Inspur NF8260M5 User manual

Inspur Server User Manual
NF8260M5

© Copyright Inspur 2018. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Inspur.
The information in this manual is subject to change without notice.
Inspur is the registered trademark of Inspur. All the other trademarks or registered
trademarks mentioned in this manual are the property of their respective holders.
Edition: 1.8
May,2021
Editon Statement:Add numbers and names for some figures and tables.

Abstract
This manual contains technical information such as specifications, hardware operations,
software configuration, fault diagnosis, etc., that are relevant to the maintenance and
operation of this server.
It is recommended that server installation, configuration, and maintenance is performed by
experienced technicians only.
Target Audience
This manual is intended for:
●Technical support engineers
●Product maintenance engineers
●Technicians
Warnings
This manual introduces the NF5270M5server’s technical features, system installation
and setup, which will help the userto understand how best to utilize the server and all its
functionalities.
1.For your safety, please do not disassemble the server’s components arbitrarily. Please do
not extend configuration or connect other peripheral devices arbitrarily. If needed, please
contactInspur for our support and guidance.
2.Before disassembling the server’s components, please be sure to disconnect all the power
cords connected to the server.
3.BIOS and BMC setup is a significant factor in correctly configuring your server. If there are
no special requirements, it is suggested to use the Default Values and not alter the parameter
settings arbitrarily. After the first login, please change the BMC user password in time.
4.Please install the product-compatible operating system and use the driver provided by
Inspur. If you use an incompatible operating system or non-Inspur driver, it may cause
compatibility issues and affect the normal use of the product, Inspur will not assume any
responsibility or liability.
Inspur is not responsible for any damages, including loss of profits, loss of information,
interruption of business, personal injury, and/or any damage or consequential damage
without limitation, incurred before, during, or after the use of our products.

Contents
1 Safety Instructions......................................................................................................................... 1
2 Product Specification..................................................................................................................... 6
2.1 Introduction................................................................................................................................ 6
2.2 Features and Specifications........................................................................................................ 7
2.3 Power Efficiency ......................................................................................................................... 8
3 Component Identification ............................................................................................................. 10
3.1 Front Panel Components............................................................................................................ 10
3.2Rear Panel Components .............................................................................................................. 11
3.3MotherboardComponents .......................................................................................................... 12
4 Operations..................................................................................................................................... 15
4.1 Power up the Server................................................................................................................... 15
4.2 Power down the Server.............................................................................................................. 15
4.3 Extend the Server from the Rack................................................................................................ 15
4.4 Remove the Access Panel........................................................................................................... 16
4.5 Install the Access Panel .............................................................................................................. 17
4.6 Remove the PCIERiser Cage........................................................................................................ 18
4.7 Install the PCIERiser Cage ........................................................................................................... 18
4.8 Remove the Air Baffle................................................................................................................. 19
5 Setup ............................................................................................................................................. 20
5.1 Optimum Environment............................................................................................................... 20
5.2 Rack Warnings ............................................................................................................................ 23
5.3 Identifying the Contents of the ServerShipping Carton..............................................................23
5.4 Installing Hardware Options....................................................................................................... 24
5.5 Installing the Server into the Rack.............................................................................................. 24
5.6 Installing the Operating System.................................................................................................. 25
6 Hardware Options Installation....................................................................................................... 26
6.1 Introduction................................................................................................................................ 26

6.2 Processor Option........................................................................................................................ 26
6.3 Memory Option.......................................................................................................................... 28
6.4 Hot-plug HDDOption .................................................................................................................. 30
6.5 Redundant Hot-plug Power Supply Option ................................................................................ 32
6.6Air BaffleOption........................................................................................................................... 33
7 BIOS Setup..................................................................................................................................... 34
7.1 Common Operations .................................................................................................................. 34
7.2 BIOS Parameter Description....................................................................................................... 52
7.3 Firmware Update........................................................................................................................ 102
8 BMC Settings ................................................................................................................................ 107
8.1 Introduction................................................................................................................................ 107
8.2 Server System Overview............................................................................................................. 107
8.3 IPMI2.0 ....................................................................................................................................... 109
8.4 Management Web GUI............................................................................................................... 115
8.5 SNMP.......................................................................................................................................... 117
8.6 Smash-Lite CLI ............................................................................................................................ 118
8.7 System Information and State .................................................................................................... 122
8.8 Device State Monitor and Diagnostic ......................................................................................... 132
8.9 Logs ............................................................................................................................................ 135
8.10 Event Alerting ........................................................................................................................... 138
8.11 Diagnostics ............................................................................................................................... 140
8.12 BMC Self Recovery.................................................................................................................... 142
8.13 LED............................................................................................................................................ 143
8.14 BMC Network........................................................................................................................... 143
8.15 Users......................................................................................................................................... 147
8.16 Protocol and Ports.................................................................................................................... 153
8.17 Time and NTP ........................................................................................................................... 154
8.18 BIOS and BMC........................................................................................................................... 154
8.19 Storage ..................................................................................................................................... 157
8.20 Server Control........................................................................................................................... 160
8.21 Power Supply and Power Consumption ................................................................................... 161
8.22 Fan Speed Control (FSC) ........................................................................................................... 164

