Inspur NF5180M6 User manual

Inspur Server NF5180M6
User Manual
Document Version: V1.5
Release Date: February 10 2022

Copyright © 2022 Inspur Electronic Information Industry Co., Ltd. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any
means without prior written consent of Inspur.
Environmental Protection
Please dispose of product packaging by recycling at a local recycling center for a
greener planet.
Trademarks
Inspur and Inspur Logo are the registered trademarks of Inspur. All the other
trademarks or registered trademarks mentioned herein are the property of their
respective holders.
Security Statement
Inspur is intensely focused on server product safety and has placed a high priority on
this. For better understanding of our server products, carefully read through the
following security risk statements.
When servers are to be repurposed or retired, it is recommended to restore their
firmware factory settings, delete information and clear logs from BIOS and BMC to
protect data privacy. Meanwhile, it is suggested to wipe the drive data thoroughly
and securely with third-party erasing tools.
The products, services or features you purchased may obtain or use some personal
data (such as email address for alerts and IP address) during operation or fault
locating. There should be user privacy policies in place with adequate measures
implemented in accordance with the applicable laws to ensure that users' personal
data are fully protected.
For server open source software statement, please contact Inspur Customer
Service.
Some interfaces and commands for production, assembly and return-to-depot,
and advanced commands for locating faults, if used improperly, may cause
equipment abnormality or business interruption. This is not described herein.
Please contact Inspur for such information.
The external interfaces of Inspur servers do not use private protocols for
communication.
Inspur has established emergency response procedures and action plans for
security vulnerabilities, so that product safety issues can be dealt with in a timely
manner. Please contact Inspur Customer Service for any safety problems found or
necessary support on security vulnerabilities when using our products.

Inspur shall remain committed to safety of our products and solutions to achieve better
customer satisfaction.
Disclaimer
The purchased products, services and features shall be bound by the contract made
between Inspur and the customer. All or part of the products, services and features
described herein may not be within your purchase or usage scope. Unless otherwise
agreed in the contract, Inspur makes no express or implied statement or warranty on
the contents herein. Images provided herein are for reference only and may contain
information or features that do not apply to your purchased model. This manual is only
used as a guide. Inspur shall not be liable for any damage, including but not limited to
loss of profits, loss of information, interruption of business, personal injury, or any
consequential damage incurred before, during, or after the use of our products. Inspur
assumes you have sufficient knowledge of servers and are well trained in protecting
yourself from personal injury or preventing product damages during operation and
maintenance. The information in this manual is subject to change without notice.
Inspur shall not be liable for technical or editorial errors or omissions contained in this
manual.
Technical Support
Global Service Hotline: [phone]
Address:
No. 1036 Langchao Road, Jinan, PRC
Inspur Electronic Information Industry Co., Ltd
Postal Code: 250101
Email: [e-mail]

Foreword
Abstract
This manual describes NF5180M6 server's specifications, features, hardware setup,
warranty information and troubleshooting, which will help users to understand how
best to utilize the server and all its functionalities.
Target Audience
This manual is intended for:
Technical support engineers
Product maintenance engineers
It is recommended that server installation, configuration, and maintenance is
performed by experienced technicians only.
Safety Precautions
If your purchases do not include Inspur on-site installation service, make sure that
you inspect the shipping cartons before unpacking the equipment. If a shipping
carton appears severe damaged, water immersed, or the seal or pressure-
sensitive adhesive tape (PSA) is broken, report this based on your purchase
channel. If you purchased from a third-party supplier, contact your supplier
directly; if you purchased through Inspur direct sales stores, call Inspur service
hotline [phone] for technical support.
For your safety, please do not disassemble the server’s components, extend
configuration or connect other peripherals arbitrarily. You can contact Inspur for
our support and guidance.
Before disassembling the server’s components, please be sure to disconnect all the
cables connected to the server.
Please install the product-compatible operating system and use the driver that
comes with the server or provided by Inspur. You can go to our official site, on the
Top Navigator, click on Support > Product Support > Drivers, then find the correct
driver of your product based on the prompt. An incompatible operating system or
a non-Inspur driver may cause compatibility issues and affect the normal use of
the product. Inspur will not assume any responsibility or liability for this.
BIOS and BMC setup is a significant factor in correctly configuring your server. If
there are no special requirements, it is suggested to use the Default Values and not

