
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on card 2, and then remove card 2.
3. Unscrew the screws on card 3, and then remove card 3.
4. Unscrew the screws on filler panel 4, and then remove filler panel 4.
5. Unscrew the screws on guide rail 5, and then remove guide rail 5.
6. Unscrew the screws on cover 6, and then remove cover 6.
7. Remove all of the inner cables.
8. Unscrew the screws on bracket 7 and remove bracket 7.
9. Unscrew the screws on power supply 8, and then remove power supply 8.
10. Unscrew the screws on PCB 9, and then remove PCB 9.
11. Remove PCB 10.
12. Unscrew the screws on PCB 11, and then remove PCB 11.
13. Unscrew the screws on PCB 12, and then remove PCB 12.
14. Unscrew the screws on PCB 16, and then remove PCB 16.
15. Unscrew the screws on PCB 17, and then remove PCB 17.
16. Unscrew the screws on PCB 15, and then remove PCB 15.
17. Unscrew the screws on PCB 14, and then remove PCB 14.
18. Remove all of the labels.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).