Espressif Systems ESP32-S2-WROVER User manual

CONFIDENTIAL
ESP32-S2-WROVER
User Manual
Prelease version 0.1
Espressif Systems
Copyright © 2019
www.espressif.com

CONFIDENTIAL
About This Document
This document provides the specifications for the ESP32-S2-WROVER module.
Revision History
For revision history of this document, please refer to the last page.
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Download certificates for Espressif products from www.espressif.com/en/certificates.
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2019 Espressif Inc. All rights reserved.
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1. Module Overview
1. Module Overview
1.1 Features
MCU
• ESP32-S2 embedded, Xtensa®single-core 32-bit
LX7 microprocessor, up to 240 MHz
• 128 KB ROM
• 320 KB SRAM
• 16 KB SRAM in RTC
Wi-Fi
• 802.11 b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
•Operating frequency range: 2412 ~ 2462 MHz
Hardware
• Interfaces: GPIO, SPI, LCD, UART, I2C, I2S, Cam-
era interface, IR, pulse counter, LED PWM, USB
OTG 1.1, ADC, DAC, touch sensor, temperature
sensor
• 40 MHz crystal oscillator
• 4 MB SPI flash
• 2 MB PSRAM
• Operating voltage/Power supply: 3.0 ~3.6 V
•Operating temperature range: –40 ~ 85 °C
• Dimensions: (18 × 31 × 3.3) mm
Certification
• Green certification: RoHS/REACH
Test
• HTOL/HTSL/uHAST/TCT/ESD
1.2 Description
ESP32-S2-WROVER is a powerful, generic Wi-Fi MCU module that has a rich set of peripherals. This module is
an ideal choice for a wide variety of application scenarios relating to Internet of Things (IoT), wearable electronics
and smart home.
This module is provided in two versions: one with a PCB antenna, the other with an Dipole antenna.
ESP32-S2-WROVER features a 4 MB external SPI flash and an additional 2 MB SPI Pseudo static RAM (PSRAM).
The information in this datasheet is applicable to both modules.
The ordering information on the two variants of ESP32-S2-WROVER is listed as follows:
Table 1: ESP32-S2-WROVER Ordering Information
Module Chip embedded Flash PSRAM Module dimensions (mm)
ESP32-S2-WROVER (PCB) ESP32-S2 4 MB 2 MB (18.00±0.10)×(31.00±0.10)×(3.30±0.10)
ESP32-S2-WROVER-I (Dipole)
Notes:
The module with various capacities of flash or flash is available for custom order.
At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The user
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1. Module Overview
can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for
changes or crossing of thresholds. ESP32-S2 integrates a rich set of peripherals, ranging from SPI, I²S, UART, I²C,
LED PWM, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed
USB On-The-Go (OTG) interface to enable USB communication.
Note:
* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• USB Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Home Control Panel
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications
• Smart POS Machines
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LIST OF TABLES
List of Tables
1 ESP32-S2-WROVER Ordering Information 3
2 Pin Definitions 10
3 Strapping Pins 11
4 Absolute Maximum Ratings 13
5 Recommended Operating Conditions 13
6 DC Characteristics (3.3 V, 25 °C) 13
7 Current Consumption Depending on RF Modes 14
8 Current Consumption Depending on Work Modes 14
9 Wi-Fi RF Standards 15
10 Transmitter Characteristics 15
11 Receiver Characteristics 15
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LIST OF FIGURES
List of Figures
1 Block Diagram 8
2 Pin Layout of ESP32-S2-WROVER (Top View) 9
3 ESP32-S2-WROVER Schematics 17
4 ESP32-S2-WROVER Peripheral Schematics 18
5 ESP32-S2-WROVER Physical Dimensions 19
6 Recommended PCB Land Pattern 20
7 Reflow Profile 21
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3. Pin Definitions
3. Pin Definitions
3.1 Pin Layout
PCB Antenna
GND
EN
IO46
IO45
RXD0
TXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
IO34
IO33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
GND
3V3
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
43 GND
17 18 19
IO14 IO15 IO16
20 21 22
IO17 IO18 IO19
23 24 25
IO20 IO21 IO26
26 GND
Figure 2: Pin Layout of ESP32-S2-WROVER (Top View)
Note:
The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer
to Figure 7.1 Physical Dimensions.
3.2 Pin Description
ESP32-S2-WROVER has 42 pins. See pin definitions in Table 2.