alter the parameter settings arbitrarily. After the first login, please change the BMC
user password in time.
Conventions
The symbols that may be found in this document are defined as follows.
Icon Description
A potential for serious injury, or even death if not properly
handled
A potential for minor or moderate injury if not properly
handled
A potential loss of data or damage to equipment if not
properly handled
Operations or information that requires special attention to
ensure successful installation or configuration
Supplementary description of important information
Revision History
Version Date Description of Changes
V1.5 2022/02/10
Added descriptions in Section 4.6, optimized
Figure 5-1, 8-1 and 8-2, deleted the 1- and 3-
DIMM population for dual-CPU configuration
in memory population guidelines
V1.4 2021/08/16 Updated Safety Instructions
V1.3 2021/06/24 Added table names for some tables
V1.2 2021/05/14 Updated 4.4.8 E1.S Drive replacement
V1.1 2021/04/09 Updated configuration descriptions in Section
3.1 and 11.7
V1.0 2021/01/15 Initial release

Table of Contents
1Safety Instructions......................................................................................1
1.1 Warnings......................................................................................................... 1
1.2 Precautions .....................................................................................................2
2Product Specifications ................................................................................5
2.1 Introduction .................................................................................................... 5
2.1.1 10 × 2.5-inch Configuration ..................................................................6
2.1.2 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration......................................6
2.1.3 32 × E1.S Configuration.........................................................................6
2.2 Features and Specifications ............................................................................ 7
2.3 Power Efficiency ..............................................................................................9
3Product Overview ..................................................................................... 12
3.1 Front View ..................................................................................................... 12
3.1.1 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration....................................12
3.1.2 4 × 3.5-inch + 4 × 2.5-inch Configuration ............................................12
3.1.3 10 × 2.5-inch Configuration ................................................................ 13
3.1.4 8 × 2.5-inch + 2 × E1.S + 2 × M.2 Configuration....................................13
3.1.5 12 × 2.5-inch Configuration ................................................................ 14
3.1.6 32 × E1.S Configuration.......................................................................14
3.1.7 EVAC Heatsink Server.......................................................................... 15
3.1.8 Front Panel Buttons and LEDs............................................................. 15
3.1.9 Drive Tray LEDs ................................................................................... 16
3.2 Rear View ...................................................................................................... 17
3.2.1 1 × PCIe + 2 × 2.5-inch .........................................................................17
3.2.2 2 × PCIe ............................................................................................... 17
3.2.3 3 × PCIe ............................................................................................... 18
3.3 Motherboard View ........................................................................................ 19
3.4 Motherboard Jumper Introduction................................................................. 20
3.5 System Layout............................................................................................... 21
4Getting Started ......................................................................................... 23
4.1 Installing Server into the Rack....................................................................... 23
4.2 Power On/Off................................................................................................ 23
4.3 Pre-Disassembly Instructions ........................................................................ 24
4.4 Disassembly/Reassembly Process ................................................................ 26
4.4.1 Access Panel Replacement ................................................................. 26
4.4.2 Air Duct Replacement .........................................................................27
4.4.3 Crossbar Replacement........................................................................28

