Inspur NF5280M6 User manual

Inspur Server NF5280M6
User Manual
Document Version: V1.3
Release Date: Sep 22, 2021

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Copyright © 2021 Inspur Electronic Information Industry Co., Ltd. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any
means without prior written consent of Inspur.
Environmental Protection
Please dispose of product packaging by recycling at a local recycling center for a
greener planet.
Trademarks
Inspur and Inspur Logo are the registered trademarks of Inspur.
All the other trademarks or registered trademarks mentioned herein are the property of
their respective holders.
Security Statement
•Inspur is intensely focused on server product safety and has placed a high priority
on this. For better understanding of our server products, carefully read through the
following security risk statements.
•When servers are to be repurposed or retired, it is allowed to restore their firmware
factory settings, delete information and clear logs from BIOS and BMC to protect
data privacy. Meanwhile, it is suggested to wipe the drive data thoroughly and
securely with third-party erasing tools.
•The products, services or features you purchased may obtain or use some personal
data (such as email address for alerts and IP address) during operation or fault
locating. There should be user privacy policies in place with adequate measures
implemented in accordance with the applicable laws to ensure that users' personal
data are fully protected.
•For server open source software statement, please contact Inspur Customer
Service.
•Some interfaces and commands for production, assembly and return-to-depot,
and advanced commands for locating faults, if used improperly, may cause
equipment abnormality or business interruption. This is not described herein.
Please contact Inspur for such information.
•The external interfaces of Inspur servers do not use private protocols for
communication.

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•Inspur has established emergency response procedures and action plans for
security vulnerabilities, so that product safety issues can be dealt with in a timely
manner. Please contact Inspur Customer Service for any safety problems found or
necessary support on security vulnerabilities when using our products.
Inspur shall remain committed to safety of our products and solutions to achieve better
customer satisfaction.
Disclaimer
The purchased products, services and features shall be bound by the contract made
between Inspur and the customer. All or part of the products, services and features
described herein may not be within your purchase or usage scope. Unless otherwise
agreed in the contract, Inspur makes no express or implied statement or warranty on
the contents herein. Images provided herein are for reference only and may contain
information or features that do not apply to your purchased model. This manual is only
used as a guide. Inspur shall not be liable for any damage, including but not limited to
loss of profits, loss of information, interruption of business, personal injury, or any
consequential damage incurred before, during, or after the use of our products. Inspur
assumes you have sufficient knowledge of servers and are well trained in protecting
yourself from personal injury or product damages during operation and maintenance.
The information in this manual is subject to change without notice. Inspur shall not be
liable for technical or editorial errors or omissions contained in this manual.
Technical Support
Technical Service Hotline: [phone]
Address: No. 1036 Langchao Road, Jinan, PRC
Inspur Electronic Information Industry Co., Ltd
Zip Code: 250101
Email: [e-mail]

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Foreword
Abstract
This manual describes NF5280M6 server's specifications, features, hardware setup,
warranty information and troubleshooting, which will help users to understand how
best to utilize the server and all its functionalities.
Target Audience
This manual is intended for:
•Technical support engineers
•Product maintenance engineers
It is recommended that server installation, configuration, and maintenance is
performed by experienced technicians only.
Safety Precautions
•If your purchases do not include Inspur on-site installation service, make sure that
you inspect the shipping cartons before unpacking the equipment. If a shipping
carton appears severely damaged, water immersed, or the seal or
pressure-sensitive adhesive tape (PSA) is broken, report this based on your
purchase channel. If you purchased from a third-party supplier, contact your
supplier directly; if you purchased through Inspur direct sales stores, call Inspur
service hotline [phone] for technical support.
•For your safety, please do not disassemble the server’s components, extend
configuration or connect other peripherals arbitrarily. You can contact Inspur for
our support and guidance.
•Before disassembling the server’s components, please be sure to disconnect all the
cables connected to the server.
•Please install the product-compatible operating system and use the driver that
comes with the server or provided by Inspur. You can go to our official site, on the
Top Navigator, click on Support > Product Support > Drivers, then find the correct
driver of your product based on the prompt. An incompatible operating system or
a non-Inspur driver may cause compatibility issues and affect the normal use of
the product. Inspur will not assume any responsibility or liability for this.
•BIOS and BMC setup is a significant factor in correctly configuring your server. If

