDDQ VDDQ
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 7 of 29
Table 1. Pin Definitions
Pin Name IO Type Pin Description
A0
A1
A
Input-
Synchronous Address Inputs Used to Select One of the Address Locations. Sampled at the rising edge of the CLK.
BWa
BWb
BWc
BWd
BWe
BWf
BWg
BWh
Input-
Synchronous Byte Write Select Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on the rising edge of CLK. BWacontrols DQa and DQPa, BWbcontrols DQb and DQPb, BWccontrols
DQcand DQPc, BWdcontrols DQd and DQPd, BWecontrols DQe and DQPe, BWfcontrols DQf and
DQPf, BWgcontrols DQg and DQPg, BWhcontrols DQh and DQPh.
WE Input-
Synchronous Write Enable Input, Active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This signal must be asserted LOW to initiate a write sequence.
ADV/LD Input-
Synchronous Advance/Load Input Used to Advance the On-Chip Address Counter or Load a New Address. When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new
address can be loaded into the device foran access. Afterbeing deselected, ADV/LD must be driven
LOW to load a new address.
CLK Input-
Clock Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK is only recognized if CEN is active LOW.
CE1Input-
Synchronous Chip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2and CE3to select/deselect the device.
CE2Input-
Synchronous Chip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1and CE3to select/deselect the device.
CE3Input-
Synchronous Chip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1 and CE2 to select/deselect the device.
OE Input-
Asynchronous OutputEnable,ActiveLOW.Combinedwiththesynchronouslogicblockinsidethedevicetocontrol the direction of the IO pins. When LOW, the IO pins can behave as outputs. When deasserted HIGH,
IO pins are tri-stated, and act as input data pins. OE is masked during the data portion of a write
sequence, during the first clock when emerging from a deselected state and when the device has
been deselected.
CEN Input-
Synchronous Clock Enable Input,ActiveLOW.Whenasserted LOWthe clocksignalis recognizedbythe SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN does not deselect the
device, CEN can be used to extend the previous cycle when required.
DQsIO-
Synchronous Bidirectional Data IO Lines. As inputs, they feed into an on-chip data register that is triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by A[18:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by
OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When
HIGH, DQa–DQhare placed in a tri-state condition. The outputs are automatically tri-stated during
the data portion ofa write sequence, during the first clock when emerging from a deselected state, and
when the device is deselected, regardless of the state of OE.
DQPXIO-
Synchronous BidirectionalDataParity IO Lines.Functionally, thesesignalsare identical toDQ[71:0].Duringwrite sequences, DQPais controlled by BWa, DQPbis controlled by BWb, DQPcis controlled by BWc, and
DQPdiscontrolledbyBWd,DQPeiscontrolled byBWe,DQPfiscontrolledbyBWf,DQPgiscontrolled
by BWg, DQPhis controlled by BWh.
MODE Input Strap Pin Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst order.
Pulled LOW selects the linear burst order. MODE must not change states during operation. When
left floating MODE defaults HIGH, to an interleaved burst order.
TDO JTAG Serial
Output
Synchronous
Serial Data Out to the JTAG Circuit. Delivers data on the negative edge of TCK.
TDI JTAG Serial Input
Synchronous Serial Data In to the JTAG Circuit. Sampled on the rising edge of TCK.
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 8 of 29
Functional Overview
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
are synchronous-pipelined Burst NoBL SRAMs designed specif-
ically to eliminate wait states during read or write transitions. All
synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock signal is qualified with the
ClockEnable inputsignal (CEN).IfCENisHIGH, theclock signal
is not recognized and all internal states are maintained. All
synchronous operations are qualified with CEN. All data outputs
pass through output registers controlled by the rising edge of the
clock. Maximum access delay from the clock rise (tCO) is 3.0 ns
(250-MHz device).
