GIGAIPC QBiX-Pro-TGLA1135G7H-A2 User manual

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
1www.gigaipc.com
QBiX-Pro-TGLA1135G7H-A2
(QP-1135A-SI)
QBiX-Pro-TGLA1115G4EH-A2
(QP-1115A-SI)
QBiX-Pro Industrial Embedded System
Quick Start Guide

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Copyright Notice
This document is copyrighted, 2022. All rights are reserved. The
original manufacturer reserves the right to make improvements to the
products described in this manual at any time without notice.
No part of this manual may be reproduced, copied, translated, or
transmitted in any form or by any means without the prior written
permission of the original manufacturer. Information provided in
this manual is intended to be accurate and reliable. However, the
original manufacturer assumes no responsibility for its use, or for any
infringements upon the rights of third parties that may result from its
use.
The material in this document is for product information only and
is subject to change without notice. While reasonable efforts have
been made in the preparation of this document to assure its accuracy,
GIGAIPC assumes no liabilities resulting from errors or omissions in this
document, or from the use of the information contained herein.
GIGAIPC reserves the right to make changes in the product design
without notice to its users.

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
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Acknowledgement
All other products’ name or trademarks are properties of their
respective owners.
• AMD is trademark of Advanced Micro Devices.
• Microsoft Windows is a registered trademark of Microsoft Corp.
• Intel, Pentium, Celeron, and Xeon are registered trademarks of Intel
Corporation
• Core, Atom are trademarks of Intel Corporation
• ITE is a trademark of Integrated Technology Express, Inc.
• IBM, PC/AT, PS/2, and VGA are trademarks of International Business
Machines Corporation.
All other product names or trademarks are properties of their
respective owners.

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Packing List
Before setting up your product, please make sure the following items
have been shipped:
Item Quantity
System kit 1
HDD screw, M3 x 8L (25KSG-130081-K1R) 4
SATA Cable (25CRI-070000-S9R) 1
Exsiccator (10g) 1
Thermal pad for Memory (25ST3-200086-T5R) 1
Power Cord : Optional (by region) 1
PSU ADP 19.5V 135W 100-240VAC (25EP4-201352-
C1S) 1
If any of these items are missing or damaged, please contact your
distributor or sales representative immediately.

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
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About this Document
This User’s Manual contains all the essential information, such as
detailed descriptions and explanations on the product’s hardware
and software features (if any), its specifications, dimensions, jumper/
connector settings/definitions, and driver installation instructions (if
any), to facilitate users in setting up their product.
Users may refer to the GIGAIPC.com for the latest version of this
document.

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Safety Precautions
Please read the following safety instructions carefully. It is advised that
you keep this manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the
device.
3. Position the power cord so that people cannot step on it. Do
not place anything over the power cord.
4. Always completely disconnect the power before working on the
system’s hardware.
5. No connections should be made when the system is powered
as a sudden rush of power may damage sensitive electronic
components.
6. If the device is not to be used for a long time, disconnect it from
the power supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before
cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray
detergents.
9. Make sure the device is installed near a power outlet and is
easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent
falls
12. Do not cover the openings on the device to ensure optimal heat
dissipation.

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
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13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is
running
15. Never pour any liquid into the openings. This could cause fire or
electric shock.
16. As most electronic components are sensitive to static electrical
charge, be sure to ground yourself to prevent static charge
when installing the internal components. Use a grounding
wrist strap and contain all electronic components in any static-
shielded containers.
17. If any of the following situations arises, please the contact our
service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described
in this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED
ENVIRONMENT WITH TEMPERATURES BEYOND THE DEVICE’S
PERMITTED STORAGE TEMPERATURES (SEE CHAPTER 1) TO
PREVENT DAMAGE.

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FCC Statement
This device complies with Part 15 FCC Rules. Operation
is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device
must accept any interference received including
interference that may cause undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with
the same or equivalent type recommended by the manufacturer. Dispose of used
batteries according to the manufacturer’s instructions and your local government’s
recycling or disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le
constructeur. Recycler les batteries usées en accord avec les instructions du fabricant
et les directives gouvernementales de recyclage.
High Temperature Warning
(1) This equipment is intended to be used in
Restrict Access Location. The access can only be
gained by Skilled person or by Instructed person
who have been instructed about the metal chassis
of the equipment is so hot that Skilled person have
to pay special attention or take special protection.
Only authorized by well trained professional person can access the
restrict access location.
(2) External metal parts are hot!! Before touching it, special attention
or protection is necessary

