Intel BX80580Q9400 - Core 2 Quad 2.66 GHz... User manual

Document Number: 320503-001
Intel®CoreTM 2 Duo Processor
and Intel®GS45 Express Chipset
(with DDR3 System Memory)
Development Kit User’s Manual
September 2008

2 Development Kit User’s Manual
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
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reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
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family, not across different processor families. See http://www.intel.com/products/processor_number for details.
The Intel®CoreTM 2 Duo processor and Intel®GS45 Express Chipset may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained
by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino logo, Core Inside, Dialogic, FlashFile, i960, InstantIP, Intel, Intel logo,
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Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007-2008, Intel Corporation. All Rights Reserved.

Development Kit User’s Manual 3
Contents
1About This Manual ............................................................................................8
1.1 Content Overview...................................................................................8
1.2 Text Conventions ...................................................................................9
1.3 Glossary of Terms and Acronyms............................................................10
1.4 Development Kit Technical Support.........................................................14
1.4.1 Online Support........................................................................14
1.4.2 Additional Technical Support .....................................................14
1.5 Related Documents...............................................................................15
1.5.1 Ordering Hard Copies of Documents...........................................15
2Getting Started...............................................................................................17
2.1 Overview ............................................................................................17
2.2 Development Kit Contents .....................................................................17
2.3 Additional Required Hardware (Not Included in the Development Kit)...........18
2.4 Additional Required Software (Not included in the Development Kit) ............19
2.5 Workspace Preparation..........................................................................20
2.6 System Setup and Power-Up..................................................................21
2.6.1 Using the AC to DC Power Supply (Mobile Power Mode) ................22
2.7 Power Down ........................................................................................23
2.8 System BIOS .......................................................................................23
2.8.1 Configuring the BIOS ...............................................................23
2.8.2 Programming BIOS Using a Bootable USB Device.........................24
3Development Board Features ............................................................................26
3.1 Block Diagram .....................................................................................26
3.2 Mechanical Form Factor.........................................................................26
3.3 Development Board Key Features ...........................................................26
3.4 Software Key Features ..........................................................................30
3.4.1 AMI BIOS ...............................................................................30
3.5 Thermal Management ...........................................................................31
3.6 System Features and Operation..............................................................31
3.6.1 Processor Support ...................................................................31
3.6.2 Processor Voltage Regulators ....................................................32
3.6.3 Front-Side Bus (FSB) ...............................................................32
3.6.4 Processor Power Management ...................................................32
3.6.5 Processor Active Cooling...........................................................32
3.6.6 Manual Processor Voltage ID (VID) Support ................................32
3.6.7 Chipset ..................................................................................33
3.6.8 System Memory ......................................................................33
3.6.9 Video Display..........................................................................34
3.6.10 PCIe Slots ..............................................................................34
3.6.11 PCI Slots................................................................................35
3.6.12 On-Board LAN.........................................................................35
3.6.13 Serial Peripheral Interface (SPI) ................................................36
3.6.14 Soft Audio/Soft Modem ............................................................36

