Fuji Electric Small-IPM Series Instructions for use

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016
Fuji Electric Co., Ltd.
Dec. 2016
Application Manual
“Small-IPM"
Fuji IGBT Intelligent-Power-Module
6MBP15XS*060-50
6MBP20XS*060-50
6MBP30XS*060-50
6MBP35XS*060-50

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016
CONTENTS
Chapter 1 Product Outline
1. Introduction .......................................................................................... 1-2
2. Product line-up ..................................................................................... 1-4
3. Definition of Type Name and Marking Spec.......................................... 1-5
4. Package outline dimensions.................................................................. 1-6
5. Absolute Maximum Ratings ................................................................. 1-7
Chapter 2 Description of Terminal Symbols and Terminology
1. Description of Terminal Symbols ........................................................ 2-2
2. Description of Terminology ................................................................. 2-3
Chapter 3 Detail of Signal Input/Output Terminals
1. Control Power Supply Terminals VCCH,VCCL,COM .............................. 3-2
2. Power Supply Terminals of High Side VB(U,V,W) .............................. 3-6
3. Function of Internal BSDs (Boot Strap Diodes) ................................... 3-9
4. Input Terminals IN(HU,HV,HW), IN(LU,LV,LW) .................................. 3-13
5. Over Current Protection Input IS ......................................................... 3-16
6. Fault Status Output VFO ..................................................................... 3-17
7. Linear Temperature Sensor Output TEMP .......................................... 3-18
8. Over Heat Protection ........................................................................... 3-20
Chapter 4 Power Terminals
1. Connection of Bus Input terminal and Low Side Emitters .................... 4-2
2. Setting of Shunt Resistor of Over Current Protection .......................... 4-3
Chapter 5 Recommended wiring and layout
1. Examples of Application Circuits.......................................................... 5-2
2. Recommendation and Precautions in PCB design ............................. 5-5
Chapter 6 Mounting Guideline and Thermal Design
1. Soldering to PCB ................................................................................. 6-2
2. Mounting to Heat sink .......................................................................... 6-3
3. Cooler (Heat Sink) Selection................................................................ 6-4
Chapter 7 Cautions
1. Other warnings and precautions ......................................................... 7-2
2. Handling and storage precautions ...................................................... 7-2
3. Notice .................................................................................................. 7-3

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-1
Contents Page
1. Introduction .............................................................................................. 1-2
2. Product line-up ......................................................................................... 1-4
3. Definition of type name and marking spec .............................................. 1-5
4. Package outline dimensions .................................................................... 1-6
5. Absolute maximum ratings ...................................................................... 1-7
Chapter 1
Product Outline

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-2
Chapter 1 Product Outline
The objective of this document is introducing Fuji IGBT Intelligent-Power-Module “Small-IPM”.
At first, the product outline of this module is described.
Secondary, the terminal symbol and terminology used in this note and the specification sheet are
explained. Next, the design guideline on signal input terminals and power terminals are shown using its
structure and behavior. Furthermore, recommended wiring and layout, and the mount guideline are given.
Feature and functions
1.1 Product concept
•7th gen. IGBT technology offers high-efficiency and energy-saving operation.
•Guarantee Tj(ope)=150℃
•Higher accuracy of short circuit detection contribute to expanding over load operating area.
•Compatible pin assignment, foot print size and mounting dimensions as the 1st gen. Small IPM series.
•Product range: 15A –35A / 600V.
•The total dissipation loss has been improved by improvement of the trade-off between the Collector-
Emitter saturation voltage VCE(sat) and switching loss.
1.2 Built-in drive circuit
•Drives the IGBT under optimal conditions.
•The control IC of upper side arms have a built-in high voltage level shift circuit (HVIC).
•This IPM is possible for driven directly by a microprocessor. Of course, the upper side arm can also
be driven directly. The voltage level of input signal is 3.3V or 5V.
•Since the wiring length between the internal drive circuit and IGBT is short and the impedance of the
drive circuit is low, no reverse bias DC source is required.
•This IPM device requires four control power sources. One is a power supply for the lower side IGBTs
and control ICs. The other three power supplies are power supplies for the upper side IGBTs with
proper circuit isolation.
The IPM doesn’t need insulated power supplies for the upper side drive because the IPM has built-in
bootstrap diodes (BSD).
Fig. 1-1 Block Diagram of Internal Circuit
VB(U)
11
10
9
5
3
21
20
19
18
17
16
15
14
13
12
22
23
24
26
28
30
36
32
U
P
V
W
N(V)
N(U)
N(W)
Vcc
IN
GND
OUT
Vs
Vcc
UIN
VIN
WIN
UOUT
VOUT
WOUT
Fo
IS
GND
VFO
IS
COM
COM
IN(LU)
IN(LV)
IN(LW)
VCCL
VCCH
IN(HU)
IN(HV)
IN(HW)
VB(V)
VB(W)
TEMP
NC
VB
7
TEMP
Vcc
IN
GND
OUT
Vs
VB
Vcc
IN
GND
OUT
Vs
VB
3×HVIC
LVIC
3×BSD
6×IGBT 6×FWD
1. Introduction

