Inspur NF5266M5 User manual

Inspur Server User Manual
NF5266M5

© Copyright Inspur 2018. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Inspur.
The information in this manual is subject to change without notice.
Inspur is the registered trademark of Inspur. All the other trademarks or registered
trademarks mentioned in this manual are the property of their respective holders.
Edition: 1.8
May，2021
Editon Statement:Add numbers and names for some figures and tables.

Abstract
This manual contains technical information such as specifications, hardware operations,
software configuration, fault diagnosis, etc., that are relevant to the maintenance and
operation of this server.
It is recommended that server installation, configuration and maintenance is performed by
experienced technicians only.
Target Audience
This manual is intended for:
Technical support engineers
Product maintenance engineers
Technicians
Warnings:
This manual introduces the NF5266M5 server’s technical features, system installation
and setup, which will help the user to understand how best to utilize the server and all its
functions.
1. For your safety, please do not disassemble the server’s components arbitrarily. Please do
not extend configuration or connect other peripheral devices arbitrarily. If needed, please
contact Inspur for our support and guidance.
2. Before disassembling the server’s components, please be sure to disconnect all the power
cords connected to the server.
3. BIOS and BMC setup is a significant factor in correctly configuring your server. If there are
no special requirements, it is suggested to use the Default Values and not alter the parameter
settings arbitrarily. After the first login, please change the BMC user password in time.
4. Please install the product-compatible operating system and use the driver provided
by Inspur. If you use an incompatible operating system or non-Inspur driver, it may cause
compatibility issues and affect the normal use of the product, Inspur will not assume any
responsibility or liability.
Inspur is not responsible for any damages, including loss of profits, loss of information,
interruption of business, personal injury, and/or any damage or consequential damage
without limitation, incurred before, during, or after the use of our products.

Contents
1 Safety Instructions......................................................................................................................... 1
2 Product Specifications ................................................................................................................... 5
2.1 Introduction................................................................................................................................ 5
2.2 Features and Specifications........................................................................................................ 5
2.3 Power Efficiency ......................................................................................................................... 8
3 Component Identification ............................................................................................................. 10
3.1 Front and Rear Panel Components............................................................................................. 10
3.2 Left and Right Ear Components ................................................................................................. 12
3.3 Motherboard Components......................................................................................................... 13
3.4 Motherboard Jumper Introduction ............................................................................................ 14
4 Operations..................................................................................................................................... 15
4.1 Power up the Server................................................................................................................... 15
4.2 Power down the Server.............................................................................................................. 15
4.3 Extend the Server from the Rack................................................................................................ 15
5 Setup ............................................................................................................................................. 17
5.1 Optimum Environment............................................................................................................... 17
5.2 Rack Warnings ............................................................................................................................ 19
5.3 Identifying the Contents of the Server Shipping Carton.............................................................20
5.4 Installing Hardware Options....................................................................................................... 20
5.5 Installing the Server into the Rack.............................................................................................. 21
5.6 Installing the Operating System.................................................................................................. 21
6 Hardware Options Installation....................................................................................................... 22
6.1 Processor Option........................................................................................................................ 22
6.2 Memory Option.......................................................................................................................... 25
6.3 Hot-plug HDD Option ................................................................................................................. 26
6.4 Redundant Hot-plug Power Supply Option ................................................................................28
6.5 Air Baffle Option......................................................................................................................... 29

