Ebyte E220-900MM22S User manual

E220-900MM22S
LLCC68 868/915MHz 160mW SPI LoRa Module SMD Type

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
Contents
Disclaimer ...........................................................................................................................................................................................................2
1.2 Features............................................................................................................................................................................................... 3
1.2 Application ......................................................................................................................................................................................... 3
2 Specification and Parameter ..............................................................................................................................................................4
2.1 RF Parameter ..................................................................................................................................................................................... 4
2.2 Electrical Parameter ......................................................................................................................................................................... 4
2.3 Hardware Parameter.........................................................................................................................................................................4
3 Size and Pin Definition................................................................................................................................................................................ 5
4 Basic Operation ..............................................................................................................................................................................................6
4.1 Hardware Design.............................................................................................................................................................................. 6
4.2 Software Design ................................................................................................................................................................................7
5 Basic Application ...........................................................................................................................................................................................8
5.1 Basic Circuit ................................................................................................................................................................................... 8
6 FAQ...................................................................................................................................................................................................................8
6.1 Communication Range Is Too Short ............................................................................................................................................8
6.2 Module Is Easy To Damage ........................................................................................................................................................... 9
6.3 BER(Bit Error Rate) Is High ......................................................................................................................................................... 9
7 Production Guidance..................................................................................................................................................................................10
7.1 Reflow Soldering Temperature ...................................................................................................................................................10
7.2 Reflow Soldering Curve ...............................................................................................................................................................10
8 E220 Series...................................................................................................................................................................................................11
9 Antenna Recommendation ........................................................................................................................................................................11
9.1 Recommendation ............................................................................................................................................................................11
10 Package For Batch Order........................................................................................................................................................................12
Revision History ............................................................................................................................................................................................. 12
About us ............................................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
Disclaimer
The information in this document, including the URL address for reference, is
subject to change without notice. Documents are provided "as is" without any
warranty, including any warranty of merchantability, fitness for a particular purpose or
non-infringement, and any warranty referred elsewhere of any proposal, specification
or sample。 This document does not bear any responsibility, including the responsibility
for any patent infringement caused by the use of the information in this document.This
document does not grant any license for the use of intellectual property by estoppel or
otherwise, whether express or implied.
The data in this paper are all from Ebyte laboratory, and the actual results may be
slightly different.
It is hereby declared that all trade names, trademarks and registered trademarks
mentioned here are the property of their respective owners.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology
Co., Ltd.
Notice:
The contents of this manual may be changed due to product version upgrade or other reasons. Ebyte Electronic
Technology Co., Ltd. reserves the right to modify the contents of this manual without any notice or prompt. This
manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd. will try its best to provide accurate
information in this manual. However, Chengdu Ebyte Electronic Technology Co., Ltd. does not guarantee that the
contents of this manual are completely correct, and all statements, information and suggestions in this manual do
not constitute any express or implied warranty.

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
1 Overview
1.1 Brief Introduction
E220-900MM22S is an ultra-small volume independently developed based on a
new generation of LoRaTM RF chip LLCC68 produced by Semtech, and is suitable for
868MHz, 915MHz SMD LoRaTM wireless modules, using industrial grade 32MHz crystal
oscillator.
Since it adopts the imported LLCC68 as the core of the module, compared with
the previous generation LoRaTM transceiver, the anti-interference performance
and communication distance have been further improved. Because it adopts the new
LoRaTM modulation technology, its anti-interference performance and communication distance far exceed the current
FSK and GFSK modulation products. This module is mainly aimed at smart home, wireless meter reading, scientific
research and medical treatment, as well as medium and long distance wireless communication equipment. This product
can cover the ultra-wide applicable frequency range of 850~930MHz.
Since this module is a pure RF transceiver module, it needs to use MCU driver or use a dedicated SPI debugging
tool.
1.2 Features
The measured distance can reach 6000m;
Maximum transmit power 160mW, multi-level software adjustable;
Support global license-free ISM 868/915MHz frequency band;
Support data transmission rate of 1.76kbps~62.5kbps in LoRaTM mode;
Supports data transfer rates up to 300kbps in FSK mode;
Large FIFO capacity, support 256Byte data buffer;
Support spreading factors SF5, SF6, SF7, SF8, SF9, SF10, SF11;
Support 1.8V~3.7V power supply, more than 3.3V power supply can ensure the best performance;
Industrial-grade standard design, support long-term use at -40 ~ 85°C;
Ultra-small 10*10mm package, convenient for secondary development and integration.
1.2 Application
Home security alarm and remote keyless entry;
Smart home and industrial sensors, etc;
Wireless alarm security system;
Building automation solutions;
Wireless industrial grade remote control;
Healthcare products;
Advanced meter reading architecture (AMI);