Accesses can be initiated by asserting all three Chip Enables
(CE1, CE2, CE3) active at the rising edge of the clock. If CEN is
active LOW and ADV/LD is asserted LOW, the address
presented to the device is latched. The access can either be a
read or write operation, depending on the status of the Write
Enable (WE). BW[x] can be used to conduct Byte Write opera-
tions.
Write operations are qualified by the Write Enable (WE). All
writes are simplified with on-chip synchronous self-timed write
circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) simplify depth expansion. All
operations (reads, writes, and deselects) are pipelined. ADV/LD
must be driven LOW after the device is deselected to load a new
address for the next operation.
Single Read Accesses
A read access is initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are ALL asserted active, (3) the input signal WE is
deasserted HIGH, and (4) ADV/LD is asserted LOW. The
address presented to the address inputs is latched into the
Address Register and presented to the memory core and control
logic. The control logic determines that a read access is in
progress and allows the requested data to propagate to the input
of the output register. At the rising edge of the next clock the
requested data is allowed to propagate through the output
register and onto the data bus within 2.6 ns (250-MHz device)
provided OE is active LOW. After the first clock of the read
access the output buffers are controlled by OE and the internal
control logic. OE must be driven LOW to drive out the requested
data. During the second clock, a subsequent operation (read,
write, or deselect) can be initiated. Deselecting the device is also
pipelined. Therefore, when the SRAM is deselected at clock rise
by one of the chip enable signals, its output tri-states following
the next clock rise.
Burst Read Accesses
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
have an on-chip burst counter that enables the user to supply a
single address and conduct up to four reads without reasserting
the address inputs. ADV/LD must be driven LOW to load a new
address into the SRAM, as described in the Single Read
Accesses section. The sequence of the burst counter is deter-
mined by the MODE input signal. A LOW input on MODE selects
a linear burst mode, a HIGH selects an interleaved burst
sequence. Both burst counters use A0 and A1 in the burst
sequence, and wraps around when incremented sufficiently. A
HIGH input on ADV/LD increments the internal burst counter
regardless of the state of chip enables inputs or WE. WE is
latched at the beginning of a burst cycle. Therefore, the type of
access (read or write) is maintained throughout the burst
sequence.
Single Write Accesses
Write accesses are initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are ALL asserted active, and (3) the signal WE is
asserted LOW. The address presented to the address inputs is
loaded into the Address Register. The write signals are latched
into the Control Logic block.
On the subsequent clock rise the data lines are automatically
tri-stated regardless of the state of the OE input signal. This
allows the external logic to present the data on DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for
CY7C1472BV25, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV25). In addition, the address for the subsequent
TMS Test Mode Select
Synchronous TMS Pin Controls the Test Access Port State Machine. Sampled on the rising edge of TCK.
TCK JTAG Clock Clock Input to the JTAG Circuitry.
VDD Power Supply Power Supply Inputs to the Core of the Device.
VDDQ IO Power Supply Power Supply for the IO Circuitry.
VSS Ground Ground for the Device. Must be connected to ground of the system.
NC – No Connects. This pin is not connected to the die.
NC(144M,
288M,
576M, 1G)
–These Pins are Not Connected. They are used for expansion to the 144M, 288M, 576M, and 1G
densities.
ZZ Input-
Asynchronous ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition with data integrity preserved. For normal operation, this pin has must be LOW or left floating.
ZZ pin has an internal pull down.
Table 1. Pin Definitions (continued)
Pin Name IO Type Pin Description
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 9 of 29
access (read, write, or deselect) is latched into the Address
Register (provided the appropriate control signals are asserted).
On the next clock rise the data presented to DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for
CY7C1472BV25, DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV25) (or a subset for Byte Write operations, see
“Partial Write Cycle Description” on page 11 for details) inputs is
latched into the device and the Write is complete.