6.6 TPM Option ................................................................................................................................ 30
6.7 M.2 SSD Option .......................................................................................................................... 30
6.8 OCP/PHY Card Option................................................................................................................. 31
7 Cabling........................................................................................................................................... 32
8 BIOS Setup..................................................................................................................................... 33
8.1 Common Operations .................................................................................................................. 33
8.2 BIOS Parameter Description ....................................................................................................... 50
8.3 Firmware Update........................................................................................................................ 91
9 BMC Settings ................................................................................................................................ 96
9.1 Introduction................................................................................................................................ 96
9.2 Functional Modules.................................................................................................................... 97
9.3 Web Interface Introduction........................................................................................................ 98
9.4 Storage ....................................................................................................................................... 104
9.5 Remote Control .......................................................................................................................... 104
9.6 Power and Fan............................................................................................................................ 106
9.7 BMC Settings .............................................................................................................................. 107
9.8 Logs ............................................................................................................................................ 111
9.9 Fault Diagnosis............................................................................................................................ 113
9.10 Administration.......................................................................................................................... 114
9.11 Command Line Function Introduction...................................................................................... 118
9.12 Time Zone Table ....................................................................................................................... 124
10 Common Faults, Diagnosis and Troubleshooting ........................................................................126
10.1 Hardware Problems.................................................................................................................. 126
10.2 Software Problems ................................................................................................................... 129
11 Battery Replacement .................................................................................................................. 131
12 Regulatory Compliance Notices................................................................................................... 132
12.1 Regulatory Compliance Identification Numbers....................................................................... 132
12.2 Federal Communications Commission Notice.......................................................................... 132

12.3 Cables ....................................................................................................................................... 133
12.4 European Union Regulatory Notice.......................................................................................... 133
12.5 Disposal of Waste Equipment by Users in the European Union...............................................133
12.6 Korean Notice........................................................................................................................... 134
12.7 Chinese Notice.......................................................................................................................... 134
12.8 Battery Replacement Notice .................................................................................................... 134
12.9 Battery Caution ........................................................................................................................ 135
12.10 Restricted Access Area ...........................................................................................................136
13 Electrostatic Discharge ................................................................................................................ 137
13.1 Preventing Electrostatic Discharge ........................................................................................... 137
13.2 Grounding Methods to Prevent Electrostatic Discharge ..........................................................137
14 Warranty...................................................................................................................................... 138
14.1 Introduction.............................................................................................................................. 138
14.2 Warranty Service ...................................................................................................................... 138
14.3 Warranty Exclusions ................................................................................................................. 139
15 Appendix ..................................................................................................................................... 140
15.1 Drive Neodymium Content Reference...................................................................................... 140

1
Safety Instructions
1 Safety Instructions
WARNING: Please be advised to follow the instructions below for safety. Failure to do so
could result in potential dangers that may cause property loss, personal injury or death.
1. The power supplies in the system may produce high voltages and energy hazards that
may cause personal injury. For your safety, please do not attempt to remove the cover
of the system to remove or replace any component without assistance provided by
Inspur. Only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
2. Please connect the equipment to the appropriate power supply. Use only power supplies
with the correct voltage and electrical specifications according to the label. To protect your
equipment from damages caused by a momentary spike or plunge of the voltage, please
use relevant voltage stabilizing equipment, or uninterruptible power supplies.
3. If you must use an extension cable, please use a three-core cable with properly
grounded plugs. Observe extension cable ratings. Ensure that the total rating of all
equipment plugged into the extension cable does not exceed 80 percent of the ratings
limit for the extension cable.
4. Please be sure to use the power supply components that come with the server, such as
power cables, power socket (if provided with the server) etc. For your safety, please do
not replace power cables or plugs randomly.
5. To prevent electric shock dangers caused by leakage in the system, please make sure
that the power cables of the system and peripheral equipment are correctly connected
to the earthed/grounded power socket. Please connect the three-core power cable
plug to the three-core AC power socket that is well earthed and easy to access. Be sure
to use earthing/grounding pin of power cables and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the earthing/grounding
conductors are not installed and it is uncertain whether there are appropriate earthing/
grounding protections, please do not use or attempt to operate the equipment. Contact
and consult an electrician.
6. Please do not push any objects into the openings of the system. Doing so may cause
fire or electric shock.
7. Please place the system far away from the cooling plate and heat sources, and be sure