4 Development Kit User’s Manual
3.6.15 SATA Storage .........................................................................36
3.6.16 USB Connectors ......................................................................37
3.6.17 LPC Super I/O (SIO)/LPC Slot ...................................................38
3.6.18 Serial, IrDA ............................................................................38
3.6.19 Intel® 82802 Firmware Hub Device Support ...............................38
3.6.20 System Management Controller (SMC)/Keyboard Controller (KBC)..39
3.6.21 Clocks ...................................................................................39
3.6.22 Real Time Clock ......................................................................39
3.6.23 Thermal Monitoring .................................................................39
3.6.24 Power Supply Solution .............................................................40
3.6.25 Manual VID support for Graphics VR...........................................40
3.6.26 Debug Interfaces.....................................................................41
3.6.27 Board Form-Factor ..................................................................41
3.7 Power Management ..............................................................................41
3.7.1 Power Management States........................................................41
3.8 Testability ...........................................................................................42
3.9 Power Measurement Support..................................................................42
3.10 Power Supply Usage and Recommendation ..............................................47
4Development Board Physical Reference ..............................................................48
4.1 Board Components ...............................................................................48
4.2 Connectors..........................................................................................51
4.2.1 Back Panel Connectors .............................................................51
4.3 Configuration Settings...........................................................................53
4.3.1 Configuration Jumpers/Switches ................................................53
4.3.2 BSEL Jumper Settings ..............................................................56
4.4 Power and Reset Push Buttons ...............................................................56
4.5 Net Detect Button ................................................................................57
4.6 LEDs ..................................................................................................58
4.7 Other Headers .....................................................................................59
4.7.1 H8 Programming Headers.........................................................59
4.7.2 Sideband and Test Headers.......................................................60
Appendix A Add-In Cards..................................................................................................61
A.1 Port 80-83 Add-in Card (Included) ..........................................................61
A.2 PCI Expansion Card (Thimble Peak 2) (Included) ......................................62
A.3 HDMI and Display Port Video Interface Add-In Card (Eaglemont) (Included) .62
A.3.1 Rework to change Eaglemont Card from HDMI to Display Port........63
A.3.2 AUX Pull Down Rework.............................................................65
A.4 Intel® High Definition Audio Interposer Card (Mott Canyon 4) (Not Included)66
A.4.1 Mott Canyon 4 Jumper Settings .................................................67
A.5 ExpressCard Module Interposer (Duck Bay 3) (Not Included) ......................69
A.6 PCI Express mini card Interposer (Upham IV) (Not Included)......................70
A.7 Docking Connector Card (Saddlestring II) (Not Included) ...........................71
Appendix B Rework Instructions ........................................................................................74
B.1 Internal HDMI Enabling .........................................................................74
B.2 Enabling the Integrated Trusted Platform Module (iTPM) ............................74
B.3 Enabling External HDMI.........................................................................75
B.4 Support for Upham 4 ............................................................................75
B.5 Low Voltage High-Definition (HD) Audio Rework .......................................75

Development Kit User’s Manual 5
Appendix C Programming System BIOS Using a Flash Programming Device .............................77
Appendix D CPU Thermal Solution (Heatsink) Installation ......................................................78
Figures
Figure 1. Fern Hill Block Diagram ......................................................................26
Figure 2. Fern Hill Development Board Components .............................................49
Figure 3. Back Panel Connectors .......................................................................51
Figure 4. D-Connector to Component Video Cable................................................52
Figure 5. D-Connector to Composite Video Cable .................................................52
Figure 6. D-Connector to S-Video Cable .............................................................52
Figure 7. Location of the Configuration Jumpers/Switches .....................................53
Figure 8. Power On and Reset Buttons ...............................................................57
Figure 9. Net Detect Button ..............................................................................57
Figure 10. Port 80-83 Interposer Card................................................................61
Figure 11. PCI Expansion Card (Thimble Peak 2) .................................................62
Figure 12. Eaglemont Add-in Card .....................................................................63
Figure 13. Location of Resistors for Rework (before Rework) .................................64
Figure 14. Location of Resistors for Rework (after Rework)....................................64
Figure 15. Location of Resistors for Rework.........................................................65
Figure 16. AUX Pull-Down Rework .....................................................................66
Figure 17. Mott Canyon 4 Interposer Card ..........................................................67
Figure 18. Duck Bay 3 Interposer Card...............................................................69
Figure 19. Upham IV Interposer Card.................................................................70
Figure 20. Saddlestring II Docking Connector......................................................72
Figure 21. iHDMI Rework Instruction 1...............................................................74
Figure 22. iHDMI Rework Instruction 2...............................................................74
Figure 23. Low Voltage HD Audio Rework (Always Rail) ........................................75
Figure 24. Low Voltage HD Audio Rework (Sus Rail).............................................76
Figure 25. Step 4 - Backplate Pins .....................................................................79
Figure 26. Step 6 - Applying the Thermal Grease.................................................80
Figure 27. Step 7 - Squeezing Activation Arm .....................................................81
Figure 28. Step 8 - Installing the Heatsink..........................................................82
Figure 29. Step 9 - Plugging in the Fan ..............................................................83
Figure 30. Step 10 - Completed Assembly ..........................................................84