8.23 Firmware Update...................................................................................................................... 165
8.24 Restore Factory Default............................................................................................................ 170
8.25 Serial Over LAN (SOL) and System Serial Log Recording...........................................................171
8.26 Console Redirection(KVM) ....................................................................................................... 173
8.27 Virtual Media............................................................................................................................ 177
8.28 Redfish...................................................................................................................................... 178
8.29 Appendix .................................................................................................................................. 183
9 Common Faults, Diagnosis and Troubleshooting ..........................................................................184
9.1 Hardware Problems.................................................................................................................... 184
9.2 Software Problems ..................................................................................................................... 188
10 Battery Replacement................................................................................................................... 190
11 Regulatory Compliance Notices................................................................................................... 191
11.1 Regulatory Compliance Identification Numbers....................................................................... 191
11.2 Federal Communications Commission Notice.......................................................................... 191
11.3 European Union Regulatory Notice.......................................................................................... 192
11.4 Disposal of Waste Equipment by Users in the European Union...............................................192
11.5 Chinese Notice.......................................................................................................................... 193
11.6 Battery Replacement Notice .................................................................................................... 193
11.7 Battery Caution ........................................................................................................................ 194
11.8 Restricted Access Area ............................................................................................................. 195
12 Electrostatic Discharge ................................................................................................................ 196
12.1 Preventing Electrostatic Discharge........................................................................................... 196
12.2 Grounding Methods to Prevent Electrostatic Discharge ..........................................................196
13 Warranty...................................................................................................................................... 197
13.1 Introduction.............................................................................................................................. 197
13.2 Warranty Service ...................................................................................................................... 197
13.3 Warranty Exclusions ................................................................................................................. 198
14 Appendix ..................................................................................................................................... 199
14.1 Drive Neodymium Content Reference...................................................................................... 199

1
Safety Introduction
1 Safety Instructions
WARNING: Please be advised to follow the instructions below for safety. Failure to do so
could result to potential dangers that may cause property loss, personal injury or death.
1. The power supplies in the system may produce high voltages and energy hazards that
may cause personal injury. For your safety, please do not attempt to remove the cover
of the system to remove or replace any component without assistance provided by
Inspur. Only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
2. Please connect the equipment to the appropriate power supply. Use only power
supplies with the correct voltage and electrical specifications according to the label. To
protect your equipment from damages caused by a momentary spike or plunge of the
voltage, please use relevant voltage stabilizing equipment, or uninterruptible power
supplies.
3. If you must use an extension cable, please use a three-core cable with properly
grounded plugs. Observe extension cable ratings. Ensure that the total rating of all
equipment plugged into the extension cable does not exceed 80 percent of the ratings
limit for the extension cable.
4. Please be sure to use the power supply components that come with the server, such as
power lines, power socket (if provided with the server) etc. For your safety, please do
not replace power cables or plugs randomly.
5. To prevent electric shock dangers caused by leakage in the system, please make sure
that the power cables of the system and peripheral equipment are correctly connected
to the earthed/grounded power socket. Please connect the three-core power line plug
to the three-core AC power socket that is well earthed and easy to access. Be sure
to use earthing /grounding pin of power lines and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the earthing/grounding
conductors are not installed and it is uncertain whether there are appropriate earthing/
grounding protections, please do not use or attempt to operate the equipment. Contact
and consult an electrician.