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
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Table Contents
QBiX-Pro Industrial Embedded System 1
Quick Start Guide
Copyright Notice .......................................................................... 2
Acknowledgement ....................................................................... 3
Packing List................................................................................... 4
About this Document ................................................................... 5
Safety Precautions ....................................................................... 6
FCC Statement.............................................................................. 8
High Temperature Warning ......................................................... 8
Chapter 1 - Product Specifications 13
1.1 Specifications ............................................................... 15
Chapter 2 – QBiX-Pro-TGLA1135G7H-A2 (QP-1135A-SI) 17
QBiX-Pro-TGLA1115G4EH-A2 (QP-1115A-SI)
Industrial Embedded System Kit
2.1 Dimension .................................................................... 18
2.2 Getting Familiar with Your Unit..................................... 19
2.3 A) Wireless Module: How to safely install the Module
(Wireless Module inclusion may vary based on local
distribution) .................................................................. 21
2.4 B) Memory Installation: DDR4 SO-DIMM .................... 22
2.5 Antenna Installation (Antenna inclusion may vary based
on local distribution) .................................................... 23

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2.6 Cable Pin-define ........................................................... 24
2.7 Support ........................................................................ 25
2.8 Safety and Regulatory Information............................... 26
Chapter 3 – Hardware Information 27
3.1 Jumpers and Connectors ............................................. 28
3.2.1 SYS_FAN (System fan connector) ................................. 31
3.2.2 CPU_FAN (CPU fan connector) ..................................... 32
3.2.3 FUSB1, FUSB2 (USB2.0 headers) ................................... 33
3.2.4 AT_CN (AT/ATX power mode select jumper) .............. 34
3.2.5 JCOM1 (COM1 RI# pin RI#/5V/12V Select).................... 35
3.2.6 SATA0 (SATA 6Gb/s connector) ................................... 36
3.2.7 SATAPW0 (SATA 6Gb/s power connector) .................... 37
3.2.8 COM2, COM3, COM4 (Serial port header, ................... 38
RS-232/422/485)........................................................... 38
3.2.9 M2E (M.2 Slot, E-key, NGFF2230, WiFi & Bluetooth
module) ......................................................................... 39
3.2.10 MPCIE (Mini PCIe full size, support 3G/4G module) ..... 39
3.2.11 BATTERY (Battery cable Connector) ............................. 40
3.2.12 DC_IN (DC IN 1x4 pin power connector) .......................41
3.2.13 SYS_PANEL (Front panel header) .................................. 42
3.2.14 GPIO_CNT (General Purpose input/output header) ..... 43
3.2.15 FP_AUDIO (Front Audio connector) .............................. 44
3.2.16 PCIEX1 (PCIe Gen3 x1 connector)................................. 45

System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
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3.2.17 ME (ME Enable jumper) ................................................ 46
3.2.18 SPK_OUT (Speaker out connector) ............................... 47
3.2.19 BKL_CN (Back light brightness control header) ............ 48
3.2.20 LVDS (LVDS connector)................................................ 49
3.2.21 LSW (LVDS resolution jumper).................................... 50
3.2.22 M2M (M.2 Slot, SATA/PCIeX2, NGFF 2280) .................. 51
3.2.23 SODIMM1, SODIMM2 (DDR4 SO-DIMM Slot)............... 51
3.2.24 TPM (Trusted Platform Module Connector)................. 52
Chapter 4 – BIOS 53
4.1 Introduction .................................................................. 54
4.2 The Main Menu............................................................. 55
4.3 Advanced ...................................................................... 56
4.3.1 TPM Configuration........................................................ 57
4.3.2 SATA And RST Configuration......................................... 59
4.3.3 CPU Configuration ........................................................ 60
4.3.4 IT8786 Super IO Configuration ..................................... 61
4.3.5 Hardware Monitor ........................................................ 62
4.3.6 S5 RTC Wake Settings ................................................... 63
4.3.7 Network Stack Configuration........................................ 64
4.3.8 NVMe Configuration..................................................... 65
4.3.9 Offboard SATA Controller Configuration ...................... 66
4.3.10 Digital IO Port Configuration ........................................ 67

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4.4 Chipset .......................................................................... 68
4.5 Security ......................................................................... 69
4.6 Boot............................................................................... 72
4.7 Save & Exit .................................................................... 73

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System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
Chapter 1
Chapter 1 - Product Specifications