6 Development Kit User’s Manual
Tables
Table 1. Text Conventions ..................................................................................9
Table 2. Definitions of Terms ............................................................................10
Table 3. Acronyms .........................................................................................11
Table 4. Related Documents .............................................................................15
Table 5. Intel Literature Centers........................................................................15
Table 6. Fern Hill Feature Set Summary .............................................................27
Table 7. TV–Out Connections ............................................................................34
Table 8. PCI Express Ports................................................................................35
Table 9. Selection of I/O Voltage for the High Definition Audio...............................36
Table 10. SATA Ports.......................................................................................37
Table 11. USB Ports mapping............................................................................38
Table 12. System Power Management States ......................................................41
Table 13. System Power Management M-States...................................................42
Table 14. Digital Multi-Meter Comparison ...........................................................43
Table 15. System Voltage Rails .........................................................................43
Table 16. Development Board Components.........................................................50
Table 17. Configuration Jumpers and Switches Settings........................................54
Table 18. BSEL Jumper Settings........................................................................56
Table 19. Power-On and Reset Push buttons .......................................................56
Table 20. LEDs ...............................................................................................58
Table 21. H8 Programming Jumpers ..................................................................60
Table 22. Mott Canyon 4 Configuration Jumper/Switches Settings ..........................68
Table 23. Upham IV default Jumper/Switches Settings .........................................71
Table 24. Board Rework to Support Display Port on Saddlestring ...........................73

Development Kit User’s Manual 7
Revision History
Document
Number Revision Number Description Revision Date
320503 001 Public launch release Sept. 2008
§

About This Manual
8 Development Kit User’s Manual
1About This Manual
This user’s manual describes the use of the Intel®CoreTM 2 Duo Processor (LV and
ULV) and Intel®GS45 Express Chipset development kit with DDR3 SDRAM system
memory. This manual has been written for OEMs, system evaluators, and embedded
system developers. This document defines all jumpers, headers, LED functions, and
their locations on the development board, along with features of the board’s
subsystems. This manual assumes basic familiarity with installing and configuring
hardware and software in a personal computer system.
The differences between the Fern Hill (GS45, DDR3), Pillar Rock (GM45, DDR2) and
Silver Cascade (GM45, DDR3) User Manuals are in these sections:
•System Memory Section 3.6.8
•Development Board Feature Set Summary Table (Table 6)
•Configuration Jumpers and Switches Settings Table (Table 17),
•BSEL Jumper Settings Table (Table 18)
All other components and references are the same between boards.
For the latest information about the Intel®CoreTM 2 Duo processor and Intel®GS45
Express Chipset Development Kit, visit:
http://developer.intel.com/design/intarch/devkits/index.htm
For design documents related to the Intel®CoreTM 2 Duo processor and Intel®GS45
Express Chipset please visit:
Processor: http://developer.intel.com/design/intarch/core2duo/tech_docs.htm
Chipset: http://www.intel.com/products/embedded/chipsets.htm
1.1 Content Overview
Chapter 1.0, “About This Manual” — This chapter contains a description of conventions
used in this manual. The last few sections explain how to obtain literature and contact
customer support.
Chapter 2.0, “Getting Started”— Describes the contents of the development kit. This
chapter explains the basics steps necessary to get the board running. This chapter
also includes information on how to update the BIOS.
Chapter 3.0, “Development Board Features” — This chapter provides details on the
hardware features of the development board. It explains the Power Management and
Testability features.

About This Manual
Development Kit User’s Manual 9
Chapter 4.0, “Development Board Physical Reference”— This chapter provides a list of
major board components and connectors. It gives a description of jumper settings
and functions. The chapter also explains the use of the programming headers.
Appendix A, “Add-In Cards” – This appendix contains information on add-in cards
available from Intel that can be used with the development board.
Appendix B, “Rework Instructions” – This appendix contains rework instructions for
the development board and for some of the add-in cards to enable additional
supported features and functionality.
Appendix C, “Programming System BIOS Using a Flash Programming Device” — This
appendix provides step by step instructions on programming the flash using a flash
programming device
Appendix D, “CPU Thermal Solution (Heatsink) Installation Instructions” — This
appendix gives detailed installation instructions for the Intel®CoreTM 2 Duo processor
heatsink.
1.2 Text Conventions
The notations listed in Table 1 may be used throughout this manual.
Table 1. Text Conventions
Notation Definition
# The pound symbol (#) appended to a signal name indicates that the signal
is active low. (e.g., PRSNT1#)
Variables Variables are shown in italics. Variables must be replaced with correct
values.
Instructions Instruction mnemonics are shown in uppercase. When you are
programming, instructions are not case-sensitive. You may use either
uppercase or lowercase.
Numbers Hexadecimal numbers are represented by a string of hexadecimal digits
followed by the character H. A zero prefix is added to numbers that begin
with A through F. (For example, FF is shown as 0FFH.) Decimal and binary
numbers are represented by their customary notations. (That is, 255 is a
decimal number and 1111 is a binary number. In some cases, the letter B
is added for clarity.)
Units of Measure
A
GByte
KByte
KΩ
mA
MByte
MHz
ms
mW
ns
pF
W
The following abbreviations are used to represent units of measure:
amps, amperes
gigabytes
kilobytes
kilo-ohms
milliamps, milliamperes
megabytes
megahertz
milliseconds
milliwatts
nanoseconds
picofarads
watts