4.4.4 Super-Capacitor Replacement............................................................ 29
4.4.5 Hot-Swap Fan Module Replacement ..................................................30
4.4.6 OCP 3.0 NIC Replacement ...................................................................33
4.4.7Hot-Swap 2.5/3.5-inch Storage Drive Replacement ........................... 34
4.4.8 E1.S Drive Replacement......................................................................37
4.4.9 M.2 Drive Replacement .......................................................................41
4.4.10 Hot-Swap and Redundant PSU Replacement .....................................46
4.4.11 DIMM Replacement............................................................................. 47
4.4.12 Processor and Heatsink Module (PHM) Replacement .........................50
4.4.13 PCIe Card Replacement ...................................................................... 55
4.4.14 RAID Controller Card Replacement .....................................................57
4.5 Firmware Update and Configuration............................................................. 58
4.6 Cable Routing................................................................................................ 59
5Battery Replacement ................................................................................ 61
6Electrostatic Discharge ............................................................................. 63
6.1 Preventing Electrostatic Discharge................................................................ 63
6.2 Grounding Methods to Prevent Electrostatic Discharge................................. 63
7Troubleshooting....................................................................................... 64
7.1 Hardware Problems ...................................................................................... 64
7.1.1 Power-On Failure................................................................................64
7.1.2 No Display .......................................................................................... 64
7.1.3 Abnormal LED on the Front Panel.......................................................65
7.1.4 Stuck in POST Interface or Other Interface .......................................... 66
7.1.5 PSU LED Off or Illuminates Amber.......................................................66
7.1.6 Abnormal Drive Status LED ................................................................. 66
7.1.7 Loud System Fan Noise....................................................................... 67
7.1.8 Alarm Sound from the Server ............................................................. 68
7.1.9 Keyboard and Mouse Failure.............................................................. 68
7.1.10 USB Port Problem ...............................................................................69
7.2 Software Problems........................................................................................ 69
7.2.1 OS Installation Problems .................................................................... 69
7.2.2 PXE Boot Failure .................................................................................70
7.2.3 Abnormal Memory Capacity ...............................................................70
7.2.4 Abnormal Network .............................................................................70
8Environmental Requirements ................................................................... 72
8.1 Ambient Temperature ................................................................................... 72
8.2 Vibration and Shock Resistance .................................................................... 72
8.3 Altitude and Air Pressure............................................................................... 73

8.4 Alternating Temperature and Humidity ........................................................ 73
8.5 Expanded Operation Temperature................................................................ 73
8.6 Expanded Operation Temperature Limits...................................................... 73
8.7 Thermal Limit ................................................................................................ 74
8.8 Operational Requirement.............................................................................. 76
8.9 Electromagnetic Compatibility Requirements ............................................... 79
8.10 Power Supply Requirements ......................................................................... 81
8.10.1 AC Power Supply Requirement ...........................................................81
8.10.2 DC Power Supply Requirement ...........................................................81
8.10.3 Recommendations on the AC Power Supply .......................................82
8.10.4 HVDC Power Supply............................................................................ 83
8.10.5 HVDC Power Supply Requirements ..................................................... 83
8.10.6 HVDC Power Supply Suggestions........................................................84
8.10.7 DC Power Supply ................................................................................ 84
9Warranty .................................................................................................. 85
9.1 Warranty Service ........................................................................................... 85
9.2 Inspur Service SLA ......................................................................................... 86
9.3 Warranty Exclusions ...................................................................................... 87
Appendix........................................................................................................ 89
Drive Neodymium Content Reference Table.................................................. 89
Acronyms and Abbreviations ........................................................................ 90

