HTCCONFIDENTIAL2
IS-5344-01-R3
1. Introduction.........................................................................................................................错误！未定义书签。
1.1 Product Features............................................................................................................ 误！未定义书签。
1.2 Product overview............................................................................................................ 误！未定义书签。
1.3 ProductTips................................................................................................................... 误！未定义书签。
2. Device Disassemblingand AssemblingProcedure.....................................................................................15
2.1 Toollist......................................................................................................................................................15
2.2 Disassemblingprocedure..........................................................................................................................16
2.3 Assembling procedure...............................................................................................................................24
2.4 Repairorassemblytips.................................................................................................. 误！未定义书签。
2.5 Unitlabel location explanation......................................................................................... 误！未定义书签。
3. ROMRe-flashProcedure....................................................................................................错误！未定义书签。
3.1 Latest ROMversion inquiry............................................................................................. 误！未定义书签。
3.2 ROMupgrade thruRUU(Re-flashUpgrade Utility)......................................................... 误！未定义书签。
3.3 RomImage upgrade thruSDcard................................................................................... 误！未定义书签。
4. DIAGNOSTICPROGRAM...............................................................................................................................41
4.1 Diagnosticmode testing.................................................................................................. 误！未定义书签。
4.2 OSMode Testing.......................................................................................................................................50
4.3 WriteUnitS/NtoDeviceviaASP_PC_Agent.............................................................................................55
4.4 Hardwarecalibration..................................................................................................................................59
5. Power measurementtest...............................................................................................................................62
5.1 Mainboardleakage currentTest Procedure...............................................................................................62
5.2 Battery rundowntest procedure.................................................................................................................66
6. CosmeticInspection Criteria.........................................................................................................................67
6.1 Classesdefinition of inspectivearea..........................................................................................................67
6.2 Displayinspection...................................................................................................................................... 69
6.3 Mainunitinspection...................................................................................................................................70
7. GenericSpare PartListandPhotos..............................................................................................................73
7.1 SPLforRepair...........................................................................................................................................73
7.2 BoardLevel2.5Repairs............................................................................................................................78
7.3 FRU M/Badditionalpartslocation..............................................................................................................81
8. RFAntennaSpecification..............................................................................................................................82
