DFI PIC-Q170/H110 User manual

A51900943
PIC-Q170/H110
Full-Size PICMG 1.3
User’s Manual

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PIC-Q170/H110
2
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The web-
site will always provide the most updated information.
© 2019. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re-
ceiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for com-
pliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

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PIC-Q170/H110
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Table of Contents
Copyright...................................................................................................................... 2
Trademarks................................................................................................................... 2
FCC and DOC Statement on Class B............................................................................... 2
Notice: ......................................................................................................................... 2
About this Manual ......................................................................................................... 4
Warranty ..................................................................................................................... 4
Static Electricity Precautions .......................................................................................... 4
Safety Measures............................................................................................................ 4
About the Package ........................................................................................................ 5
Optional Items .............................................................................................................. 5
Before Using the System Board...................................................................................... 5
Chapter 1 - Introduction................................................................................................ 6
Specifications .......................................................................................................... 6
Features ................................................................................................................. 7
Chapter 2 - Hardware Installation .................................................................................. 8
Board Layout .......................................................................................................... 8
Standby Power LED................................................................................................. 8
System Memory ...................................................................................................... 9
Installing the DIMM Module ............................................................................... 9
Removing the DIMM Module ............................................................................ 10
CPU...................................................................................................................... 11
Installing the CPU............................................................................................ 11
Installing the Fan and Heat Sink ...................................................................... 13
Jumper Settings .................................................................................................... 14
Clear CMOS..................................................................................................... 14
Rear I/O Ports....................................................................................................... 15
Graphics Display.............................................................................................. 15
USB Ports ....................................................................................................... 16
RJ45 LAN Ports ............................................................................................... 16
Internal I/O Connectors......................................................................................... 17
COM (Serial) Ports........................................................................................... 17
Digital I/O Connector....................................................................................... 18
SATA (Serial ATA) Connectors........................................................................... 18
Cooling Fan Connectors ................................................................................... 19
Chassis Intrusion Connector ............................................................................ 19
Front Panel Connector ..................................................................................... 20
LPT Connector................................................................................................. 20
DVI-D Connector ............................................................................................. 21
KB/MS Connector ............................................................................................ 21
LPC Connector ................................................................................................ 22
SMBus Connector ............................................................................................ 23
USB Headers................................................................................................... 23
12V DC Power ................................................................................................ 24
Audio Connector.............................................................................................. 24
Expansion Slot ................................................................................................ 25
Installing the M.2 Module ................................................................................ 25
Battery............................................................................................................ 26
Chapter 3 - BIOS Setup............................................................................................... 27
Overview ............................................................................................................. 27
Main ..................................................................................................................... 28
Advanced ............................................................................................................. 28
ACPI Configuration .......................................................................................... 29
CPU Configuration ........................................................................................... 30
Video Configuration ......................................................................................... 30
Audio Configuration ......................................................................................... 31
SATA Configuration .......................................................................................... 31
USB Configuration ........................................................................................... 32
PCI Express Configuration................................................................................ 32
ME Configuration............................................................................................. 33
MEBX Configuration ......................................................................................... 33
Active Management Technology Support ........................................................... 34
Debug Configuration........................................................................................ 34
UEFI Device Manager ...................................................................................... 35
SIO NUVOTON6106D....................................................................................... 35
Console Redirection ......................................................................................... 37
Security ................................................................................................................ 38
Boot ..................................................................................................................... 38
Exit ...................................................................................................................... 40
Updating the BIOS ................................................................................................ 40
Notice: BIOS SPI ROM........................................................................................... 40
Chapter 6 - Intel AMT Settings .................................................................................... 71
Overview ............................................................................................................. 71
Enabling Intel®AMT in the Insyde BIOS................................................................. 71
Entering Management Engine BIOS Extension (MEBX)............................................. 72
MEBX.................................................................................................................... 73
Main Menu...................................................................................................... 73
Intel(R) ME General Settings............................................................................ 73
Intel(R) AMT Configuration .............................................................................. 75
Chapter 5 - RAID ........................................................................................................ 86
RAID Levels .......................................................................................................... 86
Setup Procedure.................................................................................................... 86
Chapter 6 - Supported Software .................................................................................. 89
Auto-run Menu...................................................................................................... 89
Intel Chipset Software Installation Utility ................................................................ 89
Intel HD Graphics Drivers ..................................................................................... 90
Realtek Audio Drivers ............................................................................................ 91
Intel LAN Drivers ................................................................................................. 92
Intel ME Drivers .................................................................................................... 93
Intel Serial IO Drivers............................................................................................ 94
Adobe Acrobat Reader 9.3 ..................................................................................... 95
Intel Rapid Storage Technology ............................................................................. 96

