Espressif Systems ESP32-S2-WROOM User manual

ESP32-S2-WROOM &
ESP32-S2-WROOM-I
User Manual
Prerelease version 0.5
Espressif Systems
Copyright © 2020
www.espressif.com

About This Document
This document provides the specifications for the ESP32-S2-WROOM and ESP32-S2-WROOM-I module.
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For revision history of this document, please refer to the last page.
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2020 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
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1. Module Overview
1. Module Overview
1.1 Features
MCU
• ESP32-S2 embedded, Xtensa®single-core 32-bit
LX7 microprocessor, up to 240 MHz
• 128 KB ROM
• 320 KB SRAM
• 16 KB SRAM in RTC
Wi-Fi
• 802.11 b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
•Center frequency range of operating channel:
2412 ~ 2462 MHz
Hardware
• Interfaces: GPIO, SPI, LCD, UART, I2C, I2S, Cam-
era interface, IR, pulse counter, LED PWM, USB
OTG 1.1, ADC, DAC, touch sensor, temperature
sensor
• 40 MHz crystal oscillator
• 4 MB SPI flash
• Operating voltage/Power supply: 3.0 ~3.6 V
• Operating temperature range: –40 ~85 °C
• Dimensions: (18 × 31 × 3.3) mm
Certification
• Green certification: RoHS/REACH
• RF certification: FCC/CE-RED/SRRC
Test
• HTOL/HTSL/uHAST/TCT/ESD
1.2 Description
ESP32-S2-WROOM and ESP32-S2-WROOM-I are two powerful, generic Wi-Fi MCU modules that have a rich set
of peripherals. They are an ideal choice for a wide variety of application scenarios relating to Internet of Things
(IoT), wearable electronics and smart home.
ESP32-S2-WROOM comes with a PCB antenna, and ESP32-S2-WROOM-I with an IPEX antenna. They both
feature a 4 MB external SPI flash. The information in this datasheet is applicable to both modules.
The ordering information of the two modules is listed as follows:
Table 1: Ordering Information
Module Chip embedded Flash Module dimensions (mm)
ESP32-S2-WROOM (PCB) ESP32-S2 4 MB (18.00±0.15)×(31.00±0.15)×(3.30±0.15)
ESP32-S2-WROOM-I (IPEX)
Notes:
1. The module with various capacities of flash is available for custom order.
2. For dimensions of the IPEX connector, please see Section 7.3.
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1. Module Overview
At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The
chip has a low-power co-processor that can be used instead of the CPU to save power while performing tasks
that do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set
of peripherals, ranging from SPI, I²S, UART, I²C, LED PWM, LCD, Camera interface, ADC, DAC, touch sensor,
temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB On-The-Go (OTG) interface to
enable USB communication.
Note:
* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• USB Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Home Control Panel
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications
• Smart POS Machines
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2. Pin Definitions
2. Pin Definitions
2.1 Pin Layout
PCB Antenna
GND
EN
IO46
IO45
RXD0
TXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
IO34
IO33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
GND
3V3
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
43 GND
17 18 19
IO14 IO15 IO16
20 21 22
IO17 IO18 IO19
23 24 25
IO20 IO21 IO26
26 GND
Figure 1: Module Pin Layout (Top View)
Note:
The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer
to Figure 7.1 Physical Dimensions.
2.2 Pin Description
The module has 42 pins. See pin definitions in Table 2.
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2. Pin Definitions
Table 2: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
IO0 3 I/O/T RTC_GPIO0, GPIO0
IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7
IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 24 I/O/T RTC_GPIO21, GPIO21
IO26 25 I/O/T SPICS1, GPIO26
GND 26 P Ground
IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD
IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0
IO35 29 I/O/T SPIIO6, GPIO35, FSPID
IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK
IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ
IO38 32 I/O/T GPIO38, FSPIWP
IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3
IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 36 I/O/T MTMS, GPIO42
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 39 I/O/T GPIO45
IO46 40 I GPIO46
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2. Pin Definitions
Name No. Type Function
EN 41 I
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
GND 42 P Ground
Notice:
For peripheral pin configurations, please refer to ESP32-S2 User Manual.
2.3 Strapping Pins
ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and the
module is as follows, which can be seen in Chapter 5 Schematics:
• GPIO0 = IO0
• GPIO45 = IO45
• GPIO46 = IO46
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping
bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.
IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected
external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these
strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.
After reset, the strapping pins work as normal-function pins.
Refer to Table 3for a detailed boot-mode configuration of the strapping pins.
Table 3: Strapping Pins
VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
IO45 2Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
IO0 Pull-up 1 0
IO46 Pull-down Don’t-care 0
Enabling/Disabling ROM Code Print During Booting 3 4
Pin Default Enabled Disabled
IO46 Pull-down See the fourth note See the fourth note
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2.4.Pin Definitions
Note:
1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”.
2. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by
default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by
external circuit.
3. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.
4. When eFuse UART_PRINT_CONTROL value is:
0, print is normal during boot and not controlled by IO46.
1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.
2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.
3, print is disabled and not controlled by IO46.
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3. Electrical Characteristics
3.Electrical Characteristics
3.1 Absolute Maximum Ratings
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 85 °C
3.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85 °C
Humidity Humidity condition — 85 — %RH
3.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH High-level output voltage 0.8 × VDD — — V
VOL Low-level output voltage — — 0.1 × VDD V
IOH
High-level source current (VDD = 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3) — 40 — mA
IOL
Low-level sink current (VDD = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) — 28 — mA
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V
Note:
VDD is the I/O voltage for a particular power domain of pins.
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4. Electrical Characteristics
4.1 Current Consumption Characteristics
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-
S2 User Manual.
Table 7: Current Consumption Depending on RF Modes
Work mode Description Average Peak
Active (RF working)
TX
802.11b, 20 MHz, 1 Mbps, @ 22.31dBm 190 mA 310 mA
802.11g, 20 MHz, 54 Mbps, @ 25.00dBm 145 mA 220 mA
802.11n, 20 MHz, MCS7, @ 24.23dBm 135 mA 200 mA
802.11n, 40 MHz, MCS7, @ 22.86 dBm 120 mA 160 mA
RX 802.11b/g/n, 20 MHz 63 mA 63 mA
802.11n, 40 MHz 68 mA 68 mA
Note:
• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.
• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
Table 8: Current Consumption Depending on Work Modes
Work mode Description Current consumption (Typ)
Modem-sleep The CPU is
powered on
240 MHz 22 mA
160 MHz 17 mA
Normal speed: 80 MHz 14 mA
Light-sleep — 550 µA
Deep-sleep
The ULP co-processor is powered on. 220 µA
ULP sensor-monitored pattern 7 µA @1% duty
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off. 0.5 µA
Note:
• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.
• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-
tion changes accordingly.
• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to
operate.
• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 7 µA.
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5.Electrical Characteristics
5.5 Wi-Fi RF Characteristics
5.5.1 Wi-Fi RF Standards
Table 9: Wi-Fi RF Standards
Name Description
Center frequency range of operating channel note12412 ~ 2462 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, IPEX antenna
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
5.5.2 Transmitter Characteristics
Table 10: Transmitter Characteristics
Parameter Rate Unit
TX Power note1dBm
1. Target TX power is configurable based on device or certification requirements.
5.5.3 Receiver Characteristics
Table 11: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity
1 Mbps –97
dBm
2 Mbps –95
5.5 Mbps –93
11 Mbps –88
6 Mbps –92
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802.11b:22.31dBm
802.11g:25.00dBm
802.11n20:24.23dBm
802.11n40:22.86dBm

