Inspur NF3180A6 User manual

Inspur Server NF3180A6
User Manual
Document Version: V1.1
Release Date: February 23, 2022

Inspur Proprietary and Confidential. All Rights Reserved.
Copyright © 2021-2022 Inspur Electronic Information Industry Co., Ltd. All rights
reserved.
No part of this document may be reproduced or transmitted in any form or by any
means without prior written consent of Inspur.
Environmental Protection
Please dispose of product packaging by recycling at a local recycling center for a
greener planet.
Trademarks
Inspur and Inspur Logo are registered trademarks of Inspur.
All the other trademarks or registered trademarks mentioned herein are the property of
their respective holders.
Security Statement
Inspur is intensely focused on server product safety and has placed a high priority on
this. For better understanding of our server products, carefully read through the
following security risk statements.
When servers are to be repurposed or retired, it is allowed to restore their firmware
factory settings, delete information and clear logs from BIOS and BMC to protect
data privacy. Meanwhile, it is suggested to wipe out the drive data securely with
trusted third-party erasing tools.
The products, services or features you purchased may obtain or use some personal
data (such as email address for alerts and IP address) during operation or fault
locating. There should be user privacy policies in place with adequate measures
implemented in accordance with the applicable laws to ensure that users'
personal data are fully protected.
For server open source software statement, contact Inspur Customer Service.
Some interfaces and commands for production, assembly and return-to-depot,
and advanced commands for locating faults, if used improperly, may cause
equipment abnormality or business interruption. This is not described herein.
Please contact Inspur for such information.
Inspur has established emergency response procedures and action plans for
security vulnerabilities, so that product safety issues can be dealt with in a timely
manner. Please contact Inspur Customer Service for any safety problems found or

Inspur Proprietary and Confidential. All Rights Reserved.
necessary support on security vulnerabilities when using our products.
Inspur shall remain committed to safety of our products and solutions to achieve better
customer satisfaction.
Disclaimer
The purchased products, services and features shall be bound by the contract made
between Inspur and the customer. All or part of the products, services and features
described herein may not be within your purchase or usage scope. Unless otherwise
agreed in the contract, Inspur makes no express or implied statement or warranty on
the contents herein. Images provided herein are for reference only and may contain
information or features that do not apply to your purchased model. This manual is only
used as a guide. Inspur shall not be liable for any damage, including but not limited to
loss of profits, loss of information, interruption of business, personal injury, or any
consequential damage incurred before, during, or after the use of our products. Inspur
assumes you have sufficient knowledge of servers and are well trained in protecting
yourself from personal injury or preventing product damages during operation and
maintenance. The information in this manual is subject to change without notice.
Inspur shall not be liable for technical or editorial errors or omissions contained in this
manual.
Technical Support
Global Service
Hotline:
1-844-860-0011/1-760-769-1847
Address: No. 1036, Langchao Road, Jinan, Shandong Province, China
Inspur Electronic Information Industry Co., Ltd.
Email: [e-mail]
Postal Code: 250101

Inspur Proprietary and Confidential. All Rights Reserved.
Foreword
Abstract
This manual describes the server's specifications, features, hardware setup,
warranty information and troubleshooting, which will help users to
understand how best to utilize the server and all its functionalities.
Target Audience
This manual is intended for:
Technical support engineers
Product maintenance engineers
It is recommended that server installation, configuration, or maintenance is
performed by only experienced technicians with knowledge in servers.
Safety Precautions
If your purchases do not include Inspur on-site installation service, make
sure that you inspect the shipping cartons before unpacking the
equipment. If a shipping carton appears severely damaged, water
immersed, or the seal or pressure-sensitive adhesive tape (PSA) is
broken, report this based on your purchase channel. If you purchased
from a third-party supplier, contact your supplier directly; if you
purchased through Inspur direct sales stores, call Inspur service hotline 1-
844-860-0011/1-760-769-1847 for technical support.
For your safety, please do not disassemble the server's components,
extend configuration or connect other peripherals arbitrarily. You can
contact Inspur for our support and guidance.
Before disassembling the server's components, please be sure to
disconnect all the cables connected to the server.
Please install the product-compatible operating system and use the
driver that comes with the server or provided by Inspur. You can go to our
official site, on the Top Navigator, click on Support > Product Support >
Drivers, then find the correct driver of your product based on the prompt.
An incompatible operating system or a non-Inspur driver may cause
compatibility issues and affect the normal use of the product. Inspur will