About This Manual
10 Development Kit User’s Manual
Notation Definition
V
µA
µF
µs
µW
volts
microamps, microamperes
microfarads
microseconds
microwatts
Signal Names Signal names are shown in uppercase. When several signals share a
common name, an individual signal is represented by the signal name
followed by a number, while the group is represented by the signal name
followed by a variable (n). For example, the lower chip-select signals are
named CS0#, CS1#, CS2#, and so on; they are collectively called CSn#.
A pound symbol (#) appended to a signal name identifies an active-low
signal. Port pins are represented by the port abbreviation, a period, and
the pin number (e.g., P1.0).
1.3 Glossary of Terms and Acronyms
Table 2 defines terms used in this document.
Table 2. Definitions of Terms
Term/Acronym Definition
Assisted Gunning
Transceiver Logic+
The front-side bus uses a bus technology called AGTL+, or Assisted
Gunning Transceiver Logic. AGTL+ buffers are open-drain, and require
pull-up resistors to provide the high logic level and termination. AGTL+
output buffers differ from GTL+ buffers with the addition of an active
pMOS pull-up transistor to assist the pull-up resistors during the first clock
of a low-to-high voltage transition.
Asynchronous
GTL+
The processor does not utilize CMOS voltage levels on any signals that
connect to the processor. As a result, legacy input signals such as A20M#,
IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PWRGOOD, SMI#, SLP#, and
STPCLK# utilize GTL+ input buffers. Legacy output signals (FERR# and
IERR#) and non-AGTL+ signals (THERMTRIP# and PROCHOT#) also
utilize GTL+ output buffers. All of these signals follow the same DC
requirements as AGTL+ signals, however the outputs are not actively
driven high (during a logical 0 to 1 transition) by the processor (the major
difference between GTL+ and AGTL+). These signals do not have setup or
hold time specifications in relation to BCLK[1:0], and are therefore
referred to as “Asynchronous GTL+ Signals”. However, all of the
Asynchronous GTL+ signals are required to be asserted for at least two
BCLKs in order for the processor to recognize them.
Fern Hill The name of the development board that uses Intel®Core™ 2 Duo
processor SU9400 or SL9400 with the Mobile Intel GS45 Express Chipset
(Small Form Factor) and DDR3 SDRAM
Infrared Data
Assoc.
The Infrared Data Association (IrDA) has outlined a specification for serial
communication between two devices via a bi-directional infrared data
port. The development board has such a port and it is located on the rear
of the board between the two USB connectors.
IMVP6+ The Intel Mobile Voltage Positioning specification for the Intel® Core™ 2
Duo Processor. It is a DC-DC converter module that supplies the required
voltage and current to a single processor.

About This Manual
Development Kit User’s Manual 11
Term/Acronym Definition
Media Expansion
Card
The Media Expansion Card (MEC) provides digital display options through
the SDVO interface. The MEC card also incorporates video-in via a x1 PCI
Express* port.
Pad The electrical contact point of a semiconductor die to the package
substrate. A pad is only observable in simulations.
Pillar Rock The name of the development board that uses Intel®Core™ 2 Duo
processor with the Mobile Intel GM45 Express Chipset and DDR2 SDRAM
Pin The contact point of a component package to the traces on a substrate,
such as the motherboard. Signal quality and timings may be measured at
the pin.
Silver Cascade The name of the development board that uses Intel®Core™ 2 Duo
processor with the Mobile Intel GM45 Express Chipset and DDR3 SDRAM
System Bus The System Bus is the microprocessor bus of the processor.
System
Management Bus
A two-wire interface through which various system components may
communicate.
VCC (CPU core) VCC (CPU core) is the core power for the processor. The system bus is
terminated to VCC (CPU core).
Table 3 defines the acronyms used throughout this document.
Table 3. Acronyms
Acronym Definition
AC Alternating Current
ACPI Advanced Configuration and Power Interface
ADD2 Advanced Digital Display 2
ADD2N Advanced Digital Display 2 Normal
AGTL or AGTL+ Assisted Gunning Transceiver Logic (See also Table 2 above)
AMI American Megatrends Inc. (BIOS developer)
AMPS or iAMPS (Intel) Adaptive Mobile Power System
AMT or iAMT (Intel) Active Management Technology
ATA Advanced Technology Attachment (disk drive interface)
ATX Advance Technology Extended (motherboard form factor)
BGA Ball Grid Array
BIOS Basic Input/Output System
BSEL Bus Select (Front Side Bus frequency control signals)
CL Controller Link
CMOS Complementary Metal-Oxide-Semiconductor
COM Communications
CPU Central Processing Unit (processor)

