Emerson Motorola MVME162 User manual

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MVME162
Embedded Controller
User’s Manual
(MVME162/D2)

Notice
While reasonable efforts have been made to assure the accuracy of this document,
Motorola, Inc. assumes no liability resulting from any omissions in this document, or
from the use of the information obtained therein. Motorola reserves the right to revise
this document and to make changes from time to time in the content hereof without
obligation of Motorola to notify any person of such revision or changes.
No part of this material may be reproduced or copied in any tangible medium, or
stored in a retrieval system, or transmitted in any form, or by any means, radio,
electronic, mechanical, photocopying, recording or facsimile, or otherwise, without the
prior written permission of Motorola, Inc.
It is possible that this publication may contain reference to, or information about
Motorola products (machines and programs), programming, or services that are not
announced in your country. Such references or information must not be construed to
mean that Motorola intends to announce such Motorola products, programming, or
services in your country.
Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S.
Government, the following notice shall apply unless otherwise agreed to in writing by
Motorola, Inc.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth
in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software
clause at DFARS 252.227-7013.
Motorola, Inc.
Computer Group
2900 South Diablo Way
Tempe, Arizona 85282

Preface
TheMVME162User’sManual provides generalinformation,hardwarepreparationand
installation instructions, operating instructions, and a functional description for the
MVME162 Embedded Controller.
This manual is intended for anyone who wants to design OEM systems, supply
additional capability to an existing compatible system, or work in a lab environment
for experimental purposes.
A basic knowledge of computers and digital logic is assumed.
To use this manual, you should be familiar with the publications listed in the Related
Documentation section in Chapter 1 of this manual.

The computer programs stored in the Read Only Memory of this device contain
material copyrighted by Motorola Inc., first published 1990, and may be used only
under a license such as the License for Computer Programs (Article 14) contained in
Motorola’s Terms and Conditions of Sale, Rev. 1/79.
!
WARNING
This equipment generates, uses, and can radiate radio
frequency energy and if not installed and used in
accordance with the documentation for this product, may
cause interference to radio communications. It has been
tested and found to comply with the limits for a Class A
Computing Device pursuant to Subpart J of Part 15 of FCC
rules, which are designed to provide reasonable protection
against such interference when operated in a commercial
environment. Operation of this equipment in a residential
area is likely to cause interference in which case the user, at
the user’s own expense, will be required to take whatever
measures necessary to correct the interference.
Motorola®and the Motorola symbol are registered trademarks of Motorola, Inc.
Delta SeriesTM, MC68040TM, VMEmoduleTM, VMEsystemTM, VMEexecTM, and 162BugTM
are trademarks of Motorola, Inc.
IndustryPackTM and IPTM are trademarks of GreenSpring Computers, Inc.
TimekeeperTM and ZeropowerTM are trademarks of Thompson Components.
All other products mentioned in this document are trademarks or registered
trademarks of their respective holders.
© Copyright Motorola 1993, 1994
All Rights Reserved
Printed in the United States of America
July 1994

Safety Summary
Safety Depends On You
The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in
this manual violates safety standards of design, manufacture, and intended use of the equipment. Motorola,
Inc. assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. You,
as the user of the product, should follow these warnings and all other safety precautions necessary for the
safe operation of the equipment in your operating environment.
Ground the Instrument.
To minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground.
The equipment is supplied with a three-conductor AC power cable. The power cable must either be plugged
into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter, with the
grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet. The
power jack and mating plug of the power cable meet International Electrotechnical Commission (IEC) safety
standards.
Do Not Operate in an Explosive Atmosphere.
Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical
equipment in such an environment constitutes a definite safety hazard.
Keep Away From Live Circuits.
Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or
other qualified maintenance personnel may remove equipment covers for internal subassembly or
component replacement or any internal adjustment. Do not replace components with power cable
connected. Under certain conditions, dangerous voltages may exist even with the power cable removed. To
avoid injuries, always disconnect power and discharge circuits before touching them.
Do Not Service or Adjust Alone.
Do not attempt internal service or adjustment unless another person, capable of rendering first aid and
resuscitation, is present.
Use Caution When Exposing or Handling the CRT.
Breakage of the Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion).
To prevent CRT implosion, avoid rough handling or jarring of the equipment. Handling of the CRT should
be done only by qualified maintenance personnel using approved safety mask and gloves.
Do Not Substitute Parts or Modify Equipment.
Because of the danger of introducing additional hazards, do not install substitute parts or perform any
unauthorized modification of the equipment. Contact your local Motorola representative for service and
repair to ensure that safety features are maintained.
Dangerous Procedure Warnings.
Warnings, such as the example below, precede potentially dangerous procedures throughout this manual.
Instructions contained in the warnings must be followed. You should also employ all other safety
precautions which you deem necessary for the operation of the equipment in your operating environment.
!
WARNING
Dangerous voltages, capable of causing death, are present in
this equipment. Use extreme caution when handling,
testing, and adjusting.

