Huawei EM820W Installation instructions

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide
Issue 01
Date 2010-12-09

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For
any assistance, please contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
Huawei Industrial Base, Bantian, Longgang, Shenzhen 518129, People’s Republic of China
Tel: [phone] Global Hotline: [phone] Website: www.huawei.com
E-mail: [email protected]
Please refer color and shape to product. Huawei reserves the right to make changes or improvements to any
of the products without prior notice.
Copyright © Huawei Technologies Co., Ltd. 2009. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and
possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble,
decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions
are prohibited by applicable l900 or such actions are approved by respective copyright holders under
licenses.
Trademarks and Permissions
, , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned are the property of their respective
owners.
Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and may not be activated or may be limited by local network operators or
network service providers, thus the descriptions herein may not exactly match the product or its accessories
you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications
contained in this manual without prior notice or obligation.
NO WARRANTY
THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE
L900, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED
TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS
MANUAL.
TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI
TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR
CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR
ANTICIPATED SAVINGS.
Import and Export Regulations
Customers shall comply with all applicable export or import l900 and regulations and will obtain all necessary
governmental permits and licenses in order to export, re-export or import the product mentioned in this
manual including the software and technical data therein.

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide About This Document
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
About This Document
History
Version Date Chapter Descriptions
01 2010-12-09 Creation

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Contents
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. i
Contents
1 Introduction......................................................................................................................................1
1.1 Overview ........................................................................................................................................ 1
2 Overall Description..........................................................................................................................2
2.1 About This Chapter....................................................................................................................... 2
2.2 Function Overview........................................................................................................................ 2
2.3 Circuit Block Diagram................................................................................................................... 3
2.4 Application Block Diagram........................................................................................................... 4
3 Description of the Application Interfaces ......................................................................................5
3.1 About This Chapter....................................................................................................................... 5
3.2 Mini PCI Express Interface.......................................................................................................... 5
3.3 Power Sources and Grounds...................................................................................................... 8
3.4 Power Supply Time Sequence.................................................................................................... 8
3.5 USB Signals................................................................................................................................... 9
3.6 USIM Signals............................................................................................................................... 10
3.6.1 USIM Interface Schematic Reference ............................................................................ 10
3.6.2 Design Guide.......................................................................................................................11
3.6.3 Certification Test ................................................................................................................ 13
3.7 W_DISABLE# Signal.................................................................................................................. 14
3.8 LED_WWAN# Signal.................................................................................................................. 14
3.9 WAKE_NB_N Signal .................................................................................................................. 16
3.10 NC Pins ...................................................................................................................................... 16
4 RF Specifications............................................................................................................................17
4.1 Operating Frequencies .............................................................................................................. 17
4.2 Conducted RF Measurement.................................................................................................... 17
4.2.1 Test Environment ............................................................................................................... 17
4.2.2 Test Standards.................................................................................................................... 18
4.3 Conducted Rx Sensitivity and Tx Power................................................................................. 18
4.3.1 Conducted Receive Sensitivity ........................................................................................ 18
4.3.2 Conducted Transmit Power.............................................................................................. 19
4.4 Antenna Design Requirements................................................................................................. 19

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Contents
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. ii
4.4.1 Antenna Design Indicators ............................................................................................... 19
4.4.2 Interference......................................................................................................................... 23
4.4.3 GSM/WCDMA Antenna Requirements........................................................................... 23
4.4.4 Radio Test Environment.................................................................................................... 24
4.5 Design Recommendations ........................................................................................................ 25
4.6 ESD Protection for the Antenna Interface............................................................................... 26
5 Electrical and Reliability Features ................................................................................................28
5.1 About This Chapter..................................................................................................................... 28
5.2 Extreme Working Conditions .................................................................................................... 28
5.3 Working and Storage Temperatures and Humidity................................................................ 28
5.4 Electrical Criteria of Application Interfaces ............................................................................. 29
5.5 Power Supply Features ............................................................................................................. 30
5.5.1 Power Supply ..................................................................................................................... 30
5.5.2 Power Consumption .......................................................................................................... 30
5.6 Reliability Features ..................................................................................................................... 33
5.7 EMC and ESD Features ............................................................................................................ 35
6 Mechanical Specifications .............................................................................................................36
6.1 Dimensions and Interfaces........................................................................................................ 36
6.1.1 Dimensions and Interfaces of EM820W......................................................................... 36
6.2 Dimensions of the Mini PCI Express Connector.................................................................... 36
6.3 Specification Selection for Fasteners ...................................................................................... 37
6.3.1 Installing the EM820W on the Main Board of PC ......................................................... 37
6.3.2 Romoving the EM820W from the Main Board of PC.................................................... 38
7 Appendix A Circuits of Typical Interfaces...................................................................................40
8 Appendix B Acronyms and Abbreviations...................................................................................41