1
1Safety Instructions
1.1 Warnings
Please be advised to follow the instructions below for safety. Failure to do so could
result in potential dangers that may cause property loss, personal injury or death.
1. The power supplies in the system may produce high voltages and energy hazards
that may cause personal injury. For your safety, please do not attempt to remove
the cover of the system to disassemble or replace any component on your own.
Unless informed by Inspur, only service technicians trained by Inspur are
authorized to do so.
2. Please connect the equipment to an appropriate power supply. Use only the
external power supplies indicated on the rated input label to power the system. To
protect your equipment from damages caused by a momentary spike or plunge of
the voltage, please use voltage stabilizing equipment or uninterruptible power
supplies.
3. Do not connect two or more power cords to each other. If a longer power cord is
needed, contact Inspur Customer Service.
4. Please be sure to use the power supply components that come with the server,
such as power cords, power socket (if provided with the server) etc. For your safety
and safety of the equipment, please do not replace power cords or plugs
randomly.
5. To prevent electric shocks caused by leakage in the system, please make sure that
the power cables of the system and peripherals are correctly connected to the
earthed/grounded outlet. Please connect the three-core power plug to the three-
core AC power outlet that is well earthed and within reach. Be sure to use the
earthing/grounding pin of power cord and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the
earthing/grounding conductors are not installed and it is uncertain whether there
is appropriate earthing/grounding protection, please do not use or attempt to
operate the equipment. You can contact and consult an electrician.
6. Please do not push any objects into the openings of the system. Doing so may
cause short circuit of internal components and then lead to fire or electric shock.
7. Please keep the system far away from the heatsink and heat sources, and be sure
not to block the air vents.
8. Please be sure not to scatter food or spill liquid into the system or onto other
components. Do not use the product in high humid or dusty environments.

2
9. Using an incompatible battery may cause explosion. When battery replacement is
required, please consult the manufacturer first, and choose batteries of the same
or equivalent type suggested by them. Do not disassemble, crush, puncture the
batteries or short circuit the external connection point, and do not expose them in
the environment over 60°C (140°F). Never throw batteries into fire or water. Please
do not attempt to open or repair the batteries. Dispose of used batteries properly.
Do not put waste batteries, circuit boards or other components that may contain
batteries with other wastes. For battery recycling, please contact the local waste
recycling center.
10. For independent cabinets, please install front and side stabilizers before installing
the equipment into the cabinet. For cabinets connected with other cabinets, please
install front stabilizers first. Failure to install the corresponding stabilizers before
installing the equipment into the cabinet may cause the cabinet to tip over,
possibly leading to personal injury. Hence, please do make sure to install
stabilizers before installing the equipment into the cabinet. After installing the
equipment and other components into the cabinet, only one component can be
pulled out from the cabinet through its sliding part at one time. Pulling out several
components at the same time may cause the cabinet to turn over, resulting in
serious personal injury.
11. Please do not move the cabinet on your own. Considering the height and weight of
the cabinet, the moving of the cabinet should be completed by at least two people.
Moving it without adequate, trained personnel could result in severe injury or
death.
12. It is prohibited to directly short-circuit the copper busbar. Please do not touch the
copper busbar when the cabinet is powered on.
13. This is a Class A product, and may cause radio interference. In such case, users
may need to take necessary measures to mitigate the interference.
1.2 Precautions
The following considerations may help avoid problems that could damage the
components or cause data loss, etc.
In the event of the following, please unplug the power plug from the outlet and
contact Inspur Customer Service:
-The power cords or power plugs are damaged.
-The products get wet.
-The products have fallen or have been damaged.
-Other objects have fallen into the products.
-The products do not or cannot function normally even when you operate
according to the instructions.
If the system gets wet or damp, please follow steps below:

3
-Power off the equipment, disconnect them with the outlet, wait for 10 to 20
seconds, and then open the access panel.
-Move the equipment to a well-ventilated place to dry the system for at least 24
hours and make sure that the system is fully dried.
-Close the access panel, reconnect the system to the power outlet, and then
power on.
-In case of operation failure or other abnormal situations, please contact Inspur
for technical support.
-Avoid cabling system cables and power cords in high foot traffic locations.
Please do not place objects on the cables.
-Before removing the access panel or accessing the internal components,
please let the equipment cool first. To avoid damaging the motherboard,
please power off the system and wait for 5 seconds, and then remove
components from the motherboard or disconnect the peripherals from the
system.
-If there are modem, telecom or LAN options installed in the equipment, please
pay attention to the followings:
-In case of thunder and lightning, please do not connect or use the modem.
Otherwise, there's risk of lightning stroke.
-Never connect or use the modem in a damp environment.
-Never insert the modem or telephone cables into the socket of network
interface controller (NIC).
-Before unpacking the product package, accessing or installing internal
components, or touching uninsulated cables or jacks of the modem, please
disconnect the modem cables.
In order to avoid damages of electronic components in the equipment caused by
electrostatic discharge, please pay attention to the followings:
-Please remove any static electricity on your body before dismounting or
accessing any electronic component in the equipment, to prevent the static
electricity from conducting itself to the sensitive components. You may remove
the static electricity on your body by touching the metal earthing objects (such
as the unpainted metal surface on the rack).
-Please do not take static sensitive components that are not ready to be
installed or used out of the anti-static packages.
-During operation, please touch the earthing conductor or the unpainted metal
surface on the cabinet regularly to remove any static electricity from your body
that may damage the internal components.
When dismounting internal components upon receiving proper authorization from
Inspur, please pay attention to the followings:
-Power off the system and disconnect the cables, including all connections of
the system. When disconnecting the cables, please hold the connector of the
cables to slowly pull them out. Never pull the cables.

