Fuji Electric EconoPACK+ User guide

© Fuji Electric Co., Ltd. All rights reserved.MT5Q03980
MT5Q1070c © Fuji Electric Co., Ltd. All rights reserved.
Industrial IGBT Module
EconoPACK™+
(M629)
Mounting Instruction
July 2022
Note) EconoPACKTM+ is a registered trademark of Infineon Technologies.

MT5Q1070c
1.
Scope of application
2
2.
Mounting the module to heat sink
3
2
-1. Surface conditions of heat sink
3
2
-2. Application of thermal grease
4
2
-3. Screw fastening to heat sink
5
3.
Main terminal connection
6
3
-1. Bus bar connection
6
3
-2. Maximum allowable mechanical force when connecting to bus bar
6
4.
PCB mounting instruction
7
4
-1. Soldering of PCB
7
4
-2. Screw fastening of PCB
7
© Fuji Electric Co., Ltd. All rights reserved.
CONTENTS
1

MT5Q1070c
1. Scope of application
© Fuji Electric Co., Ltd. All rights reserved.
This document describes how to safely mount and use EconoPACKTM+ modules for the following part
numbers.
[V-series]
6MBI225V-120-50
6MBI300V-120-50
6MBI450V-120-50
6MBI550V-120-50
6MBI300V-170-50
6MBI450V-170-50
When handling the module, in addition to the contents described in this document, please check the
Warning and Caution in the module’s specification too.
2
Note) EconoPACKTM+ is a registered trademark of Infineon Technologies.

MT5Q1070c
2. Mounting the module to heat sink
© Fuji Electric Co., Ltd. All rights reserved.
2-1. Surface conditions of heat sink
Design the heat sink so that the following surface conditions are satisfied. If the roughness and
flatness do not satisfy the conditions, it may cause an increase in contact thermal resistance, or
insulation failure due to package cracking.
1. The surface roughness (Rz) of the heat sink should be 10μm or less.
2. The surface flatness of the heat sink should be within +50μm (-50μm) per 100mm, taking the
straight line connecting the center points of the two screw mounting holes as reference.
Here, "+" (plus) is defined when the heat sink has a convex shape, and "-" (minus) is defined
when the heat sink has a concave shape. If both shapes exist, the sum of the absolute values
of the maximum and minimum values should be 50μm or less.
Figure 1 shows the definition of surface roughness and flatness of the heat sink.
3
Figure 1. Heat sink surface flatness and roughness
(Heat sink)
Thermal grease
application surface P=100mm pitch
-50μm
(b) In the case of concave shape
(Heat sink)
Thermal grease
application surface P=100mm pitch
(c) In the case of both shapes exist
50μm
(Heat sink)
Thermal grease
application surface P=100mm pitch
+50μm
The surface flatness should be 50μm or less per 100mm, taking the straight line
connecting the center points of the two screw mounting holes as reference.
(a) In the case of convex shape
The surface roughness
(Rz) should be 10μm or
less. Refer to ISO4287
for definition.
Rz

MT5Q1070c
2. ヒートシンクへの実装
© Fuji Electric Co., Ltd. All rights reserved.
2-2. Application of thermal grease
It is recommended to apply thermal grease between the module’s base plate and the heat sink to
ensure heat dissipation to the heat sink.
If the properties, amount, and application method of the thermal grease are not appropriate, it may
result in poor heat dissipation and lead to thermal failure. Table 1 shows the recommended thermal
grease properties and thickness. Assuming that the thickness is uniform, the required amount (weight)
of thermal grease can be calculated from the following formula.
We recommend using the stencil mask method to control the appropriate thermal grease thickness
(Figure. 2). The recommended stencil mask pattern can be provided upon request.
It is recommended to confirm that the thermal grease is spread over the entire module’s base plate by
removing the module after mounting and check the extent of spreading.
4
Unit Recommended value
Penetration (typ.) ->= 340
Thermal conductivity W/m・K>= 1
Thermal grease thickness μm 100 +/-30
Figure 2. Thermal grease application
Table 1. Recommended properties of thermal grease
Thermal grease
thickness (μm)
Thermal grease
weight (g) x 104Base plate area of module (cm2)
=Density of thermal
grease (g/cm3)
x x
Squeegee
(for applying thermal
grease)
Thermal grease
(apply to module’s
base plate)
Stencil mask
Stencil mask
fixing tool

MT5Q1070c © Fuji Electric Co., Ltd. All rights reserved. 5
2. ヒートシンクへの実装
2-3. Screw fastening to heat sink
This section describes how to tighten the screws when mounting the module to heat sink.
1. Use M5 screws to fix the module to heat sink.
2. To fix the module with even force, first perform temporary tightening with 1/3 of the final
tightening torque. Figure 3 shows the tightening sequence.
3. Perform final tightening in the same sequence as temporary tightening. The final tightening
torque should be within the range of 2.5~3.5Nm.
Tightening torque Tightening sequence
Temporary tightening 1/3 of the final tightening torque (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)
Final tightening 2.5～3.5Nm (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)
Figure 3. Tightening torque and tightening sequence
(1) (5)(3)(7)
(4) (8)(2)(6)

