Fuji Electric P642 Series User guide

MT6M16534
Mounting Instruction
Small IPM (Intelligent Power Module)
P642 Series
6MBP**XT*060-50
July 2022

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
This Instruction contains the product specifications, characteristics, data, materials, and structures as of
July 2022. The contents are subject to change without notice for specification changes or other reason.
When using a product listed in this Instruction be sure to obtain the latest specifications.
The application examples in this note show the typical examples of using Fuji products and this note
shall neither assure to enforce the industrial property including some other rights nor grant the license.
Although Fuji Electric Co., Ltd. continually strives to enhance product quality and reliability, a small
percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor
products in your equipment, be sure to take adequate safety measures such as redundant, flame-
retardant and fail-safe design in order to prevent a semiconductor product failure from leading to a
physical injury, property damage or other problems.
The product introduced in this Application note is intended for use in the following electronic and
electrical equipment which requires ordinary reliability:
・Inverter for Compressor motor or fan motor for Room Air Conditioner
・Inverter for Compressor motor for heat pump applications.
If you need to use a semiconductor product in this application note for equipment requiring higher
reliability than normal, such as listed below, be sure to contact Fuji Electric Co., Ltd.to obtain prior
approval. When using these products, take adequate safety measures such as a backup system to
prevent the equipment from malfunctioning when a Fuji Electric’s product incorporated in the equipment
becomes faulty.
・Transportation equipment (mounted on vehicles and ships)
・Trunk communications equipment
・Traffic-signal control equipment
・Gas leakage detectors with an auto-shutoff function
・Disaster prevention / security equipment
・Safety devices, etc.
Do not use a product in this application note for equipment requiring extremely high reliability
such as:
・Space equipment ・Airborne equipment ・Atomic control equipment
・Submarine repeater equipment ・Medical equipment
All rights reserved. No part of this application note may be reproduced without permission in writing from
Fuji Electric Co., Ltd.
If you have any question about any portion of this application note, ask Fuji Electric Co., Ltd.or its sales
agencies. Neither Fuji Electric Co., Ltd.nor its agencies shall be liable for any injury or damage caused
by any use of the products not in accordance with instructions set forth herein.
i
Cautions

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
Chapter 1 Precautions during transportation and storage 1-1
ii
Chapter 2 Precautions in unpacking 2-1
1.
Removing the pin from the tube
2
-1
2.
Picking out the Small IPM from the stick
2
-3
Chapter 3 Through hole design for PCB 3-1
Chapter 4 Spacer 4-1
Chapter 5 Application of thermal grease 5-1
Chapter 6 Heat sink selection 6-1
1.
Selection
6
-1
2.
Shape
6
-2
3.
Mounting
(tightening) 6
-2
Chapter 7 Soldering to Printed Circuit Board 7-1
Chapter 8 Appendix 8-1
1.
Stencil mask drawing for thermal grease application (recommended)
8
-1
2.
Isolation distance of heat sink
8
-2
CONTENTS

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
•The product should be stored at a normal temperature of 5to 35oCand relative humidity of 45 to
75%, otherwise the product might be corroded or destructed, or its lifetime. If the storage area is
very dry, a humidifier may be required. In such a case, use only deionized water or boiled water,
since the chlorine in tap water may corrode the leads.
•In case of storage environment with rapid temperature changes, condensation will be occurred on
the surface of the product. In order to avoid the condensation, the product shall be stored in steady
temperature environment if possible.
•Should not be stored or used in an environment where it is exposed to acids, organic substances, or
corrosive gas (hydrogen sulfide, sulfurous acid gas etc.) or in a dusty place.
•When stored, it is necessary to prevent external pressure to the product. Stacking that may deform
the outer box shall be avoided even when it is packed in the outer box.
•Transport the cardboard box with the appropriate side facing up. This is to prevent unexpected
stress being applied to the product, which may cause bending of the terminals or distortion in the
resin package of the product. Throwing or dropping the product can cause severe damage to the
product. Also, it is necessary to pay attention to rain and freezing to avoid wetting, as it may cause
damage or destruction. The environmental conditions such as temperature and humidity during
transportation described in the specifications shall be strictly observed.
•The product should be stored with the lead terminals remaining unprocessed. It is necessary to
avoid rusting etc.due to scratches during processing, resulting in poor soldering.
•The containers and bags for storing the product should be non-static or conductive.
•Under the above storage condition, use the product within one year.
1. Precautions during transportation and storage
This chapter describes the precautions during transportation and storage for the product.
1-1

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
•The products are packaged in tubes that are pinned at both ends.
•Remove the pin on one side to pick out the product from the tube.
•If the pin and the product are in contact with each other when removing the pin, a strong impact
might be applied to the product, which may cause deformation or damage to the product terminals.
Make a gap between the pin and the product when removing the pin.
•The recoil of removing the pins may cause deformation or damage to the terminals of the product,
so remove the pins with holding them.
•If the product falls out from the tube when removing the pins, it may cause a strong impact to the
product, causing the product terminals to be deformed or damaged. Remove the pin with the tube
opening facing up.
•It is recommended to use a remover (removal jig) to remove the pins. The following shows how to
remove the pins using the remover.
•Pin removing method using remover (removal jig).
1. Make a gap between the pin and the product. (See Fig. 2-1)
2. Precautions in unpacking
This chapter describes the precautions in unpacking for the product.
2-1
1Removing the pin from the tube
2. Push the pointed end of the pin with your index finger, and make a gap between the pin and the
tube to insert the remover removal part as shown in Fig. 2-2. (See Fig. 2-3)
Fig. 2-2 Example of remover (removal jig) Fig. 2-3 Gap between the pin and the tube
Fig. 2-1 Gap between the pin and the product
GAP
Removal part
Gap

