Huawei ME909 Series Installation instructions

HUAWEI ME909 Series Mini PCIe Module
Hardware Guide
Issue
0.1
Date
2013-06-09

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HUAWEI ME909 Series Mini PCIe Module
Hardware Guide
About This Document
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About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
0.1
2013-06-09
Creation
This is a draft version, and some chapters
are still with "TBD".

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Hardware Guide
Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram....................................................................................................................... 9
3 Description of the Application Interfaces..............................................................................10
3.1 About This Chapter......................................................................................................................... 10
3.2 Mini PCIe Interface......................................................................................................................... 10
3.3 Power Sources and Grounds......................................................................................................... 14
3.4 Power Supply Time Sequence....................................................................................................... 15
3.5 WAKE# Signal................................................................................................................................ 16
3.6 RESIN_N Signal............................................................................................................................. 16
3.7 W_DISABLE# Signal...................................................................................................................... 18
3.8 LED_WWAN# Signal...................................................................................................................... 18
3.9 USB Interface................................................................................................................................. 18
3.10 USIM Card Interface .................................................................................................................... 19
3.10.1 Overview.............................................................................................................................. 19
3.10.2 Circuit Recommended for the USIM Card Interface............................................................ 20
3.11 Audio Interface.............................................................................................................................. 21
3.12 RF Antenna Connector................................................................................................................. 22
3.13 Reserved Pins.............................................................................................................................. 23
3.14 NC Pins........................................................................................................................................ 23
4 RF Specifications.........................................................................................................................25
4.1 About This Chapter......................................................................................................................... 25
4.2 Operating Frequencies................................................................................................................... 25
4.3 Conducted RF Measurement......................................................................................................... 26
4.3.1 Test Environment................................................................................................................... 26
4.3.2 Test Standards....................................................................................................................... 26
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 26
4.4.1 Conducted Receive Sensitivity.............................................................................................. 26
4.4.2 Conducted Transmit Power................................................................................................... 28
4.5 Antenna Design Requirements ...................................................................................................... 29

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4.5.1 Antenna Design Indicators..................................................................................................... 29
4.5.2 Interference ........................................................................................................................... 31
4.5.3 GSM/WCDMA/GPS Antenna Requirements......................................................................... 31
4.5.4 Radio Test Environment ........................................................................................................ 32
5 Electrical and Reliability Features...........................................................................................34
5.1 About This Chapter......................................................................................................................... 34
5.2 Absolute Ratings ............................................................................................................................ 34
5.3 Operating and Storage Temperatures and Humidity...................................................................... 35
5.4 Electrical Features of USIM ........................................................................................................... 35
5.5 Electrical Features of Application Interfaces.................................................................................. 35
5.6 Power Supply Features.................................................................................................................. 36
5.6.1 Input Power Supply ............................................................................................................... 36
5.6.2 Power Consumption.............................................................................................................. 37
5.7 Reliability Features......................................................................................................................... 42
5.8 EMC and ESD Features................................................................................................................. 43
6 Mechanical Specifications.........................................................................................................45
6.1 About This Chapter......................................................................................................................... 45
6.2 Dimensions and Interfaces............................................................................................................. 45
6.3 Dimensions of the Mini PCI Express Connector............................................................................ 46
6.4 Specification Selection for Fasteners............................................................................................. 47
6.4.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 47
6.4.2 Removing the Mini PCIe Adapter from the Main Board ........................................................ 49
7 Certifications................................................................................................................................51
7.1 About This Chapter......................................................................................................................... 51
7.2 Certifications................................................................................................................................... 51
8 Safety Information......................................................................................................................52
8.1 Interference .................................................................................................................................... 52
8.2 Medical Device............................................................................................................................... 52
8.3 Area with Inflammables and Explosives......................................................................................... 52
8.4 Traffic Security................................................................................................................................ 53
8.5 Airline Security................................................................................................................................ 53
8.6 Safety of Children........................................................................................................................... 53
8.7 Environment Protection.................................................................................................................. 53
8.8 WEEE Approval.............................................................................................................................. 53
8.9 RoHS Approval............................................................................................................................... 53
8.10 Laws and Regulations Observance ............................................................................................. 54
8.11 Care and Maintenance................................................................................................................. 54
8.12 Emergency Call............................................................................................................................ 54
8.13 Regulatory Information................................................................................................................. 54
8.13.1 CE Approval (European Union)........................................................................................... 54