2
not to block the air vents.
8. Please be sure not to scatter food or liquid in the system or on other components, and
do not use the product in humid or dusty environments.
9. Using an incompatible battery may cause explosion. When battery replacement is
required, please consult the manufacturer first, and choose batteries of the same or
equivalent type. Do not disassemble, crush, puncture the batteries or make the external
connection point short circuit, and do not expose them in the environment over 60°C.
Never throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries according to instructions. For battery recycling,
please contact the local waste recycling center.
10. Before installing equipment into the rack, please install all front and side stabilizers on
the independent rack first. Please install the front stabilizers first, if connecting with
other racks. Please install stabilizers before installing equipment into the rack. Failure to
install the corresponding stabilizers before installing equipment into the rack may cause
the cabinet to tip over, possibly resulting in severe injury. After installing the equipment
and other components into the rack, only one component can be pulled out from the
rack through its sliding part at one time. Pulling out several components at the same
time may cause the rack to turn over, resulting in serious personal injury.
11. A minimum of two people are required to safely move a rack. The racks are extremely
awkward and heavy, moving them without adequate, trained personnel could result in
severe injury or death.
12. It is prohibited to directly short-circuit the copper busbar. Please do not touch the
copper busbar when the rack is powered on.
13. This is Class A product, and may cause radio interference. In such case, users may need
to take necessary measures to mitigate the interference.
14. The equipment is intended for installation in a Restricted Access Location.
Note: The following considerations may help avoid the occurrence of problems that could
damage the components or cause data loss, etc.
1. In the event of the following, please unplug the power cable plug from the power
socket and contact Inspur’s customer service department:
1) The power cables, extension cables or power plugs are damaged.

3
Safety Instructions
2) The products get wet.
3) The products have fallen or have been damaged.
4) Other objects have fallen into the products.
5) The products do not or are unable to function normally even when attempting to
operate according to the instructions.
2. If the system becomes wet or damp, please follow these steps:
1) Power off the equipment, disconnect them with the power socket, wait for 10 to 20
seconds, and then open the host cover.
2) Move the equipment to a well-ventilated place to dry the system at least for 24 hours
and make sure that the system is fully dried.
3) Close the host cover, reconnect the system to the power socket, and then power on.
4) In case of operation failure or other abnormal situations, please contact Inspur and get
technical support.
3. Pay attention to the position of system cables and power cables-avoid placing wires in
high foot traffic locations. Please do not place objects on the cables.
4. Before removing the host cover, and/or touching the internal components, please
allow for the equipment to cool first. To avoid damaging the motherboard, please
power off the system and wait for five seconds, and then remove the components from
the motherboard and/or disconnect the peripheral device from the system. Please
remember that only service technicians trained by Inspur are authorized to remove the
cover of the host, and to remove and replace internal components.
5. If there is modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:
1) In the case of thunder and lightning, please do not connect or use the modem.
2) Never connect or use the modem in a damp environment.
3) Never insert the modem or telephone cables into the socket of network interface
controller (NIC).
4) Before unpacking the product package, installing internal components, touching
uninsulated cables or jacks of the modem, please disconnect the modem cables.
6. In order to prevent electrostatic discharge from damaging the electronic components in
the equipment, please pay attention to the followings:
1) Please remove any static electricity on your body before dismounting or touching
any electronic component in the equipment, to prevent the static electricity from

4
conducting itself to the sensitive components. You may remove the static electricity on
the body by touching the metal earthing objects (such as the unpainted metal surface
on the rack).
2) Please do not take electrostatic sensitive components that are not ready to be installed
for application out of the antistatic package materials.
3) While working, please touch the earthing conductor or the unpainted metal surface on
the cabinet regularly to remove any static electricity from the body that may damage
the internal components.
7. Upon receiving the proper authorization from Inspur and dismounting the internal
components, please pay attention to the followings:
1) Switch the system power supply off and disconnect the cables, including all connections
of the system. When disconnecting the cables, please hold the connector of the cables
and slowly pull the plugs out. Never pull on the cables.
2) The products need to completely cool down before dismounting the host cover or
touching the internal components.
3) During the dismounting process, avoid making large movement ranges to prevent
damage to the components or scratching arms.
4) Handle components and plug-in cards with care. Please do not touch the components
or connection points on the plug-in cards. When handling the plug-in cards or
components, firmly grab the edges of the plug-in cards and components, and/or their
metal fixed supports.
8. During the process of rack installation and application, please pay attention to the followings:
1) After the rack installation is finished, please ensure that the stabilizers have been fixed
to the rack and supported to ground, and the weight of the rack is firm on ground.
2) Always load from the bottom up, and load the heaviest items first.
3) When pulling out the components from the rack, apply slight force to keep the rack
balanced.
4) When pressing down the release latch and the rail of components is sliding, please be
careful; as the sliding may hurt your fingers.
5) Do not overload the AC power supply branch circuits in the rack. The total load of the
rack should not exceed 80% of the ratings of the branch circuits.
6) Ensure that components in the rack have good ventilation conditions.
7) When repairing components in the rack, never step on any other components.

