HPE Primera 6 Series Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Storage
Marketing Name / Model
[List multiple models if applicable.]
HPE Primera 6xx Storage Controllers (600, 630, 650, 670)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Nodes =1 ea
Power supply =1 ea
IOM = 1 ea
Midplanes =1 ea
Temp sensor boards = 1ea
1 per node
1 per
power
supply
1 per IOM
1 per
Enclosure
1 per temp
sensor
Batteries
All types including standard alkaline and lithium
coin or button style batteries : 1EA Coin cell in
Node module; Up to 4 Li ion battery pack in Power
Cooling Battery Module
2 Li Ion per
2Node
4 Li Ion per
4Node
1 Coin per
node
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
PCV insulation on external power cords.
0
Gas Discharge Lamps
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screw driver
#0,#1, #2
Pry Bar
Small
Torx Driver
T10, T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove SFP/Transceivers from HBA’s if present:
2. Use thumb screw on installed HBA’s to remove from controllers.
3. Remove HBA PCBA from HBA frame.
4. Pull release handle on Node(s) to remove from node enclosure.
5. Remove top cover by depressing the latches on each side of the nodes
6. Remove air flow dividers if present and heat sync/s from PCA with a T10 Torx driver and pry bar if needed.
7. Remove processor/s from the PCA.
8. Remove DIMM’s and blanks from the PCA.
9. Remove coin battery from PCA and recycle according to local government rules.
10. Remove SAS connector daughter card from frame using a phillips screw driver.
11. Remove PCBA from the frame using a Phillips screw driver.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
Remove HBA from node:
Remove top cover of node:
Remove boot drive/s, DIMM’s, Processor/s and air baffles. Nodes may have different amounts of boot drives, DIMM’s and Processors.
.

MF877-00 Page 4
Template Revision A
HPE instructions for this template are available at MF877-01
Remove PCA from sheet metal frame. All phillips screws must be removed.
Remove SAS port riser card from Sheetmetal base. Phillips screws must be removed.
Remove Battery