Huawei MU709 Series Installation instructions

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Issue 04
Date 2015-06-25

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
About This Document
Issue 04 (2015-06-25)
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About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2014-09-15 Creation
02 2014-09-18 3.3.2 Updated section 3.3.2: Reset the Module
03 2015-02-16 All Added the description of MU709s-6 module
04 2015-06-25 2.2 Updated Table 2-1: Features
5.3 Updated Table 5-2: Operating and storage
temperatures
7.2 Updated Table 7-1: Product Certifications
Scope
MU709s-2
MU709s-6

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Contents
4
Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram....................................................................................................................... 9
3 Description of the Application Interfaces..............................................................................11
3.1 About This Chapter..........................................................................................................................11
3.2 Mini PCIe Interface..........................................................................................................................11
3.3 Power Interface.............................................................................................................................. 16
3.3.1 Sources and Grounds............................................................................................................ 16
3.3.2 Power Supply Time Sequence .............................................................................................. 17
3.4 Signal Control Interface.................................................................................................................. 18
3.4.1 Overview................................................................................................................................ 18
3.4.2 WAKE# Signal....................................................................................................................... 18
3.4.3 RESIN_N Signal.................................................................................................................... 19
3.4.4 LED_WWAN# Signal............................................................................................................. 20
3.5 USB Interface................................................................................................................................. 21
3.5.1 Overview................................................................................................................................ 21
3.5.2 Circuit Recommended for the USB Interface........................................................................ 22
3.6 USIM Card Interface ...................................................................................................................... 22
3.6.1 Overview................................................................................................................................ 22
3.6.2 Circuit Recommended for the USIM Card Interface.............................................................. 23
3.7 Audio Interface ............................................................................................................................... 24
3.7.1 Overview................................................................................................................................ 24
3.7.2 Circuit Recommended for the Audio Interface ...................................................................... 25
3.8 NC Pins .......................................................................................................................................... 25
4 RF Specifications.........................................................................................................................27
4.1 About This Chapter......................................................................................................................... 27
4.2 Operating Frequencies................................................................................................................... 27
4.3 Conducted RF Measurement......................................................................................................... 28
4.3.1 Test Environment................................................................................................................... 28
4.3.2 Test Standards....................................................................................................................... 28
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4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 28
4.4.1 Conducted Receive Sensitivity.............................................................................................. 28
4.4.2 Conducted Transmit Power................................................................................................... 29
4.5 Antenna Design Requirements ...................................................................................................... 30
4.5.1 Antenna Design Indicators..................................................................................................... 30
4.5.2 Interference ........................................................................................................................... 33
4.5.3 GSM/WCDMAAntenna Requirements.................................................................................. 33
5 Electrical and Reliability Features ...........................................................................................35
5.1 About This Chapter......................................................................................................................... 35
5.2 Absolute Ratings ............................................................................................................................ 35
5.3 Operating and Storage Temperatures............................................................................................ 35
5.4 Power Supply Features.................................................................................................................. 36
5.4.1 Input Power Supply ............................................................................................................... 36
5.4.2 Power Consumption.............................................................................................................. 37
5.5 Reliability Features......................................................................................................................... 41
5.6 EMC and ESD Features................................................................................................................. 44
6 Mechanical Specifications.........................................................................................................46
6.1 About This Chapter......................................................................................................................... 46
6.2 Dimensions and Interfaces............................................................................................................. 46
6.3 Dimensions of the Mini PCI Express Connector............................................................................ 47
6.4 Packaging....................................................................................................................................... 48
6.5 Specification Selection for Fasteners............................................................................................. 49
6.5.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 49
6.5.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 51
6.6 Antenna Plug.................................................................................................................................. 52
6.7 Thermal Design Guide ................................................................................................................... 53
7 Certifications................................................................................................................................56
7.1 About This Chapter......................................................................................................................... 56
7.2 Certifications................................................................................................................................... 56
8 Safety Information......................................................................................................................57
8.1 Interference .................................................................................................................................... 57
8.2 Medical Device............................................................................................................................... 57
8.3 Area with Inflammables and Explosives......................................................................................... 57
8.4 Traffic Security................................................................................................................................ 58
8.5 Airline Security................................................................................................................................ 58
8.6 Safety of Children........................................................................................................................... 58
8.7 Environment Protection.................................................................................................................. 58
8.8 WEEE Approval.............................................................................................................................. 58
8.9 RoHS Approval............................................................................................................................... 58
8.10 Laws and Regulations Observance ............................................................................................. 59
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8.11 Care and Maintenance................................................................................................................. 59
8.12 Emergency Call............................................................................................................................ 59
8.13 Regulatory Information................................................................................................................. 59
8.13.1 CE Approval (European Union)........................................................................................... 59
8.13.2 FCC Statement.................................................................................................................... 60
9 Appendix A Circuit of Typical Interface................................................................................61
10 Appendix B Acronyms and Abbreviations..........................................................................62
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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Introduction
7
1Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ Mini PCIe
Module (hereinafter referred to as the MU709 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709 module.