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there are no special requirements, it is suggested to use the Default Values and not
alter the parameter settings arbitrarily. After the first login, please change the BMC
user password in time.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
A potential for serious injury, or even death if not
properly handled
A potential for minor or moderate injury if not
properly handled
A potential loss of data or damage to equipment if
not properly handled
Operations or information that requires special
attention to ensure successful installation or
configuration
Supplementary description of manual information
Revision History
Version Date Description of Changes
V1.0 2021/03/20 Initial release
V1.1 2021/05/20
1. Added notes for Gen4 PCIe expansion
cards
2. Added troubleshooting for HCA card
installation
3. Updated thermal restrictions
V1.2 2021/07/01 Updated the Inspur logo and corrected a
typo

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Version Date Description of Changes
V1.3 2021/09/22 1. Added Erp Lot 9 tables

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Table of Contents
1Safety Instructions......................................................................................1
1.1 Warnings.........................................................................................................1
1.2 Precautions .....................................................................................................2
2Product Specifications................................................................................5
2.1 Introduction .................................................................................................... 5
2.1.1 24 × 2.5" Configuration (Full configuration)..........................................6
2.1.2 12 × 3.5" Configuration (Full configuration)..........................................6
2.1.3 25 × 2.5" Configuration (Full configuration)..........................................7
2.2 Features and Specifications ............................................................................8
2.3 Power Efficiency............................................................................................ 10
3Product Overview ..................................................................................... 14
3.1 Front View ..................................................................................................... 14
3.1.1 24 × 2.5" Drive Bay ..............................................................................14
3.1.2 25 × 2.5" Drive Bay ..............................................................................14
3.1.3 12 × 3.5" Drive Bay ..............................................................................15
3.1.4 Front Panel Buttons and LEDs............................................................. 15
3.1.5 Drive Tray LEDs ................................................................................... 17
3.1.6 PSU LEDs.............................................................................................17
3.2 Rear View ...................................................................................................... 18
3.3 Motherboard View ........................................................................................ 19
3.4 Motherboard Jumper Introduction................................................................. 21
3.5 Layout ........................................................................................................... 22
4Getting Started ......................................................................................... 24
4.1 Installing Server into the Rack....................................................................... 24
4.2 Power On/Off................................................................................................ 24

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4.3 Pre-Disassembly Instructions ........................................................................ 24
4.4 Disassembly/Reassembly Process ................................................................ 26
4.4.1 Access Panel Replacement .................................................................26
4.4.2 Super-Capacitor Replacement............................................................28
4.4.3 Air Duct Replacement .........................................................................29
4.4.4 Hot-Swap Fan Module Replacement ..................................................29
4.4.5 Onboard M.2 Drive Replacement ........................................................30
4.4.6 DIMM Replacement.............................................................................32
4.4.7 Processor and Heatsink Module (PHM) Replacement ......................... 36
4.4.8 PCIe Card Replacement ......................................................................40
4.4.9 Hot-Swap Storage Drive Replacement ...............................................42
4.4.10 Hot-Swap PSU Replacement............................................................... 45
4.4.11 OCP Card Replacement.......................................................................46
4.4.12 Rear M.2 Drive Replacement...............................................................47
4.4.13 E1.S Drive Replacement......................................................................50
4.5 Firmware Update and Configuration............................................................. 51
4.6 Cabling.......................................................................................................... 51
5Battery Replacement ................................................................................ 54
6Electrostatic Discharge ............................................................................. 56
6.1 Preventing Electrostatic Discharge................................................................ 56
6.2 Grounding Methods to Prevent Electrostatic Discharge.................................56
7Troubleshooting....................................................................................... 57
7.1 Hardware Problems ...................................................................................... 57
7.2 Software Problems........................................................................................ 63
8Environmental Requirements ................................................................... 66
8.1 Ambient Temperature ................................................................................... 66
8.2 Vibration and Shock Resistance .................................................................... 66

