Fuji Electric P633A Series User guide

MT6M15589
Mounting Instruction
Fuji Small IPM (Intelligent Power Module)
P633A series
6MBP**XS*060-50
15th of June, 2020 Rev.0

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
This Instruction contains the product specifications, characteristics, data, materials, and structures as
of May 2020. The contents are subject to change without notice for specification changes or other reason.
When using a product listed in this Instruction be sure to obtain the latest specifications.
All applications described in this Instruction exemplify the use of Fuji’s products for your reference only.
No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual
property right owned by Fuji Electric Co., Ltd. Is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes
no representation or warranty, whether express or implied, relating to the infringement or alleged infringement
of other’s intellectual property rights which may arise from the use of the applications described herein.
Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of
semiconductor products may become faulty. When using Fuji Electric semiconductor products in your
equipment, you are requested to take adequate safety to prevent the equipment from causing a physical
injury, fire, or other problem if any of the products become faulty. It is recommended to make your design
failsafe, flame retardant, and free of malfunction.
The products introduced in this Instruction are intended for use in the following electronic and electrical
equipment which has normal reliability requirements.
・Inverter for Compressor motor, or fan motor for Room Air Conditioner
・Inverter for Compressor motor for heat pump application, etc
If you need to use a product in this Instruction for equipment requiring higher reliability than normal,
such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior
approval. When using these products for such equipment, take adequate measures such as a backup
system to prevent the equipment from malfunctioning even if a Fuji’s product incorporated in the equipment
becomes faulty.
・Transportation equipment (mounted on cars and ships) ・Trunk communications equipment
・Traffic-signal control equipment ・Gas leakage detectors with an auto-shut-off feature
・Disaster prevention / security equipment ・Safety devices, etc
Do not use products in this Instruction for the equipment requiring strict reliability such as the following
and equivalents to strategic equipment (without limitation).
・Space equipment ・Aeronautic equipment ・Nuclear control equipment
・Submarine repeater equipment ・Medical equipment, etc
i
Cautions

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
All rights reserved. No part of this Instruction may be reproduced without permission in writing from
Fuji Electric Co., Ltd.
If you have any question about any portion in this Instruction, ask Fuji Electric Co., Ltd. or its sales agents
before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused
by any use of the products not in accordance with instructions set forth herein.
ii

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
Contents
Chapter 1 Precautions during transportation and storage 1-1
iii
Chapter 2 Precautions in unpacking 2-1
1.
Removing the pin from the tube
2
-1
2.
Picking out the Small IPM from the stick
2
-3
Chapter 3 Through hole design for PCB 3-1
Chapter 4 Spacer 4-1
Chapter 5 Compound application 5-1
Chapter 6 Heat sink selection 6-1
1.
Selection
6
-1
2.
Shape
6
-2
3.
Mounting
(tightening) 6
-2
Chapter 7 Soldering to Printed Circuit Board 7-1
Chapter 8 Appendix 8-1
1.
Stencil mask drawing for thermal compound application (recommended)
8
-1
2.
Isolation distance of heat sink
8
-2

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•The Small IPM should be stored at a normal temperature of 5 to 35℃and relative humidity of 45 to
75%, otherwise the product might be corroded or destructed, or it’s life time might be shorter. If the
storage area is very dry, a humidifier may be required. In such a case, use only deionized water or
boiled water, since the chlorine in tap water may corrode the leads.
•In case of storage environment with rapid temperature changes, condensation will be occurred on
the surface of the Small IPM. In order to avoid the condensation, the Small IPM shall be stored in
steady temperature environment.
•The Small IPM should not stored or used in an environment where it is exposed to acids, organic
substances, or corrosive gas (hydrogen sulfide, sulfurous acid gas etc.) or in a dusty place.
•When stored, it is necessary to prevent external pressure to the Small IPM. Stacking that may
deform the outer box shall be avoid even when it is packed in the outer box.
•Transport the cardboard box with the appropriate side facing up. Otherwise, unexpected stress may
be applied to the Small IPM, which may cause bending of the terminals or distortion in the resin
package of the product. In addition, throwing or dropping the product can cause significant damage
to the product. Also, it is necessary to pay attention to rain and freezing to avoid wetting, as it may
cause damage or destruction. The environmental conditions such as temperature and humidity
during transportation described in the specifications shall be strictly observed.
•The Small IPM should be stored with the lead terminals remaining unprocessed. It is necessary to
avoid rusting etc. due to scratches during processing, resulting in poor soldering.
•The containers and bags for storing the Small IPM should be non-static or conductive.
•Under the above storage condition, use the Small IPM within one year.
1. Precautions during transportation and storage
This chapter describes the precautions during transportation and storage for the product (Small IPM).
1-1