vii
Contents
CHAPTER 1 GENERAL INFORMATION
Introduction .............................................................................................................1-1
Models ......................................................................................................................1-1
Features.....................................................................................................................1-2
Specifications ...........................................................................................................1-3
Cooling Requirements.....................................................................................1-4
Special Considerations for Elevated Temperature Operation...................1-4
FCC Compliance..............................................................................................1-5
General Description................................................................................................1-6
Input/Output ...................................................................................................1-6
VMEbus Interface ............................................................................................1-7
No-VMEbus-Interface Option........................................................................1-7
MCchip..............................................................................................................1-7
Flash Memory and EPROM............................................................................1-7
IndustryPack Modules....................................................................................1-8
Optional SCSI Interface...................................................................................1-8
Optional LAN Ethernet Transceiver Interface.............................................1-8
Required Equipment...............................................................................................1-8
MVME162Bug Firmware................................................................................1-8
MVME712 Series Transition Modules...........................................................1-9
Available Software...........................................................................................1-9
Related Documentation........................................................................................1-10
Support Information.............................................................................................1-11
Manual Terminology ............................................................................................1-12

viii
CHAPTER 2 HARDWARE PREPARATION AND INSTALLATION
Introduction.................................................................................................................2-1
Unpacking Instructions..............................................................................................2-1
Hardware Preparation ...............................................................................................2-1
SIM Selection........................................................................................................2-2
Removal of Existing SIM.............................................................................2-4
Installation of New SIM ..............................................................................2-5
System Controller Select Header (J1)................................................................2-5
Synchronous Clock Select Header (J11) for Serial Port 1/Console ..............2-6
Clock Select Header (J12) for Serial Port 2.......................................................2-6
SRAM Battery Backup Source Select Header (J20).........................................2-7
EPROM Size Select Header (J21).......................................................................2-7
General-Purpose Readable Jumpers Header (J22)..........................................2-8
Installation Instructions.............................................................................................2-9
IP Installation on the MVME162 .......................................................................2-9
MVME162 Module Installation .......................................................................2-10
System Considerations .....................................................................................2-12
CHAPTER 3 OPERATING INSTRUCTIONS
Introduction.................................................................................................................3-1
Switches and LEDs.....................................................................................................3-1
ABORT Switch (S1)..............................................................................................3-1
RESET Switch (S2)...............................................................................................3-1
Front Panel Indicators (DS1 - DS4) ...................................................................3-2
Memory Maps.............................................................................................................3-3
Local Bus Memory Map .....................................................................................3-3
Normal Address Range...............................................................................3-3
Detailed I/O Memory Maps..............................................................................3-7
IPIC Overall Memory Map.......................................................................3-17
BBRAM, TOD Clock Memory Map.........................................................3-21
Interrupt Acknowledge Map....................................................................3-24
VMEbus Memory Map.....................................................................................3-24
VMEbus Accesses to the Local Bus..........................................................3-24
VMEbus Short I/O Memory Map............................................................3-24
Software Initialization..............................................................................................3-24
Multi-MPU Programming Considerations....................................................3-24
Local Reset Operation.......................................................................................3-25