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8.13.2 FCC Statement.................................................................................................................... 55
9 Appendix A Circuit of Typical Interface................................................................................56
10 Appendix B Acronyms and Abbreviations..........................................................................57

HUAWEI ME909 Series Mini PCIe Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909 Series Mini PCIe Module, including ME909u-521,
ME909u-121 and ME909u-721 (hereinafter referred to as the ME909 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909 module.
Table 1-1 ME909 series product name
Product name
Description
State
ME909u-521
LTE Module for Europe.
Under development
ME909u-121
LTE Module for North America.
Planning
ME909u-721
LTE Module for Japan.
Planning

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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909 module and provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
Dimensions
Dimensions (L ×W ×H): 51 mm ×30.4 mm ×3.35 mm
Weight: about 12 g
Operating
Temperature
–20°C to +60°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.0 V–3.6 V (typical value is 3.3 V)
Application
Interface
(52-pin Mini
PCIe interface
One standard USIM(Universal Subscriber Identity Module) card
(Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
RESIN_N: Reset module
WAKE#: Wake up signal
W_DISABLE# Signal (the software version is planning.)

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Feature
Description
LED_WWAN#: Active-low LED signal indicating the state of the
module (the software is under development)
Antenna
connector
WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
GPS antenna connector x1
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME909 Mini PCIe Adapter. The
major functional unit of the Mini PCIe Adapter contains the following parts:
DCDC Circuit
LGA Module
Control signals
Antenna Connectors
Figure 2-1 Circuit block diagram of the ME909 module

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Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909
module, including:
Mini PCIe Interface
Power Sources and Grounds
Power Supply Time Sequence
WAKE# Signal
RESIN_N Signal
W_DISABLE# Signal
LED_WWAN# Signal
USB Interface
USIM Card Interface
Audio Interface
RF Antenna Connector
Reserved Pins
NC Pins
3.2 Mini PCIe Interface
The ME909 module uses a Mini-PCIe interface as its external interface. For details
about the module and dimensions, see “ 6.2 Dimensions and Interfaces”.

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Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIeAdapter.
Figure 3-1 Sequence of Mini-PCIe interface
Table 3-1 shows the pin definitions of the Mini PCIe Interface.
Table 3-1 Pin definitions of the Mini PCIe interface
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Min.
Typ.
Max.
1
WAKE#
WAKE#
O
Open collector
active low signal.
This signal is used
to wake up the host.
–0.3
-
-
2
3.3Vaux
VCC_3V3
P
3.3 V DC supply
rails from the PC
side.
3.0
3.3
3.6
3
COEX1
NC
-
Not connected
-
-
-
4
GND
GND
-
Ground
-
-
-
5
COEX2
NC
-
Not connected
-
-
-
6
1.5 V
NC
-
Not connected
-
-
-
7
CLKREQ#
NC
-
Not connected
-
-
-