About This Manual
12 Development Kit User’s Manual
Acronym Definition
CRB Customer Reference Board
DC Direct Current
DC Dual-Core
DDR Double Data Rate
DDR2 Double Data Rate SDRAM version 2
DDR3 Double Data Rate SDRAM version 3
DIMM Dual Inline Memory Module
DMI Direct Memory Interface
DOS Disk Operating System
DP Display Port
DPST or iDPST (Intel) Display Power Savings Technology
EBL Extended Battery Life
EC Embedded Controller
ECC Error Correcting Code
EHCI Enhanced Host Controller Interface
EMA Extended Media Access
eSATA External SATA (Serial ATA)
ESD Electrostatic Discharge
FCBGA Flip Chip Ball Grid Array
FCPGA Flip Chip Pin Grid Array
FS Full-speed. Refers to USB
FSB Front Side Bus
FWH Firmware Hub
GbE Gigabit Ethernet
GLCI Gigabit LAN Connect Interface
GS45 Intel® GS45 Express Graphics and Memory Controller Hub
GMCH Graphics and Memory Controller Hub
GND Ground (VSS)
GPIO General Purpose Input/Output
HDA High Definition Audio
HDMI High Definition Media Interface
HS High-speed. Refers to USB
ICH I/O Controller Hub
ICH9M I/O Controller Hub 9M (Mobile)
ICH9M-E SFF ICH9M-Enhanced, Small Form Factor

About This Manual
Development Kit User’s Manual 13
Acronym Definition
IDE Integrated Drive Electronics
IMVP-6 or (Intel MVP-6) Intel Mobile Voltage Positioning – revision 6
I/O Input / Output
IrDA Infrared Data Association
ITP Integrated Test Port
KBC Keyboard Controller
L2 Level-2 (Cache)
LAN Local Area Network
LED Light Emitting Diode
LPC Low Pin Count
LS Low-speed. Refers to USB
LV Low Voltage
LVDS Low Voltage Differential Signaling (Video Standard)
mBGA Mini Ball Grid Array
MEC Media Expansion Card
MHz Mega-Hertz
MT/s Mega Transfers per second
NMI Non-Maskable Interrupt
OEM Original Equipment Manufacturer
PEG PCI Express Graphics
PCI Peripheral Connect Interface
PCIe PCI Express*
PCM Pulse Code Modulation
POST Power On Self Test
PS/2 Personal System/2 (Keyboard and Mouse Connector)
PSI2 Power Status Indicator - 2
PWM Pulse Width Modulation
RAID Redundant Array of Inexpensive Disks
RCA (Type of Audio and Video Connector)
RTC Real Time Clock
SATA Serial ATA
SDVO Serial Digital Video Output
SIO Super Input/Output
SKU (SKU Number) Stock Keeping Unit (Stock Keeping Unit Number)
SMC System Management Controller

About This Manual
14 Development Kit User’s Manual
Acronym Definition
SODIMM or SO-DIMM Small Outline Dual In-line Memory Module
SOIC-8 or SOIC-16 Small Outline Integrated Circuit (8 or 16 pin package)
SPI Serial Peripheral Interface
SPWG Standard Panels Working Group - http://www.spwg.org/
SRC Source (Clock)
SUT System Under Test
TME Technical Marketing Engineer
TPM Trusted Platform Module
TV or TVO Television (Output)
µBGA Micro Ball Grid Array
UHCI Universal Host Controller Interface
ULV Ultra-Low Voltage
USB Universal Serial Bus
VGA Video Graphics Adapter
VID Voltage Identification
WiMAX (Wireless Communications Standard)
WLAN Wireless Local Area Network
VREG or VR Voltage Regulator
WWAN Wireless Wide Area Network
VCC Power Signal
x1 (x2, etc) By 1 (By 2, etc) (refers to number of PCIe Links)
XDP eXtended Debug Port
1.4 Development Kit Technical Support
1.4.1 Online Support
Intel’s web site (http://www.intel.com/) provides up-to-date technical information and
product support. This information is available 24 hours per day, 7 days per week,
providing technical information whenever you need it.
1.4.2 Additional Technical Support
If you require additional technical support, please contact your Intel Representative or
local distributor.