ix
CHAPTER 4 FUNCTIONAL DESCRIPTION
Introduction ................................................................................................................ 4-1
MVME162 Functional Description .......................................................................... 4-1
Data Bus Structure.............................................................................................. 4-1
MC68040/MC68LC040 MPU............................................................................ 4-2
EPROM and Flash Memory............................................................................... 4-2
SRAM.................................................................................................................... 4-2
About the Battery......................................................................................... 4-3
Onboard DRAM.................................................................................................. 4-4
Battery Backed Up RAM and Clock................................................................. 4-5
VMEbus Interface and VMEchip2....................................................................4-5
I/O Interfaces ...................................................................................................... 4-5
Serial Communications Interface .............................................................. 4-5
IndustryPack (IP) Interfaces.......................................................................4-8
Ethernet Interface......................................................................................... 4-8
SCSI Interface ............................................................................................... 4-9
SCSI Termination......................................................................................... 4-9
Local Resources................................................................................................... 4-9
Programmable Tick Timers...................................................................... 4-10
Watchdog Timer ........................................................................................ 4-10
Software-Programmable Hardware Interrupts..................................... 4-10
Local Bus Timeout.....................................................................................4-10
Timing Performance ......................................................................................... 4-10
Local Bus to DRAM Cycle Times............................................................ 4-11
EPROM/Flash Cycle Times ..................................................................... 4-11
SCSI Transfers ............................................................................................ 4-11
LAN DMA Transfers................................................................................. 4-12
Remote Status and Control..............................................................................4-12
APPENDIX A SERIAL INTERCONNECTIONS
Introduction ...............................................................................................................A-1
EIA-232-D Connections............................................................................................A-1
Interface Characteristics....................................................................................A-3
EIA-530 Connections ................................................................................................A-4
Interface Characteristics....................................................................................A-6
Proper Grounding.....................................................................................................A-8

x

xi
List of Figures
Figure 2-1. MVME162 Switch, Header, Connector, Fuse,
and LED Locations.............................................................................2-3
Figure 2-2. Serial Interface Module, Connector Side .........................................2-4
Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram........2-14
Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram..........2-20
Figure 2-5. MVME162 EIA-530 Connection Diagram......................................2-24
Figure 4-1. MVME162 Main Module Block Diagram ....................................4-13
Figure 4-2. Parity DRAM Mezzanine Module Block Diagram.......................4-14

xii

xiii
List of Tables
Table 1-1. MVME162 Models.................................................................................1-1
Table 1-2. MVME162 Specifications......................................................................1-3
Table 2-1. Serial Interface Module Part Numbers...............................................2-4
Table 3-1. Local Bus Memory Map .......................................................................3-4
Table 3-2. Local I/O Devices Memory Map........................................................3-5
Table 3-3. VMEchip2 Memory Map......................................................................3-8
Table 3-4. MCchip Register Map.........................................................................3-14
Table 3-5. Z85230 SCC Register Addresses........................................................3-15
Table 3-6. 82596CA Ethernet LAN Memory Map.............................................3-15
Table 3-7. 53C710 SCSI Memory Map ................................................................3-16
Table 3-8. IPIC Overall Memory Map ................................................................3-17
Table 3-9. IPIC Memory Map—Control and Status Registers ........................3-18
Table 3-10. MK48T08 BBRAM/TOD Clock Memory Map..............................3-19
Table 3-11. BBRAM Configuration Area Memory Map...................................3-19
Table 3-12. TOD Clock Memory Map.................................................................3-20
Table 4-1. DRAM Performance............................................................................4-11
Table A-1. EIA-232-D Interconnections...............................................................A-2
Table A-2. EIA-232-D Interface Transmitter Characteristics............................A-3
Table A-3. EIA-232-D Interface Receiver Characteristics .................................A-4
Table A-4. Serial Port B EIA-530 Interconnect Signals......................................A-4
Table A-5. EIA-530 Interface Transmitter Characteristics ................................A-7
Table A-6. EIA-530 Interface Receiver Characteristics......................................A-7