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•The Small IPMs are packaged in tubes that are pinned at both ends.
•Remove the pin on one side to pick out the product from the tube.
•If the pin and the Small IPM are in contact with each other when removing the pin, a strong shock
might be applied to the product, which may cause deformation or damage to the Small IPM
terminals. Make a gap between the pin and the Small IPM when removing the pin.
•The recoil of removing the pins may cause deformation or damage to the terminals of the Small IPM,
so remove the pins with holding them.
•If the product falls out from the tube when removing the pins, it may cause a strong impact to the
product, causing the product terminals to be deformed or damaged. Remove the pin with the tube
opening facing up.
•It is recommended to use a remover (removal jig) to remove the pins. Page 2-2 shows how to
remove the pins using the remover.
2. Precautions in unpacking
This chapter describes the precautions in unpacking for the product (Small IPM).
2-1
1Removing the pin from the tube

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved. 2-2
③Insert the removal part of the remover into the gap between the pin and the tube. (See Fig. 2-4)
①Make a gap between the pin and the product. (See Fig. 2-1)
②Push the pointed end of the pin with your index finger, and make a gap between the pin and the
tube to insert the remover removal part as shown in Figure 2-2. (See Fig. 2-3)
Removal part
Fig. 2-2 Example of remover (removal jig)
Gap
Fig. 2-1 Gap between the pin and the Small IPM
Gap
Fig. 2-3 Gap between the pin and the tube
Fig. 2-6 Tube opening orientation
④Hold the pin with your finger and remove the pin with the tube opening facing up. (See Fig. 2-5, 2-6)
Insert the remover to reach to the
opposite side of the pin head
Fig. 2-4 Insert remover
Fig. 2-5 How to hold the pin
•Pin removing method using remover (removal jig)

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved. 2-3
2Picking out the Small IPM from the stick
•Since the elements installed in the Small IPM are extremely weak to electrostatic discharge,
appropriate ESD countermeasures are necessary in the assembly environment within the range
described in the specifications. In particular, when picking it out from the tube, it may cause the
most electrical damage to the product.
•When picking out the Small IPM, do not strongly collide the Small IPM with each other or touch the
Small IPM terminals to the tube. A strong impact on the Small IPM may cause deforming or damage
of the terminals of the Small IPM.

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
3. Through hole design for PCB
This chapter describes the through hole design for PCB attaching to the product (Small IPM).
3-1
Figures 3-1 to 3-4 show examples of recommended through hole dimensions and through hole layout
designs.
•The through hole dimensions are the inner diameter after plating (dimension unit: mm).
•If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be
impaired. Also, if the land diameter is too large, solder bridges are likely to occur.
•The hole size and land size should be optimized as appropriate, taking into consideration the printed
circuit board processing accuracy and mounting method.
Fig. 3-4 Through hole layout with
zigzag pattern terminal
Fig. 3-1 Control side through hole
dimensions
Through hole
Land
Fig. 3-2 Power side through hole
dimensions
Through hole
Land
Fig. 3-3 Through hole layout with standard
terminals and short terminals
F2 short terminal 29.2 Standard terminal 29.4

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•When using spacer between the PCB and the Small IPM for alignment during soldering to printed
circuit board, it is recommended to support the Small IPM at the hatched area as shown in Fig. 4-1.
•The spacer should be made of resin or metal, and select a material that does not cause
contamination or corrosion.
4. Spacer
This chapter describes the spacer for PCB attaching to the product (Small IPM).
4-1
Fig. 4-1 Spacer installation position (recommended)