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-3
Chapter 1 Product Outline
FWDIGBT WIREIC
Mold resin
Lead frame
BSD
Aluminum base PCB with isolation layer
Mold resin FWDIGBT WIREIC
Mold resin
Lead frame
BSD
Aluminum base PCB with isolation layer
Mold resin
Fig.1-2 Package overview
•The OC protection circuits protect the IGBT against over current, load short-circuit or arm short-circuit.
The protection circuit monitors the emitter current using external shunt resistor in each lower side IGBT
and thus it can protect the IGBT against arm short-circuit.
•The UV protection circuit is integrated into all of the IGBT drive circuits and control power supply. This
protection function is effective for a voltage drop of all of the high side drive circuits and the control
power supply.
•The OH protection circuit protects the IPM from overheating. The OH protection circuit is built into the
control IC of the lower side arm (LVIC).
•The temperature sensor output function enables to output measured temperature as an analog voltage
(built in LVIC)
•The FO function outputs a fault signal, making it possible to shut down the system reliably by outputting
the fault signal to a microprocessor unit which controls the IPM when the circuit detects abnormal
conditions.
1.3 Built-in protection circuits
•The following built-in protection circuits are incorporated in the IPM device:
(OC): Over current protection
(UV): Under voltage protection for power supplies of control IC
(LT) or (OH): Temperature sensor output function or Overheating protection
(FO): Fault alarm signal output
Fig.1-3 Package cross section diagram
1.4 Compact package
•The package of this product includes with an aluminum base, which further improves the heat radiation.
•The control input terminals have a shrink pitch of 1.778mm (70mil).
•The power terminals have a standard pitch of 2.54mm (100mil).

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-4
Chapter 1 Product Outline
2. Product line-up and applicable products for this manual
Type name Rating of IGBT Isolation Voltage
[Vrms] Variation Target application
Voltage
[V] Current [A]
6MBP15XSD060-50 600
15 1500Vrms
Sinusoidal 60Hz, 1min.
(Between shorted all terminals and case)
LT*1
・Room air conditioner
compressor drive
・Heat pump
applications
・Fan motor drive
・General motor drive
・Servo drive
6MBP15XSF060-50 LT*1
OH*1
6MBP20XSD060-50 20 LT*1
6MBP20XSF060-50 LT*1
OH*1
6MBP30XSD060-50 30 LT*1
6MBP30XSF060-50 LT*1
OH*1
6MBP35XSD060-50 35 LT*1
6MBP35XSF060-50 LT*1
OH*1
Table. 1-1 Line-up
*1 (LT): Temperature sensor output function (LT)
(OH): Overheating protection function (OH)

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-5
Chapter 1 Product Outline
060-50 270001
Trademark Type Name
DATE CODE & Serial number
Y
M
A
1
A
2
Products code
P
Country of Origin mark
Year Code (0 to 9)
Month Code (1 to 9 and O, N, D)
6MBP20XSD
“” (Bank) : Japan
P : Philippine
YMNNNN
Y : Year (0 to 9)
M : Month (1 to 9 and O, N, D)
NNNN : Serial number
3. Definition of Type Name and Marking Spec.
Fig.1-4 Marking Specification
•Type name
6 MBP 20 X S D 060 –50
Additional model number (Option)
50 : RoHS
Voltage rating
060 : 600V
Additional number of series
D : Temperature sensor output
F : Temperature sensor output and Over heating protection
Series name
S: Package type
Series name
X: Chip generation
IGBT current rating
15: 15A, 20: 20A, 30: 30A, 35: 35A
Indicates IGBT-IPM
Number of switch elements
6 : 6-chip circuit of three phase bridge
A1 A2
6MBP15XSD060-50 L D
6MBP15XSF060-50 L F
6MBP20XSD060-50 M D
6MBP20XSF060-50 M F
6MBP30XSD060-50 O D
6MBP30XSF060-50 O F
6MBP35XSD060-50 P D
6MBP35XSF060-50 P F
TYPE NAME
PRODUCT CODE

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-6
Chapter 1 Product Outline
4. Package outline dimensions
Fig.1-5. Case outline drawings
Pin No. Pin Name
22 N(W)
23 N(V)
24 N(U)
26 W
28 V
30 U
32 P
36 NC
Pin No. Pin Name
3 VB(U)
5 VB(V)
7 VB(W)
9 IN(HU)
10 IN(HV)
11 IN(HW)
12 VCCH
13 COM
14 IN(LU)
15 IN(LV)
16 IN(LW)
17 VCCL
18 VFO
19 IS
20 COM
21 Temp
A
DETAIL A
14.13
14x2.54 (=35.56)
13.0
3.50(min.)
43.0
35.0
26.0
18x1.778(=32.004)
±0.5
±0.3
±0.5
4.2
1.6 ±0.1
±0.1
3.2±0.1
14.0 14.7 29.4±0.5
±0.5 ±0.5
1.8
1.5
3.7
±0.1
±0.1
0.40
10.6±0.1
1.8 ±0.1
2.5(min)
(1.2 )
(0.6)
8.96
15.56
3579101112131415161718192021
22 23 24 26 28 30 32 36
±0.1
0.98(min.)
Note.1
The IMS (Insulated Metal Substrate) deliberately protruded from back surface of case.
It is improved of thermal conductivity between IMS and heat-sink.
4.76 ±0.3
15.56±0.3
※Note.1
Solder Plating
5.63
±0.25
0.7 ±0.4
±0.3
8.58(min.)
3.50(min.)
13.0
30.4
±0.3
±0.3
±0.3
Insulated Metal
Substrate
2.54±0.2
1.778±0.2
B
±0.1
0.40
±0.1
D
Insulated Metal
Substrate
DETAIL B
DETAIL C DETAIL D
C
0.6
0.9
0.6
1.2
2.5(min)
3.50(min.)
±0.1
±0.1
±0.1
±0.1
±0.5
±0.5
3.83 2.6 ±0.1
0.13±0.13
Unit: mm

