HP 5130 48G 4SFP+ XI Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE 5130 48G 4SFP+ XI 1-slot Switch(JM051A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Tool Description
Tool Size (if
applicable)
Phillips screwdriver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws and remove common mout angle component 4, power 1 or blank panel 1, fan 2, blank panel 3.
2. Unscrew the screws and remove top cover 5.
3. Remove label 5-2 from top cover 5-1.
4. Unscrew the screws and remove air deflector panel 6.
5. Remove fan connector 7 from bottom shell 11.
6. Unscrew the screws and remove pcb 8 from pcb 10.
7. Remove lamp guide 9 from pcb 10.
8. Unscrew the screws and remove pcb 10 from bottom shell 11.
9. Remove film 12 from bottom shell 11.
10. Unscrew the screws and remove hexagon stud 13 from pcb 10.
11. Remove heat sink mounting kit, then remove heat sink 10-2 from pcb 10-1.
12. Remove shading foam 14 from pcb 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 1 Treatments to the product Figure 2 Remove the top cover
Figure 3 Treatments to the product
Figure 4 Treatments to the pcb 10 Figure 5 Treatments to the pcb 8