Inspur Proprietary and Confidential. All Rights Reserved.
not assume any responsibility or liability for this.
BIOS and BMC settings are crucial to correctly configuring your server. If
there are no special requirements, it is suggested to use the Default
Values and not alter the parameter settings arbitrarily. Change the BMC
user password the first time you log in.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
A potential for serious injury, or even death if not
properly handled
A potential for minor or moderate injury if not properly
handled
A potential loss of data or damage to equipment if not
properly handled
Operations or information that requires special attention
to ensure successful installation or configuration
Supplementary description of manual information
Revision History
Version Date Description of Changes
V1.0 2021/06/25 Initial release
V1.1 2022/2/23
Updated the power supply specifications
and figures for fan blade and multiple-
power safety protection

Table of Contents
1Safety Instructions......................................................................................1
1.1 Warnings......................................................................................................... 1
1.2 Precautions .....................................................................................................2
2Product Specifications ................................................................................5
2.1 Introduction .................................................................................................... 5
2.1.1 4 × 2.5-inch Drive Configuration (Full Configuration)............................6
2.1.2 10 × 2.5-inch Drive Configuration (Full Configuration) .............................6
2.1.3 16 × E1.S Drive Configuration (Full Configuration)................................7
2.1.4 32 × E1.S Drive Configuration (Full Configuration)................................7
2.2 Features and Specifications ............................................................................ 8
2.3 Power Efficiency............................................................................................ 10
3Product Overview ..................................................................................... 13
3.1 Front Panel.................................................................................................... 13
3.1.1 4 × 2.5-inch Drive Configuration ......................................................... 13
3.1.2 10 × 2.5-inch Drive Configuration .......................................................13
3.1.3 16 × E1.S Drive Configuration..............................................................14
3.1.4 32 × E1.S Drive Configuration..............................................................14
3.2 Rear Panel..................................................................................................... 15
3.3 Buttons and LEDs .......................................................................................... 16
3.3.1 Front Panel Buttons and LEDs.............................................................16
3.3.2 Drive Tray LEDs ................................................................................... 17
3.3.3 PSU LEDs.............................................................................................17
3.4 Port Description............................................................................................. 18
3.5 Motherboard View ........................................................................................ 19
3.6 How to Clear CMOS........................................................................................ 20

3.7 System Layout............................................................................................... 22
4Getting Started ......................................................................................... 23
4.1 Installing Server into the Rack....................................................................... 23
4.2 Power On/Off................................................................................................ 23
4.3 Pre-Disassembly Instructions ........................................................................ 24
4.4 Disassembly/Reassembly Process ................................................................ 25
4.4.1 Top Cover Replacement...................................................................... 26
4.4.2 Super-Capacitor Replacement............................................................ 27
4.4.3 Air Duct Replacement .........................................................................28
4.4.4 Hot-Swap Fan Module Replacement ..................................................28
4.4.5 DIMM Replacement.............................................................................30
4.4.6 Processor Heatsink Module (PHM) Replacement ................................32
4.4.7 PCIe Expansion Card Replacement .....................................................35
4.4.8 Hot-Swap Storage Drive Replacement ............................................... 36
4.4.9 Hot-Swap PSU Replacement...............................................................38
4.4.10 OCP Card Replacement....................................................................... 39
4.4.11 E1.S Replacement ............................................................................... 40
4.5 Firmware Update and Configuration............................................................. 42
4.6 Cable Routing................................................................................................ 42
5Battery Replacement ................................................................................ 44
6Electrostatic Discharge ............................................................................. 46
6.1 ESD Prevention.............................................................................................. 46
6.2 Anti-ESD Grounding Methods........................................................................ 46
7Troubleshooting....................................................................................... 47
7.1 Hardware Problems ...................................................................................... 47
7.1.1 Power-On Failure................................................................................47
7.1.2 No Display ..........................................................................................48

