Fuji Electric P633A Series User guide

MT6M15589
Mounting Instruction
Fuji Small IPM (Intelligent Power Module)
P633A series
6MBP**XS*060-50
15th of June, 2020 Rev.0

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
This Instruction contains the product specifications, characteristics, data, materials, and structures as
of May 2020. The contents are subject to change without notice for specification changes or other reason.
When using a product listed in this Instruction be sure to obtain the latest specifications.
All applications described in this Instruction exemplify the use of Fuji’s products for your reference only.
No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual
property right owned by Fuji Electric Co., Ltd. Is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes
no representation or warranty, whether express or implied, relating to the infringement or alleged infringement
of other’s intellectual property rights which may arise from the use of the applications described herein.
Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of
semiconductor products may become faulty. When using Fuji Electric semiconductor products in your
equipment, you are requested to take adequate safety to prevent the equipment from causing a physical
injury, fire, or other problem if any of the products become faulty. It is recommended to make your design
failsafe, flame retardant, and free of malfunction.
The products introduced in this Instruction are intended for use in the following electronic and electrical
equipment which has normal reliability requirements.
・Inverter for Compressor motor, or fan motor for Room Air Conditioner
・Inverter for Compressor motor for heat pump application, etc
If you need to use a product in this Instruction for equipment requiring higher reliability than normal,
such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior
approval. When using these products for such equipment, take adequate measures such as a backup
system to prevent the equipment from malfunctioning even if a Fuji’s product incorporated in the equipment
becomes faulty.
・Transportation equipment (mounted on cars and ships) ・Trunk communications equipment
・Traffic-signal control equipment ・Gas leakage detectors with an auto-shut-off feature
・Disaster prevention / security equipment ・Safety devices, etc
Do not use products in this Instruction for the equipment requiring strict reliability such as the following
and equivalents to strategic equipment (without limitation).
・Space equipment ・Aeronautic equipment ・Nuclear control equipment
・Submarine repeater equipment ・Medical equipment, etc
i
Cautions

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
All rights reserved. No part of this Instruction may be reproduced without permission in writing from
Fuji Electric Co., Ltd.
If you have any question about any portion in this Instruction, ask Fuji Electric Co., Ltd. or its sales agents
before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused
by any use of the products not in accordance with instructions set forth herein.
ii

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
Contents
Chapter 1 Precautions during transportation and storage 1-1
iii
Chapter 2 Precautions in unpacking 2-1
1.
Removing the pin from the tube
2
-1
2.
Picking out the Small IPM from the stick
2
-3
Chapter 3 Through hole design for PCB 3-1
Chapter 4 Spacer 4-1
Chapter 5 Compound application 5-1
Chapter 6 Heat sink selection 6-1
1.
Selection
6
-1
2.
Shape
6
-2
3.
Mounting
(tightening) 6
-2
Chapter 7 Soldering to Printed Circuit Board 7-1
Chapter 8 Appendix 8-1
1.
Stencil mask drawing for thermal compound application (recommended)
8
-1
2.
Isolation distance of heat sink
8
-2

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•The Small IPM should be stored at a normal temperature of 5 to 35℃and relative humidity of 45 to
75%, otherwise the product might be corroded or destructed, or it’s life time might be shorter. If the
storage area is very dry, a humidifier may be required. In such a case, use only deionized water or
boiled water, since the chlorine in tap water may corrode the leads.
•In case of storage environment with rapid temperature changes, condensation will be occurred on
the surface of the Small IPM. In order to avoid the condensation, the Small IPM shall be stored in
steady temperature environment.
•The Small IPM should not stored or used in an environment where it is exposed to acids, organic
substances, or corrosive gas (hydrogen sulfide, sulfurous acid gas etc.) or in a dusty place.
•When stored, it is necessary to prevent external pressure to the Small IPM. Stacking that may
deform the outer box shall be avoid even when it is packed in the outer box.
•Transport the cardboard box with the appropriate side facing up. Otherwise, unexpected stress may
be applied to the Small IPM, which may cause bending of the terminals or distortion in the resin
package of the product. In addition, throwing or dropping the product can cause significant damage
to the product. Also, it is necessary to pay attention to rain and freezing to avoid wetting, as it may
cause damage or destruction. The environmental conditions such as temperature and humidity
during transportation described in the specifications shall be strictly observed.
•The Small IPM should be stored with the lead terminals remaining unprocessed. It is necessary to
avoid rusting etc. due to scratches during processing, resulting in poor soldering.
•The containers and bags for storing the Small IPM should be non-static or conductive.
•Under the above storage condition, use the Small IPM within one year.
1. Precautions during transportation and storage
This chapter describes the precautions during transportation and storage for the product (Small IPM).
1-1