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8.3 Altitude and Air Pressure............................................................................... 67
8.4 Alternating Temperature and Humidity ........................................................ 67
8.5 Extended Operation Temperature................................................................. 67
8.6 Extended Operation Temperature Limits....................................................... 68
8.7 Thermal Restrictions...................................................................................... 68
8.8 Operational Requirement.............................................................................. 69
8.9 Electromagnetic Compatibility Requirements ............................................... 72
8.10 Power Supply Requirements ......................................................................... 74
8.10.1 AC Power Supply Requirement ...........................................................74
8.10.2 DC Power Supply Requirement ...........................................................75
8.10.3 Recommendations on the AC Power Supply ....................................... 76
8.10.4 HVDC Power Supply............................................................................ 76
8.10.5 HVDC Power Supply Requirements ..................................................... 76
8.10.6 HVDC Power Supply Suggestions........................................................77
8.10.7 DC Power Supply ................................................................................ 78
9Warranty .................................................................................................. 79
9.1 Warranty Service ........................................................................................... 79
9.2 Inspur Service SLA ......................................................................................... 81
9.3 Warranty Exclusions...................................................................................... 81
Appendix........................................................................................................ 83
Drive Neodymium Content Reference Table.................................................. 83A.1
Acronyms and Abbreviations ........................................................................ 84A.2
Backplane DIP Switch.................................................................................... 91A.3

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1Safety Instructions
1.1 Warnings
Please be advised to follow the instructions below for safety. Failure to do so could
result in potential dangers that may cause property loss, personal injury or death.
•The power supplies in the system may produce high voltages and energy
hazards that may cause personal injury. For your safety, please do not attempt
to remove the cover of the system to dissemble or replace any component on
your own. Unless informed by Inspur, only service technicians trained by Inspur
are authorized to do so.
•Please connect the equipment to an appropriate power supply. Use only the
external power supplies indicated on the rated input label to power the system.
To protect your equipment from damages caused by a momentary spike or
plunge of the voltage, please use voltage stabilizing equipment or
uninterruptible power supplies.
•Do not connect two or more power cords to each other. If a longer power cord
is needed, contact Inspur Customer Service.
•Please be sure to use the power supply components that come with the server,
such as power cords, power socket (if provided with the server) etc. For your
safety and safety of the equipment, please do not replace power cords or
plugs randomly.
•To prevent electric shocks caused by leakage in the system, please make sure
that the power cables of the system and peripherals are correctly connected to
the earthed/grounded outlet. Please connect the three-core power plug to the
three-core AC power outlet that is well earthed and within reach. Be sure to use
the earthing/grounding pin of power cord and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the
earthing/grounding conductors are not installed and it is uncertain whether
there is appropriate earthing/grounding protection, please do not use or
attempt to operate the equipment. You can contact and consult an electrician.
•Please do not push any objects into the openings of the system. Doing so may
cause short circuit of internal components and then lead to fire or electric
shock.
•Please keep the system far away from the heatsink and heat sources, and be
sure not to block the air vents.
•Please be sure not to scatter food or spill liquid into the system or onto other
components. Do not use the product in high humid or dusty environments.