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PIC-Q170/H110
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About this Manual
An electronic file of this manual is included in the CD. To view the user’s manual in the CD, in-
sert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click
“User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper
installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether
in or out of warranty. It must be returned to the purchase point, factory or authorized
service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, con-
tacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the sys-
tem chassis cover for installation or servicing. After installation or servicing, cover the
system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

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PIC-Q170/H110
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About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One PIC-Q170/H110 board
• Two Serial ATA cables (500mm)
• One DVD
• Two RS232 cables (160mm)
• One USB cable (350/398mm)
Optional Items
• USB2.0 cable
• COM cable
• SATA cable
• DIO cable
• PS/2 cable
• LPT cable
• DVI-D board with cable
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• CPU
• Memory module
• Storage device such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

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PIC-Q170/H110
Chapter 1 - Introduction
6
Chapter 1 - Introduction
►Specifications
SYSTEM Processor 7th Generation Intel®CoreTM Processors, LGA1151:
• Intel®CoreTM i7-7700 Processor, Four Core, 8M, 3.6GHz (4.2GHz), 65W
• Intel®CoreTM i7-7700T Processor, Four Core, 8M, 2.9GHz (3.8GHz), 35W
• Intel®CoreTM i5-7500 Processor, Four Core, 6M, 3.4GHz (3.8GHz), 65W
• Intel®CoreTM i5-7500T Processor, Four Core, 6M, 2.7GHz (3.3GHz), 35W
• Intel®CoreTM i3-7101E Processor, Dual Core, 3M, 3.9GHz, 54W
• Intel®CoreTM i3-7101TE Processor, Dual Core, 3M, 3.4GHz, 35W
• Intel®CoreTM G3930E Processor, Dual Core, 2M, 2.9GHz, 54W
• Intel®CoreTM G3930TE Processor, Dual Core, 2M, 2.7GHz, 35W
6th Generation Intel®CoreTM Processors, LGA1151:
• Intel®CoreTM i7-6700 Processor, Four Core, 8M, 3.4GHz (4.0GHz), 65W
• Intel®CoreTM i7-6700TE Processor, Four Core, 8M, 2.4GHz (3.4GHz), 35W
• Intel®CoreTM i5-6500 Processor, Four Core, 6M, 3.2GHz (3.6GHz), 65W
• Intel®CoreTM i5-6500TE Processor, Four Core, 6M, 2.3GHz (3.3GHz), 35W
• Intel®CoreTM i3-6100 Processor, Dual Core, 4M, 65W
• Intel®CoreTM i3-6100TE Processor, Dual Core, 4M, 2.7GHz, 35W
• Intel®CoreTM G4400 Processor, Dual Core, 3M, 3.3GHz, 65W
• Intel®CoreTM G4400TE Processor, Dual Core, 3M, 2.9GHz, 35W
• Intel®CoreTM G3900 Processor, Dual Core, 2M, 2.8GHz, 65W
• Intel®CoreTM G3900TE Processor, Dual Core, 2M, 2.6GHz, 35W
Chipset Q170/H110
Memory Two 288-pin DIMM up to 32GB
Dual Channel DDR4 1866/2133MHz
BIOS Insyde SPI 128Mbit
GRAPHICS Display 1 x VGA, resolution up to 1920x1200 @ 60Hz
1 x DVI-D (available upon request), resolution up to 1920x1200 @ 60Hz
Dual
Displays
VGA + DVI-D (available upon request)
EXPANSION Interface 1 x PCIe x16 Gen. 3
4 x PCIe x1
4 x PCI
1 x M.2 M key 2280 (PCIe/SATA3.0) (Q170 only)
ETHERNET Controller/
Phy
PIC-Q170:
•1 x Intel®I211AT PCIe (10/100/1000Mbps)
•1 x Intel®I219LM PCIe with iAMT11.6 (10/100/1000Mbps) (only Core i7/i5
supports iAMT)
PIC-H110:
•1 x Intel®I211AT PCIe (10/100/1000Mbps)
•1 x Intel®I219V PCIe (10/100/1000Mbps)
REAR I/O Ethernet 2 x GbE (RJ-45)
USB 2 x USB 3.0
Display 1 x VGA
1 x DVI-D (available upon request)
INTERNAL I/O Serial 2 x RS-232/422/485 (2.54mm pitch)
2 x RS232 (2.54mm pitch)
USB 2 x USB 3.0 (2.0mm pitch) (Q170 only)
6 x USB 2.0 (2.54mm pitch) (Q170), 4 x USB 2.0 (2.54mm pitch) (H110)
Audio 1 x Intel High Definition audio interface (by request)
SATA 4 x SATA 3.0 (up to 6Gb/s)
DIO 1 x 8-bit DIO
SMBus 1 x SMBus
ATX ATX 12V Power Connector and Expansion Goldfinger
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM fTPM2.0 or DTPM2.0 (optional)
OS SUPPORT Microsoft Windows 7 (32/64 bit)
Windows 8.1 (64 bit)
Windows 10 IoT Enterprise (64 bit)
Note: 7th Gen Intel Core processors only support Win 10.
Linux
ENVIRONMENT Temperature Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
MECHANICAL Dimensions Full Size PICMG 1.3
338mm (13.3") x 126.39mm (4.98")