The data written during the Write operation is controlled by BW
(BWa,b,c,d for CY7C1470BV25, BWa,b for CY7C1472BV25, and
BWa,b,c,d,e,f,g,h for CY7C1474BV25) signals. The
CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
provides Byte Write capability that is described in “Partial Write
Cycle Description” on page 11. Asserting the WE input with the
selected BW input selectively writes to only the desired bytes.
Bytes not selected during a Byte Write operation remain
unaltered. A synchronous self-timed write mechanism has been
provided to simplify the write operations. Byte Write capability
has been included to greatly simplify read, modify, or write
sequences, which can be reduced to simple Byte Write opera-
tions.
Because the CY7C1470BV25, CY7C1472BV25, and
CY7C1474BV25 are common IO devices, data must not be
driven into the device while the outputs are active. OE can be
deasserted HIGH before presenting data to the DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for
CY7C1472BV25, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV25) inputs. Doing so tri-states the output drivers.
As a safety precaution, DQ and DQP (DQa,b,c,d/DQPa,b,c,d for
CY7C1470BV25, DQa,b/DQPa,b for CY7C1472BV25, and
DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474BV25) are
automatically tri-stated during the data portion of a write cycle,
regardless of the state of OE.
Burst Write Accesses
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
has an on-chip burst counter that enables the user to supply a
single address and conduct up to four write operations without
reasserting the address inputs. ADV/LD must be driven LOW to
load the initial address, as described in “Single Write Accesses”
on page 8. When ADV/LD is driven HIGH on the subsequent
clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs
are ignored and the burst counter is incremented. The correct
BW (BWa,b,c,d for CY7C1470BV25, BWa,b for CY7C1472BV25,
and BWa,b,c,d,e,f,g,h for CY7C1474BV25) inputs must be driven
in each cycle of the burst write to write the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation “sleep” mode. Two clock
cycles are required to enter into or exit from this “sleep” mode.
While in this mode, data integrity is guaranteed. Accesses
pendingwhenentering the“sleep”modearenotconsideredvalid
nor is the completion of the operation guaranteed. The device
must be deselected before entering the “sleep” mode. CE1, CE2,
and CE3, must remain inactive for the duration of tZZREC after the
ZZ input returns LOW.
Table 2. Linear Burst Address Table (MODE = GND)
First
Address Second Address Third Address Fourth Address
A1,A0 A1,A0 A1,A0 A1,A0
00 01 10 11
01 10 11 00
10 11 00 01
11 00 01 10
Table 3. Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address Second Address Third Address Fourth Address
A1,A0 A1,A0 A1,A0 A1,A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
ZZ Mode Electrical Characteristics
Parameter Description Test Conditions Min Max Unit
IDDZZ Sleep mode standby current ZZ >VDD − 0.2V 120 mA
tZZS Device operation to ZZ ZZ > VDD −0.2V 2tCYC ns
tZZREC ZZ recovery time ZZ < 0.2V 2tCYC ns
tZZI ZZ active to sleep current This parameter is sampled 2tCYC ns
tRZZI ZZ Inactive to exit sleep current This parameter is sampled 0 ns
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 10 of 29
Table 4. Truth Table
The truth table for CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 follows. [1, 2, 3, 4, 5, 6, 7]
Operation Address
Used CE ZZ ADV/LD WE BWxOE CEN CLK DQ
Deselect Cycle None H L L X X X L L-H Tri-State
Continue Deselect Cycle None X L H X X X L L-H Tri-State
Read Cycle
(Begin Burst) External L L L H X L L L-H Data Out (Q)
Read Cycle
(Continue Burst) Next X L H X X L L L-H Data Out (Q)
NOP/Dummy Read
(Begin Burst) External L L L H X H L L-H Tri-State
Dummy Read
(Continue Burst) Next X L H X X H L L-H Tri-State
Write Cycle
(Begin Burst) External L L L L L X L L-H Data In (D)
Write Cycle
(Continue Burst) Next X L H X L X L L-H Data In (D)
NOP/Write Abort
(Begin Burst) None L L L L H X L L-H Tri-State
Write Abort
(Continue Burst) Next X L H X H X L L-H Tri-State
Ignore Clock Edge (Stall) Current X L X X X X H L-H –
Sleep Mode None X H X X X X X X Tri-State
Notes
1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx= L signifies at least one Byte Write Select is active, BWx= Valid
signifies that the desired Byte Write Selects are asserted, see “Partial Write Cycle Description” on page 11 for details.