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Tables
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. iii
Tables
Table 2-1 Feature................................................................................................................................2
Table 3-1 Pin definitions of the Mini PCI-E Interface..................................................................... 5
Table 3-2 Power and ground specifications.................................................................................... 8
Table 3-3 USB pins............................................................................................................................. 9
Table 3-4 USB signal DC characteristics ........................................................................................ 9
Table 3-5 USIM pins ......................................................................................................................... 10
Table 3-6 SIM RST requirements ................................................................................................... 12
Table 3-7 SIM CLK requirements ................................................................................................... 12
Table 3-8 SIM IO requirements....................................................................................................... 13
Table 3-9 W_DISABLE_N signal .................................................................................................... 14
Table 3-10 Radio operational states .............................................................................................. 14
Table 3-11 LED_WWAN signal ....................................................................................................... 15
Table 4-1 RF bands .......................................................................................................................... 17
Table 4-2 EM820W conducted Rx sensitivity (unit: dBm)........................................................... 18
Table 4-3 EM820W conducted Tx power (unit: dBm).................................................................. 19
Table 4-4 Isolation between the master antenna and the Wi-Fi antenna................................. 20
Table 4-5 GSM/WCDMA antenna requirements .......................................................................... 23
Table 5-1 Working and storage temperatures and humidity for the EM820W module .......... 29
Table 5-2 Electrical features of application interfaces................................................................. 29
Table 5-3 Power requirements........................................................................................................ 30
Table 5-4 DC power consumption (HSPA/WCDMA) ................................................................... 30
Table 5-5 DC power consumption (GSM/GPRS/EDGE) ............................................................ 32
Table 5-6 DC power consumption(Idle and Suspend) ................................................................ 33
Table 5-7 Test conditions and results of the mechanical reliability of the EM820W module.34

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Figures
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. iv
Figures
Figure 2-1 Circuit block diagram of the EM820W module ........................................................... 4
Figure 2-2 Application block diagram of the EM820W module ................................................... 4
Figure 3-1 HUAWEI EM820W power supply time sequence. ..................................................... 9
Figure 3-2 USIM interface schematic on PC.................................................................................11
Figure 3-3 Pin definition of the SIM card Socket ..........................................................................11
Figure 3-4 LED_WWAN# signal reference circuit diagram........................................................ 15
Figure 3-5 LED typical electro-optical characteristics curves.................................................... 16
Figure 4-1 SATIMO microwave testing chamber......................................................................... 25
Figure 4-2 Recommended antenna positions .............................................................................. 26
Figure 4-3 ESD protection circuit recommended for the antenna interface ............................ 27
Figure 6-1 Dimensions of the EM820W ........................................................................................ 36
Figure 6-2 Dimensions of the Mini PCI Express connector ....................................................... 37
Figure 7-1 Circuits of typical interfaces in the EM820W module .............................................. 40

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Introduction
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. 1
1 Introduction
1.1 Overview
This document describes the hardware application interfaces and air interfaces that
are provided when the Huawei EM820W HSPA+ PC Embedded module (hereinafter
referred to as the EM820W module) is used.
This document helps you to understand the interface specifications, electrical
features, and related product information of the EM820W module. To facilitate its use
in different fields, relevant development guides document are also provided with the
module, which can be obtained through Huawei website.

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Overall Description
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. 2
2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the EM820W module and provides:
zFunction Overview
zCircuit Block Diagram
zApplication Block Diagram
2.2 Function Overview
Table 2-1 Feature
Feature Description
Working bands GSM/GPRS/EDGE 850/900/1800/1900 (MHz)
HSPA+/HSUPA/HSDPA/WCDMA 2100/1900/900/850 (MHz)
Normal working temperature: –10°C to +55°C
Working
temperature Extreme working temperatures: –20°C to –10°C and +55°C to
+70°C
Ambient
temperature for
storage
–40°C to 85°C
Power voltage 3.3 V±9 %(3.3 V is recommended)
AT commands See the HUAWEI EM820W HSPA+ PC Embedded Module
Software Guide Specification.
One standard Subscriber Identity Module (SIM) card interface (3
V or 1.8 V)
USB 2.0 (high speed)
Application
interface (52pin
Mini PCI-E
interface)
WAKE#: Wake up signal

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Overall Description
Issue 01 (2010-12-09) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. 3
Feature Description
W_Disable#: for turning on/off the RF signal.
LED_WWAN#: Active-low LED signal indicating the state of the
card
Power Interface
New message alert, receiving and sending text messages
SMS Management of text messages: read messages, delete
messages, storage status, and message list
Support for the protocol data unit (PDU) mode
GSM CS: 9.6/14.4 kbps
GPRS/EDGE: Multi-slot Class 12, Class B
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA/HSDPA PS: UL384kbps/DL3.6Mbps, HSDPA Category
6, 8, 9, 10, 12, 14
Data services
HSPA+ Rel7
Physical
features
Dimensions (L × W × H): 50.95 mm × 30 mm × 4.5 mm
Weight: < 15 g
Certification
information
Restriction of the use of certain Hazardous Substances (RoHS),
European Conformity (CE), Federal Communications
Commission (FCC)
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the EM820W module. The application
block diagram and major functional units of the EM820W module contain the
following parts:
zMobile data modem
zPower management
zMulti-chip package (MCP) memory
zRadio frequency (RF) transceiver
zRF front-end modules
zReceive filter