HP ProCurve 520wl Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP ProCurve Wireless Access Point 520wl (J8133A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
0 Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
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Components, parts and materials containing
radioactive substances 0

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexnut driver 5mm
Philips Screw Driver #2
Flat head screw driver Small
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove base metal plate if attached by sliding it as shown in the fig. #1
2. Disconnect and remove power adapter if present as shown in fig. #2.
3. Remove plastic cover by pulling it away from the metal chassis as shown in fig. #3
4. Remove the 4 screws from the metal chassis by using Philips screw driver #2 shown in fig. #4
5. Remove the 4 hex nut screws holding the PCB by using hex nut driver, shown in fig. #5
6. Remove PCB from the chassis, fig. #6
7. Pry open the power adapter from the side with a flat-head screw driver to remove PCA.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Fig.1 Separate metal base Fig. 2 Disconnect PA and Fig. 3 Pull the unit from plastic case
by sliding from unit pull out from case
Fig. 4 Remove 4 screws Fig. 5 Remove hex nuts Fig. 6 Remove PCA.
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