Digi XBee 3 Quick user guide

Digi XBee® 3
RF Module
Hardware Reference Manual

Revision history—90001543
Revision Date Description
J October
2018
Added Brazilian certifications.
K March
2019
Added BLE power output specifications. Added I2C pin specifications. Added a
new antenna. Added XBee3 USB Adapter information.
L April 2019 Added XBIB-C board information.
M May 2019 Added FCC publication 996369 related information.
N December
2019
Added antennas.
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© 2019 Digi International Inc. All rights reserved.
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merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.
Warranty
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www.digi.com/howtobuy/terms
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Logs (from time of reported issue)
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Digi XBee® 3 RF Module Hardware Reference Manual 2

Description of issue
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Digi XBee® 3 RF Module Hardware Reference Manual 3

Contents
Digi XBee® 3 RF Module Hardware Reference Manual
General XBee 3 specifications
General specifications 9
Regulatory conformity summary 9
Serial communication specifications 10
UART pin assignments 10
SPI pin assignments 10
GPIO specifications 10
Electro Static Discharge (ESD) 11
IEEE 802.15.4-specific specifications
Performance specifications 13
Power requirements 13
Networking and security specifications 13
Communication interface specifications 14
Mechanical drawings
XBee 3 surface-mount antennas 16
XBee 3 surface-mount - U.FL/RF pad antenna 16
XBee 3 surface-mount - embedded antenna 17
XBee 3 micro antennas 18
XBee 3 micro (U.FL/RF Pad) 18
XBee 3 micro (chip antenna) 19
XBee 3 through-hole antennas 20
XBee 3 through-hole - PCB antenna 20
XBee 3 through-hole - U.FL antenna 20
XBee 3 through-hole - RPSMA antenna 21
Pin signals
Pin signals for the XBee 3 surface-mount module 23
Pin signals for the XBee 3 micro module 26
Pin signals for the XBee 3 through-hole module 29
Recommended pin connections 30
Digi XBee® 3 RF Module Hardware Reference Manual 4

Digi XBee® 3 RF Module Hardware Reference Manual 5
Design notes
Power supply design 32
Board layout 32
Antenna performance 32
Design notes for PCB antenna and chip antenna devices 33
Surface-mount embedded antenna keepout area 33
XBee 3 Micro chip antenna keepout area 34
Through-hole embedded antenna keepout area 35
Design notes for RF pad devices 35
Copper keepout for test points 38
Regulatory information
United States (FCC) 41
OEM labeling requirements 41
FCC notices 41
FCC-approved antennas (2.4 GHz) 42
RF exposure 50
XBee 3 USB Adapter 50
FCC publication 996369 related information 50
Europe (CE) 51
Maximum power and frequency specifications 51
OEM labeling requirements 51
Declarations of conformity 52
Antennas 52
ISED (Innovation, Science and Economic Development Canada) 53
Labeling requirements 53
For XBee 3 53
RF Exposure 53
Australia (RCM)/New Zealand 54
Japan (TELEC) 54
Brazil ANATEL 54
Modelo: XBee 3 55
South Korea 55
XBIB-C development boards
XBIB-C Micro Mount reference 57
XBIB-C SMT reference 59
XBIB-CU TH reference 61
XBIB-C-GPS reference 63
Interface with the XBIB-C-GPS module 65
I2C communication 66
UART communication 66
Manufacturing information
Recommended solder reflow cycle 68
Handling and storage 68
Recommended footprint 68
Flux and cleaning 70
Reworking 71

Digi XBee® 3 RF Module Hardware Reference Manual 6
Troubleshooting
Brownout issue 73
Voltage brownout 73
Voltage ramp up discontinuities 73
How to distinguish revision B parts 73

