HP ProLiant BL660c Gen 9 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP ProLiant BL660c Gen 9
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
9
Batteries
All types including standard alkaline and lithium
coin or button style batteries
3
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
6
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Torx driver
T10
Description #2: Torx driver
T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press the latch to remove top cover from chassis.
2. Locate the battery on the system board. Push the lock area of battery holder and remove the battery by hand.
3. Press the latch and rotate the handle to remove the BROC card from MB.
4. Remove megacell from left baffle and right baffle.
5. Remove the left baffle and mid baffle and right baffle from system.
6. Rotate the retention structure and remove the MEZZ card connectors from MB(if MEZZ cards installed).
7. Loose screws of MEZZ Card and remove the MEZZ frame.
8. Remove BLOM card from MB(if BLOM card installed).
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1
Attachment 1 –System Board Battery
Attachment 2 –Mega cell

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Attachment 2