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
5. Compound application
This chapter describes the Compound application for the product (Small IPM).
5-1
•In order to obtain effective heat dissipation, thermal compound with good thermal conductivity
should be applied uniformly with +50μm thickness on the contacting surface between the Small IPM
and heat sink. Refer to the following Fig. 5-1 for an application position and application quantity.
•The recommended compound shown below is an example. When using a hard compound material,
check the spread of the compound after mounting.
•For the stencil mask used when applying the thermal compound, refer to the appendix at the end of
this document.
•In the case of liquid cooling, the difference between the heat sink temperature and the temperature
inside the Small IPM (temperature gradient) becomes large. When fixing the Small IPM, secure a
thermal compound coating amount that can absorb the strain due to the difference in thermal
expansion when the temperature gradient is large.
•In the case of a multiple structure heat sink, the number of fastening parts increases and heat
transfer (diffusion) becomes uneven. Therefore, it is necessary to design for suppression the
distortion, such as securing the thermal compound coating amount in consideration of the generated
distortion.
A
B
DETAIL A DETAIL B
14.0 ±0.5
14x2.54 (=35.56)
13.0
3.8(min.)
43.0
35.0
26.0
16-0.6
8-0.6
18x1.778(=32.004)
±0.5
±0.5
±0.5
4.2
1.6 ±0.5
±0.5
3.2 ±0.5
14.0 14.7
29.4±0.5
±0.5 ±0.5
1.8
1.5
3.7
±0.1
±0.5
0.40
2.6±0.5
10.6±0.5
1.8±0.1
5.2(min)
2.4 ±0.5
1.0 ±0.1
3.2
3.2
±0.5
±0.5
±0.5
5.2
±0.5
±0.54x1.2
1.0
4.5
8.7 ±0.5
±0.5
15.6
31.2 ±0.5
±0.5
3579101112131415161718192021
22 23 24 26 28 30 32 36
37
38
39
40
±0.1
Fig. 5-1 Recommended an application position and application quantity
Recommended:
Product name :Shin-Etsu Chemical Co., Ltd. Oil compound G-747
Application position : 7.5mm apart from the edge of aluminum base
Application quantity : 0.03g
Thermal compound
7.5mm 7.5mm
Center line of
Aluminum base

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
6. Heat sink selection
This chapter describes the heat sink selection for the product (Small IPM).
6-1
•Please make sure that the junction temperature Tj should not exceed the maximum junction
temperature Tj(max) for safe operation. Cooling device (heat sink) should be designed to ensures
that Tj is always below Tj(max).
•If the IGBT or FWD junction temperature is higher than Tj(max), it might cause damage to the chips.
Some types of the Small-IPM have the over-heating (OH) protection function which works when the
IGBT junction temperature exceeds Tj(max). However, if the temperature rises too quickly, the OH
protection might not work.
•When selecting a cooling device (heat sink), please verify the chip temperature Tj by measuring Tc
at the position shown in Figure 6-1, and calculating the Tj from device power dissipation and
thermal resistance. In addition, this product has a built-in temperature sensor, and Tj can be
confirmed by the analog voltage that is output according to the LVIC chip temperature. Please refer
to it when selecting the cooling device (heat sink).
•For more detail design, please refer “IGBT Module Application Manual (REH984c)” and “Small IPM
Application Manual (MT6M12343)”.
1Selection
Approx.4.5
Approx.0.7
Approx. 7.0
TOP VIEWSIDE VIEW
Heat sink side
Tc measurement position
Temperature sensor position
Approx. 6.3
Fig. 6-1 Temperature sensing and Tc measurement points