2. Write is defined by WE and BW[a:d]. See “Partial Write Cycle Description” on page 11 for details.
3. When a write cycle is detected, all IOs are tri-stated, even during Byte Writes.
4. The DQ and DQP pins are controlled by the current cycle and the OE signal.
5. CEN = H inserts wait states.
6. Device powers up deselected with the IOs in a tri-state condition, regardless of OE.
7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles.During a Read cycle DQsand DQP[a:d] = tri-state when OE is
inactive or when the device is deselected, and DQs = data when OE is active.
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 11 of 29
Table 5. Partial Write Cycle Description
The partial write cycle description for CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 follows.[1, 2, 3, 8]
Function (CY7C1470BV25) WE BWdBWcBWbBWa
Read H X X X X
Write – No bytes written L H H H H
Write Byte a – (DQa and DQPa) LHHHL
Write Byte b – (DQband DQPb)LHHLH
Write Bytes b, a L H H L L
Write Byte c – (DQc and DQPc)LHLHH
Write Bytes c, a L H L H L
Write Bytes c, b L H LL L H
Write Bytes c, b, a L H L L L
Write Byte d – (DQd and DQPd)LLHHH
Write Bytes d, a L L H H L
Write Bytes d, b L L H L H
Write Bytes d, b, a L L H L L
Write Bytes d, c L L L H H
Write Bytes d, c, a L L L H L
Write Bytes d, c, b L L L L H
Write All Bytes L L L L L
Function (CY7C1472BV25) WE BWbBWa
Read H x x
Write – No Bytes Written L H H
Write Byte a – (DQa and DQPa)L H L
Write Byte b – (DQb and DQPb)L L H
Write Both Bytes L L L
Function (CY7C1474BV25) WE BWx
Read Hx
Write – No Bytes Written L H
Write Byte X − (DQx and DQPx) LL
Write All Bytes L All BW = L
Note
8. Table lists only a partial listing of the Byte Write combinations. Any combination of BW[a:d] is valid. Appropriate write is based on which Byte Write is active.
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 12 of 29
IEEE 1149.1 Serial Boundary Scan (JTAG)
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
incorporates a serial boundary scan test access port (TAP). This
port operates in accordance with IEEE Standard 1149.1-1990
but does not have the set of functions required for full 1149.1
compliance. These functions from the IEEE specification are
excluded because their inclusion places an added delay in the
critical speed path of the SRAM. Note that the TAP controller
functions in a manner that does not conflict with the operation of
other devices using 1149.1 fully compliant TAPs. The TAP
operates using JEDEC-standard 2.5V IO logic levels.
The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25
contains a TAP controller, instruction register, boundary scan
register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are inter-
nally pulled up and may be unconnected. They may alternately
be connected to VDD through a pull up resistor. TDO must be left
unconnected. During power up, the device comes up in a reset
state, which does not interfere with the operation of the device.
The 0/1 next to each state represents the value of TMS at the
rising edge of TCK.
Test Access Port (TAP)
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test MODE SELECT (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this ball unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information about
loading the instruction register, see the TAP Controller State
Diagram. TDI is internally pulled up and can be unconnected if
the TAP is unused in an application. TDI is connected tothe most
significant bit (MSB) of any register. (See TAP Controller Block
Diagram.)
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
oftheTAP statemachine.The outputchanges onthefallingedge
of TCK. TDO is connected to the least significant bit (LSB) of any
register. (See TAP Controller State Diagram.)