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved. 2-2
3. Insert the removal part of the remover into the gap between the pin and the tube. (See Fig. 2-4)
2Removing the product from the tube
•Since the elements installed in the Small IPM are extremely weak to electrostatic discharge,
appropriate ESD countermeasures are necessary in the assembly environment within the range
described in the specifications. In particular, when removing it out from the tube, it is most likely to
cause electrical damage to the product.
•When removing the product, do not strongly collide the products with each other or touch the
product terminals to the tube. A strong impact on the product may cause deforming or damage to
the product terminals.
4. Hold the pin with your finger and remove the pin with the tube opening facing up.
(See Fig. 2-5, 2-6)
Fig. 2-5 How to hold the pin Fig. 2-6 Tube opening orientation
Fig. 2-4 Insert remover
Insert the remover to reach to the
opposite side of the pin head

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
3. Through hole design for PCB
This chapter describes the through hole design for PCB attaching to the product.
3-1
Figures 3-1 to 3-3 show examples of recommended through hole dimensions and through hole layout
designs.
•The through hole dimensions are the inner diameter after plating (dimension unit: mm).
•If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be
impaired. Also, if the land diameter is too large, solder bridges are likely to occur.
•The hole size and land size should be optimized as appropriate, taking into consideration the printed
circuit board processing accuracy and mounting method.
Fig. 3-1 Control side through hole dimensions Fig. 3-2 Power side through hole dimensions
Fig. 3-3 Through hole layout
Through hole
Land Through hole
Land

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
•When using spacer between the PCB and the product for alignment during soldering to printed
circuit board, it is recommended to support the product at the hatched area as shown in Fig. 4-1.
•Select a spacer material that does not cause contamination or corrosion.
4. Spacer
This chapter describes the spacer for PCB attaching to the product.
4-1
Fig. 4-1 Spacer installation position

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
5. Application of thermal grease
This chapter describes the thermal grease application for the product.
5-1
•It is recommended to apply thermal grease between the product’s aluminum base and the heat sink
to ensure heat dissipation to the heat sink. If the properties, amount, and application method of the
thermal grease is not appropriate, it may result in poor heat dissipation and lead to thermal failure.
Table 5-1 shows the recommended thermal grease properties and thickness
•Assuming that the thickness is uniform, the required amount (weight) of thermal grease can be
calculated from the following formula.
•We recommend using the stencil mask method to control the appropriate thermal grease thickness
(Fig. 5-1). The recommended stencil mask pattern is shown in appendix.
•It is recommended to check the spread of thermal grease by removing the product after mounting
and check the extent of spreading.
•In the case of liquid cooling, the temperature difference (temperature gradient) between the heat
sink temperature and the temperature inside the product becomes large. When mounting the
product to heat sink, secure a thermal grease coating amount that can absorb the distortion due to
the difference in thermal expansion when the temperature gradient is large.
•In the case of a multiple structure heat sink, the number of fastening parts increases and heat
transfer (diffusion) becomes uneven. Therefore, it is necessary to suppress the distortion, such as
securing the thermal grease coating amount in consideration of the generated distortion during
design.
Table 5-1. Recommended properties of thermal grease
Fig. 5-1 Thermal grease application
Squeegee
（for applying
thermal grease）
Thermal grease
(apply to product’s
aluminum base)
Stencil mask
Stencil mask
fixing tool
Unit Recommended value
Penetration (typ.) -328
Thermal conductivity W/m・K0.90
Thermal grease thickness μm 100±30
Thermal grease
thickness (μm)
Thermal grease
weight (g)x 104Aluminum base area of product (cm2)
=Density of thermal
grease (g/cm3)
x x

MT6M16534 © Fuji Electric Co., Ltd. All rights reserved.
6. Heat sink selection
This chapter describes the heat sink selection for the product.
6-1
•The junction temperature Tvj should not exceed the maximum junction temperature rating for safe
operation. Heat sink (cooling device) should be designed to ensures that Tvj is always below the
maximum junction temperature rating.
•If the IGBT or FWD junction temperature is higher than the maximum junction temperature rating, it
might cause damage to the chips. Some types of the products have the over heating (OH)
protection function which works when the LVIC chip temperature exceeds the maximum junction
temperature rating. However, if the temperature rises too quickly, the OH protection might not work.
•When selecting a heat sink, please verify the chip temperature Tvj by measuring Tcat the position
shown in Figure 6-1, and calculating the Tvj from device power dissipation and thermal resistance.
In addition, this product has a built-in temperature sensor, and Tvj can be confirmed by the analog
voltage that is output according to the LVIC chip temperature. Please refer to it when selecting the
heat sink.
•For more detail design, please refer to “IGBT Module Application Manual (REH984e)” and “Small
IPM Application Manual (MT6M15234b)”.
1Selection
Fig. 6-1 Temperature sensing and Tcmeasurement points