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•Using an incompatible battery may cause explosion. When battery
replacement is required, please consult the manufacturer first, and choose
batteries of the same or equivalent type suggested by them. Do not
disassemble, crush, puncture the batteries or short circuit the external
connection point, and do not expose them in the environment over 60°C. Never
throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries properly. Do not put waste batteries, circuit
boards or other components that may contain batteries with other wastes. For
battery recycling, please contact the local waste recycling center.
•For independent cabinets, please install front and side stabilizers before
installing the equipment into the cabinet. For cabinets connected with other
cabinets, please install front stabilizers first. Failure to install the
corresponding stabilizers before installing the equipment into the cabinet may
cause the cabinet to tip over, possibly leading to personal injury. Hence, please
do make sure to install stabilizers before installing the equipment into the
cabinet. After installing the equipment and other components into the cabinet,
only one component can be pulled out from the cabinet through its sliding part
at one time. Pulling out several components at the same time may cause the
cabinet to turn over, resulting in serious personal injury.
•Please do not move the cabinet on your own. Considering the height and
weight of the cabinet, the moving of the cabinet should be completed by at
least two people. Moving it without adequate, trained personnel could result in
severe injury or death.
•It is prohibited to directly short-circuit the copper busbar. Please do not touch
the copper busbar when the cabinet is powered on.
•This is a Class A product, and may cause radio interference. In such case, users
may need to take necessary measures to mitigate the interference.
1.2 Precautions
The following considerations may help avoid problems that could damage the
components or cause data loss, etc.
•In the event of the following, please unplug the power plug from the outlet and
contact Inspur Customer Service:
– The power cords or power plugs are damaged.
– The products get wet.
– The products have fallen or have been damaged.
– Other objects have fallen into the products.

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– The products do not or cannot function normally even when you operate
according to the instructions.
•If the system gets wet or damp, please follow steps below:
a. Power off the equipment, disconnect them with the outlet, wait for 10 to 20
seconds, and then open the access panel.
b. Move the equipment to a well-ventilated place to dry the system for at
least 24 hours and make sure that the system is fully dried.
c. Close the access panel, reconnect the system to the power outlet, and then
power on.
d. In case of operation failure or other abnormal situations, please contact
Inspur for technical support.
•Avoid cabling system cables and power cords in high foot traffic locations. Please
do not place objects on the cables.
•Before removing the access panel or accessing the internal components, please let
the equipment cool down first. To avoid damaging the motherboard, please power
off the system and wait for 5 seconds, and then remove components from the
motherboard or disconnect the peripherals from the system.
•If there are modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:
– In case of lightning, please do not connect or use the modem. Otherwise,
there's risk of lightning stroke.
– Never connect or use the modem in a damp environment.
– Never insert the modem or telephone cables into the socket of network
interface controller (NIC).
– Before unpacking the product package, accessing or installing internal
components, or touching uninsulated cables or jacks of the modem, please
disconnect the modem cables.
•In order to avoid damages of electronic components in the equipment caused by
electrostatic discharge, please pay attention to the followings:
a. Please remove any static electricity on your body before dismounting or
accessing any electronic component in the equipment, to prevent the static
electricity from conducting itself to the sensitive components. You may
remove the static electricity on your body by touching the metal earthing
objects (such as the unpainted metal surface on the rack).
b. Please do not take static sensitive components that are not ready to be
installed or used out of the anti-static packages.

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c. During operation, please touch the earthing conductor or the unpainted
metal surface on the cabinet regularly to remove any static electricity from
your body that may damage the internal components.
•When dismounting internal components upon receiving proper authorization from
Inspur, please pay attention to the followings:
a. Power off the system and disconnect the cables, including all connections
of the system. When disconnecting the cables, please hold the connector
of the cables to slowly pull them out. Never pull the cables.
b. Only after the products completely cool down can you dismount the
access panel or access the internal components.
c. Please remove any static electricity on your body by touching metal
earthing objects before dismounting or accessing any electronic
component in the equipment.
d. When dismounting, avoid making large movement to prevent damage to
the components or scratching arms.
e. Handle components and plug-in cards with care. Please do not touch the
components or connectors on the plug-in cards. When handling the
plug-in cards or components, firmly grab the edges of the plug-in cards or
those of components, or their metal retaining brackets.
•During cabinet installation and application, please pay attention to the followings:
a. After the cabinet has been installed, please ensure that the stabilizer feet
have been fixed into the cabinet and supported to ground, and the full
weight of the cabinet is on the ground.
b. Always load from the bottom up, and load the heaviest items first.
c. When pulling out components from the rack, apply slight force to keep the
rack balanced.
d. Please be careful when pressing down the release latch to slide the server
in or out as the rail may hurt your fingers.
e. Do not overload the AC power branch circuits in the cabinet. The total load
of the cabinet should not exceed 80% of the ratings of the branch circuits.
f. Ensure that components in the cabinet are well vented.
g. When repairing components in the cabinet, never step on any other
component.