Performing a TAP Reset
A RESET is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
During power up, the TAP is reset internally to ensure that TDO
comes up in a High-Z state.
TAP Registers
Registers are connected between the TDI and TDO balls to scan
the data in and out of the SRAM test circuitry. Only one register
can be selected at a time through the instruction register. Data is
serially loaded into the TDI ball on the rising edge of TCK. Data
is output on the TDO ball on the falling edge of TCK.
Figure 2. TAP Controller State Diagram
TEST-LOGIC
RESET
RUN-TEST/
IDLE
SELECT
DR-SCAN
SELECT
IR-SCAN
CAPTURE-DR
SHIFT-DR
CAPTURE-IR
SHIFT-IR
EXIT1-DR
PAUSE-DR
EXIT1-IR
PAUSE-IR
EXIT2-DR
UPDATE-DR
EXIT2-IR
UPDATE-IR
1
1
1
0
1 1
0 0
1 1
1
0
0
0
0 0
0
0
0 0
1
0
1
1
0
1
0
1
1
1
1 0
Figure 3. TAP Controller Block Diagram
Bypass Register
0
Instruction Register
012
Identication Register
012293031 ...
Boundary Scan Register
012..x ...
Selection
Circuitry
TCK
TMS TAP CONTROLLER
TDI TDO
Selection
Circuitry
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 13 of 29
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This registeris loaded whenitis placed between theTDI
and TDO balls as shown in the “TAP Controller Block Diagram”
on page 12. During power up, the instruction register is loaded
with the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significantbitsareloadedwith abinary ‘01’ patternto enablefault
isolation of the board-level serial test data path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This shifts the data through the SRAM with
minimal delay. The bypass register is set LOW (VSS) when the
BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
The boundary scan register is loaded with the contents of the
RAM IO ring when the TAP controller is in the Capture-DR state
and is then placed between the TDI and TDO balls when the
controller is moved to the Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE Z instructions can be used to
capture the contents of the IO ring.
The Boundary Scan Order tables on page 17 show the order in
which the bits are connected. Each bit corresponds to one of the
bumps on the SRAM package. The MSB of the register is
connected to TDI and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in “Identification Register Definitions” on
page 16.
TAP Instruction Set
Overview
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in “Identification
Codes” on page 17. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in this section in detail.
The TAP controller used in this SRAM is not fully compliant to the
1149.1 convention because some of the mandatory 1149.1
instructions are not fully implemented.
The TAP controller cannot be used to load address data or
control signals into the SRAM and cannot preload the IO buffers.
The SRAM does not implement the 1149.1 commands EXTEST
or INTEST or the PRELOAD portion of SAMPLE/PRELOAD;
rather, it performs a capture of the IO ring when these instruc-
tions are executed.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction after it is shifted in, the TAP controller must be
moved into the Update-IR state.
EXTEST
EXTEST is a mandatory 1149.1 instruction which is executed
whenever the instruction register is loaded with all 0s. EXTEST
is not implemented in this SRAM TAP controller, and therefore
this device is not compliant to 1149.1. The TAP controller does
recognize an all-0 instruction.
When an EXTEST instruction is loaded into the instruction
register, the SRAM responds as if a SAMPLE/PRELOAD
instruction hasbeenloaded.There is one differencebetween the
two instructions. Unlike the SAMPLE/PRELOAD instruction,
EXTEST places the SRAM outputs in a High-Z state.
IDCODE
The IDCODE instruction loads a vendor-specific, 32-bit code into
the instruction register. It also places the instruction register
between the TDI and TDO balls and shifts theIDCODE out of the
device when the TAP controller enters the Shift-DR state.
The IDCODE instruction is loaded into the instruction register
during power up or whenever the TAP controller is in a test logic
reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO pins when the TAP controller is in a
Shift-DR state. It also places all SRAM outputs into a High-Z
state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. The
PRELOAD portion of this instruction is not implemented, so the
device TAP controller is not fully 1149.1 compliant.