4
-Only after the products completely cool down can you dismount the access
panel or access the internal components.
-Please remove any static electricity on your body by touching metal earthing
objects before dismounting or accessing any electronic component in the
equipment.
-When dismounting, avoid making large movement to prevent damage to the
components or scratching arms.
-Handle components and plug-in cards with care. Please do not touch the
components or connectors on the plug-in cards. When handling the plug-in
cards or components, firmly grab the edges of the plug-in cards or those of
components, or their metal retaining brackets.
During cabinet installation and application, please pay attention to the followings:
-After the cabinet has been installed, please ensure that the stabilizer feet have
been fixed into the rack and supported to ground, and all the weight of the
rack has fallen to the ground.
-Always load from the bottom up, and load the heaviest items first.
-When pulling out components from the rack, apply slight force to keep the rack
balanced.
-Please be careful when pressing down the release latch to slide components in
or out as the rail may hurt your fingers.
-Do not overload the AC power branch circuits in the cabinet. The total load of
the cabinet should not exceed 80% of the ratings of the branch circuits.
-Ensure that components in the cabinet are well vented.
-When repairing components in the cabinet, never step on any other
component.

5
2Product Specifications
2.1 Introduction
Inspur NF5180M6 is a high-end 2-socket rack-mounted server that features the third
generation Intel® Xeon® scalable processors and is designed for high-end IT
applications such as virtualization, database and high-end computing etc, delivering
high performance and high density in a compact space. The server maintains high
quality and reliability of Inspur servers and achieves innovation and breakthrough in
compute performance, scalability, configuration elasticity, intelligent management,
etc. Hence, it is perfect for high-demanding customers in communications, finance,
large-scale enterprise, Internet industry, etc.
Key features:
2 Intel® Xeon® scalable processors, TDP up to 270 W
3 channels UPI for 11.2 GT/s
Up to 32 DIMMs with RDIMMs, LRDIMMs, NVDIMMs (BPS) memory mirroring and
memory hot spare supported
Up to 12 hot-swap SAS/SATA/NVMe drives or 32 hot-swap E1.S all-flash drives at
the front
Up to 2 × 2.5-inch SAS/SATA/SSD at the rear
Hot-swap OCP 3.0 SFF expansion card
4 onboard Slimline connectors, 2 Gen-Z connectors and up to 12 direct-attached
onboard NVMe drives
Up to 3 standard PCIe expansion cards, including 1 full-height half-length and 2
half-height half-length cards
Up to 2 single-width GPUs
Onboard AST2500 BMC chip with KVM functionality as standard
Hot-swap LCD module and remote monitoring on mobile devices via BMC
Intel remote BMC debug
Dual BIOS and dual BMC Flash chip redundancy
NVMe hardware RAID
Modular design of drives, PCI expansion cards, PSUs and fans, enabling free-tool
maintenance