5
Product Specications
2 Product Specifications
2.1 Introduction
Inspur server NF5266M5 is a 2U2S rack-mounted server, designed for meeting the
requirements of Internet, IDC (Internet Data Center), cloud computing, enterprise market
and telecommunication services, on the basis of the new generation of Intel® Xeon®
scalable processors. This product meets the business requirements of high network
bandwidth, high computing performance, large memory capacity and large storage capacity,
and provides a good solution for customers with density and storage requirements. It is
especially suitable for business intelligence, financial services, public cloud and private
cloud applications that have stringent requirements on servers.
Figure 2-1 NF5266M5 External View
2.2 Features and Specifications
2.2.1 Product Features
Inspur server NF5266M5 has a very high computing density, and meets the needs of cloud
computing data center’s multiple application scenarios, with different drive configuration,
high scalability, and flexible network deployment capability. Inspur uses the ultimate design
concept in terms of performance, scalability, usability and managbility to maintain the
consistently high quality and high reliability of Inspur servers.
Performance
NF5266M5 is designed on the basis of the new generation of Intel® Xeon® Skylake &
Cascadelake scalable processors. One single CPU has up to 24 cores and 48 threads, and
supports up to TDP165W, 36MB L3 cache and two 10.4 GT/s UPI interconnection links, with

6
high processing performance.
Supports 12 2933 MT/s DDR4 ECC memories. The memory supports RDIMM type, which
provides excellent speed, high availability and large capacity.
Supports 4 hot-swappable NVMe SSDs, which can provide 10 times more IOPS than high-
end enterprise-class SATA SSDs; supports 24 hot-swappable hard drives in the front.
Scalability
Supports up to 24*3.5” hard drive + 4*2.5” hard drive or 24*2.5” hard drive + 4*2.5” hard
drive, and 2 internal SATA M.2 SSDs.
Supports free switch between the OCP card and PHY card, provides 1G, 10G, 25G and 40G
network interface options, and provides a more flexible network structure for applications.
Supports up to 4 standard PCIe 3.0 expanders, to further improve the I/O performance.
Usability
NF5266M5 provides several features to enhance usability and improve system stability.
Based on the humanized design concept, the entire system can achieve tool-free
maintenance. Through structure optimization, rapid disassembly and assembly is achieved,
and the operation and maintenance time is greatly shortened.
With Inspur’s unique intelligent control technology and advanced air-cooling system, it can
achieve the best operating environment, and ensure the stable operation of the system.
Hot-swappable hard drives; supports RAID 0/1/5/10 to provide RAID Cache; supports super-
capacitor power-down data protection.
Using the latest BMC technology, technicians can locate issues through Web management
interface, fault diagnosis LED and other guidance devices, mark the faulty machine with the
UID LED on the front panel, and quickly find the component that has failed (or is failing),
which simplifies product maintenance, speeds up problem resolution, and increases system
usability.
The BMC monitors system parameters and sends alarm information in advance, enabling
technicians to take appropriate measures to ensure stable operation of the machine and
reduce the possibility of downtime.
Managbility
Inspur’s power management technology helps users to accurately monitor and control
system power consumption. With Node Manager 4.0 technology, comprehensive power
management and control can be effectively implemented to further improve the energy
efficiency of the overall IT architecture.