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Overall Description
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2Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU709 module and provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature Description
Physical
Dimensions
Dimensions: (L × W × H): 51 mm × 30.4 mm × 3.27 mm
Weight: about 12 g
Operating
Bands
MU709s-2
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8, all bands with
diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
MU709s-6
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, all
bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –30°C to +75°C
Storage
Temperature –40°C to +85°C
Humility RH5% to RH95%
Power
Voltage DC 3.0 V to 3.6 V (typical value is 3.3 V)
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Overall Description
9
Feature Description
AT
Commands See the HUAWEI MU709 Series HSPA+ Module AT Command Interface Specification.
Application
Interface
(52-pin Mini
PCIe interface
One standard USIMcard (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
RESIN_N: Reset module
WAKE#: Wake up signal
LED_WWAN#: Active-low LED signal indicating the state of the
module
Antenna
connector
WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
SMS New message alert
Management of SMS: read SMS, write SMS, send SMS, delete
SMS and list SMS
Supports MO and MT: Point-to-point
Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s
Operating
Systems Android 2.x/3.x/4.x Linux (Kernel 2.6.18 or later)
Windows 7/8/8.1
Windows CE 5.0/6.0/7.0
[1]: When the ME909s LGAmodule works in the range from –30°C to –20°C or +70°C to
+75°C, NOT all their RF performances comply with 3GPP specifications.
The thermal design must be implemented according to the chapter 6.7 Thermal Design
Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini
PCIe and the network connection will be terminated.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709 adapter. The major
functional unit of the Mini PCIeAdapter contains the following parts:
Power supply circuit
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Overall Description
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LGA Module
Control signals
Antenna Connectors
Figure 2-1 Circuit block diagram of the MU709 module
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Description of the Application Interfaces
11
3Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709
module, including:
Mini PCIe Interface
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Audio Interface
NC Pins
3.2 Mini PCIe Interface
The MU709 module uses a Mini PCIe interface as its external interface. For details
about the module and dimensions, see Dimensions and Interfaces.
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Description of the Application Interfaces
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Figure 3-1 Sequence of Mini PCIe interface
Table 3-1 Pin definitions of the Mini PCIe Interface
Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
1 WAKE# WAKE# O Open
collector
active low
signal. This
signal is
used to wake
up the host.
