Four-Faith F-B200GLGL Guide

F-B200GLGL NB-IoT
module hardware design
manual
Document Version
Security
V1.0.3
F-B200GLGL
35 pages
F-B200GL NB-IoT Module
Hardware Design Manual
Xiamen Four-Faith Communication Technology Co., Ltd.
Add: Floor 11, Area A06, No 370,chengyi
street,Jimei,Xiamen
Tel: [phone] Fax: [phone]
Web: http://en.four-faith.com

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Files Revised Record
Date
Version
Remark
Author
2019/7/2
V1.0.3
Initial version
Jim Chen

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Copyright Notice
All contents in the files are protected by copyright law, and all copyrights are reserved
by Xiamen Four-Faith Communication Technology Co., Ltd. Without written
permission all commercial use of the files from Four-Faith are forbidden, such as copy,
distribute,
reproduce the files, etc., but non-commercial purpose, download or printed by
individual (all files shall be not revised, and the copyright and other proprietorship
notice shall be reserved) are welcome.
Trademark Notice
Four-Faith, 四 信 ,, , are all registered trademarks of
Xiamen Four-Faith Communication Technology Co., Ltd, illegal use the name of
Four-Faith, trademarks and others marks of Four-Faith is forbidden, unless written
permission is authorized in advance.

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Product Appearance
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BOTTOM

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Contents
Chapter1 Product Overview.....................................................................................................7
1.1 F-B200GL Summary.................................................................................................... 7
1.2 Main Performance........................................................................................................7
1.3 RF Block Diagram........................................................................................................ 8
Chapter2 Application Interfaces.............................................................................................. 9
2.1 Pin Assignments.........................................................................................................10
2.2 I/O Definition............................................................................................................... 10
2.3 Pin Descriptions..........................................................................................................11
2.4 Working Mode.............................................................................................................14
2.5 Low Power Consumption Mode...............................................................................14
2.5.1 Extended idle mode discontinuous reception(e-I-DRX)..................................14
2.5.2 Airplane mode...................................................................................................15
2.5.3 Power Save Mode (PSM)................................................................................. 15
2.6 Power supply...............................................................................................................16
2.6.1 Power Supply Interface.....................................................................................16
2.6.2 Power Supply Reference Design...................................................................... 16
2.7 Module Startup/Shutdown........................................................................................ 17
2.7.1 Startup............................................................................................................... 17
2.7.2 Shutdown.......................................................................................................... 18
2.8 Module Reset..............................................................................................................18
2.9 (U)SIM interface......................................................................................................... 19
2.10 UART interface........................................................................................................... 21
2.11 I2C Interface................................................................................................................23
2.12 Module Status Indication...........................................................................................23
Chapter3 BT Function............................................................................................................. 24
Chapter4 Antenna interface................................................................................................... 24
4.1 Main Antenna Interface............................................................................................. 24
4.1.1 Pin Description................................................................................................. 24
4.1.2 Working Frequency Band................................................................................. 24
4.1.3 Main Antenna Reference Design......................................................................24
4.1.4 RF_ANT Layout Guideline.............................................................................. 25
4.2 BT Antenna Interface.................................................................................................27
4.2.1 Pin Description................................................................................................. 27
4.2.2 BT Antenna Interface Reference Design.......................................................... 27
4.3 Antenna Connector.................................................................................................... 27
Chapter5 Electrical Reliability and RF Performance......................................................... 29
5.1 Absolute Maximum Rating........................................................................................29
5.2 Power Supply..............................................................................................................29
5.3 Operating Temperature............................................................................................. 29
5.4 Power Consumption.................................................................................................. 30
5.5 Output Power.............................................................................................................. 30

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5.6 Receive Sensitivity.....................................................................................................30
5.7 Electronic Static Discharge (ESD).......................................................................... 31
Chapter6 Dimensions..............................................................................................................31
6.1 Module Dimensions................................................................................................... 31
6.2 Module Package.........................................................................................................32
Chapter7 Storage and Production........................................................................................ 32
7.1 Storage.........................................................................................................................32
7.2 Product Welding......................................................................................................... 33
7.3 Package....................................................................................................................... 34