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3. Pin Definitions
Table 2: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
IO0 3 I/O/T RTC_GPIO0, GPIO0
IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7
IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 24 I/O/T RTC_GPIO21, GPIO21
IO26 25 I/O/T SPICS1, GPIO26
GND 26 P Ground
IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD
IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0
IO35 29 I/O/T SPIIO6, GPIO35, FSPID
IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK
IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ
IO38 32 I/O/T GPIO38, FSPIWP
IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3
IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 36 I/O/T MTMS, GPIO42
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 39 I/O/T GPIO45
IO46 40 I GPIO46
EN 41 I
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
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3. Pin Definitions
Name No. Type Function
GND 42 P Ground
Notice:
• By default, IO26 is connected to the CS side of the PSRAM. If PSRAM is not a must, IO26 can be used as a regular
GPIO.
• For peripheral pin configurations, please refer to ESP32-S2 Datasheet.
3.3 Strapping Pins
ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and the
module is as follows, which can be seen in Chapter 5Schematics:
• GPIO0 = IO0
• GPIO45 = IO45
• GPIO46 = IO46
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping
bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.
IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected
external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these
strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.
After reset, the strapping pins work as normal-function pins.
Refer to Table 3for a detailed boot-mode configuration of the strapping pins.
Table 3: Strapping Pins
VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
IO45 2Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
IO0 Pull-up 1 0
IO46 Pull-down Don’t-care 0
Enabling/Disabling ROM Code Print During Booting 3 4
Pin Default Enabled Disabled
IO46 Pull-down See the fourth note See the fourth note
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3. Pin Definitions
Note:
1. Firmware can configure register bits to change the settings of ”VDD_SDIO Voltage”.
2. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash and SRAM in ESP32-S2-WROVER
work at 3.3 V by default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is
powered up by external circuit.
3. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.
4. When eFuse UART_PRINT_CONTROL value is:
0, print is normal during boot and not controlled by IO46.
1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.
2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.
3, print is disabled and not controlled by IO46.
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4. Electrical Characteristics
4. Electrical Characteristics
4.1 Absolute Maximum Ratings
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 150 °C
4.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85°C
Humidity Humidity condition — 85 — %RH
4.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH High-level output voltage 0.8 × VDD — — V
VOL Low-level output voltage — — 0.1 × VDD V
IOH
High-level source current (VDD = 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3) — 40 — mA
IOL
Low-level sink current (VDD = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) — 28 — mA
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH _nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V
Note:
VDD is the I/O voltage for a particular power domain of pins.
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4. Electrical Characteristics
4.4 Current Consumption Characteristics
With the use of advanced power-management technologies, ESP32-S2-WROVER can switch between different
power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in
ESP32-S2 Datasheet.
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.
Table 7: Current Consumption Depending on RF Modes
Work mode Description Average Peak
Active (RF working)
TX
802.11b, 20 MHz, 1 Mbps, @21.14 dBm 190 mA 310 mA
802.11g, 20 MHz, 54 Mbps, @22.75dBm 145 mA 220 mA
802.11n, 20 MHz, MCS7, @23.06dBm 135 mA 200 mA
802.11n, 40 MHz, MCS7, @22.53 dBm 120 mA 160 mA
RX 802.11b/g/n, 20 MHz 63 mA 63 mA
802.11n, 40 MHz 68 mA 68 mA
Note:
The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
Table 8: Current Consumption Depending on Work Modes
Work mode Description Power consumption (Typ)
Modem-sleep The CPU is
powered on
240 MHz 21 mA
160 MHz 17 mA
Normal speed: 80 MHz 14 mA
Light-sleep — 550 µA
Deep-sleep
The ULP co-processor is powered on. 220 µA
ULP sensor-monitored pattern 7 µA @1% duty
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off. 0.5 µA
Note:
• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.
• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-
tion changes accordingly.
• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to
operate.
• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 7 µA.
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4. Electrical Characteristics
4.5 Wi-Fi RF Characteristics
4.5.1 Wi-Fi RF Standards
Table 9: Wi-Fi RF Standards
Name Description
Operating frequency range note12412 ~ 2462 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, Dipole antenna
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use Dipole antennas, the output impedance is 50 Ω. For other modules without Dipole antennas,
users do not need to concern about the output impedance.