7
Product Specications
Providing a fast optical path diagnosis method for the server, the use of LEDs not only
greatly saves space on the motherboard, but also displays the server power-on progress
more visually and quickly, which brings convenience for server debugging, and enables the
maintenance personnel to quickly find the equipment to be maintained.
Energy efficiency
Provides 800W/1300W platinum power supply with up to 94% efficiency at 50% load.
Supports 1+1 redundant power supplies to improve power conversion efficiency.
High-efficient single-board VRD power supply reduces DC to DC losses.
Supports system fan intelligent speed regulation and CPU intelligent frequency adjustment
to save energy.
All-round optimized system cooling design and high-efficient energy-saving system fans
reduce system cooling energy consumption.
Safety
Implements firmware encryption/digital signature to prevent illegal writing of unknown firmware.
2.2.2 Product Specifications
Table 2-1
Component Description
Form 2U rack-mounted server
Processor
Supports 1 or 2 Intel® Xeon® 4100/5100/6100 series Skylake scalable processors;
Supports 1 or 2 Intel® Xeon® 4200/5200/6200/8200 series Cascadelake scalable
processors
Two UPI interconnection links, up to 10.4GT/s per link
Maximum 165W TDP
Chipset Intel LBG-2 (C622)
GPU Integrated in Aspeed 2500 chip, supports up to 1280*1024 resolution, 32MB video memory
Memory Supports up to 12 memories. Each processor supports 6 memory channels, and the
maximum memory speed is 2933MT/s.
Maximum memory
capacity
RDIMM/LRDIMM: Two processors support up to 12×64GB memory modules with a
capacity of 768GB
Storage
Front panel:
24 * 3.5" SATA/SAS drive, supporting hot swap
Rear panel:
4 * 2.5" SATA/NVMe SSD, supporting hot swap
M.2 Supports up to 2 80MM SATA M.2 SSDs
Storage controller
(24i Raid/SAS
configuration)
Front RAID/SAS controller
9305-24i, 3154-24i
Rear RAID controller
PM8060-8i, 9460-8i, 9361-8i

8
Storage controller
(Expander
configuration)
PM8060-8i, 9460-8i, 9361-8i, 3008IR, 3008-IT, 3108
Network interface
OCP/PHY card: 10Gb/s, 25Gb/s
Standard PCIe card: 1Gb/s, 10Gb/s, 25Gb/s, 100Gb/s
I/O expansion slot
Supports up to 4 standard PCIe cards and 1 OCP card slot (connector A+C)
CPU1 can expand PCIe 3.0 x32, supporng 2 HHHL PCIe 3.0 x16 cards
CPU0 can expand PCIe 3.0 x16, supporting 2 HHHL PCIe 3.0 x8 cards
I/O
2 front USB 3.0 ports, 2 rear USB 3.0 ports
1 front VGA port, 1 rear VGA port
1 rear RJ45 IPMI port
Fan 5 hot-swappable N+1 redundant 6038 fans
Power supply Supports 1+1 redundant power supply 1300W
Supports CRPS, PMBUS, Node Manager 4.0 functions
System management Integrates 1 independent 1000Mbps network interface for IPMI2.0 remote management
Operating system
Windows 2012R2/2016
Redhat 6.9/7.4
Suse 12
CentOS 7.2/7.4
Oracle Linux 7
Operating
temperature 5℃-35℃
Storage &
transportation
temperature
-40℃-60℃
Operating humidity 20％-80％relative humidity
Storage &
transportation
humidity
20％-93％(40℃) relative humidity
2.3 Power Efficiency
Table 2-2
Efficiency
Level
Efficiency PF
Rated
Power @10%
Load
@20%
Load
@50%
Load
@100%
Load
@50%
Load
Platinum
90% 94% 91% 0.98800W
90% 94% 91% 0.981300W
94% 96% 91% 0.981300W
Titanium 90%