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•The Small IPMs are packaged in tubes that are pinned at both ends.
•Remove the pin on one side to pick out the product from the tube.
•If the pin and the Small IPM are in contact with each other when removing the pin, a strong shock
might be applied to the product, which may cause deformation or damage to the Small IPM
terminals. Make a gap between the pin and the Small IPM when removing the pin.
•The recoil of removing the pins may cause deformation or damage to the terminals of the Small IPM,
so remove the pins with holding them.
•If the product falls out from the tube when removing the pins, it may cause a strong impact to the
product, causing the product terminals to be deformed or damaged. Remove the pin with the tube
opening facing up.
•It is recommended to use a remover (removal jig) to remove the pins. Page 2-2 shows how to
remove the pins using the remover.
2. Precautions in unpacking
This chapter describes the precautions in unpacking for the product (Small IPM).
2-1
1Removing the pin from the tube

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved. 2-2
③Insert the removal part of the remover into the gap between the pin and the tube. (See Fig. 2-4)
①Make a gap between the pin and the product. (See Fig. 2-1)
②Push the pointed end of the pin with your index finger, and make a gap between the pin and the
tube to insert the remover removal part as shown in Figure 2-2. (See Fig. 2-3)
Removal part
Fig. 2-2 Example of remover (removal jig)
Gap
Fig. 2-1 Gap between the pin and the Small IPM
Gap
Fig. 2-3 Gap between the pin and the tube
Fig. 2-6 Tube opening orientation
④Hold the pin with your finger and remove the pin with the tube opening facing up. (See Fig. 2-5, 2-6)
Insert the remover to reach to the
opposite side of the pin head
Fig. 2-4 Insert remover
Fig. 2-5 How to hold the pin
•Pin removing method using remover (removal jig)

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved. 2-3
2Picking out the Small IPM from the stick
•Since the elements installed in the Small IPM are extremely weak to electrostatic discharge,
appropriate ESD countermeasures are necessary in the assembly environment within the range
described in the specifications. In particular, when picking it out from the tube, it may cause the
most electrical damage to the product.
•When picking out the Small IPM, do not strongly collide the Small IPM with each other or touch the
Small IPM terminals to the tube. A strong impact on the Small IPM may cause deforming or damage
of the terminals of the Small IPM.

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
3. Through hole design for PCB
This chapter describes the through hole design for PCB attaching to the product (Small IPM).
3-1
Figures 3-1 to 3-4 show examples of recommended through hole dimensions and through hole layout
designs.
•The through hole dimensions are the inner diameter after plating (dimension unit: mm).
•If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be
impaired. Also, if the land diameter is too large, solder bridges are likely to occur.
•The hole size and land size should be optimized as appropriate, taking into consideration the printed
circuit board processing accuracy and mounting method.
Fig. 3-4 Through hole layout with
zigzag pattern terminal
Fig. 3-1 Control side through hole
dimensions
Through hole
Land
Fig. 3-2 Power side through hole
dimensions
Through hole
Land
Fig. 3-3 Through hole layout with standard
terminals and short terminals
F2 short terminal 29.2 Standard terminal 29.4

MT6M15589 © Fuji Electric Co., Ltd. All rights reserved.
•When using spacer between the PCB and the Small IPM for alignment during soldering to printed
circuit board, it is recommended to support the Small IPM at the hatched area as shown in Fig. 4-1.
•The spacer should be made of resin or metal, and select a material that does not cause
contamination or corrosion.
4. Spacer
This chapter describes the spacer for PCB attaching to the product (Small IPM).
4-1
Fig. 4-1 Spacer installation position (recommended)