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178
125
134.65
52.7
56.7

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System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
1.1 Specifications
System QBiX-Pro-TGLA1135G7H-A2
(QP-1135A-SI)
QBiX-Pro-TGLA1115G4EH-A2
(QP-1115A-SI)
Dimension System Size : 178W x 125D x 52.7H (mm)
CPU
Intel® Core™ i5-1135G7 Processor
10nm SuperFin, 4 cores,
8 threads, up to 4.2 GHz
Intel® Core™ i3-1115G4E
Processor
10nm SuperFin, 2 cores,
4 threads, up to 3.9 GHz
Chipset SoC
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual channel DDR4 3200 MHz memory modules
Ethernet 2 x GbE LAN Ports (Intel® I219V and Intel® I211AT)
Graphic
support
Integrated Graphics Processor -
Intel® Iris® Xᵉ Graphics :
2 x HDMI 2.0 ports,
supporting a maximum resolution
of 4096x2304 @60Hz
(2 independent display outputs)
Integrated Graphics Processor -
Intel® UHD Graphics for 11th Gen
Intel® Processors :
2 x HDMI 2.0 ports,
supporting a maximum resolution of
4096x2304 @60Hz
(2 independent display outputs)
Audio Realtek® Audio Codec
Storage 1 x 2.5” HDD/SSD (SATA 6Gb/s)
Expansion
Slots
1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB 2.0) -- support
3G/4G module
Front I/O
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 2x1
2 x HDMI
1 x Power button with LED
1 x HDD LED
1 x COM Port (RS-232/422/485 & RI/5V/12V)
Rear I/O
2 x USB 2.0
2 x COM Ports (RS-232/422/485)
1 x GPIO (8 bits)
1 x Headphone Jack
1 x Screw Type DC Jack
Side I/O 2 x External Antenna Holes (Optional)

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System QBiX-Pro-TGLA1135G7H-A2
(QP-1135A-SI)
QBiX-Pro-TGLA1115G4EH-A2
(QP-1115A-SI)
TPM —
Power +9V~36VDC (Adapter 19.5V/135W)
Operation
Temperature
Operating temperature: 0°C to 50°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Vibration
During
Operation
Operation:
IEC 60068-2-64, 5 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, with
SSD/M.2 2280
Non-operation:
IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During
Operation Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD
Packaging
Content
Carton size: 505 x 333 x 231 (mm)
Packing Capacity: 5pcs
Including:
Screw I Head for 2.5” HDD M3x8L x 4 (P/N: 25KSG-130081-K1R)
Thermal Pad for Memory x 1 (P/N: 25ST3-200086-T5R)
SATA Cable x 1 (P/N: 25CRI-070000-S9R)
Power Cord : Optional (by region)
PSU ADP 19.5V 135W 100-240VAC x 1 (P/N: 25EP4-201352-C1S)
Order
Information
System: 6BQP1135AMR-SI (Box
packing)
System: 6BQP1115AMR-SI (Box
packing)

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System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
Chapter 2
Chapter 2 – QBiX-Pro-TGLA1135G7H-A2 (QP-1135A-SI)
QBiX-Pro-TGLA1115G4EH-A2 (QP-1115A-SI)
Industrial Embedded System Kit

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2.1 Dimension
178
125
134.65
52.7
56.7

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System - QBiX-Pro Series QBiX-Pro-TGLA1135G7H_1115G4EH-A2
2.2 Getting Familiar with Your Unit
[Rear Side]
[Front Side]
[Right Side]
[Left Side]
4 x USB 3.2 Gen 2x1
2 x HDMI
1 x Power button with LED
2 x USB 2.0
2 x COM Ports
(COM2 & COM3, RS-232/422/485)
1 x Headphone Jack
1 x Screw Type
DC Jack
1 x GPIO (8-bits)
2 x Antenna (Optional)
2 x Antenna (Optional)
1 x COM Port (COM1, RS-232/422/485 & RI/5V/12V)
1 x HDD LED
2 x RJ45 LAN Ports
1 x Antenna (Optional)

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[Install]
[Bottom PCB Side]
* Before opening the case, make
sure to unplug the power cord.
* Before Connecting the power,
make sure to fasten the case
securely.
Information
A2 x DDR4 SO-DIMM sockets, DDR4
3200 MHz, Max. Capacity 64 GB
B1 x Mini PCIe slot (PCIe x1 +
USB2.0) with SIM Slot
Information
C1 x M.2 slot (Support NGFF-2280
SATA)
D1 x M.2 slot (Support NGFF-2230
WiFi/BT)
E support 2.5’’ Hard drive/SSD
A
B
C
E
D