5. Electrical Characteristics
Parameter Rate Typ Unit
RX Sensitivity
9 Mbps –91
dBm
12 Mbps –89
18 Mbps –86
24 Mbps –83
36 Mbps –80
48 Mbps –76
54 Mbps –74
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –85
11n, HT20, MCS3 –82
11n, HT20, MCS4 –79
11n, HT20, MCS5 –75
11n, HT20, MCS6 –73
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –79
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –70
11n, HT40, MCS7 –68
RX Maximum Input Level
11b, 1 Mbps 5
dBm
11b, 11 Mbps 5
11g, 6 Mbps 5
11g, 54 Mbps 0
11n, HT20, MCS0 5
11n, HT20, MCS7 0
11n, HT40, MCS0 5
11n, HT40, MCS7 0
Adjacent Channel Rejection
11b, 11 Mbps 35
dB
11g, 6 Mbps 31
11g, 54 Mbps 14
11n, HT20, MCS0 31
11n, HT20, MCS7 13
11n, HT40, MCS0 19
11n, HT40, MCS7 8
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6. Physical Dimensions and PCB Land Pattern
6.Physical Dimensions and PCB Land Pattern
6.1 Physical Dimensions
31.00±0.15
18.00±0.15 0.80
3.30±0.15
1.50
0.9
0.45
1
0.90
0.85
15.45
10.19
4.00
4.00
2.25
0.45
Unit: mm
Tolerance: +/-0.1 mm
Top View Side View Bottom View
6.30
8.35
23.10
15.84
19.30
2,25
10.44
1.50
1.00
0.50
1.00
0.50
0.85
0.90
0.1
Figure 6: Physical Dimensions
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6. Physical Dimensions and PCB Land Pattern
6.2 Recommended PCB Land Pattern
42x0.90
42x1.50
0.50
0.50
1.00
2.25
1.50
1.50
15.45
Antenna Area
18.00
31.00
6.30
1
17 26
42
4.10
4.10
1.10 0.40
1.10
0.40
7.81
Unit: mm
Copper
Via for thermal pad
Figure 7: Recommended PCB Land Pattern
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6.Physical Dimensions and PCB Land Pattern
6.3 U.FL Connector Dimensions
Unit: mm
Figure 8: U.FL Connector Dimensions
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7. Product Handling
7.Product Handling
7.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The
module needs to be baked if the above conditions are not met.
7.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
7.3 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.:<150℃Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃(<245℃recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 9: Reflow Profile
Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.
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8. MAC Addresses and eFuse
8.MAC Addresses and eFuse
The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station
and AP modes correspond to mac_address in the following way:
• Station mode: mac_address
• AP mode: mac_address + 1
There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read
disable controller. Six of them can be used to store encrypted key or user data, and the remaining one is only used
to store user data.
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9.Antenna Specifications
9.Antenna Specifications
9.1 PCB Antenna
Model: ESP ANT B
Assembly: PTH
Gain:
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9. Antenna Specifications
Dimensions:
Pattern Plots:
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9. Antenna Specifications
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