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-7
Chapter 1 Product Outline
An example of the absolute maximum ratings of 6MBP20XSD060-50 is shown in Table 1-2.
Item Symbol Rating Unit Description
DC bus Voltage VDC 450 V DC voltage that can be applied between
P-N(U),N(V),N(W) terminals
Bus Voltage (Surge) VDC(Surge) 500 V
Peak value of the surge voltage that can be
applied between P-N(U),N(V),N(W)
terminals during switching operation
Collector-Emitter Voltage VCES 600 V
Maximum collector-emitter voltage of the
built-in IGBT chip and repeated peak
reverse voltage of the FWD chip
Collector Current IC@25 20 A Maximum collector current for the IGBT chip
Tc=25C, Tj=150C
Peak Collector Current ICP@25 40 A Maximum pulse collector current for the
IGBT chip Tc=25C, Tj=150C
Diode Forward Current IF@25 20 A Maximum forward current for the FWD chip
Tc=25C, Tj=150C
Peak Diode Forward Current IFP@25 40 A Maximum pulse forward current for the
FWD chip Tc=25C, Tj=150C
Collector Power Dissipation PD_IGBT 41.0 W Maximum power dissipation for one IGBT
element at Tc=25C, Tj=150C
FWD Power Dissipation PD_FWD 27.8 W Maximum power dissipation for one FWD
element at Tc=25C, Tj=150C
Maximum Junction Temperature
of Inverter Block Tj(max) +150 C Maximum junction temperature of the IGBT chips and the FWD chips
Operating Junction Temperature
of Inverter Block TjOP -40 ~ +150 C Junction temperature of the IGBT and FWD chips during continuous operation
5. Absolute Maximum Ratings
Table 1-2 Absolute Maximum Ratings at Tj=25C,Vcc=15V (unless otherwise specified)

Fuji Electric Co., Ltd.
MT6M12343 Rev.1.0
Dec.-2016 1-8
Chapter 1 Product Outline
Item Symbol Rating Unit Descriptions
High-side Supply Voltage VCCH -0.5 ~ 20 V Voltage that can be applied between COM
and VCCH terminal
Low-side Supply Voltage VCCL -0.5 ~ 20 V Voltage that can be applied between COM
and VCCL terminal
High-side Bias Supply Voltage
VB(U)-COM
VB(V)-COM
VB(W)-COM
-0.5 ~ 620 V
Voltage that can be applied between VB(U)
terminal and COM, VB(V) terminal and
COM,VB(W) terminal and COM.
High-side Bias Voltage for IGBT
Gate Driving
VB(U)
VB(V)
VB(W)
20 V
Voltage that can be applied between U
terminal and VB(U) terminal , V terminal and
VB(V) terminal , W terminal and VB(W)
terminal.
Input Signal Voltage VIN
-0.5 ~ VCCH+0.5
-0.5 ~ VCCL+0.5 V Voltage that can be applied between COM and each IN terminal
Input Signal Current IIN 3 mA Maximum input current that flows from IN
terminal to COM
Fault Signal Voltage VFO -0.5 ~ VCCL+0.5 V Voltage that can be applied between COM
and VFO terminal
Fault Signal Current IFO 1 mA Sink current that flows from VFO to COM
terminal
Over Current Sensing
Input Voltage VIS -0.5 ~ VCCL+0.5 V Voltage that can be applied between IS and COM terminal
Maximum Junction Temperature
of Control Circuit Block Tj +150 C Maximum junction temperature of the control circuit block
Operating Case Temperature Tc -40 ~ +125 C
Operating case temperature (temperature of
the aluminum plate directly under the IGBT
or the FWD)
Storage Temperature Tstg -40 ~ +125 C
Range of ambient temperature for storage
or transportation, when there is no electrical
load
Isolation Voltage Viso AC 1500 Vrms
Maximum effective value of the sine-wave
voltage between the terminals and the heat
sink, when all terminals are shorted
simultaneously. (Sine wave = 60Hz / 1min)
Table 1-2 Absolute Maximum Ratings at Tj=25C,Vcc=15V (Continued)