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
Automotive industry applications.
2 Specification and Parameter
2.1 RF Parameter
RF Parameter
Parameter Value
Remark
Operating frequency
850MHz～930MHz
Support ISM
Transmit power
21dBm～22dBm
The software is adjustable and needs to be developed and set by
the user
Receiving sensitivity
-129dBm
BW_L=250kHz，SF = 10，LORATM
FIFO
256Byte
Maximum length of single transmission
Modulation mode
LoRa
LoRa modulation is recommended
Blocking power
10dBm
The probability of burning at close range is small
Air rate
LoRa（bps）
1.76k～62.5k
User programming control
Reference distance
5500m
Clear and open environment, antenna gain 5dBi, antenna height
2.5 meters, air rate 2.4kbps
2.2 Electrical Parameter
Main Parameter
Performance
Remark
Min.
Type
Max.
Operating voltage（V）
1.8
3.3
3.7
≥3.3V can guarantee the output power, more than 3.7V will
permanently burn the module
Communication level（V）
-
3.3
-
Risk of burnout with 5V TTL
Operating temperature（℃）
-40
-
+85
Industrial grade design
Power
consumption
TX current
（mA）
-
100
-
Instantaneous power consumption
RX current
（mA）
-
10
-
-
Sleep current
（nA）
-
180
-
software shutdown
2.3 Hardware Parameter
Hardware Parameters
Parameter Value
Remark
Crystal oscillation frequency
32MHz
-

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
Package
SMD
-
Connector
stamp hole
Spacing 1.27mm
Communication interface
SPI
0-10Mbps
Size
10* 10*2.5 mm
With shield
Net weight
0.5g±0.02g
-
RF interface
stamp hole
-
3 Size and Pin Definition
Pin No.
Item
Direction
Description
1
VCC
-
Power supply, range 1.8V~3.7V (recommended to add external ceramic
filter capacitor)
2
GND
-
Ground wire, connected to the power reference ground
3
NRST
Input
Chip reset trigger input pin, active low
4
NC
-
-
5
NC
-
-
6
ANT
-
RF interface, stamp hole
7
GND
-
Ground wire, connected to the power reference ground
8
NC
-
-
9
TXEN
Input
RF switch launch control pin, connected to external microcontroller IO
or DIO2, active high
10
RXEN
Input
RF switch receiving control pin, connected to external microcontroller
IO, active high

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
11
BUSY
Output
Used for status indication (see LLCC68 manual for details)
12
MISO
Output
SPI data output pin
13
MOSI
Input
SPI data input pin
14
NSS
Input
Module chip select pin for starting an SPI communication
15
SCK
Input
SPI clock input pin
16
GND
-
Ground wire, connected to the power reference ground
17
NC
-
-
18
DIO3
Input/Output
Configurable general-purpose IO port (see LLCC68 manual for details)
19
DIO2
Input/Output
Configurable general-purpose IO port (see LLCC68 manual for details)
20
DIO1
Input/Output
Configurable general-purpose IO port (see LLCC68 manual for details)
For the pin definition, software driver and communication protocol of the module, please refer to the official
LLCC68 Datasheet of SEMTECH
4 Basic Operation
4.1 Hardware Design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply,
reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done;
It is not recommended to use 5V level for communication lines, and there is a risk of damage. A level conversion

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
circuit needs to be added;
The antenna installation structure has a great influence on the performance of the module. Make sure that the
antenna is exposed, preferably vertically upward. When the module is installed inside the case, a high-quality
antenna extension cable can be used to extend the antenna to the outside of the case;
The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance;
It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.
4.2 Software Design
This module is LLCC68+ peripheral circuit, users can operate according to LLCC68 chip book;
DIO1, DIO2, and DIO3 are general-purpose IO ports, which can be configured with various functions; DIO2 can be
connected with TXEN, not with the IO port of MCU, and is used to control the RF switch transmission, see
LLCC68 manual for details, if not used, it can be left floating;
Internal use of 32MHz passive crystal, no pin control, software program control;
Difference between LLCC68 and SX1262/SX1268:
1. SX1262/SX1268 support spreading factors SF5, SF6, SF7, SF8, SF9, SF10, SF11, SF12;
LLCC68 supports spreading factors SF5, SF6, SF7, SF8, SF9, SF10, SF11.
2. Spread spectrum factor and receiver bandwidth that can be set by LLCC68:
LoRa® Rx/Tx, BW = 125 – 250 - 500 kHz,
LoRa®，SF = 5 - 6 - 7 - 8 - 9 for BW = 125 kHz,
LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 for BW = 250 kHz,
LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 - 11 for BW = 500 kHz;