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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Min.
Typ.
Max.
8
UIM_PWR
UIM_PWR
P
Power source for
the external USIM
card
-
1.8/2.85
-
9
GND
GND
-
Ground
-
-
-
10
UIM_DATA
UIM_DATA
I/O
External USIM data
signal
-
1.8/2.85
-
11
REFCLK-
NC
-
Not connected
-
-
-
12
UIM_CLK
UIM_CLK
O
External USIM clock
signal
-
1.8/2.85
-
13
REFCLK+
NC
-
Not connected
-
-
-
14
UIM_RESET
UIM_RESET
O
External USIM reset
signal
-
1.8/2.85
-
15
GND
GND
-
Ground
-
-
-
16
UIM_Vpp
NC
-
Not connected
-
-
-
17
Reserved
Reserved
-
Reserved
-
-
-
18
GND
GND
-
Ground
-
-
-
19
Reserved
Reserved
-
Reserved
-
-
-
20
W_DISABLE#
W_DISABLE#
-
The W_DISABLE#
signal is an active
low signal that when
asserted (driven
low) by the system
shall disable radio
operation.
The software
version is planning.
-
-
-
21
GND
GND
-
Ground
-
-
-
22
PERST#
RESIN_N
-
Reset module
Active-low
-
-
-
23
PERn0
NC
-
Not connected
-
-
-
24
3.3Vaux
VCC_3V3
P
3.3 V DC supply
rails from the PC
side.
3.0
3.3
3.6
25
PERp0
NC
-
Not connected
-
-
-

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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Min.
Typ.
Max.
26
GND
GND
-
Ground
-
-
-
27
GND
GND
-
Ground
-
-
-
28
1.5 V
NC
-
Not connected
-
-
-
29
GND
GND
-
Ground
-
-
-
30
SMB_CLK
NC
-
Not connected
-
-
-
31
PETn0
NC
-
Not connected
-
-
-
32
SMB_DATA
NC
-
Not connected
-
-
-
33
PETp0
NC
-
Not connected
-
-
-
34
GND
GND
-
Ground
-
-
-
35
GND
GND
-
Ground
-
-
-
36
USB_D-
USB_DM
I/O
USB signal D-
-
-
-
37
GND
GND
-
Ground
-
-
-
38
USB_D+
USB_DP
I/O
USB signal D+
-
-
-
39
3.3Vaux
VCC_3V3
P
3.3 V DC supply
rails from the PC
side.
3.0
3.3
3.6
40
GND
GND
-
Ground
-
-
-
41
3.3Vaux
VCC_3V3
P
3.3 V DC supply
rails from the PC
side
3.0
3.3
3.6
42
LED_WWAN#
LED_WWAN#
O
Active-low LED
signal indicating the
state of the card.
The software
feature is under
development and
don't support this
function now.
Drive strength: 10
mA
-
-
-
43
GND
GND
-
Ground
-
-
-
44
LED_WLAN#
NC
-
Not connected
-
-
-
45
Reserved
PCM_CLK
O
PCM interface clock
–0.3
1.8
2.1

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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Min.
Typ.
Max.
46
LED_WPAN#
NC
-
Not connected
-
-
-
47
Reserved
PCM_DOUT
O
PCM I/F data out
–0.3
1.8
2.1
48
1.5 V
NC
-
Not connected
-
-
-
49
Reserved
PCM_DIN
I
PCM I/F data in
–0.3
1.8
2.1
50
GND
GND
-
Ground
-
-
-
51
Reserved
PCM_SYNC
O
PCM interface sync
–0.3
1.8
2.1
52
3.3Vaux
VCC_3V3
P
3.3 V DC supply rail
from the PC side.
3.0
3.3
3.6
Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output. AI indicates pins for analog signal input.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Therefore, these pins should not be used.
3.3 Power Sources and Grounds
For the Mini PCIe Adapter, +3.3 Vaux is the only voltage supply that is available. The
input voltage is 3.3 V±9%, as specified by PCI Express Mini CEM Specifications 1.2.
Table 3-2 Power and ground specifications
Pin No.
Pin Name
Minimum
Typical
Maximum
2, 24, 39, 41 and 52
VCC_3V3
3.0 V
3.3 V
3.6 V
4, 9, 15, 18, 21, 26, 27,
29, 34, 35, 37, 40, 43,
and 50
GND
-
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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3.4 Power Supply Time Sequence
Power on sequence
Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low
will extend time for module startup.
Figure 3-2 Power on timing sequence
Parameter Remarks Time (Nominal value) Unit
TPD+ Power Valid to USB
D+ high 14 s
Power off Sequence
Cutting off 3.3 V will power off the module.
Figure 3-3 Power off timing sequence