6
Hot-plug and redundant CRPS of 80 Plus Platinum or higher rank with PMBus and
NM 4.0 functionality
Hot-plug fan/fan cage design; the fan is N+1 redundant and of low noise
2.1.1 10 × 2.5-inch Configuration
Up to 10 front 2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.
Figure 2-1 10 × 2.5-inch Configuration
2.1.2 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration
3.5-inch drive trays can accommodate 3.5- or 2.5-inch drives.
Figure 2-2 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration
2.1.3 32 × E1.S Configuration
32 front E1.S SSDs, as shown in the figure below.
Figure 2-3 32 × E1.S configuration

7
2.2 Features and Specifications
Table 2-1 Features and Specifications
Time to
Market 2021/4
Processor Processor Type 2 third generation Intel® Xeon® scalable
processors (TDP at 270 W)
Chipset Chipset Type C621A
Memory
Memory Type RDIMM, LRDIMM, NVDIMM and Barlow Pass
Memory Slot Qty 32
Total Memory
Capacity
Up to 10 TB
Storage Storage
Configuration
Front panel:
12 hot-swap 2.5-inch SATA/SAS/NVMe
drives (Up to 12 NVMe drives)
32 hot-swap E1.S SSDs
4 × 3.5-inch SAS/SATA/NVMe drive (hot-
swap) + 2 × M.2 (non-hot-swap) + 2 ×
E1.S (hot-swap)
4 × 3.5-inch SAS/SATA/NVMe drive (hot-
swap) + 4 × 2.5-inch SAS/SATA/NVMe
drive (hot-swap)
10 × 2.5-inch SATA/SAS/NVMe drive
(hot-swap)
8 × 2.5-inch SATA/SAS/NVMe drive (hot-
swap) + 2 × E1.S (hot-swap) + 2 × M.2
(non-hot-swap)
Rear panel:
2 × 2.5-inch SATA/SAS drive (hot-swap)
Internal storage:
Up to 2 TF cards (one for BIOS and the
other for BMC)
Up to 2 SATA M.2 drives
Up to 2 PCIe x4 M.2 drives
I/O
Connector USB Port 2 rear USB 3.0 ports, 1 front USB 2.0 + 1 front USB 3.0 port

8
Video 1 front and 1 rear VGA ports
Serial Port
1 rear serial port
UID LED 2 UID buttons with LEDs (1 front and 1 rear)
Management
Network Port
One 1000 Mbps BMC management network
port
Display Controller Type Integrated in the Aspeed AST2500 chip, up to
1280 × 1024 resolution
Network NIC Controller
1 optional OCP 3.0 module (1 Gb/s, 10 Gb/s,
25 Gb/s, 40 Gb/s, 100 Gb/s)
A pair of onboard ten Gigabit Ethernet ports
(10 Gb/s)
A pair of onboard Gigabit Ethernet ports (1
Gb/s)
Standard 1 Gb/10 Gb/25 Gb/40 Gb/100 Gb
NICs
Expansion
Slot PCIe Expansion Slot
Up to 3 PCI Express 4.0 slots for standard
PCIe cards (1 PCIe 4.0 x16 full height
card and 2 PCIe 4.0 x16 half height
cards)
1 onboard OCP 3.0 SFF slot for OCP 3.0
card
2 internal SATA M.2 or PCIe x4 M.2
Fan Fan Configuration 8 hot-swap N+1 redundant fans (4056)
Power
Specification 1+1 redundant power supplies (550 W/800
W/1300 W and above)
Power Input Please refer to the power input on the
nameplate label of the chassis
Physical
Outer Packaging
Dimensions (L × W ×
H)
780-depth chassis: 1031 × 651 × 247 mm
(40.59 × 25.63 × 9.72 in.)
840-depth chassis: 1080 × 600 × 240 mm
(42.52 × 23.62 × 9.45 in.)
Chassis Dimensions
(W × H × D)
With mounting ears:
482 × 43.05 × 811.8 mm (18.98 × 1.69 × 31.96
in.)
32-E1.S SSD system: 482 × 43.05 × 871.8 mm
(18.98 × 1.69 × 34.32 in.)
Without mounting ears:

9
438 × 43.05 × 780 mm (17.24 × 1.69 × 30.71
in.)
32-E1.S SSD system: 438 × 43.05 × 840 mm
(17.24 × 1.69 × 33.07 in.)
Product Weight
4 × 3.5-inch configuration (rear 2.5-inch
drives included):
Net weight: about 21 kg (56.26 lbs)
Gross weight: 31.5 kg (84.40 lbs) (Packages
+Rails + Accessory Box included)
10 × 2.5-inch Configuration (rear 2.5-
inch drives included):
Net weight: about 21 kg (56.26 lbs)
Gross weight: 31 kg (83.06 lbs) (Packages
+Rails + Accessory Box included)
2.3 Power Efficiency
Table 2-2 Platinum Power Supplies
Rated
Power
@20%Load @50%Load @100%Load PF@50%Load
550 W
90%
94%
91%
0.98
800 W 90% 94% 91% 0.98
1300 W
90%
94%
91%
0.98
Table 2-3 Titanium Power Supplies
Rated
Power
@10%
Load
@20%
Load
@50%
Load
@100%
Load
PF@50%
Load
800 W 90% 94% 96% 91% 0.98
Table 2-4 ErP lot 9-1
EU Regulation 2019/424
Server configurations
High-end
performance
configuration
Low-end
performance
configuration
(h) idle state power 322.7W 202.3W
(i) list of all components for
additional idle power allowances,
if any (additional PSU, HDDs or
SSDs, additional memory,
additional buffered DDR channels,
additional I/O devices);
See Table 2-5 See Table 2-5

10
EU Regulation 2019/424
Server configurations
High-end
performance
configuration
Low-end
performance
configuration
(j) maximum power, expressed in
Watts and rounded to the first
decimal place;
956.8 W 688.1 W
(k) declared operating condition
class, as detailed in Table 6;
A2 A2
(l) idle state power (Watts) at the
higher boundary temperature of
the declared operating condition
class;
328.4 W 206.9 W
(m) the active state efficiency and
the performance in active state of
the server;
40.5 30.4
Table 2-5 ErP lot 9-2
(i) List of components for additional
power allowance
High-end
performance
configuration
Low-end
performance
configuration
CPU
Performance
1 socket: 10 × Perf CPU
W
2 socket: 7 × Perf CPU
W
240.31 W 124.81 W
Additional PSU 10 W per PSU 10 W 10 W
HDD or SSD 5,0 W per HDD or SSD 10 W 10 W
Additional
memory
0,18 W per GB 367.92 W 45.36 W
Additional
buffered DDR
channel
4,0 W per buffered
DDR channel
32 W 32 W
Additional I/O
devices
< 1 Gb/s: No
Allowance
= 1 Gb/s: 2,0 W/Active
Port
> 1 Gb/s and < 10
Gb/s: 4,0 W/Active
Port
≥ 10 Gb/s and <
25Gb/s: 15,0 W/Active
Port
0 0

11
(i) List of components for additional
power allowance
High-end
performance
configuration
Low-end
performance
configuration
≥ 25 Gb/s and <
50Gb/s: 20,0 W/Active
Port
≥ 50 Gb/s 26,0
W/Active Port
Total power 660.23 W 222.17 W

12
3Product Overview
3.1 Front View
3.1.1 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration
Figure 3-1 Front Panel of 4 × 3.5-inch + 2 × E1.S + 2 × M.2 Configuration
# Item
1 E1.S Drive Bay × 2
2 M.2 Drive Bay × 2
3 Power Button/LED
4 UID/BMC RST Button/LED
5 LEDs
6 USB 3.0 Port
7 USB 2.0 Port
8 VGA Port
9 Quick Release Lever × 2
10 3.5-inch Drive Bay × 4
3.1.2 4 × 3.5-inch + 4 × 2.5-inch Configuration
Figure 3-2 Front Panel of 4 × 3.5-inch + 4 × 2.5-inch Configuration
# Item
1 2.5-inch Drive Bay × 4
2 Power Button/LED