When the SAMPLE/PRELOAD instruction is loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and bidirectional balls is
captured in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output may undergo a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
time (tCS plus tCH).
The SRAM clock input might not be captured correctly if there is
no way in a design to stop (or slow) the clock during a
SAMPLE/PRELOAD instruction. If this is an issue, it is still
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 14 of 29
possible to capture all other signals and simply ignore the value
of the CLK captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not imple-
mented,puttingthe TAPtotheUpdate-DR statewhileperforming
a SAMPLE/PRELOAD instruction has the same effect as the
Pause-DR command.
BYPASS
WhentheBYPASSinstructionis loadedinthe instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Figure 4. TAP Timing
tTL
Test Clock
(TCK)
123456
T
est Mode Select
(TMS)
tTH
Test Data-Out
(TDO)
tCYC
Test Data-In
(TDI)
tTMSH tTMSS
tTDIH tTDIS
tTDOX
tTDOV
DON’T CARE UNDEFINED
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CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 15 of 29
TAP AC Switching Characteristics
Over the Operating Range [9, 10]
Parameter Description Min Max Unit
Clock
tTCYC TCK Clock Cycle Time 50 ns
tTF TCK Clock Frequency 20 MHz
tTH TCK Clock HIGH time 20 ns
tTL TCK Clock LOW time 20 ns
Output Times
tTDOV TCK Clock LOW to TDO Valid 10 ns
tTDOX TCK Clock LOW to TDO Invalid 0 ns
Setup Times
tTMSS TMS Setup to TCK Clock Rise 5 ns
tTDIS TDI Setup to TCK Clock Rise 5 ns
tCS Capture Setup to TCK Rise 5 ns
Hold Times
tTMSH TMS Hold after TCK Clock Rise 5 ns
tTDIH TDI Hold after Clock Rise 5 ns
tCH Capture Hold after Clock Rise 5 ns
Notes
9. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
10.Test conditions are specified using the load in TAP AC Test Conditions. tR/tF= 1 ns.
[+] Feedback

CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 16 of 29
2.5V TAP AC Test Conditions
Input pulse levels.................................................VSS to 2.5V
Input rise and fall time .....................................................1 ns
Input timing reference levels.........................................1.25V
Output reference levels ................................................1.25V
Test load termination supply voltage ............................1.25V
Note
11. All voltages refer to VSS (GND).
Figure 5. 2.5V TAP AC Output Load Equivalent
TDO
1.25V
20pF
Z = 50Ω
O
50Ω
TAP DC Electrical Characteristics And Operating Conditions
(0°C < TA< +70°C; VDD = 2.5V ±0.125V unless otherwise noted)[11]
Parameter Description Test Conditions Min Max Unit
VOH1 Output HIGH Voltage IOH = –1.0 mA, VDDQ = 2.5V 1.7 V
VOH2 Output HIGH Voltage IOH = –100 μA, VDDQ = 2.5V 2.1 V
VOL1 Output LOW Voltage IOL = 1.0 mA, VDDQ = 2.5V 0.4 V
VOL2 Output LOW Voltage IOL = 100 μA, VDDQ = 2.5V 0.2 V
VIH Input HIGH Voltage VDDQ = 2.5V 1.7 VDD + 0.3 V
VIL Input LOW Voltage VDDQ = 2.5V –0.3 0.7 V
IXInput Load Current GND ≤VI≤VDDQ –5 5 μA
Table 6. Identification Register Definitions
Instruction Field CY7C1470BV25
(2M x 36) CY7C1472BV25 (4M x 18) CY7C1474BV25 (1M x 72) Description
Revision Number (31:29) 000 000 000 Describes the version number
Device Depth (28:24) 01011 01011 01011 Reserved for internal use
Architecture/Memory Type(23:18) 001000 001000 001000 Defines memory type and archi-
tecture
Bus Width/Density(17:12) 100100 010100 110100 Defines width and density
Cypress JEDEC ID Code (11:1) 00000110100 00000110100 00000110100 Allows unique identification of
SRAM vendor
ID Register Presence Indicator (0) 1 1 1 Indicates the presence of an ID
register
Table 7. Scan Register Sizes
Register Name Bit Size (x36) Bit Size (x18) Bit Size (x72)
Instruction 3 3 3
Bypass 1 1 1
ID 32 32 32
Boundary Scan Order–165FBGA 71 52 –
Boundary Scan Order–209BGA – – 110
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CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 17 of 29
Table 8. Identification Codes
Instruction Code Description
EXTEST 000 Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to High-Z state. This instruction is not 1149.1-compliant.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This
operation does not affect SRAM operations.