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Chapter1 Product Overview
1.1 F-B200GL Summary
F-B200GL is an LTE Cat.NB1 mode wireless communication module that supports
half duplex LTE, but does not support the function of diversity receive. It can provide
data connection through NB-IoT network.
F-B200GL supports band and BT function are shown as follows.
Form 1-1 Band and BT Function
Module
LTE Band
Diversity Reception
BT
F-B200GL
Cat NB1:
LTE-FDD: B3/B5/B8
Nonsupport
TBD
F-B200GL has a 15.2mm x 17.0mm x 2.6mm compact size, which can meet
almost all the M2M application, including automobile and personal tracking service,
wearable service, security systems, wireless POS machine, industrial-grade PDA,
smart meter, wireless remote control, etc.
F-B200GL is a SMD type module with 58 LCC pads, which can be easily
embedded into other products. It integrates many network protocols such as TCP,
UDP, CoAP, MQTT, LWM2M and the extended extension AT command makes these
Internet protocols easier for users.
1.2 Main Performance
Form 1-2 Main Performance Parameters
Functions
Description
Power Supply
Power supply range: 3.3V ~ 4.3V.
Typical power supply: 3.8V.
Power Class
Class 3 (23dBm±2.7dB) for LTE-FDD.
Class 3 (23dBm±2.7dB) for LTE-TDD.
LTE Features
Support LTE Cat.NB1.
Support 200KHz bandwidth under LTE Cat.NB1.
Support SISO of downlink
Cat.NB1: Maximum uplink rate is 70kbps
Maximum downlink rate is 32kbps
Network Protocol
Support
PPP/TCP/UDP/COAP/MQTT/LWM2M/SSL/TLS/FTP(S)/HTTP(S).
Support PAP (Password Authentication Protocol) and

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CHAP (Challenge Handshake Authentication Protocol).
SMS
Text and PDU mode.
Point-to-point messaging*
SMS community broadcast*
SMS storage: (U)SIM card default
(U)SIM Card
Support USIM/SIM card: power supply is 1.8V and 2.85V
UART Interface
UART1:
Used for AT command and data transfer
Default baud rate is 57600bps
UART2:
Reserved
UART3:
Reserved
UART4:
Used for software download, Module debug and log output
AT Command
The commands defined by 3GPP TS 27.007 and 3GPP TS 27.005,
and add the new commands from Xiamen Four-Faith Technology
Antenna Interface
Include the main antenna interface (ANT_MAIN) and the BT
antenna interface (ANT_BT)
Dimensions
(15.2±0.15) mm × (17.0±0.15) mm × (2.6±0. 2) mm
Operating
Temperature
Normal operating temperature: -35℃~ +75℃
Extended operating temperature: -40℃~ +85℃
Software Upgrade
Upgrade software through UART or FOTA.
RoHS
All components completely conform to EU RoHS standard.
Note: “*” means in development.
1.3 RF Block Diagram

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Figure 1-1 F-B200GL- RF Block Diagram
Chapter2 Application Interfaces
F-B200GL is an LCC footprint with 58 pins which can be used to wireless
application platform and provide a functional interface as follows:
1. Power supply interface
2. (U)SIM card interface
3. UART interface
4. I2C interface
5. SPI interface

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2.1 Pin Assignments
Figure 2-1 F-B200GL - Pin Assignments
NOTES:
1. All the RESERVED and unused pins need to float
2. GND pins need to connect to ground
3. Due to diode drop of chipset inside, The PWRKEY pin will output 1.0V
2.2 I/O Definition
Form 2-1 I/O Definition

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Symbol
Description
IO
IN/OUT dual-port
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open-drain
2.3 Pin Descriptions
Form 2-2 Pin Descriptions
Power Supply
Pad #
Pad Name
I/O
Description
Remark
13, 14
VBAT
PI
Power supply for
module
3.4~4.2V
42
VDD_EXT
PO
Output 1.8/2.8V
Pull up only for external
GPIOS; unused state: float.
7, 15,
16, 24,
27, 29,
31, 41,
47~58
GND
Ground
Module on/off
Pad #
Pad Name
I/O
Description
Remark
35
PWRKEY
DI
Turn on/off signal
26
RESET_N
DI
Reset signal
Unused state: float.
Status indication
Pad #
Pad Name
I/O
Description
Remark
10
STATUS
DO
Indicates working state
VDD_EXT power domain,
unused state: float.
GPIO interface
Pad #
Pad Name
I/O
Description
Remark
37
GPIO_36
IO
General purpose
input/output
VDD_EXT power domain,
unused state: float.
36
GPIO_34
IO
General purpose
input/output
VDD_EXT power domain,
unused state: float.