7.1.3 Abnormal LED on the Front Panel.......................................................48
7.1.4 Stuck in POST Interface or Other Interface .......................................... 49
7.1.5 PSU LED Off or Illuminates Amber....................................................... 49
7.1.6 Abnormal Drive Status LED ................................................................. 50
7.1.7 Loud System Fan Noise....................................................................... 51
7.1.8 Alarm from the Server ........................................................................ 51
7.1.9 Keyboard and Mouse Failure.............................................................. 52
7.1.10 USB Port Problem ...............................................................................52
7.2 Software Problems ....................................................................................... 53
7.2.1 OS Installation Problems .................................................................... 53
7.2.2 PXE Boot Failure ................................................................................. 53
7.2.3 Abnormal Memory Capacity ...............................................................54
7.2.4 Abnormal Network .............................................................................54
8Environment Requirements ...................................................................... 55
8.1 Ambient Temperature ................................................................................... 55
8.2 Vibration and Shock Resistance .................................................................... 55
8.3 Altitude and Air Pressure............................................................................... 56
8.4 Alternating Temperature and Humidity ........................................................ 56
8.5 Expanded Operation Temperature................................................................ 56
8.6 Expanded Operation Temperature Limits...................................................... 57
8.7 Thermal Restrictions...................................................................................... 57
8.8 Operational Requirements ............................................................................ 57
8.9 Electromagnetic Compatibility and Safety Requirements ............................. 61
8.10 Power Supply Requirements ......................................................................... 62
8.10.1 Requirements for AC Power Supply .................................................... 62
8.10.2 Requirements for DC Power Supply ....................................................63
8.10.3 Recommendations on the AC Power Supply ....................................... 63

8.10.4 HVDC Power Supply............................................................................ 63
8.10.5 Requirements for HVDC Power Supply................................................ 64
8.10.6 Recommendations for HVDC Power Supply ........................................ 65
8.10.7 DC Power Supply ................................................................................ 65
9Warranty .................................................................................................. 66
9.1 Warranty Service ........................................................................................... 66
9.2 Inspur Service SLA ......................................................................................... 68
9.3 Warranty Exclusions ...................................................................................... 68
10 Appendix.................................................................................................. 70
10.1 Drive Neodymium Content Reference Table.................................................. 70
10.2 Acronyms and Abbreviations ........................................................................ 71

1
1Safety Instructions
1.1 Warnings
The following warnings indicate potential hazards that may cause property
damage, personal injury, or death:
The power supply equipment of this system may generate high voltages and
energy hazards that may cause personal injury. For your safety, do not
attempt to remove the top cover to disassemble or replace any component on
your own. Unless informed by Inspur, only service technicians trained by
Inspur are authorized to do so.
Ensure the system is powered by an external power supply that matches the
ratings indicated on the nameplate. Use a voltage regulator or UPS
(uninterruptible power supply) to prevent damage to the system that is caused
by voltage sags or surges.
Do not lengthen a power cord by connecting two or more power cords. If you
need a longer power cord, please contact Inspur Customer Service.
For the safety of the system and user, be sure to use the power cables and
sockets (if available) shipped with the product, and do not replace them with
other power cables or plugs.
To avoid electric shocks caused by electrical leakage, always connect the
power cables of the system and peripherals to properly grounded sockets.
Insert the three-prong plug into a properly grounded and easily accessible
three-prong AC power socket. Be sure to use the ground pin of the cable, and
do not use a prong adapter or unplug the ground pin. Do not operate the
system without a grounding conductor installed. If you're not sure whether the
grounding protection is in place, contact an electrician.
Do not insert any object into the openings of the system. Otherwise, it may
result in a short circuit of inner components and thus cause a fire or electric
shock.
Keep the system away from heatsinks and heat sources, and be sure not to
block the air vents.
Avoid contaminating the inside of the system or other components with food
debris or liquid. Do not use the product in a humid or dusty environment.
Always use the battery type recommended by the manufacturer or an
equivalent type for replacement as using an incorrect battery type may cause