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved. 6-2
•When mounting the Small IPM to a heat sink, the following fastening order is recommended.
Uneven fastening due to excessive torque might lead to destruction or degradation of the chip.
•Standard: Metric screw JIS B 1111
•Screw length: 8mm
•Screw head shape: Pan shape (head diameter 5.5 mm)
•Material: Stainless
•Use flat washers (JIS B1258 recommended). Washer head type screws can be used as well.
•The mounting (tightening) that support the load of structure such as heat sink or printed circuit
board by Small IPM should be avoided.
•When mounting this Small IPM together with other components to the heat sink, ensure the flatness
of the components mounted on the board before mounting.
3Mounting (tightening)
2Shape
Fig. 6-2 The measurement point of heat sink flatness
100mm
External Heat sink
+
-
•As shown in Fig. 6-2, the heat sink flatness should be from 0μm/100mm to +100μm/100mm, and
the surface roughness (Rz) should be less than 10 μm.
•If the heat sink surface is concave, a gap occurs between the heat sink and the IPM, leading to
deterioration of cooling efficiency.
•If the flatness is +100 μm or more, the aluminum base of the IPM is deformed and cracks could
occur in the internal isolating substrates.
A
B
DETAIL A DETAIL B
14.0 ±0.5
14x2.54 (=35.56)
13.0
3.8(min.)
43.0
35.0
26.0
16-0.6
8-0.6
18x1.778(=32.004)
±0.5
±0.5
±0.5
4.2
1.6 ±0.5
±0.5
3.2 ±0.5
14.0 14.7
29.4±0.5
±0.5 ±0.5
1.8
1.5
3.7
±0.1
±0.5
0.40
2.6±0.5
10.6±0.5
1.8±0.1
5.2(min)
2.4 ±0.5
1.0 ±0.1
3.2
3.2
±0.5
±0.5
±0.5
5.2
±0.5
±0.54x1.2
1.0
4.5
8.7 ±0.5
±0.5
15.6
31.2 ±0.5
±0.5
3579101112131415161718192021
22 23 24 26 28 30 32 36
37
38
39
40
±0.1
Fig. 6-3 Recommended screw fastening procedure
Recommended:
Pre-screwing: 1 2
Final screwing: 2 1
Note: the pre-screwing torque is set to 30% of the maximum torque rating.
1 2

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•The device temperature during soldering might exceed the maximum storage temperature. To
prevent damage to the device and to ensure reliability, please use the following soldering
temperature.
7. Soldering to Printed Circuit Board
This chapter describes the soldering to printed circuit board for the product (Small IPM).
7-1
Methods Soldering Temp. & Time Note
a Solder dipping / Soldering iron 260±5℃, 10±1sec.
b Solder dipping / Soldering iron 350±10℃, 3.5±0.5sec.
Table 7.1 Soldering temperature and duration
•A stopper is provided on the terminal to prevent the immersion depth of the terminal from coming
too close to the product body. Use this stopper to secure the required distance from the printed
circuit board and prevent the product body from being immersed in the solder bath during flow
soldering.
•It is not recommended to reuse the device after it is removed from the circuit board. There is a
possibility that the removed device was subjected to thermal or mechanical damage during the
removal process.

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
8. Appendix
This chapter describes the appendix for mounting of the product (Small IPM).
8-1
1Stencil mask drawing for thermal compound application (recommended)
Package No. : P633A
Metal mask thickness: T = 150 μm
(Target compound thickness: T = approx. 75 μm)
※ : Aluminum base centerline
This figure shows the view from the aluminum base surface.
Fig. 8-1 Stencil mask drawing for thermal compound application (recommended)

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•When this product is mounted on a flat heat sink, there is a possibility that discharge will occur
between the lead terminals and the heat sink, so the isolation voltage will be 1.5 kVrms.
•By ensuring a creepage distance of 2.5 mm or more between the lead terminals and the heat sink,
the isolation voltage will be 2.5 kVrms.
•By processing the heat sink as follows, it is possible to secure a clearance distance of 5.08 mm or
more in accordance with UL508C table 36.3 standard (240 VAC / with surge protection device
(SPD)).
8-2
2Isolation distance of heat sink
Secure a creepage distance and clearance of 5.08 mm or more
IPM
Heat-sink
Heat-sink
3.5mm (min.)
1.70mm
(min.)
1.70mm
(min.)
3.5mm
(min.)
7.7mm
(min.)
IPM’s creepage
distance
INV. side lead Ctrl. side lead
Fig. 8-2 Isolation distance of heat sink