xiv

MVME162/D21-1
1
GENERAL INFORMATION
Introduction
This manual provides general information, hardware preparation and
installation instructions, operating instructions, and a functional description
of the MVME162 Embedded Controller (referred to as the MVME162
throughout this manual).
Models
The MVME162 is available in several models, which are listed in Table 1-1.
Table 1-1. MVME162 Models
Model Description
-001 MC68LC040 microprocessor, 1MB DRAM, 512KB SRAM
-002 MC68040 microprocessor, 1MB DRAM, 512KB SRAM
-003 MC68LC040 microprocessor, 1MB DRAM, 512KB SRAM, no VMEbus
-010 MC68LC040 microprocessor, 4MB DRAM, 512KB SRAM
-011 MC68LC040 microprocessor, 4MB DRAM, SCSI, 512KB SRAM
-012 MC68LC040 microprocessor, 4MB DRAM, Ethernet, 512KB SRAM
-013 MC68LC040 microprocessor, 4MB DRAM, SCSI, Ethernet, 512KB SRAM
-014 MC68LC040 microprocessor, 4MB DRAM, Ethernet, no VMEbus
-020 MC68040 microprocessor, 4MB DRAM, 512KB SRAM
-021 MC68040 microprocessor, 4MB DRAM, SCSI, 512KB SRAM
-022 MC68040 microprocessor, 4MB DRAM, Ethernet, 512KB SRAM
-023 MC68040 microprocessor, 4MB DRAM, SCSI, Ethernet, 512KB SRAM
-026 MC68040 microprocessor, 4MB DRAM, Ethernet, no VMEbus
-030 MC68LC040 microprocessor, 8MB DRAM, 512KB SRAM
-031 MC68LC040 microprocessor, 8MB DRAM, SCSI, 512KB SRAM
-032 MC68LC040 microprocessor, 8MB DRAM, Ethernet, 512KB SRAM
-033 MC68LC040 microprocessor, 8MB DRAM, SCSI, Ethernet, 512KB SRAM
-040 MC68040 microprocessor, 8MB DRAM, 512KB SRAM
-041 MC68040 microprocessor, 8MB DRAM, SCSI, 512KB SRAM
-042 MC68040 microprocessor, 8MB DRAM, Ethernet, 512KB SRAM
-043 MC68040 microprocessor, 8MB DRAM, SCSI, Ethernet, 512KB SRAM

General Information
1-2 MVME162 Embedded Controller User’s Manual
1
Features
Features of the MVME162 include:
❏25MHz 32-bit Microprocessor: either an MC68LC040 Enhanced 32-bit
Microprocessor with 8KB of cache and MMU, or an optional 25MHz
MC68040 32-bit Microprocessor with 8KB of cache, MMU, and FPU
❏1MB, 4MB, or 8MB of shared Dynamic Random Access Memory (DRAM)
with programmable parity
❏512KB of Static Random Access Memory (SRAM) with battery backup
❏One JEDEC standard 32-pin PLCC EPROM socket (EPROMs may be
shipped separately from the MVME162)
❏1MB Flash memory: either one Intel 28F008SA (for older boards) or four
Intel 28F020s (for newer boards)
❏Four 32-bit programmable timers and programmable Watchdog Timer
(MCchip)
❏Two 32-bit programmable timers and programmable Watchdog Timer
(optional VMEchip2)
❏8K by 8 Non-Volatile Random Access Memory (NVRAM) and Time of
Day (TOD) clock with battery backup (Thompson MK48T08)
❏Input/Output
– Two serial ports (one EIA-232-D DCE; one EIA-232-D or EIA-530
DCE/DTE)
– Serial port controller (Zilog Z85230)
– Optional Small Computer Systems Interface (SCSI) bus interface with
32-bit local bus burst Direct Memory Access (DMA) (NCR 53C710
controller)
– Optional LAN Ethernet transceiver interface with 32-bit local bus
DMA (Intel 82596CA controller)
– Four MVIP IndustryPack interfaces
❏VMEbus interface (VMEchip2)—non-VMEbus version optional
– VMEbus system controller functions
– VMEbus interface to local bus (A24/A32, D8/D16/D32
(D8/D16/D32/D64BLT) (BLT = Block Transfer)
– Local bus to VMEbus interface (A16/A24/A32, D8/D16/D32)
– VMEbus interrupter