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38
GPIO_35
IO
General purpose
input/output
VDD_EXT power domain,
unused state: float.
(U)SIM card interface
Pad #
Pad Name
I/O
Description
Remark
43
USIM_PRESEN
CE
DI
(U)SIM card detection
VDD_EXT power domain,
unused state: float.
1
USIM_VDD
PO
(U)SIM card power
supply
The module identification
1.8V or 2.85V automatically.
44
USIM_RST
DO
(U)SIM card reset line
45
USIM_DATA
IO
(U)SIM card data line
46
USIM_CLK
DO
(U)SIM card clock line
2
USIM_GND
(U)SIM card specified
ground
UART1 interface
Pad #
Pad Name
I/O
Description
Remark
12
UART1_RXD
DI
Data receive
VDD_EXT power domain,
unused state: float.
11
UART1_TXD
DO
Data transmit
VDD_EXT power domain,
unused state: float.
18
UART1_CTS
DO
Clear to send
VDD_EXT power domain,
unused state: float.
17
UART1_RTS
DI
Require to send
VDD_EXT power domain,
unused state: float.
UART2 interface
Pad #
Pad Name
I/O
Description
Remark
19
UART2_TXD
DO
UART2_TXD, data
transmit
VDD_EXT power domain,
unused state: float.
20
UART2_RXD
DI
UART2_RXD, data
receive
VDD_EXT power domain,
unused state: float.
UART3 interface
Pad #
Pad Name
I/O
Description
Remark
40
UART3_RXD
DI
Data transmit
VDD_EXT power domain,
unused state: float.
39
UART3_TXD
DO
Data receive
VDD_EXT power domain,
unused state: float.
UART4 interface
Pad #
Pad Name
I/O
Description
Remark
9
HST_RXD
DI
Data receive
VDD_EXT power domain,

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unused state: float.
8
HST_TXD
DO
Data transmit
VDD_EXT power domain,
unused state: float.
SPI interface
Pad #
Pad Name
I/O
Description
Remark
6
SPI_CS
DO
SPI chipset selection
VDD_EXT power domain,
unused state: float.
5
SPI_CLK
IO
SPI clock
VDD_EXT power domain,
unused state: float.
4
SPI_DI_0
IO
SPI data transmission
VDD_EXT power domain,
unused state: float.
3
SPI_DI_1
IO
SPI data transmission
VDD_EXT power domain,
unused state: float.
I2C interface
Pad #
Pad Name
I/O
Description
Remark
21
I2C_SCL
OD
I2C serial clock
VDD_EXT power domain,
unused state: float.
22
I2C_SDA
OD
I2C serial data
VDD_EXT power domain,
unused state: float.
Antenna interface
Pad #
Pad Name
I/O
Description
Remark
28
ANT_MAIN
IO
Main antenna interface
30
ANT_BT
IO
BT antenna interface
Unused state: float.
Other pins
Pad #
Pad Name
I/O
Description
Remark
34
WAKEUP_IN
DI
Wake-up module
1.08V power domain, enable
it high level more than last
1s.
It used on wakeup module in
PSM mode.
23
WAKEUP_OUT
DO
Wakeup external device
VDD_EXT power domain,
unused state: float.
32
V_BAT_SENSO
R
DI
VBAT voltage detection
Need connect with VBAT
33
V_BAT_RTC
DO
LDO Output for
VBAT_RTC
Only external GPS RTC
power supply, no load
capacity
ADC interface