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2Product Specifications
2.1 Introduction
The Inspur NF5280M6 is a high-end 2-socket rack server that features the 3rd
generation Intel® Xeon® scalable processors and is designed for high-end IT
applications such as cloud computing, big data, data mining, deep learning etc. The
server maintains high quality and reliability you have come to expect from Inspur
servers and achieves innovation and breakthrough in compute performance, scalability,
configuration elasticity, intelligent management, etc. Hence, it is perfect for
high-demanding customers in telecommunications, finance, large-scale enterprise,
Internet industry, etc.
●Key features:
•2 Intel® Xeon® scalable processors, TDP up to 270 W
•3 channels UPI for 11.2 GT/s
•Up to 32 DIMMs with RDIMMs, LRDIMMs, NVDIMMs (BPS), memory mirroring and
memory hot spare supported
•Up to 24 × 2.5" SAS/SATA/NVMe drive or 12 × 3.5" SAS/SATA drive at the front
•Up to 10 × 2.5" SAS/SATA drive or 4 × 2.5" SAS/SATA/NVMe drive and 4 × 3.5"
SAS/SATA drive at the rear
•Up to 4 × 3.5" internal SAS/SATA drive
•1 OCP 3.0 SFF expansion card
•4 onboard Slimline x8 connectors to directly attach NVMe drives from CPU
•Up to 14 onboard direct-attached drives from PCH
•Up to 11 standard PCIe expansion cards, including 5 full-height and 6 half-height
half-length cards
•Up to 4 double-width GPUs
•Motherboard integrated with AST2500 BMC chip with KVM functionality as standard
•Hot-swap LCD module and remote monitoring on mobile devices via BMC
•Intel remote BMC debug
•Modular design of drives, PCI expansion cards, PSUs and fans, enabling free-tool
maintenance
•Hot-swap and redundant CRPS of 80 Plus Platinum or higher rank with PMBus and
NM 4.0 functionality

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•Hot-swap fan/fan cage design; the fan is N+1 redundant and of low noise
2.1.1 24 × 2.5" Configuration (Full configuration)
Up to 24 front 2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.
Figure 2-1 24 × 2.5" Configuration
2.1.2 12 × 3.5" Configuration (Full configuration)
3.5 inch drive trays can accommodate 3.5- or 2.5-inch drives.
Up to 12 front 3.5/2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.

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Figure 2-2 12 × 3.5" Configuration
2.1.3 25 × 2.5" Configuration (Full configuration)
Up to 25 front 2.5-inch SAS/SATA drives, as shown in the figure below.
Figure 2-3 25 × 2.5" Configuration

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2.2 Features and Specifications
Table 2‑1 Features and Specifications
Manufacturing
Time
2021/4
Processor
Processor Type The 3rd generation Intel® Xeon® scalable processors
(Up to 2 CPUs with TDP up to 270 W)
Socket Two
Chipset
Chipset Type C621A
Memory
Memory Type RDIMMs, LRDIMMs, NVDIMMs (Barlow Pass)
Memory Slot Qty 32 (Refer to DIMM Replacement for DIMM population
and combination principles)
Total Memory
Capacity Up to 4.0 TB (128 GB per memory module)
I/O Port
USB 2 rear USB 3.0 ports, 1 front USB 3.0 port and 1 front
USB 2.0 port
VGA 1 front VGA port
1 rear VGA port
Serial Port 1 rear serial port
UID LED 2 UID buttons with LEDs (1 front and 1 rear)
Display
Controller Type Integrated in the Aspeed 2500 chip, up to 1280 × 1024
resolution
Backplane
Backplane
Hot-swap SAS/SATA/NVMe drives
NIC
NIC Controller
Standard OCP NIC 3.0 cards or standard PCIe cards and
onboard Intel X710 network supported on the
motherboard
Management
Management Chip Integrated with 1 independent 1000 Mbps network
port, dedicated for IPMI remote management.
PCIe Expansion
Slot
3 onboard PCI Express Gen-Z 4.0 x16 slots and 1
PCI Express 4.0 x16 slot (16 lanes) for PCIe Riser
cards
The Riser card supports horizontal-inserted
full-height or half-height cards
8 PCIe Cards Configuration: Up to 3 Riser cards
(You can choose left 2 slot Riser or left 3 slot Riser)