Specifications
MVME162/D2 1-3
1
– VMEbus interrupt handler
– Global CSR for interprocessor communications
– DMA for fast local memory-VMEbus transfers (A16/A24/A32,
D16/D32[D16/D32/D64BLT])
❏Switches and Light-Emitting Diodes (LEDs)
– Two pushbutton switches (ABORT and RESET)
– Eight LEDs (FAIL, STAT, RUN, SCON, LAN, FUSE, SCSI, and VME)
Specifications
Table 1-2, MVME162 Specifications, lists the specifications for an MVME162
without IndustryPacks. The subsequent sections detail cooling requirements
and FCC compliance.
Note Refer to the following sections on CoolingRequirements and
Special Considerations for Elevated Temperature Operation.
Table 1-2. MVME162 Specifications
Characteristics Specifications
Power requirements
(with PROM; without IPs) +5V (± 5%), 3.5 A typical, 4.5 A maximum +12 Vdc (± 5%), 100 mA maximum
-12 Vdc (± 5%), 100 mA maximum
Operating temperature 0° to 70° C exit air with forced air cooling (see NOTE)
Storage temperature -40° to +85° C
Relative humidity 5% to 90% (noncondensing)
Physical dimensions
PC board with mezzanine
module only
Height
Depth
Thickness
Double-high VMEboard
9.2 inches (233 mm)
6.3 inches (160 mm)
0.66 inch (17 mm)
PC board with connectors
and front panel
Height
Depth
Thickness
10.3 inches (262 mm)
7.4 inches (188 mm)
0.80 inch (20.32 mm)

General Information
1-4 MVME162 Embedded Controller User’s Manual
1
Cooling Requirements
The Motorola MVME162 Embedded Controller is specified, designed, and
tested to operate reliably with an incoming air temperature range from 0° to
55° C (32° to 131° F) with forced air cooling at a velocity typically achievable
by using a 100 CFM axial fan. Temperature qualification is performed in a
standard Motorola VMEsystem 3000 chassis. Twenty-five watt load boards
are inserted in two card slots, one on each side, adjacent to the board under
test, to simulate a high power density system configuration. An assembly of
three axial fans, rated at 100 CFM per fan, is placed directly under the VME
card cage. The incoming air temperature is measured between the fan
assembly and the card cage, where the incoming airstream first encounters the
controller under test. Test software is executed as the controller is subjected to
ambient temperature variations. Case temperatures of critical, high power
density integrated circuits are monitored to ensure component vendors
specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the controller. Less airflow is required to cool the
controller in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the controller
reliably at higher than 55° C with increased airflow. It is important to note that
there are several factors, in addition to the rated CFM of the air mover, which
determine the actual volume and speed of air flowing over the controller.
Special Considerations for Elevated Temperature Operation
The following information is for users whose applications for the MVME162
may subject it to high temperatures.
The MVME162 uses commercial grade devices. Therefore, it can operate in an
environment with ambient air temperatures from 0° C to 70° C. Several factors
influence the ambient temperature seen by components on the MVME162.
Among them are inlet air temperature; air flow characteristics; number, types,
and locations of IndustryPack (IP) modules; power dissipation of adjacent
boards in the system, etc.
A temperature profile of the MVME162-023 was developed in an MVME945
12-slot VME chassis. This board was loaded with one GreenSpring IP-Dual
P/T module (position a) and three GreenSpring IP-488 modules (positions b,
c, and d). One twenty-five-watt load board was installed adjacent to each side
of the board under test. The exit air velocity was approximately 200 LFM

Specifications
MVME162/D2 1-5
1
between the MVME162 and the IP-Dual P/T module. Under these conditions,
a 10° C rise between the inlet and exit air was observed. At 70° C exit air
temperature (60° C inlet air), the junction temperatures of devices on the
MVME162 were calculated (from the measured case temperatures) and did
not exceed 100° C.
Caution
For elevated-temperature operation, the user must perform
similar measurements and calculations to determine what
operating margin exists in a specific environment.
The following are some steps that the user can take to help make elevated-
temperature operation possible:
1. Position the MVME162 board in the chassis for maximum airflow over the
component side of the board.
2. Avoid placing boards with high power dissipation adjacent to the
MVME162.
3. Use low-power IP modules only. The preferred locations for IP modules
are position a (J2 and J3) and position d (J18 and J19).
FCC Compliance
The MVME162 was tested without IndustryPacks in an FCC-compliant chassis
and meets the requirements for Class A equipment. FCC compliance was
achieved under the following conditions:
1. Shielded cables on all external I/O ports.
2. Cable shields connected to earth ground via metal shell connectors
bonded to a conductive module front panel.
3. Conductive chassis rails connected to earth ground. This provides the
path for connecting shields to earth ground.
4. Front panel screws properly tightened.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the FCC compliance of the
equipment containing the module.