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
5 Basic Application
5.1 Basic Circuit
Note: The L1 inductor is a protective device used to prevent the device from being damaged due to excessive input
power of the antenna. The user should add this inductor when using the module.
6 FAQ
6.1 Communication Range Is Too Short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
At room temperature, the low voltage of the power supply is lower than the recommended value. The lower the
voltage, the lower the output power.;
Due to antenna quality or poor matching between antenna and module.

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
6.2 Module Is Easy To Damage
Please check the power supply to ensure that it is between the recommended supply voltages, as exceeding the
maximum value will cause permanent damage to the module;
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) Is High
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
The clock waveform on the SPI is not standard, check whether there is interference on the SPI line, and the SPI bus
routing should not be too long;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
7 Production Guidance
7.1 Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Max preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Average ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
6 minutes max
8 minutes max
7.2 Reflow Soldering Curve

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
8 E220 Series
Model No.
Core IC
Frequency
Hz
Tx power
dBm
Distance
km
Package
Size mm
Interface
E22-400M22S
SX1268
433M/470M
22
5.0
SMD
14*20
SPI
E22-900M22S
SX1262
868M/915M
22
5.5
SMD
14*20
SPI
E220-400M22S
LLCC68
433M/470M
22
5.5
SMD
14*20
SPI
E220-900M22S
LLCC68
868M/915M
22
5.5
SMD
14*20
SPI
E32-400M20S
SX1278
410M/493M
20
5.0
SMD
14*20
SPI
E32-900M20S
SX1276
850M/931M
20
5.0
SMD
17.6*25.2
SPI
9 Antenna Recommendation
9.1 Recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the
communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Model No.
Type
Frequency
Hz
Interface
Gain
dBi
Height
Cable
Function Feature
TX433-NP-4310
Flexible pcb
antenna
433M
SMA-J
2
43.8*9.5mm
-
Built-in flexible, FPC soft
antenna
TX433-JW-5
Rubber antenna
433M
SMA-J
2
50mm
-
Flexible &omnidirectional
TX433-JWG-7
Rubber antenna
433M
SMA-J
2.5
75mm
-
Flexible &omnidirectional
TX433-JK-20
Rubber antenna
433M
SMA-J
3
210mm
-
Flexible &omnidirectional
TX433-JK-11
Rubber antenna
433M
SMA-J
2.5
110mm
-
Flexible &omnidirectional
TX433-XP-200
Sucker antenna
433M
SMA-J
4
19cm
200cm
Sucker antenna, high gain
TX433-XP-100
Sucker antenna
433M
SMA-J
3.5
18.5cm
100cm
Sucker antenna, high gain
TX433-XPH-300
Sucker antenna
433M
SMA-J
6
96.5cm
300cm
Vehicle suction cup
antenna, super high gain
TX433-JZG-6
Rubber antenna
433M
SMA-J
2.5
52mm
-
Short straight
&omnidirectional
TX433-JZ-5
Rubber antenna
433M
SMA-J
2
52mm
-
Short straight
&omnidirectional
TX490-XP-100
Sucker antenna
490M
SMA-J
50
12cm
100cm
Sucker antenna, high gain
TX490-JZ-5
Rubber antenna
490M
SMA-J
50
50mm
-
Short straight
&omnidirectional

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
10 Package For Batch Order
Revision History
Version
Date
Description
Issued By
1.0
2022-8-20
Initial version
Huang
1.1
2022-8-29
Content update
Hao
1.2
2023-5-12
Correct the recommended line diagram
Hao

Chengdu Ebyte Electronic Technology Co., Ltd. E220-900MM22S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
About us
Technical support: sup[email protected]m
Documents and RF Setting download link: https://www.cdebyte.com
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