SAMPLE Z 010 Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation. This instruction does not implement 1149.1 preload function and
is therefore not 1149.1-compliant.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
RESERVED 110 Do Not Use: This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operations.
Table 9. Boundary Scan Exit Order (2M x 36)
Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID
1C121R341J1161B7
2D1 22P2 42K10 62B6
3E1 23R4 43J10 63A6
4D2 24P6 44H11 64B5
5E2 25R6 45G11 65A5
6F1 26R8 46F11 66A4
7G1 27P3 47E11 67B4
8 F2 28 P4 48 D10 68 B3
9G2 29P8 49D11 69A3
10 J1 30 P9 50 C11 70 A2
11 K1 31 P10 51 G10 71 B2
12 L1 32 R9 52 F10
13 J2 33 R10 53 E10
14 M1 34 R11 54 A9
15 N1 35 N11 55 B9
16 K2 36 M11 56 A10
17 L2 37 L11 57 B10
18 M2 38 M10 58 A8
19 R1 39 L10 59 B8
20 R2 40 K11 60 A7
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CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 18 of 29
Boundary Scan Exit Order (4M x 18)
Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID
1D214R427L1040B10
2E215P628K1041A8
3F2 16R6 29J10 42B8
4G2 17R8 30H11 43A7
5J1 18P3 31G11 44B7
6K119P432F1145B6
7L1 20P8 33E11 46A6
8M1 21P9 34D11 47B5
9 N1 22 P10 35 C11 48 A4
10 R1 23 R9 36 A11 49 B3
11 R2 24 R10 37 A9 50 A3
12 R3 25 R11 38 B9 51 A2
13 P2 26 M10 39 A10 52 B2
Boundary Scan Exit Order (1M x 72)
Bit # 209-Ball ID Bit # 209-Ball ID Bit # 209-Ball ID Bit # 209-Ball ID
1 A1 29 T1 57 U10 85 B11
2A2 30T2 58T11 86B10
3B1 31U1 59T10 87A11
4B2 32U2 60R11 88A10
5 C1 33 V1 61 R10 89 A7
6C2 34V2 62P11 90A5
7D1 35W1 63P10 91A9
8D2 36W2 64N11 92U8
9 E1 37 T6 65 N10 93 A6
10 E2 38 V3 66 M11 94 D6
11 F1 39 V4 67 M10 95 K6
12 F2 40 U4 68 L11 96 B6
13 G1 41 W5 69 L10 97 K3
14 G2 42 V6 70 P6 98 A8
15 H1 43 W6 71 J11 99 B4
16 H2 44 V5 72 J10 100 B3
17 J1 45 U5 73 H11 101 C3
18 J2 46 U6 74 H10 102 C4
19 L1 47 W7 75 G11 103 C8
20 L2 48 V7 76 G10 104 C9
21 M1 49 U7 77 F11 105 B9
22 M2 50 V8 78 F10 106 B8
23 N1 51 V9 79 E10 107 A4
24 N2 52 W11 80 E11 108 C6
25 P1 53 W10 81 D11 109 B7
26 P2 54 V11 82 D10 110 A3
27 R2 55 V10 83 C11
28 R1 56 U11 84 C10
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 19 of 29
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on VDD Relative to GND........–0.5V to +3.6V
Supply Voltage on VDDQ Relative to GND.......–0.5V to +VDD
DC to Outputs in Tri-State....................–0.5V to VDDQ + 0.5V
DC Input Voltage ...................................–0.5V to VDD + 0.5V
Current into Outputs (LOW) ........................................20 mA
Static Discharge Voltage.......................................... > 2001V
(MIL-STD-883, Method 3015)
Latch up Current.................................................... > 200 mA