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Pad #
Pad Name
I/O
Description
Remark
25
ADC_IN
AI
General analog to digital
interface
unused state: float.
2.4 Working Mode
Form 2-3 Working Mode
Mode
Introductions
Normal
Work Mode
Idle
The software is working. The module registers on the network and
can receive and send data.
Talk /
Data
The network connected normally. In this mode, the module power
consumption depends on network setting and data transmission
rate.
Extended Idle Mode
Discontinuous
Reception
Compared with PSM, the power consumption of e-I-DRX slightly
higher than PSM, but the accessibility of downlink communication
link is greatly improved. The module and core network negotiate
the parameters related to e-I-DRX through attachment and TAU
process.
Airplane Mode
AT+CFUN=4 command can make the module into airplane mode,
and in this mode, the RF function is closed.
Minimum Functional
Mode
Using AT+CFUN=0 command can make the module into Minimum
Functional Mode with constant electricity. In this mode, the RF and
(U)SIM card function are off, but the GPIOS and USB can still
work.
PSM
The module can further reduce its power consumption by entering
PSM mode. PSM is similar to the shutdown mode, but the module
is still registered on the network. The module does not need to
reattach and re-establish PDN connection after awakening from
PSM mode.
Shutdown Mode
In this mode, the module out-off of power, serial port and USB port
unable to access, software not running.
2.5 Low Power Consumption Mode
2.5.1 Extended Idle Mode Discontinuous
Reception(e-I-DRX)
F-B200GL can make power consumption through the e-I-DRX mode. The power
consumption of e-I-DRX slightly higher than PSM. But compared with PSM, the

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accessibility of downlink communication is greatly improved. The module and core
network negotiate the correlative parameters of e-I-DRX through attachment and TAU
processes.
If the module decides to request e-I-DRX, it will carry the e-I-DRX parameters by
the attached request or the TAU request message, including the parameters related to
DRX, etc.
The core network decides whether to accept the e-I-DRX activation request.
1. When accepted, the core network can provide different e-I-DRX parameters
from the module request and also provide the length of paging time window to
the module based on operator's strategy.
2. The module uses the normal DRX mechanism when the core network rejects
the module's request or does not support e-I-DRX, there are no e-I-DRX
parameters in the attached /TAU receiving the message.
If the network support e-I-DRX, you can use the AT+CEDRXS=1 command to
enable this function.
2.5.2 Airplane Mode
The RF function will be turned off when the F-B200GL module enters into airplane
mode, and all related AT commands are not accessible. You can make the module
into airplane mode by software.
You can send AT+CFUN=<fun> command into this mode. The parameters of
<fun> can be set 0,1 or 4.
1. AT+CFUN=0: Minimum functional mode, RF and (U)SIM card are off.
2. AT+CFUN=1: all functions mode (default).
3. AT+CFUN=4: RF is off (airplane mode).
2.5.3 Power Save Mode (PSM)
PSM can make the power consumption lower. This mode is similar to power off,
but the module is still connecting network. The module does not need to reattach and
re-establish PDN connection after awakening from PSM mode. Therefore, it cannot
immediately respond to the user request when the module enters into PSM.
When the module needs to use PSM, it will request an active time value during
each attachment and TAU process. The network confirms the use of PSM by
assigning active time values to the module if it supports PSM and accepts the module
use of PSM. If the module wants to change the active time value, for example when
the condition of the module changed, the module will request the required value in the
TAU process.
If the network supports PSM, you can send the AT+CSCLK=2, AT+NVSETUP=2,
AT+CPSMS=1 or AT+CPSMS=1 command to enable PSM.
When the module in PSM state, you can awaken the module under the following

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ways:
1. Pull the PWRKEY pin into high;
2. Waiting for timer (T3412) overflow, the module will wake up automatically.
2.6 Power Supply
2.6.1 Power Supply Interface
F-B200GL has two VBAT pins for external power supply.
Form 2-4 VBAT And Relevant Ground Pins
Pad #
Pad Name
I/O
Description
DC
characteristic
Remark
13, 14
VBAT
PI
power supply for
RF module
Vmax = 4.2V
Vmin = 3.4V
Vnorm =3.8V
7,15,16,24,27,
29,31,41,47~58
GND
Ground
2.6.2 Power Supply Reference Design
F-B200GL power supply range is 3.4-4.2V, need to ensure input voltage not less
than 3.4V. To reduce voltage dropping, it is recommended to place a low ESR 100uF
filter capacitor and three ceramic capacitors (100nF, 33pF and 10pF) near the VBAT
pin. When the module connection external power supply, the line width of VBAT
should not be less than 2mm. In general, when route VBAT, the line should be the
longer, the wider.
In additional, it is recommended to add a 5.1V, more than 0.5W Zener diode at the
front of the power supply for keeping the power supply stable. The reference design of
the power supply circuit is as follows:
Figure 2-2 Power Supply Reference Design