Digi XBee® 3 RF Module Hardware Reference Manual
This manual provides information for the XBee 3 RF Module hardware. The XBee 3 RF Module can be
any of the following form factors:
nMicro-mount
nThrough-hole
nSurface-mount
For more information about the operation and programming functions of the device, see:
nXBee 3 DigiMesh RF Module User Guide
nXBee 3 Zigbee RFModule User Guide
nXBee 3 802.15.4 RFModule User Guide
Digi XBee® 3 RF Module Hardware Reference Manual 7

General XBee 3 specifications
The following tables provide general specifications for the hardware.
General specifications 9
Regulatory conformity summary 9
Serial communication specifications 10
GPIO specifications 10
Electro Static Discharge (ESD) 11
Digi XBee® 3 RF Module Hardware Reference Manual 8

General XBee 3 specifications General specifications
Digi XBee® 3 RF Module Hardware Reference Manual 9
General specifications
The following table describes the general specifications for the devices.
Specification
XBee 3/XBee 3-PRO
micro-mount
XBee 3/XBee 3-PRO
surface-mount
XBee 3/XBee 3-PRO
through-hole
Operating frequency
band
ISM 2.4 – 2.4835 GHz
Form factor Micro-mount Surface-mount Through-hole
Dimensions Micro-mount: 1.36 cm x
1.93 cm x 0.241 cm (0.534
in x 0.760 in x 0.095 in)
Surface-mount: 2.199
x 3.4 x 0.368 cm (0.866
x 1.33 x 0.145 in)
Through-hole: 2.438
x 2.761 cm (0.960 x
1.087 in)
Operatingtemperature -40 to 85 °C (industrial)
Antenna options RF pad, chip antenna, or
U.FL connector
RF pad, embedded
antenna, or U.FL
connector
RPSMA connector,
embedded antenna,
or U.FL connector
Analog-to-digital
converter (ADC)
4 10-bit analog inputs 4 10-bit analog inputs 4 10-bit analog
inputs
Regulatory conformity summary
This table describes the agency approvals for the devices.
Approval XBee 3 XBee 3-PRO
United States (FCC Part 15.247) FCC ID: MCQ-XBEE3 FCC ID: MCQ-XBEE3
Innovation, Science and Economic Development
Canada (ISED)
IC: 1846A-XBEE3 IC: 1846A-XBEE3
FCC/IC Test Transmit Power Output range -6.8 to +8 dBm -6.8 to +19.9 dBm
Bluetooth® (XBee 3 Zigbee only) Declaration ID:
D042514
QDID: 121268
Declaration ID:
D042514
QDID: 121268
Australia RCM RCM
Brazil ANATEL 06329-18-
01209
ANATEL 06329-18-
01209
Europe (CE) Yes No
Japan (TELEC) R210-119309 No
RoHS Compliant
South Korea (KCC) R-C-DIG-XBEE3 No

General XBee 3 specifications Serial communication specifications
Digi XBee® 3 RF Module Hardware Reference Manual 10
Serial communication specifications
The XBee 3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART) and Serial
Peripheral Interface (SPI)serial connections.
UART pin assignments
UART pins Device pin number
XBee 3 micro-mount XBee 3 surface-mount XBee 3 through-hole
DOUT/DIO13 3 3 2
DIN / CONFIG/DIO14 4 4 3
CTS / DIO7 24 25 12
RTS/ DIO6 27 29 16
SPI pin assignments
SPI pins Device pin number
XBee 3 micro-mount XBee 3 surface-mount XBee 3 through-hole
SPI_CLK 13 14 18
SPI_SSEL 14 15 17
SPI_MOSI 15 16 11
SPI_MISO 16 17 4
SPI_ATTN 11 12 19
GPIO specifications
XBee 3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list
depends on the device configuration as some GPIO pads are used for purposes such as serial
communication.
GPIO electrical specification Value
Voltage - supply 2.1 - 3.6 V
Low switching threshold 0.3 x VCC
High switching threshold 0.7 x VCC
Input pull-up resistor value 40 kΩ(typical)