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– Right 2 slot Riser (PCIe signal routed from
CPU0) is populated with a Riser card with 2 PCI
Express 4.0 x16 slots
– Middle 3 slot Riser (PCIe signal routed from
CPU0/CPU1) is populated with a Riser card
with 2 PCI Express 3.0 x8 slots and 1 PCI
Express 4.0 x16 slot
– Left 2 slot Riser (PCIe signal routed from CPU1)
is populated with a Riser card with 2 PCI
Express 4.0 x16 slots
– Left 3 slot Riser (PCIe signal routed from CPU1)
is populated with 1 Riser card with 1 PCI
Express 3.0 x16 slot and 2 PCI Express 3.0 x16
slots
11 PCIe Configuration
– Right 5 slot Riser (PCIe signal routed from
CPU0/1) is populated with a Riser card with 1
PCI Express 3.0 x16 slot and 4 PCI Express 3.0
x8 slots
– Left 6 slot Riser (PCIe signal routed from
CPU0/1) is populated with a Riser card with 6
PCI Express 3.0 x8 slots
4-GPU Configuation
– Left 1 slot Riser (PCIe signal routed from CPU1)
is populated with 1 Riser card with 1 PCI
Express 4.0 x16 slot
•1 onboard OCP NIC 3.0 SFF slot for OCP NIC 3.0
card
Drive
Drive Type
2.5"/3.5" SAS/SATA/NVMe drives (Actual configuration
may vary depending on the model you purchased)
External Storage Drive
Optical Drive External USB optical drives
T-flash Card Built-in TF card
Power

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Specification
•
Single/dual power supplies with output
power at 550 W/800 W/1300 W/1600 W or
higher
•1+1 redundancy
•2 power supply units
•PMBus power and Node Manager 4.0
supported
Power Input Please refer to the power input on the nameplate label
of the chassis
Physical
Outer Packaging
Dimensions
780-length packaging box: 651 width × 295 height ×
1031 depth (mm)
Chassis
Dimensions (With
Mounting Ears)
780-length chassis: 478.8 width × 87 height × 811.7
depth (mm)
Product Weight
Full configuration of 12 × 3.5" drive (with 12 drives)
Net weight: 31.2 kg
Gross weight: 41 kg (Chassis + Packaging Box + Rails +
Accessory Box)
Full configuration of 24 × 2.5" drive (with 24 drives)
Net weight: 25.2 kg
Gross weight: 35 kg (Chassis + Packaging Box + Rails +
Accessory Box)
2.3 Power Efficiency
Table 2‑2 Power Efficiency of Platinum Power Supplies
Rated
Power
@20%
Load
@50%
Load
@100%
Load
PF@50%
Load
550 W 90% 94% 91% 0.98
800 W 90% 94% 91% 0.98
1300 W 90% 94% 91% 0.98

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Rated
Power
@20%
Load
@50%
Load
@100%
Load
PF@50%
Load
1600 W 90% 94% 91% 0.98
2000 W 90% 94% 91% 0.98
Table 2-3 Power Efficiency of Titanium Power Supplies
Rated
Power
@10%
Load
@20%
Load
@50%
Load
@100%
Load
PF@50%
Load
800 W 90% 94% 96% 91% 0.98
Table 2-4 Erp Lot 9-1
EU Regulation 2019/424
Server configurations
High-end
performance
configuration
Low-end
performance
configuration
(h) idle state power 187.8 166.4
(i) list of all components for
additional idle power
allowances, if any
(additional PSU, HDDs or
SSDs, additional memory,
additional buffered DDR
channels, additional I/O
devices);
See Table 2-5 See Table 2-5
(j) maximum power,
expressed in Watts and
rounded to the first decimal
place;
855.3 580.9
(k) declared operating
condition class;
A2 A2