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PIC-Q170/H110
Chapter 1 - Introduction
7
►Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2.
Graphics
The integrated Intel®HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications. Supports DVI-D (optional) and
VGA interfaces for diaplay outputs.
Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
Gigabit LAN
Intel®I211AT PCI Express Gigabit Ethernet controller and Intel®I219LM PCI Express Gigabit
Ethernet controller support up to 1Gbps data transmission.
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is
supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Man-
agement Event) signal. However, if your system is in the Suspend mode, you can power-on
the system only through an IRQ or DMA interrupt.
USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis-
sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement in
device transfer speeds between your computer and a wide range of simultaneously accessibl
external Plug and Play peripherals.
Wake-On-PS/2
This function allows you to use the PS/2 keyboard or PS/2 mouse to power-on the system.
Wake-On-USB
This function allows you to use a USB keyboard or USB mouse to wake up a system from the
S3 (STR - Suspend To RAM) state.
RTC Timer
The RTC installed on the system board allows your system to automatically power-on on the
set date and time.
ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows®without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.
PICMG®1.3 (SHB Express ™)
PICMG 1.3 is a form factor developed specifially with 20 PCI Express lanes for high-speed I/O
exapnsion via a passive backplane. Full-size (two x16 fingers and two x8 fingers) or half-size
(one x16 finger and one x8 finger) form factors of the host board along with electrical require-
ments are specified. Combinations of lanes and channels of the PCIe edge connectors are also
configurable for various applications.