2
an explosion. Never attempt to disassemble, crush or puncture a battery or
short circuit the battery. Do not throw it into fire or water, or expose it to an
environment over 60°C (140°F). Never attempt to open or repair a battery.
Dispose of used batteries properly. Do not mix used batteries, circuit boards or
other components that may contain batteries with other wastes. For battery
recycling, contact the local recycling center.
For stand-alone cabinets, install front and side leveling feet before installing
devices into the cabinets. For cabinets connected with other cabinets, install
front leveling feet first. Be sure to install the leveling feet before installing
devices into cabinets to prevent the cabinets from tipping over, possibly
resulting in personal injury. After installing devices and other components in
the cabinet, slide only one component out of the cabinet at a time. Pulling out
multiple components at a time may cause the cabinet to tip over and result in
personal injury.
Do not move the cabinet alone. At least two people are required to move the
cabinet.
It is prohibited to directly short-circuit the copper busbar. Do not touch the
copper busbar when the cabinet is powered on.
This is a Class A product, and may cause radio interference. In such case, you
may need to take necessary measures to mitigate the interference.
1.2 Precautions
Before using the product, read through the following precautions to avoid the
issues that may cause component damage or data loss.
Unplug the product's power plug from the power socket and contact Inspur
Customer Service under any of the following circumstances:
-The power cables or power plugs are damaged.
-The product gets wet with water.
-The product falls off or is damaged.
-Other objects fall into the product.
-The product does not work properly when the operating instructions are
followed.
If the system is exposed to moisture, follow the steps below.
a. Power off the system and devices. Disconnect their power cables, wait 10
to 20 seconds, and then remove the top cover.
b. Move the devices to a ventilated area to dry the system off for at least 24
hours. Make sure that the system is fully dried.

3
c. Close the top cover, reconnect the system's power cable, and power on
the system.
d. If it cannot operate normally, contact Inspur for technical support.
The cable routing should ensure that the system cables and power cables will
not be stepped on or knocked off. Do not place any objects on the cables.
Before removing the top cover or accessing any inner component, wait until
the device is cooled down. After the system is powered off, wait 5 seconds
before removing components from the motherboard or disconnecting
peripherals to avoid damage to the motherboard.
If a modem, telecom or LAN option is installed:
-Do not connect or use the modem in the event of lightning to avoid
lightning strikes.
-Never connect or use the modem in a damp environment.
-Never insert the modem or telephone cables into the socket of network
interface controller (NIC).
-Before unpacking the product, accessing or installing inner components,
or touching an uninsulated modem cable or jack, be sure to disconnect the
modem cable.
To prevent electrostatic discharge from damaging electronic components
inside the device:
-Ground yourself before installing, removing, or accessing any electronic
components inside the device. You may remove the static electricity from
your body by touching a grounded metal object (such as the unpainted
metal surface of the chassis).
-Do not take out ESD-sensitive components from their anti-static packages
if they are not intended for use.
-Regularly touch grounded conductors or unpainted metal surface of the
chassis during operation to discharge static electricity from your body that
could damage inner components.
When installing or removing any components inside the system with the
permission of Inspur:
a. Power off the system and disconnect its power cables and all the cables
connected to the system. Disconnect the cable by holding the cable
connector (instead of the cable) and pulling it out.
b. Only after the products completely cool down can you disassemble the top
cover or access the internal components.

4
c. Discharge static electricity from your body by touching a grounded metal
object before installing, removing, or touching any electronic components
inside the device.
d. Install and remove components gently to avoid damaging the components
or scratching your arm.
e. Handle all the components and cards with care and do not touch the
components or contacts on the cards. Grab a card or component by
holding its edge or metal bracket.
When installing and using the cabinet:
-After installing the cabinet, make sure the leveling feet are secured to the
rack and extended to the floor so that the full weight of the cabinet rests
on them.
-Be sure to load the cabinet from bottom to top and install the heaviest
component first.
-Always slide a component from the cabinet gently to keep the cabinet
balanced and stable.
-Be careful when pressing the release latches to slide components in or out
as the rails may hurt your fingers.
-Do not overload the AC power branch circuits in the cabinet. The total load
of the cabinet should not exceed 80% of the ratings of the branch circuits.
-Ensure the components in the cabinet are properly ventilated.
-Never step on other components when repairing components in the
cabinet.