Operating Range
Range Ambient
Temperature VDD VDDQ
Commercial 0°C to +70°C 2.5V –5%/+5% 2.5V–5% to
VDD
Industrial –40°C to +85°C
Electrical Characteristics
Over the Operating Range[12, 13]
Parameter Description Test Conditions Min Max Unit
VDD Power Supply Voltage 2.375 2.625 V
VDDQ IO Supply Voltage For 2.5V IO 2.375 VDD V
VOH Output HIGH Voltage For 2.5V IO, IOH= −1.0 mA 2.0 V
VOL Output LOW Voltage For 2.5V IO, IOL= 1.0 mA 0.4 V
VIH Input HIGH Voltage[12] For 2.5V IO 1.7 VDD + 0.3V V
VIL Input LOW Voltage[12] For 2.5V IO –0.3 0.7 V
IXInput Leakage Current
except ZZ and MODE GND ≤VI≤VDDQ –5 5μA
Input Current of MODE Input = VSS –30 μA
Input = VDD 5μA
Input Current of ZZ Input = VSS –5 μA
Input = VDD 30 μA
IOZ Output Leakage Current GND ≤VI≤VDDQ, Output Disabled –5 5μA
IDD [14] VDD Operating Supply VDD = Max, IOUT = 0 mA,
f = fMAX = 1/tCYC 4.0-ns cycle, 250 MHz 450 mA
450 mA5.0-ns cycle, 200 MHz
6.0-ns cycle, 167 MHz 400 mA
ISB1 Automatic CE
Power Down
Current—TTL Inputs
Max. VDD, Device Deselected,
VIN ≥VIH or VIN ≤VIL,
f = fMAX = 1/tCYC
4.0-ns cycle, 250MHz 200 mA
5.0-ns cycle, 200 MHz 200 mA
6.0-ns cycle, 167 MHz 200 mA
ISB2 Automatic CE
Power Down
Current—CMOS Inputs
Max. VDD, Device Deselected,
VIN ≤0.3V or
VIN > VDDQ − 0.3V, f = 0
All speed grades 120 mA
Notes
12.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2). Undershoot: VIL(AC)> –2V (pulse width less than tCYC/2).
13.TPower-up: assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ <VDD.
14.The operation current is calculated with 50% read cycle and 50% write cycle.
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CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D Page 20 of 29
ISB3 Automatic CE
Power Down
Current—CMOS Inputs
Max. VDD, Device Deselected,
VIN ≤0.3V or
VIN > VDDQ − 0.3V,
f = fMAX = 1/tCYC
4.0-ns cycle, 250 MHz 200 mA
5.0-ns cycle, 200 MHz 200 mA
6.0-ns cycle, 167 MHz 200 mA
ISB4 Automatic CE
Power Down
Current—TTL Inputs
Max. VDD, Device Deselected,
VIN ≥VIH or VIN ≤VIL, f = 0 All speed grades 135 mA
Electrical Characteristics
Over the Operating Range[12, 13] (continued)
Parameter Description Test Conditions Min Max Unit
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max 165 FBGA Max 209 FBGA Max Unit
CADDRESS Address Input Capacitance TA= 25°C, f = 1 MHz,
VDD = 2.5V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CIO Input/Output Capacitance 5 5 5 pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package 165 FBGA Package 209 FBGA Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 2.1 1.7 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V IO Test Load
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