MT5Q1070c
3-1. Bus bar connection
This section describes the conditions and precautions when connecting the module to bus bar.
1. Screw size：M6
2. Screw length：Bus bar thickness + (7 ~ 9mm)
3. Tightening torque：3.5 ~ 4.5Nm
<Important notes>
Do not apply excessive force to the module main terminals when connecting to bus bar. The force
applied to the end of the bus bar is much greater than at the main terminal because the moment of
force is proportional to the bus bar length. Also, do not tighten the screws if the main terminal and the
bus bar is misaligned. This may cause damage to the terminals as mechanical stress is continuously
applied to the terminals.
3-2. Maximum allowable mechanical force when connecting to bus bar
The maximum allowable mechanical force when connecting the bus bar is shown in Figure 4.
Do not exceed this value even for a moment.
3. Main terminal connection
© Fuji Electric Co., Ltd. All rights reserved. 6
Figure 4. Maximum allowable force for each direction
* Short period force applied during mounting
process
Direction of force Maximum
allowable force*
A5 Nm
B3 Nm
C500 N
D500 N
E5 Nm
F5 Nm
G500 N
H1000 N (a) Horizontal direction
(b) Vertical direction
A
B
C D
E
F
G
H

MT5Q1070c
4-1. Soldering of PCB
The recommended soldering conditions for mounting a PCB on the module are shown below.
4. PCB mounting instruction
© Fuji Electric Co., Ltd. All rights reserved. 7
4-2. Screwing fastening of PCB
This section describes the screwing method and precautions when mounting the PCB to the module.
1. Use a self-tapping screw to fix the PCB to the module. As shown in Figure 5, use screws with
a diameter of 2.4 to 2.6 mm and a length of 7.0 to 10.0 mm from the underside of the PCB.
2. To fix the PCB with even force, first perform temporary tightening with 1/3 of the final
tightening torque. Figure 6 shows the tightening sequence.
3. Perform final tightening in the same sequence as temporary tightening. The final tightening
torque should be within the range of 0.4±10% Nm.
Temperature Time
Flow soldering Pre heat: 125℃max
Post heat：265℃max Post heat：11s max
Hand soldering (by soldering iron) 410℃max 5s max
Table 2. Recommended soldering conditions
＜Important notes＞
Manual screwing is recommended to avoid damage to the module. When using an electric screwdriver,
optimize the parameters such as tool selection and tightening conditions. Check that the product is not
damaged after tightening. Also, the rotation speed should not exceed 300 rpm when screwing.
Do not tighten the screws in an tilted state as shown in Figure 7(a). It may result in mechanical
damage as shown in Figure 7(b).
Figure 5. Recommended screw dimensions and mounting image
(b) Recommended screw dimension (length)
and mounting image
(a) Recommended screw dimension (diameter)
2.4~2.6mm2.4~2.6mm
2.4 ~ 2.6mm
Module
7.0 ~ 10.0mm

MT5Q1070c
Figure 7. Poor example of screw tightening
(b) Example of mechanical damage(a) Example of screw in tilted state
© Fuji Electric Co., Ltd. All rights reserved. 8
Tightening torque Tightening sequence
Temporary tightening 1/3 of the final tightening torque (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)
Final tightening 0.4±0.05 Nm (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)
Figure 6. Tightening torque and tightening sequence
(1) (5)(3)(7)
(4) (8)(2)(6)

MT5Q1070c © Fuji Electric Co., Ltd. All rights reserved. 9
Warning:
The contents in this manual (product specifications, characteristics, data, materials, structure, etc.) are as
of July 2022. The contents are subject to change without prior notice due to changes in product
specifications or for other reasons. When using a product described in this manual, please obtain the
product’s latest specification and check the data.
This manual does not describe all applications and mounting conditions. Therefore, it is necessary to
evaluate under actual usage conditions and confirm the mechanical characteristics, electrical characteristics,
thermal characteristics, lifetime, etc.
The order in which CONTENTS is described in this manual does not indicate the order in which the
products should be mounted. Please consider and decide the installation process.
The applications described in this manual are illustrative of typical applications using Fuji Electric's
semiconductor products. This manual do not warrant or grant licenses for the enforcement of industrial
property rights or other rights.

MT5Q1070c © Fuji Electric Co., Ltd. All rights reserved.
(1) Transportation
Transport the carton box with the appropriate side facing up. Otherwise, the product may be
subject to unexpected stress, which may result in bending of terminals, distortion in the resin
package etc. Furthermore, throwing or dropping the product can cause significant damage to the
product. If the product gets wet, it may lead to destruction or malfunction. Please take sufficient
measures against rain and freezing.
(2) Storage
Please manage the storage location so that the temperature is 5 to 35oC and the humidity is 45 to
75%. Condensation may form on the surface of semiconductor devices when there are sudden
temperature changes. Avoid such environment and store in a place where temperature changes
are minimal. If more than a year has passed since the product was manufactured under these
storage conditions, confirm that the terminal solderability is not deteriorated before mounting.
Avoid storing in a place where corrosive gas is generated or where there is a lot of dust.
When storing, make sure that no external force or load is applied to the semiconductor device.
Store the terminals of semiconductor devices in an unprocessed state. If the terminals are stored
after the terminal is processed, soldering defects may occur when mounting the product due to rust.
(3) Assembly environment
The semiconductor device in the power module is very vulnerable to electrostatic discharge (ESD).
If excessive static electricity is applied to the control terminal, the device might be destroyed. Take
appropriate measures for ESD in the assembly environment within the scope described in the
IGBT Module Application Manual (Chapter 3-2).
(4) Operating environment
If the product is used in an environment exposed to acids, organic substances, and corrosive
gases (hydrogen sulfide gas, sulfuric acid gas, etc.), the product’s performance and appearance
may deteriorate.
Cautions
10