Huawei ME309-562 Installation instructions

HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Issue 03
Date 2017-07-18

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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2017-03-23 - Draft release
02 2017-05-26 - 1.Cancel SPI/I2C function;
2.Cancel wake_up out function, use
RING to replace it;
3.Update the pin map interface picture
because the change above.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Contents
1 Introduction....................................................................................................................................5
2 Overall Description ......................................................................................................................6
2.1 About This Chapter........................................................................................................................... 6
2.2 Function Overview............................................................................................................................ 6
2.3 Circuit Block Diagram....................................................................................................................... 7
2.4 Application Block Diagram ............................................................................................................... 8
3 Description of the Application Interfaces..............................................................................10
3.1 About This Chapter......................................................................................................................... 10
3.2 LGA Interface ................................................................................................................................. 10
4 Mechanical Specifications.........................................................................................................20
4.1 About This Chapter......................................................................................................................... 20
4.2 Storage Requirement..................................................................................................................... 20
4.3 Moisture Sensitivity ........................................................................................................................ 20
4.4 Dimensions..................................................................................................................................... 20
4.5 Customer PCB Design................................................................................................................... 22
4.5.1 PCB Surface Finish............................................................................................................... 22
4.5.2 PCB Pad Design.................................................................................................................... 22
4.5.3 Solder Mask........................................................................................................................... 24
4.5.4 Requirements on PCB Layout............................................................................................... 24
4.5.5 Stencil Design........................................................................................................................ 24
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the
ME309-562 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME309-562 module.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME309-562 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 ME309-562 module features
Feature Description
Physical
Dimensions
Dimensions (W × L × H): 18 mm × 24 mm × 2.5 mm
Weight TBD
Operating
Bands
HD-FDD LTE: Band 2, Band 4, Band 12, Band13
Operating
Temperature Normal operating temperature: –30°C to +75°C (Characteristics guaranteed)
Extended operating temperature[1]: –40°C to +85°C (Normal
working)
Storage
Temperature –40°C to +95°C
Power
Voltage 3.3 V to 4.2 V (3.8 V is recommended.)
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Feature Description
Application
Interface
(120-pin LGA
interface)
GPIO x 5
UART interface (one 8-wire UART0, two 4-wire UART1&UART2,
and UART2 is only for debugging)
Standard SIM interface
ADC interface x 2
SPI interface (software not support)
I2C interface (software not support)
LED interface x 2
JTAG interface
Power supply interface
Power on/off interface
Hardware reset interface
Wake in/out interface
Antenna
Interface RF antenna pad x 1
Data Services LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1
[1]: When the ME309-562 module works at –40°C to –30°C or +75°C to +85°C, NOT all its
RF performances comply with the 3GPP specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME309-562 module. The major
functional units of the ME309-562 module contain the following parts:
Baseband controller
Nor flash
RF Circuit
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Figure 2-1 Circuit block diagram of the ME309-562 module
2.4 Application Block Diagram
Figure 2-2 Application block diagram of the ME309-562 module
UART Interface: The module supports 3 UART interfaces. Two are 4-wire
UARTs, and the other one is 8-wire UART. Uart02 is only for
debugging.
SIM Interface: The SIM interface provides the interface for a SIM card.
GPIO: General Purpose I/O pins.
External Power
Supply: DC 3.8 V is recommended.
ADC: Analog-to-Digital Converter
I2C: Inter－Integrated Circuit
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
SPI: Serial Peripheral Interface
RF Pad: RF antenna interface.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME309-562
module LGA Interface.
3.2 LGA Interface
The ME309-562 module uses a 120-pin LGA as its external interface. For details
about the module and dimensions, see 4.4 Dimensions.
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