2
6. Please do not push any objects into the openings of the system. Doing so may cause
fire or electric shock.
7. Please place the system far away from the cooling plate and heat sources, and be sure
not to block the air vents.
8. Please be sure not to scatter food or liquid in the system or on other components, and
do not use the product in humid or dusty environments.
9. Using an incompatible battery may cause explosion. When battery replacement is
required, please consult the manufacturer first, and choose batteries of the same or
equivalent type. Do not disassemble, crush, puncture the batteries or make the external
connection point short circuit, and do not expose them in the environment over 60°C.
Never throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries according to instructions. For battery recycling,
please contact the local waste recycling center.
10. Before installing equipment into the rack, please install all front and side stabilizers on
the independent rack first. Please install the front stabilizers first, if connecting with
other racks. Please install stabilizers before installing equipment into the rack. Failure to
install the corresponding stabilizers before installing equipment into the rack may cause
the cabinet to tip over, possibly resulting to severe injury. After installing the equipment
and other components into the rack, only one component can be pulled out from the
rack through its sliding part at one time. Pulling out several components at the same
time may cause the rack to turn over, resulting to serious personal injury.
11. A minimum of two people are required to safely move a rack. The racks are extremely
awkward and heavy, moving them without adequate, trained personnel could result in
severe injury or death.
12. It is prohibited to directly short-circuit the copper busbar. Please do not touch the
copper busbar when the rack is powered on.
13. This is Class A product, and may cause radio interference. In such case, users may need
to take necessary measures to mitigate the interference.
14. The equipment is intended for installation in a Restricted Access Location.
Note: The following considerations may help avoid the occurrence of problems that could
damage the components or cause data loss, etc.

3
Safety Introduction
1. In the event of the following, please unplug the power line plug from the power socket
and contact Inspur’s customer service department:
1) The power cables, extension cables or power plugs are damaged.
2) The products get wet.
3) The products have fallen or have been damaged.
4) Other objects have fallen into the products.
5) The products do not or are unable to function normally even when attempting to
operate according to the instructions.
2. If the system becomes wet or damp, please follow these steps:
1) Power off the equipment, disconnect them with the power socket, wait for 10 to
20 seconds, and then open the host cover.
2) Move the equipment to a well-ventilated place to dry the system at least for 24
hours and make sure that the system is fully dried.
3) Close the host cover, reconnect the system to the power socket, and then power
on.
4) In case of operation failure or other abnormal situations, please contact Inspur and
get technical support.
3. Pay attention to the position of system cables and power cables-avoid placing wires in
high foot traffic locations. Please do not place objects on the cables.
4. Before removing the host cover, and/or touching the internal components, please
allow for the equipment to cool first. To avoid damaging the mainboard, please power
off the system and wait for five seconds, and then remove the components from the
mainboard and/or disconnect the peripheral device from the system. Please remember
that only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
5. If there is modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:
1) In the case of thunder and lightning, please do not connect or use the modem.
2) Never connect or use the modem in a damp environment.
3) Never insert the modem or telephone cables into the socket of network interface
controller (NIC).
4) Before unpacking the product package, installing internal components, touching
uninsulated cables or jacks of the modem, please disconnect the modem cables.

4
6. In order to prevent electrostatic discharge from damaging the electronic components in
the equipment, please pay attention to the followings:
1) Please remove any static electricity on your body before dismounting or touching
any electronic component in the equipment, to prevent the static electricity from
conducting itself to the sensitive components. You may remove the static electricity
on the body by touching the metal earthing objects (such as the unpainted metal
surface on the rack).
2) Please do not take electrostatic sensitive components that are not ready to be
installed for application out of the antistatic package materials.
3) While working, please touch the earthing conductor or the unpainted metal
surface on the cabinet regularly to remove any static electricity from the body that
may damage the internal components.
7. Upon receiving the proper authorization from Inspur and dismounting the internal
components, please pay attention to the following:
1) Switch the system power supply off and disconnect the cables, including all
connections of the system. When disconnecting the cables, please hold the
connector of the cables and slowly pull the plugs out. Never pull on the cables.
2) The products need to completely cool down before dismounting the host cover or
touching the internal components.
3) During the dismounting process, avoid making large movement ranges to prevent
damage to the components or scratching arms.
4) Handle components and plug-in cards with care. Please do not touch the
components or connection points on the plug-in cards. When handling the plug-in
cards or components, firmly grab the edges of the plug-in cards and components,
and/or their metal fixed supports.
8. During the process of rack installation and application, please pay attention to the
followings:
1) After the rack installation is finished, please ensure that the stabilizers have been
fixed to the rack and supported to ground, and the weight of the rack is firm on
ground.
2) Always load from the bottom up, and load the heaviest items first.
3) When pulling out the components from the rack, apply slight force to keep the rack
balanced.

5
Safety Introduction
4) When pressing down the release latch and the rail of components is sliding, please
be careful; as the sliding may hurt your fingers.
5) Do not overload the AC power supply branch circuits in the rack. The total load of
the rack should not exceed 80% of the ratings of the branch circuits.
6) Ensure that components in the rack have good ventilation conditions.
7) When repairing components in the rack, never step on any other components.