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3.5 WAKE# Signal
WAKE# pin (the signal that the module uses to wake up the PC) supports software
control.
This signal is used for module to wake up the host. It is designed as an OC gate, so it
should be pulled up by the host and it is active-low.
When the module wakes up the host, the BB Chip hold 1s high-level-voltage pulse
and then module output low-level-voltage to wake the host.
Figure 3-4 Connections of the WAKE# pin
3.6 RESIN_N Signal
The RESIN_N pin is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when
3.3 V is applied and it is active-low.

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Figure 3-5 Connections of the RESIN_N pin
As the RESIN_N signal are relatively sensitive, it is recommended that you install a 10
nF to 0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In addition,
when you design a circuit on the PCB of the interface board, it is recommended that
the circuit length should not exceed 20 mm and that the circuit should be kept at a
distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to
wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module
may be reset due to interference.
The ME909 module supports hardware reset function. If the software of the ME909
module stops responding, you can reset the hardware through the RESIN_N signal as
shown inFigure 3-6 . When a low-level pulse is supplied through the RESIN_N pin, the
hardware will be reset.After the hardware is reset, the software starts powering on the
module and reports relevant information according to the actual settings. For example,
the AT command automatically reports ^SYSSTART.
Figure 3-6 Reset pulse timing
The RESIN_N pin must not be pulled down for more than 1s.
The RESIN_N pin is optional, which can be not connected.
The maximum Forward Voltage Drop of the diode used in the module is 0.6 V.

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3.7 W_DISABLE# Signal
The W_DISABLE# signal is provided to allow users to disable wireless
communications of the module.
The software version is planning.
3.8 LED_WWAN# Signal
ME909 provides a LED_WWAN# signal to indicate the RF status.
The ME909 module does not support this function because the software feature is
under development. The planning drive strength is10 mA.
External Circuits
Figure 3-7 shows the recommended circuits of the LED_WWAN# pin.According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R.
Figure 3-7 Driving circuit
3.9 USB Interface
The ME909 module is compliant with USB 2.0 protocol. The USB interface is powered
directly from the VBAT supply. The USB input/output lines are compatible with the
USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface.

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Description of the Application Interfaces
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Table 3-3 Definition of the USB interface
Pin No.
Pin Name
I/O
Description
DC Characteristics (V)
Min.
Typ.
Max.
36
USB_DM
I/O
USB signal D-
-
-
-
38
USB_DP
I/O
USB signal D+
-
-
-
According to USB protocol, for bus timing or electrical characteristics of ME909 USB
signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.
Figure 3-8 Recommended circuit of USB interface
3.10 USIM Card Interface
3.10.1 Overview
The ME909 module provides a USIM card interface complying with the ISO 7816-3
standard and supports both Class B and Class C USIM cards.
Table 3-4 USIM card interface signals
Pin
No.
Pin Name
I/O
Description
DC Characteristics (V)
Min.
Typ.
Max.
14
UIM_RESET
O
External USIM
reset signal.
-
1.8/2.85
-
12
UIM_CLK
O
External USIM
clock signal
-
1.8/2.85
-
10
UIM_DATA
I/O
External USIM
data signal
-
1.8/2.85
-

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Pin
No.
Pin Name
I/O
Description
DC Characteristics (V)
Min.
Typ.
Max.
8
UIM_PWR
P
Power source for
the external
USIM card
-
1.8/2.85
-
3.10.2 Circuit Recommended for the USIM Card Interface
As the Mini PCIeAdapter is not equipped with an USIM socket, you need to place an
USIM socket on the user interface board.
Figure 3-9 shows the circuit of the USIM card interface.
Figure 3-9 Circuit of the USIM card interface