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2.7 Module Startup/Shutdown
2.7.1 Startup
You can startup module by pulling down PWRKEY pin at least 480ms when the
module in power off mode. It is recommended to use the open collector drive circuit to
control the PWRKEY pin. You can release the PWRKEY pin after the STATUS pin is
high.
Form 2-5 PWRKEY Pin Description
Pad #
Pin Name
Description
DC character
Remark
35
PWRKEY
Used for the
module
startup/shutdown
VIH max=2.1V
VIH min=1.3V
VIL max=0.5V
Due to diode voltage drop of
chipset inside, this pin will
output 1.0V
Reference Design:
Figure 2-3 Open Collector Drive Circuit Reference
Another way to control PWRKEY pin is through a button switch directly. A TVS is
placed near the button for ESD protection.
Figure 2-4 Button Startup Reference Circuit

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2.7.2 Shutdown
You can shutdown module by AT+CPOF command.
2.8 Module Reset
The RESET_N pin is used to reset the module. You can reset it by pulling down
the RESET_N pin at least 950ms. The RESET_N signal is sensitive to interference,
so it is recommended that the wiring on the interface board of the module should be
as short as possible, and the trace should be surrounded by GND.
AT reset command: AT+TRB.
Form 2-6 RESET_N Pin Description
Pad #
Pad Name
I/O
Description
DC
Characteristic
Remark
26
RESET_N
DI
Reset signal
VIH max=2.1V
VIH min=1.3V
Unused state:
float.
The reference circuit is similar to the PWRKEY control circuit, you can use an
open collector drive circuit or a button to control the RESET_N pin, shown as follows:
Figure 2-5 RESET_N Open Collector Drive Reference Reset Circuit
Figure 2-6 RESET_N Button Reset Reference Circuit

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2.9 (U)SIM Interface
The (U)SIM interface conforms to ETSI and IMT-2000 standard, support for 1.8V
and 2.85V (U)SIM card.
Form 2-7 (U)SIM Pins Description
Pin No
Pin name
I/O
Description
Remark
43
USIM_DETE
CT
DI
(U)SIM insert in or out
detection
1
USIM_VDD
PO
(U)SIM power supply
Support 1.8V and 2.85V
voltage
44
USIM_RST
DO
(U)SIM reset signal
45
USIM_DATA
IO
(U)SIM data signal
46
USIM_CLK
DO
(U)SIM clock signal
2
USIM_GND
(U)SIM’s dedicated GND
The F-B200GL module can support (U)SIM card hot plug function and support
high and low levels detection through the USIM_DETECT pin. This function is closed
by default.
The 8-pin (U)SIM connector reference circuit design as follows:
Figure 2-7 8-pin (U)SIM Connector Reference Circuit Design
If you do not need the USIM_PRESENCE pin to detect (U)SIM card, please keep it
float. The reference circuit as follows:

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Figure 2-8 6-pin (U)SIM Connector Reference Design
In the circuit design of (U)SIM interface, the following design principles are
recommended in the circuit design to ensure the good performance and non-damage
of (U)SIM card:
1. (U)SIM card connector is placed close to the module, and make sure the
(U)SIM card signal line should not longer than 200mm.
2. (U)SIM card signal need to route away from the RF trace and the VBAT power
trace.
3. The GND of (U)SIM card connector and the USIM_GND of the module are
wiring should be short and thick; Ensure that the width of USIM_VDD and
USIM_GND wiring is not less than 0.5mm, and the bypass capacitance
between USIM_VDD and USIM_GND is not more than 1uF, and close to the
USIM card connector; if the system is complete on the client motherboard, the
USIM_GND can connect directly to the system ground.
4. In order to prevent the signal mutual crosstalk between the USIM_CLK and the
USIM_DATA, they cannot route too close, and the ground-shielded should be
add between the USIM_CLK and the USIM_DATA; otherwise, the USIM_RST
signal also need to be protected by ground.
5. In order to ensure good ESD performance, it is recommended to add the TVS
tube to (U)SIM card; The parasitic capacitance of TVS tube should not more
than 15PF; For the convenience of debugging, it is recommended reserve
series resistance is needed on the (U)SIM signal line of the module; The
peripheral components of the (U)SIM card should be placed as close as
possible to the (U)SIM card connector;
6. The USIM_DATA, USIM_CLK and USIM_RST need add parallel 33pF
capacitors which used to filter out the interference of RF, and these capacitors
should be placed close to (U)SIM card connector.
7. The pull-up resistor of USIM_DATA can increase the antijamming capability of