9
Product Specications
Table 2-3
EU Regulation 2019/424
Server configurations
High-end performance
configuration
Low-end performance
configuration
(h) idle state power 128.3W95.2W
(i) list of all components for additional idle power
allowances, if any (additional PSU, HDDs or SSDs,
additional memory, additional buffered DDR channels,
additional I/O devices);
(j) maximum power, expressed in Watts and rounded to
the first decimal place; 525.7W200.6W
(k) declared operating condition class, as detailed in
Table 6; A2 A2
(l) idle state power (Watts) at the higher boundary
temperature of the declared operating condition class; 157.8W147.6W
(m) the active state efficiency and the performance in
active state of the server; 37.7 20.6
Table 2-4
(i) List of components for additional power allowance
High-end
performance
configuration
Low-end
performance
configuration
CPU Performance 1 socket: 10 × Perf CPU W
103.46W18.2W
2 socket: 7 × Perf CPU W
Additional PSU 10 W per PSU 10W 10W
HDD or SSD 5.0 W per HDD or SSD 10W 10W
Additional memory 0.18 W per GB 137.52W 33.84W
Additional buffered DDR channel 4.0 W per buffered DDR channel 16W 16W
Additional I/O devices
< 1 Gb/s: No Allowance
0 0
= 1 Gb/s: 2.0 W/Active Port
> 1 Gb/s and < 10 Gb/s: 4.0 W/Active Port
≥ 10 Gb/s and < 25Gb/s: 15.0 W/Active Port
≥ 25 Gb/s and < 50Gb/s: 20.0 W/Active Port
≥ 50 Gb/s 26.0 W/Active Port
Total idle state power allowed 314.98W126.04W
See Below See Below

10
3 Component Identification
3.1 Front and Rear Panel Components
Figure 3-1
Table 3-1
Item Description
1Front HDD LED
2PCIE slot (CPU1)
3 Drive module
4PCIE slot (CPU0)
5 PSU0
6VGA port
7 RST button
8 I2C0/1 port
9 I2C2/3 port
10 USB3.0 port
11 BMC port
12 UID button
13 OCP expansion card
14 PSU1

11
Component Identication
●Front Drive Tray LEDs
Figure 3-2
Table 3-2
Description Status & Interpretation
Activity status LED
Steady green: Normal
Flashing green (0.5 times/sec): Rebuilding or ongoing Replace Member operation
Flashing green 4HZ: Data transmitting
Flashing amber: Fault alarm
Off: HDD not in position
●Rear Drive Tray LEDs
Figure 3-3
Table 3-3
Item Description Status & Interpretation
1 Activity status LED Steady green: Normal
Flashing green: Read and write activity
2 Fault alarm LED
Steady red: A failure occurs
Steady blue: Disk positioning
Steady purple: RAID rebuilding

12
3.2 Left and Right Ear Components
Figure 3-4
Table 3-4
Item Descripon
1Power buon
2 System status LED
3 System overheat LED
4Power failure LED
5 UID|RST buon
6Fan failure LED
7Memory failure LED
8 Network status LED
9USB3.0 port (2)
10 VGA port

13
Component Identication
3.3 Motherboard Components
Figure 3-5
Table 3-5
Item Descripon
1 System fan connectors
2DIMM slots (CPU0)
3DIMM slots (CPU1)
4PCIE_CPU1 slot
5 M.2 connector
6VGA port
7BMC_RST buon
8JBOD_I2C connector
9USB3.0+MLAN port
10 UID LED
11 CLR_CMOS

14
Item Descripon
12 SLIM_SATA0-3 connector
13 SLIM_SSATA2-5 connector
14 SLIM_SATA4-7 connector
15 Front panel right ear connector
16 OCPC connector
17 OCPA_CPU0 connector
18 RAID_KEY
19 SLIM_NVME2/3
20 SLIM_NVME0/1
21 PCIE0_CPU0 slot
22 PSU_CONTROL connector
23 LED_BOARD1 connector
24 BP_2_3_4 connector
25 LED_BOARD0 connector
26 BP_0_1_2 connector
27 PWR_U.2 connector
28 Front panel le ear connector
29 PWR_X16 RISER connector
30 TCP/TPM connector
31 PSU1 connector
32 PSU0 connector
3.4 Motherboard Jumper Introduction
See [3.3 Motherboard Components] for the jumper position.
Table 3-6
Item Description Function
CLR_CMOS CMOS clear jumper Short-circuit pin1-2, normal status;
Short-circuit pin2-3, clear CMOS.
Note:
It is required to shut down the system, as well as disconnect the power supply during
CMOS clearing. Hold for 5 seconds after short-circuiting pin2-3, and then short-circuit pin1-
2 (default setting) to restore to its original status.