4.5.2 Transmitter Characteristics
Table 10: Transmitter Characteristics
Parameter Rate Typ Unit
TX Power note1
11b, 1 Mbps 21.14
dBm
11g, 6 Mbps 22.75
11n, HT20, MCS0 23.06
11n, HT40, MCS0 22.53
1. Target TX power is configurable based on device or certification requirements.
4.5.3 Receiver Characteristics
Table 11: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity 1 Mbps –97 dBm
2 Mbps –95
5.5 Mbps –93
11 Mbps –88
6 Mbps –92
9 Mbps –91
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4. Electrical Characteristics
Parameter Rate Typ Unit
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –76
54 Mbps –75
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –85
11n, HT20, MCS3 –83
11n, HT20, MCS4 –79
11n, HT20, MCS5 –75
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –86
11n, HT40, MCS2 –83
11n, HT40, MCS3 –80
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
11n, HT40, MCS7 –69
RX Maximum Input Level 11b, 1 Mbps 5 dBm
11b, 11 Mbps 5
11g, 6 Mbps 5
11g, 54 Mbps 0
11n, HT20, MCS0 5
11n, HT20, MCS7 0
11n, HT40, MCS0 5
11n, HT40, MCS7 0
Adjacent Channel Rejection 11b, 11 Mbps 35 dB
11g, 6 Mbps 31
11g, 54 Mbps 14
11n, HT20, MCS0 31
11n, HT20, MCS7 13
11n, HT40, MCS0 19
11n, HT40, MCS7 8
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7. Physical Dimensions and PCB Land Pattern
7. Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
31.00
18.00 0.80
3.30
1.50
0.45
0.90
0.85
15.45
10.19
4.00
4.00
2.25
0.45
ESP32-S2-WROVER Dimensions
Unit: mm
Tolerance: +/-0.10mm
Top View Side View Bottom View
6.30
8.35
23.10
15.84
19.30
10.44
1.50
1.00
0.50
1.00 0.50
0.85
0.90
0.90
1.00
2.25
Figure 5: ESP32-S2-WROVER Physical Dimensions
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Note:
• Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermal
performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• To ensure the power supply to the ESP32-S2 chip during power-up, it is advised to add an RC delay circuit at the
EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩand C = 0.1 µF. However, specific
parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence
timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to Section Power
Scheme in ESP32-S2 Datasheet.

CONFIDENTIAL
7. Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
42x0.90
42x1.50
0.50
0.50
1.00
2.25
1.50
1.50
15.45
Antenna Area
18.00
31.00
Unit: mm
6.30
Copper
1
17 26
42
4.10
4.10
1.10 0.40
1.10
0.40
Via for thermal pad
7.81
Figure 6: Recommended PCB Land Pattern
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8. Product Handling
8. Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
MSL 3 and floorlife: 168 hrs �30 °C/60%RH
8.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 8000 V
• Contact discharge: 6000 V
8.3 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.:<150℃Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃(<245℃recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 7: Reflow Profile
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9. MAC Addresses and eFuse
9. MAC Addresses and eFuse
The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station
and AP modes correspond to mac_address in the following way:
• Station mode: mac_address
• AP mode: mac_address + 1
There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read
disable controller. Six of them can be used to store encrypted key or user data, and one is only used to store user
data.
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Revision History
Revision History
Date Version Release notes
2019.09 V0.1 Preliminary release
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FCC Statement
Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and (2) This device must accept
any interference received, including interference that may cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment .This equipment should be installed and operated with
minimum distance 20cm between the radiator& your body.

Regulatory Module Integration Instructions
2.2 List of applicable FCC rules
This device complies with part 15.247 of the FCC Rules.
2.3 Summarize the specific operational use conditions
This module can be used in household electrical appliances as well as lighting
equipments. The input voltage to the module should be nominally 3.0~3.6 VDC ,typical
value 3.3VDC and the ambient temperature of the module should not exceed 85℃.
This module using two kinds of antennas ,PCB antenan with maximum gain is 3.40dBi .
Dipole antenan with maximum gain is 2.33dBi .Other antenna arrangement is not covered
2.4 Limited module procedures
Not applicable
2.5 Trace antenna designs
Not applicable
2.6 RF exposure considerations
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment .This equipment should be installed and operated with minimum distance
20cm between the radiator& your body. If the device built into a host as a portable usage,
the additional RF exposure evaluation may be required as specified by§ 2.1093.
by this certification.The antenna is not field replaceable. If the antenna needs to be changed,
the certification should be re-applied.