6
2 Product Specification
2.1 Introduction
Inspur NF8260M5 is a 2U4S rack-mounted server, which is designed based on the new
generation of Intel® Xeon® scalable processor, to satisfy the requirements of virtualization,
data base (OLAP/OLTP), CRM, SAP, HANA, HPC and other compute-intensive scenarios. This
server has high quality and high reliability on the performance, storage and extension, and
makes innovations and breakthroughs on computing performance, flexible configuration
and intelligent management, particularly suitable for telecom operators, financial industry,
internet companies and other large-scale enterprises.
Main features:
Excellent computing, storage and scalability
Supports a new generation of Intel® Xeon® scalable processors, and up to 4 CPUs (TDP
205W); supports up to 48 DIMMs (RDIMM and LRDIMM), supports 2400/2666/2933MHz
memories, with computing performance increased by 65% over the previous generation.
The product density is doubled, supporting 24 2.5” hard drives (SAS/SATA HDD/SSD) in 2U
space, supporting 6 U.2 SSDs as well. Supports different types of disks for tiered storage
and improves storage performance.In addition to one PCIE OCP card, 7*PCIEX8 + 1*PCIEX16
ports can be extended through the PCIE expansion slot, which is easy for users to extend.
Application optimization
Storage modules, I/O modules, network modules, GPU modules can achieve a variety of
different combinations of scenarios, users can configure the flexibility according to business
needs.
Provides ample I/O and offers up to 8 PCI-E 3.0 slots in a small 2U chassis; 4 full-width GPU
cards are supported to meet the needs of high-end customers on system function and
performance.
Excellent low-noise and thermal design
With the systematic low-noise design, the server can achieve “quiet” work under high load.
The hot-plug fan design has both maintainability and 5+1 redundant backup capability.
Intelligent monitoring, three-dimensional management
In order to simplify the device management in data center, Inspur Dashboard visual
management module is provided. With the help of Inspur Light Path Diagnostics,

7
Product Specication
administrators can quickly locate the device to be maintained, which greatly reduces the
workload of the administrators.
Supports embedded high-capacity flash memory, built-in Inspur InCloud Manager, greatly
simplifies the user’s equipment deployment, management and maintenance.
2.5 x 24 configuration (i.e. Full Configuration)
Supports 24 2.5-inch SAS/SATA/SSD/NVME drives in the front, as shown in the figure below.
Figure 2-1
2.2 Features and Specifications
Table 2-1
Processor
Processor Type Supports 2/4 Skylake&Cascadelake Intel® Xeon® scalable processors
Supports 81/82/61/62/51/52 series, TDP 205W
Chipset
Chipset Type Intel® C620 Series Chipset
Memory
Memory Type DDR4 RDIMM/LRDIMM 2400/2666MHZ, supports NVDIMM
Memory Slot Qty. 48
Total Memory
Capacity Supports up to 3072GB (64GB per memory)
I/O
USB 1 front USB 3.0 port, 1 front USB 2.0 port, 2 rear USB 3.0 ports, 1 internal USB 3.0 port
VGA 1 front VGA port
1 rear VGA port
Serial Port 1 rear system serial port, 1 internal BMC Debug serial port
Display
Controller Type Integrated in the AST2500 chip, supports up to 1920*1200 resolution
PCIE Expansion
PCI Expansion
Slot
 3 onboard PCI Express 3.0 x24 slots, used to support PCI-E Riser cards
 Riser card can be inserted horizontally and supports full-height cards
 1 onboard Type A/C slot, used to support OCP/PHY card

8
Drive
Drive Type SSD/SATA/SAS/NVME: supports up to 24 2.5” SAS/SATA/SSD disks, and up to 6 NVME SSDs
External Storage Drive
Optical Drive Supports external USB drive
TF Card Built-in TF card
Power
Specification Dual power supply with 800W/1300W/1600W/2000Wand above output power;
1+1 redundancy
Power Input Please refer to the power input on the nameplate label of the host.
Physical
External
Dimensions of
Packing box 651 width × 295 height × 1031 depth (unit: mm)
Size of Host
Machine 435 width × 87 height × 779.5 depth (unit: mm)
Product Weight 2.5*24 full configuration (24 hard drives)
Gross weight: 37.2kg (Gross weight includes: Host + Packing Box + Rails + Accessory Box)
Environmental
Operating
Temperature 10℃-35℃
Storage &
Transportation
Temperature
-40℃-60℃
Operating
Humidity 20％-80％relative humidity
Storage &
Transportation
Humidity
20％-93％(40℃) relative humidity
2.3 Power Efficiency
Table 2-2
Efficiency
Level
Efficiency PF
Rated
Power @20%
Load
@50%
Load
@100%
Load
@50%
Load
Platinum
90% 94% 91% 0.98800W
90% 94% 91% 0.981300W
90% 94% 91% 0.981600W
90% 94% 91% 0.982000W