- –0.3 - 0.45 -
2 3.3Vaux VCC_3V3 PI 3.3 V DC
supply input. - 3.0 3.3 3.6 -
3 COEX1 NC - Not
connected - - - - -
4 GND GND - Ground - - - - -
5 COEX2 NC - Not
connected - - - - -
6 1.5 V NC - Not
connected - - - - -
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Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
7 CLKREQ# NC - Not
connected - - - - -
8 UIM_PWR USIM_PWR PO Power
source for
the external
USIM card
- –0.3 1.8 1.98 USIM_PW
R=1.8 V
- –0.3 3.0 3.3 USIM_PW
R=3.0 V
9 GND GND - Ground - - - - -
10 UIM_DATA USIM_DATA I/O External
USIM data
signal
VOH 0.7 x
USIM
_PW
R
- 3.3 USIM_PW
R=1.8 V or
3.0 V
VOL 0 - 0.2 x
USIM_
PWR
VIH 0.65 x
USIM
_PW
R
- 3.30
VIL 0 - 0.25x
USIM_
PWR
11 REFCLK- NC - Not
connected - - - - -
12 UIM_CLK USIM_CLK O External
USIM clock
signal
VOH 0.7 x
USIM
_PW
R
- 3.3 USIM_PW
R=1.8 V or
3.0 V
VOL 0 - 0.2 x
USIM_
PWR
13 REFCLK+ NC - Not
connected - - - - -
14 UIM_RESET USIM_RESE
T O External USIM reset
signal
VOH 0.7 x
USIM
_PW
R
- 3.3 USIM_PW
R=1.8 V or
3.0 V
VOL 0 - 0.2 x
USIM_
PWR
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Description of the Application Interfaces
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Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
15 GND GND - Ground - - - - -
16 UIM_Vpp NC - Not
connected - - - - -
17 Reserved NC - Not
connected - - - - -
18 GND GND - Ground - - - - -
19 Reserved NC - Not
connected - - - - -
20 W_DISABLE
# NC - Not connected - - - - -
21 GND GND - Ground - - - - -
22 RERST# RESIN_N I Reset
module
Active-low
VIL –0.3 0 0.3 -
VIH 1.17 1.8 3.6 -
23 PERn0 NC - Not
connected - - - - -
24 3.3Vaux VCC_3V3 PI 3.3 V DC
supply input. - 3.0 3.3 3.6 -
25 PERp0 NC - Not
connected - - - - -
26 GND GND - Ground - - - - -
27 GND GND - Ground - - - - -
28 1.5 V NC - Not
connected - - - - -
29 GND GND - Ground - - - - -
30 SMB_CLK NC - Not
connected - - - - -
31 PETn0 NC - Not
connected - - - - -
32 SMB_DATA NC - Not
connected - - - - -
33 PETp0 NC - Not
connected - - - - -
34 GND GND - Ground - - - - -
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Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
35 GND GND - Ground - - - - -
36 USB_D- USB_DM I/O USB signal
D- - - - - -
37 GND GND - Ground - - - - -
38 USB_D+ USB_DP I/O USB signal
D+ - - - - -
39 3.3Vaux VCC_3V3 PI 3.3 V DC
supply input. - 3.0 3.3 3.6 -
40 GND GND - Ground - - - - -
41 3.3Vaux VCC_3V3 PI 3.3 V DC
supply input. - 3.0 3.3 3.6 -
42 LED_WWAN
# LED_WWAN # O Active-low LED signal
indicating the
state of the
card.
VOL –0.3 - 0.45 -
43 GND GND - Ground - - - - -
44 LED_WLAN
# NC - Not connected - - - - -
45 Reserved PCM_CLK O PCM
interface
clock
VOL –0.3 0 0.45 -
VOH 1.35 1.8 2.1 -
46 LED_WPAN
# NC - Not connected - - - - -
47 Reserved PCM_DOUT O PCM I/F data
output VOL –0.3 0 0.45 -
VOH 1.35 1.8 2.1 -
48 1.5 V NC - Not
connected - - - - -
49 Reserved PCM_DIN I PCM I/F data
input VIL –0.3 0 0.63 -
VIH 1.17 1.8 2.1 -
50 GND GND - Ground - - - - -
51 Reserved PCM_SYNC O PCM
interface
sync
VOL –0.3 0 0.45 -
VOH 1.35 1.8 2.1 -
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Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
52 3.3Vaux VCC_3V3 PI 3.3 V DC
supply input - 3.0 3.3 3.6 -
Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output; PO indicates power output pins; PI indicates power input pins.
VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.
The NC pins are floating and there are no signal connected to these pins. Therefore, these
pins should not be used.
3.3 Power Interface
3.3.1 Sources and Grounds
For the Mini PCIe Adapter, +3.3Vaux is the only voltage supply that is available. The
input voltage is 3.3 V±9%, as specified by PCI Express Mini Card Electromechanical
Specification Revision 1.2.
Table 3-2 Power and ground specifications
Pin No. Pin Name Pad
Type
Descriptiom Min.(V) Typ .(V) Max.(V)
2, 24, 39, 41 and 52 VCC_3V3 PI 3.3 V DC supply input 3.0 3.3 3.6
4, 9, 15, 18, 21, 26, 27,
29, 34, 35, 37, 40, 43
and 50
GND - Ground - - -
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.
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3.3.2 Power Supply Time Sequence
Power on Sequence
Figure 3-2 Power on timing sequence
Parameter Remarks Time (Nominal value) Unit
TPD+ Power Valid to USB D+ high 7.0 s
Do not toggle RESIN_N pin during the power on sequence. Pull-Down RESIN_N pin will extend
time for module startup.
Power off Sequence
Cutting off the VCC_3V3 power supply will power off the module.
Figure 3-3 Power off timing sequence
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3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the MU709 module consists of the following:
WAKE# Signal
RESIN_N Signal
LED_WWAN# Signal
Table 3-3 Definitions of the pins on the signal control interface
Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
1 WAKE# O Open collector active low signal.
This signal is used to wake up the
host.
- –0.3 - 0.45
22 RESIN_N I Reset module
Active-low
VIL –0.3 0 0.3
VIH 1.17 1.8 3.6
42 LED_WWAN# O Active-low LED signal indicating
the state of the card. VOL –0.3 - 0.45
3.4.2 WAKE# Signal
WAKE# signal supports software control.
This signal is used for module to wake up the host. It is designed as an OC (Open
Collector) gate, so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage for
1s to wake up the host.
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Figure 3-4 Connections of the WAKE# pin
3.4.3 RESIN_N Signal
The RESIN_N signal is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, and it turns on automatically when
the VCC_3V3 is pulled up. The RESIN_N signal is active-low.
Figure 3-5 Connections of the RESIN_N pin
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As the RESIN_N signal is relatively sensitive, it is recommended that you install a
10 nF–0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In
addition, when you design a circuit on the PCB of the interface board, it is
recommended that the circuit length should not exceed 20 mm and that the circuit
should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.
Furthermore, you need to wrap the area adjacent to the signal wire with a ground
wire. Otherwise, the module may be reset due to interference.
The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So
when the host wants to reset the module, the low-level-voltage in the RESIN_N pin
should be below 50 mV.
The MU709 module supports hardware reset function. If the software of the MU709
module stops responding, you can reset the hardware through the RESIN_N signal as
shown in Figure 3-6 . When a low-level pulse is supplied through the RESIN_N pin,
the hardware will be reset. After the hardware is reset, the software starts powering on
the module and reports relevant information according to the actual settings. For
example, the AT command automatically reports ^SYSSTART.
Figure 3-6 Reset pulse timing
The RESIN_N pin must not be pulled down for more than 1s.
The RESIN_N pin is optional, which can not be connected.
3.4.4 LED_WWAN# Signal
MU709 series module provides an LED_WWAN# signal to indicate the work status.
This function is disabled by default, it is controlled by AT^LEDCTRL. For details about
the command, please refer to HUAWEI MU709 Series HSPA+ Module AT Command
Interface Specification.
Table 3-4 State of the LED_WWAN# pin
No. Operating Status LED_WWAN#
1 No service or Restricted service Outputs: low (0.1s)-high (0.1s)-low
(0.1s)-high (1.7s)
2s cycle
2 Register to the network Outputs: low (0.1s)-high (1.9s)
2s cycle
3 Dial-up successfully Outputs: low
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