5
2Product Specifications
2.1 Introduction
The Inspur NF3180A6 is a high-end single socket rack server that features AMD®
Milan®scalable processors and is designed for high-end IT applications such as
cloud computing, big data, data mining, deep learning, and so on. The server
maintains high quality and reliability of Inspur servers and brings innovation and a
breakthrough in compute performance, scalability, configurability, intelligent
management, and so on. Hence, it is perfect for customers with demanding
workloads in telecommunications, finance , Internet industry, and so on.
Key features:
1 AMD® Milan® scalable processor with a variety of TDPs up to 280 W
Up to 16 DIMMs (RDIMMs and LRDIMMs) with memory mirroring and hot
spare supported
Up to 4 × 3.5-inch SAS/SATA/NVMe drives, 4 × 2.5-inch SAS/SATA/NVMe
drives, 12 × 2.5-inch SAS/SATA/NVMe drives, or 32 × E1.S NVMe drives at
the front
OCP NIC 3.0 SFF expansion card
6 onboard Slimline ×8 connectors with NVMe drives directly connected to
the CPU
Up to 3 standard PCIe expansion cards, including 1 full-height half-length
and 2 half-height half-length cards
Up to 2 single-width full-height half-length GPU cards
Motherboard integrated with an AST2500 BMC chip with KVM functionality
as standard
Hot-swap LCD module and remote monitoring on mobile devices via BMC
Modular design of drives, PCIe expansion cards, PSUs and fans, enabling
tool-free maintenance
Hot-swap and redundant CRPS of 80 Plus Platinum or higher rating with
PMBus and NM 4.0 functionality
Hot-swap fan/fan cage design; the fans are N+1 rotor redundant and of
low noise

6
2.1.1 4 × 2.5-inch Drive Configuration (Full
Configuration)
A 3.5-inch drive tray can accommodate a 3.5- or 2.5-inch drive.
Figure 2-1 4 × 2.5-inch Drive Configuration
2.1.2 10 × 2.5-inch Drive Configuration (Full
Configuration)
Up to 10 front 2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.
Figure 2-2 10 × 2.5-inch Drive Configuration

7
2.1.3 16 × E1.S Drive Configuration (Full
Configuration)
Up to 16 front E1.S NVMe drives (15 mm), as shown in the figure below.
Figure 2-3 16 × E1.S Drive Configuration
2.1.4 32 × E1.S Drive Configuration (Full
Configuration)
Up to 32 front E1.S NVMe drives (9.5 mm), as shown in the figure below.
Figure 2-4 32 × E1.S Drive Configuration

8
2.2 Features and Specifications
Table 2-1 Features and Specifications
Item Description
Time to Market 2022/03
Processor Type AMD® Milan® scalable processors (1 CPU, TDP
up to 280 W)
Processor Socket One
Memory
Memory type: RDIMM, LRDIMM
Memory slots: 16
Total memory capacity: Up to 2 TB (128 GB
per memory module)
Display Controller Type Integrated in the ASPEED 2500 chip, up to 1280
× 1024 resolution
Backplane Hot-swap SAS/SATA/NVMe drives
NIC Controller Standard OCP NIC 3.0 cards or standard PCIe
cards supported on the motherboard
Management Chip
Integrated with 1 independent 1000 Mbps
network port, dedicated for IPMI remote
management
I/O Ports
2 rear USB 3.0 ports, 1 front USB 3.0 port
1 front VGA port, 1 rear VGA port
1 rear serial port
2 UID buttons and LEDs (1 front and 1
rear)
PCIe Expansion Slots
1. 3 onboard PCIe Gen 4.0 ×16 slots and 1
PCIe 4.0 ×16 slot (16 lanes) for PCIe riser
cards
2. The riser card supports horizontal-
inserted full-height or half-height cards.
3. 3 PCIe configuration: Up to 2 riser cards
Butterfly riser is populated with a riser
card with 2 PCIe 4.0 ×16 slots.
Right 1 slot riser is populated with a
riser card with 1 PCIe 4.0 ×16 slot.
4. 2 PCIe configuration: Up to 3 riser cards
Left 1 slot riser is populated with a
riser card with 1 PCIe 4.0 ×16 slot.
Right 1 slot riser is populated with a