9
Product Specication
Table 2-3
EU Regulation 2019/424
Server configurations
High-end
performance
configuration
Low-end performance
configuration
(h) idle state power 342.8W 270.1W
(i) list of all components for additional idle power
allowances, if any (additional PSU, HDDs or SSDs,
additional memory, additional buffered DDR channels,
additional I/O devices);
NA NA
(j) maximum power, expressed in Watts and rounded to
the first decimal place; 1268W 618.4W
(k) declared operating condition class, as detailed in
Table 6; A2 A2
(l) idle state power (Watts) at the higher boundary
temperature of the declared operating condition class; 361.4W 286.1W
(m) the active state efficiency and the performance in
active state of the server; 23.3 12.6

10
3 Component Identification
3.1 Front Panel Components
2.5” × 24 HDD Bays
Figure 3-1
Figure 3-1
Item Description
1Front control panel buttons and LEDs
2 Quick release lever
3HDD bays
4 VGA port
5 USB3.0 port
6 USB2.0 + LCD port
2.5” × 24 HDD sequence diagram
Figure 3-2
Front Control Panel Buttons and LEDs
Figure 3-3

11
Component Identication
Figure 3-2
Item Description
1Power button
2UID│RST button
3System failure LED
4Memory failure LED
5Fan failure LED
6Power failure LED
7System overheat LED
8Network status LED
HDD Tray LEDs
Figure 3-4
Figure 3-3
Item Description Status & Interpretation
1Fault alarm LED
Steady red: An HDD failure occurs
Steady blue: HDD positioning
Steady pink: RAID rebuilding
2Activity status LED Steady green: Normal
Flashing green: Read and write activity
3.2 Rear Panel Components
Figure 3-5

12
Figure 3-4
Item Descripon
1PCIE slots (CPU0/3)
2PCIE slots (CPU0/1)
3PCIE slots (CPU1)
4 MLAN port
5VGA port
6 USB3.0 ports (2)
7 Serial port
8BMC_RST buon
9UID│RST buon
10 OCP card
11 RJ45 latch
12 PSU0
13 PSU1
14 GPU0
15 GPU2
16 GPU1
17 GPU3
3.3 Motherboard Components
Figure 3-6

13
Component Identication
Figure 3-5
Item Description
1BMC_RST button
2UID│RST button
3OCPB connector
4 OCPC connector
5PCH TF card slot
6 PSOC TF card slot
7OCPA connector
8 Motherboard handle0
9PCIE2_CPU1 slot
10 PSU0 connector
11 PSU1 connector
12 DIMM slots (CPU1)
13 GPU3 power connector0
14 GPU2 power connector
15 GPU1 power connector
16 GPU0 power connector
17 GPU3 I2C connector
18 GPU3 power connector1
19 PCIEX8_CPU2 Slimline connector0
20 PCIEX8_CPU2 Slimline connector1
21 Front panel left lug connector
22 CPU1 socket
23 Fan connectors (0-5)
24 DIMM slots (CPU2)
25 HDD_BP0 power connector
26 CPU2 socket
27 HDD_BP0 I2C connector
28 HDD_BP1 I2C connector
29 HDD_BP1 power connector
30 CPU3 socket
31 HDD_BP2 I2C connector
32 HDD_BP1 NVME connector
33 HDD_BP0 NVME connector
34 HDD_BP2 NVME connector
35 HDD_BP2 power connector
36 DIMM slots (CPU3)
37 Motherboard handle1

14
Item Description
38 CPU0 socket
39 DIMM slots (CPU0)
40 Front panel right lug connector
41 M2_RISER connector
42 SATA0-3 connector
43 TPM_SPI connector
44 PCIE0_CPU0/3 slot
45 CLR_CMOS
46 Network management port
47 VGA port
48 USB3.0 ports (2)
49 Serial port
50 USB3.0 port (1)
51 BMC_TF connector
52 TPM_LPC connector
53 PCIE1_CPU0/1 slot
Motherboard Jumper Introduction
See [3.3 Motherboard Components] for the jumper position.
Figure 3-6
Item Description Function
CLR_CMOS CMOS clear jumper
Short-circuit pin1-2, normal status;
Short-circuit pi
n2-3, clear CMOS.
Note:
It is required to shut down the system, as well as disconnect the power supply during CMOS
clearing. Short-circuit Pin2-3, hold for 5 seconds, and then short-circuit Pin1 and Pin2 (default
setting) to restore to its original status.