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PIC-Q170/H110
Chapter 2 - Hardware Installation
8
Chapter 2 - Hardware Installation
►Board Layout
Buzzer
DIO
KB/MS
SATA 3/2/1/0
(left to right)
SPI Flash
BIOS
CPU FAN
12
10
1
JP1
1
2
11
12 Front Panel
DDR4_1
DDR4_2
1
2
1
910
2
12
10
1 2
25
LPT
Chassis
Intrusion
1
ASM1085
+12V Power
10
9
11 11
12
10
Standby Power LED
Intel
I211AT
dTPM 2.0 Note
1
System Fan 1
1
2
5
SMBus
M.2 M Key
2280 Note
DVI-D Note
Audio Note
1
910
2
LPC
1
13
2
14
USB 3/4 (USB 3.0)
USB 13/14 (USB 2.0) Note
USB 1/2 (upper/lower)
(USB 3.0)
USB 1/2
(USB 2.0)
Note
USB 5/6
(USB 2.0)
USB 3/4
(USB 2.0)
1
2
29
30
1 2
9
COM 4/3/2/1
(left to right)
1 2
9
1 2
9
1 2
9
Socket LGA1151
1
Battery
Intel
Q170/H110
11
101
LAN 2
LAN 1
VGA
Note:
The components may only be present in certain models.
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other com-
ponents. Perform installation procedures at an ESD workstation only. If such a station is not available, you
can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of
the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
Important:
When the Standby Power LED lit red, it indicates that
there is power on the system board. Power-off the PC
then unplug the power cord prior to installing any devices.
Failure to do so will cause severe damage to the mother-
board and components.
►Standby Power LED
Standby Power LED

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PIC-Q170/H110
Chapter 2 - Hardware Installation
9
• Two 288-pin DDR4 DIMM sockets
• Supports 1866/2133 MHz DDR4 SDRAM
• Dual channel memory interface
• Supports maximum of 32GB system memory
►System Memory
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration are on different channels.
DDR4_1
DDR4_2
Installing the DIMM Module
Before installing the memory module, please make sure that the following safety cautions are
well-attended.
1. Make sure the PC and all other peripheral devices connected to it has been powered
down.
2. Disconnect all power cords and cables.
3. Locate the DIMM socket on the system board
4. Make sure the notch on memory card is aligned to the key on the socket.
Socket Side View
Socket Top View
DDR4 DIMM
Notch
Key
Eject TabEject Tab
Step 3
Step 2
Step 1 Step 1
Step 2
Step 3
Socket Side View
Socket Top View
DDR4 SO-DIMM
Key
Eject TabEject Tab
Step 3
Step 2
Step 1
Step 1
Step 2
Step 3
Notch
Retention Notch
►System Memory

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PIC-Q170/H110
Chapter 2 - Hardware Installation
10
Please follow the steps below to install the memory card into the socket.
Step 1:
Press the eject tabs at both ends of the socket outward and downward to release them from the
locked position.
Step 2:
Insert the memory card into the slot while making sure the notch and the key are aligned. Press
the card down firmly with fingers while applying and maintaining even pressure on both ends.
Step 3:
The tabs snap automatically to the edges of the card and lock the card in place.
Socket Side View
Socket Top View
DDR4 DIMM
Notch
Key
Eject TabEject Tab
Step 3
Step 2
Step 1
Step 1
Step 2
Step 3
Socket Side View
Socket Top View
DDR4 SO-DIMM
Key
Eject TabEject Tab
Step 3
Step 2
Step 1
Step 1
Step 2
Step 3
Notch
Retention Notch
Socket Side View
Socket Top View
DDR4 DIMM
Notch
Key
Eject TabEject Tab
Step 3
Step 2
Step 1
Step 1
Step 2
Step 3
Socket Side View
Socket Top View
DDR4 SO-DIMM
Key
Eject TabEject Tab
Step 3
Step 2
Step 1
Step 1
Step 2
Step 3
Notch
Retention Notch
►System Memory
►Installing the DIMM Module
Please follow the steps below to remove the memory card from the socket.
Step 1:
Press the eject tabs at both ends of the socket outward and downward to release them from the
locked position.
Step 2:
The memory card ejects from the slot automatically.
Step 3:
Hold the card by its edges and remove it from the slot.
Removing the DIMM Module
►System Memory