9
Item
Description
riser card plus extended riser card with
1 PCIe 4.0 ×16 slot.
5. 1 onboard OCP NIC 3.0 SFF slot for OCP NIC
3.0 card
Storage
Front panel:
1. 32 × hot-swap E1.S SSD drives (9.5
mm)(0.37 inch)/16 × E1.S SSD drives (15
mm)(0.59 inch)
2. 4 × 3.5-inch hot-swap SAS/SATA/NVMe
drives and 4 × 2.5-inch hot-swap
SAS/SATA/NVMe drives
3. 10 × 2.5-inch hot-swap SATA/SAS/NVMe
drives
Built-in storage:
1.
Up to 2 TF cards for BIOS and BMC
respectively
2. Up to 2 SATA M.2 drives
3. Up to 2 PCIe ×4 M.2 drives
External Storage Drive External USB drives
Power Supply Specifications
Output power of 550 W,
800 W, 1300 W,
1600 W or above in a single- or dual-power
supply configuration
1+1 redundancy
2 PSUs
PMBus and Node Manager 4.0 supported
Power Input Please refer to the power input on the
nameplate of the chassis.
Fans 8 hot-swap 4056 fans with N+1 redundancy
Outer Packaging Dimensions
(L × W × H)
780-depth chassis: 1031 × 651 × 247 mm
(40.59 × 25.63 × 9.72 in.)
840-depth chassis: 1080 × 600 × 240 mm
(42.52 × 23.62 × 9.45 in.)
Chassis Dimension
(W × H × D)
With mounting ears:
32R SSD configuration: 482 × 43.05 × 871.8
mm (18.98 × 1.69 × 34.32 in.)

10
Item
Description
Other configurations: 482 × 43.05 × 811.8
mm (18.98 × 1.69 × 31.96 in.)
Without mounting ears:
32R SSD configuration: 438 × 43.05 × 840
mm (17.24 × 1.69 × 33.07 in.)
Other configurations: 438 × 43.05 × 780 mm
(17.24 × 1.69 × 30.71 in.)
Product Weight (Gross weight:
Chassis + Packaging Box + Rails
+ Accessory Box)
4 × 2.5-inch configuration:
Net weight: approx. 21 kg (46.30 lbs)
Gross weight: 31.5 kg (69.45 lbs) (chassis +
packaging box + rails + accessory box)
10 x 2.5-inch configuration:
Net weight: approx. 21 kg (46.30 lbs)
Gross weight: 31 kg (68.34 lbs) (chassis +
packaging box + rails + accessory box)
2.3 Power Efficiency
Table 2-2 Platinum Level Power Supply Efficiency
Rated
Power @20% Load @50% Load @100% Load PF@50% Load
800 W
90%
94%
91%
0.98
1300 W 90% 94% 91% 0.98
1600 W 90% 94% 91% 0.98
2000 W 90% 94% 91% 0.98
Table 2-3 Titanium Level Power Supply Efficiency
Rated
Power @10% Load @20% Load @50% Load @100% Load
PF@50%
Load
800 W
90%
94%
96%
91%
0.98

11
Table 2-4 EU Regulation 2019/424 Server Configurations
EU Regulation 2019/424
Server Configurations
High-end
Performance
Configuration
Low-end
Performance
Configuration
(h) idle state power 139.4 W 137.7 W
(i) list of all components for additional
idle power allowances, if any (additional
PSU, HDDs or SSDs, additional memory,
additional buffered DDR channels,
additional I/O devices);
See Table 2-5 See Table 2-5
(j) maximum power, expressed in Watts
and rounded to the first decimal place; 606.6 W 353.6 W
(k) declared operating condition class;A2 A2
(l) idle state power (Watts) at the higher
boundary temperature of the declared
operating condition class;
139.9 W 138.5 W
(m) the active state efficiency and the
performance in active state of the server;
45.2 38.5
Table 2-5 List of Components for Additional Power Allowance
(i) List of Components for Additional Power
Allowance
High-end
Performance
Configuration
Low-end
Performance
Configuration
CPU
Performance
1 socket: 10 × Perf CPU W
2 socket: 7 × Perf CPU W 211.4 W 126.9 W
Additional
PSU
10 W per PSU 10 W 10 W
HDD or SSD 5.0 W per HDD or SSD 10 W 10 W
Additional
Memory 0.18 W per GB 45.36 W 22.32 W
Additional
Buffered DDR
Channel
4.0 W per buffered DDR
channel 0 0
Additional I/O
Devices
< 1 Gbps: No Allowance
= 1 Gbps: 2.0 W/Active Port
> 1 Gbps and < 10 Gb/s: 4.0
W/Active Port
≥ 10 Gbps and < 25 Gbps: 15.0
W/Active Port
0 0