About This Manual
Development Kit User’s Manual 15
1.5 Related Documents
Table 4 lists publicly available documents related to this development kit. For
additional documentation, please contact your Intel Representative.
Table 4. Related Documents
Document Title Location
Intel® Core™ 2 Duo Processor on 45-nm
process Datasheet
http://www.intel.com/design/intarch/core2duo/te
ch_docs.htm
Mobile Intel®4 Series Express Chipset
Family Datasheet
http://www.intel.com/Products/Notebook/Chipset
s/GS45/GS45-technicaldocuments.htm
Intel®I/O Controller Hub 9 (ICH9) Family
Datasheet
http://www.intel.com/Products/Notebook/Chipset
s/GS45/GS45-technicaldocuments.htm
[Montevina] Small Form Factor (SFF)
Platform Design Guide
Contact your Intel representative for access to
this document. (Doc #358405)
[Montevina] Small Form Factor (SFF)
Platform, Fern Hill (DDR3) – Customer
Reference Board Schematic
Contact your Intel representative for access to
this document. (Doc #358533)
1.5.1 Ordering Hard Copies of Documents
To order hard copies of product literature, do the following:
1. Determine the SKU Number
The SKU number is listed at the bottom of the download page for that
document. It is also usually the first 6 digits of the name of the PDF file, such
as: 12345612.pdf.
2. Call or E-mail a Request
Call: To place an order for a publication or text in hardcopy or CD form,
please contact the Intel Literature Fulfillment Centers listed in Table 5.
Table 5. Intel Literature Centers
Location Telephone Number
U.S. and Canada 1-800-548-4725
International 1-303-675-2148
Fax [phone]

About This Manual
16 Development Kit User’s Manual
Email: To order a publication or text in hardcopy or CD form, send your
request to: [e-mail]
Please make sure to include in your e-mailed request:
SKU #
Company Name
Your Name (first, last)
Full mailing address
Daytime Phone Number in case of questions
Note: Please be aware not all documents are available in all media types. Some may only be
available as a download.
§

Getting Started
Document Number: 320249-001
2Getting Started
This chapter identifies the development kit’s key components, features and
specifications. It also details basic development board setup and operation.
2.1 Overview
The development board consists of a baseboard populated with the Intel®CoreTM 2
Duo SL9400 or SU9400 processor, the Intel®GS45 Express Chipset, and other system
board components and peripheral connectors.
This development kit is available with either a Low-Voltage Intel®CoreTM 2 Duo
Processor SL9400 or an Ultra-Low Voltage Intel®CoreTM 2 Duo Processor SU9400 (see
note below). Both the LV and ULV processors are 22 mm x 22 mm, and are
sometimes referred to as “Small Form Factor”, or SFF components. The Intel®GS45
Express Chipset included on this development board is also the Small Form Factor
(SFF) version of the Intel®GM45 Express Chipset. The development board in this kit
may sometimes be referred to by its code name, Fern Hill. This manual will cover the
features and details of the Fern Hill development board.
Note: The Intel® Core™ 2 Duo SU9400 processor at 1.4 GHz core frequency is not on the
Intel embedded roadmap offering and as such does not have embedded market 7
year availability. The Intel® Core™ 2 Duo SU9300 processor at 1.2 GHz core
frequency is on the Intel embedded roadmap offering and has embedded market 7
year availability.
2.2 Development Kit Contents
The following hardware, software and documentation are included in the development
kit. Check for damage that may have occurred during shipment. Contact your sales
representative if any items are missing or damaged.
•Letter to the Customer
•Development Kit User’s Manual (this document)
•Software CD-ROM, which includes (see the readme.txt file for a complete list
of CD-ROM contents):
oEmbedded system BIOS
oBIOS installation utilities
oChipset drivers
oIntel Embedded Graphics Drivers
oIntel®Active Management Technology (AMT) software installation kit

Getting Started
18 Development Kit User’s Manual
•Pre-assembled development system, which includes:
oFern Hill development board
oPlexiglass stand with Acrylic pad
oMounting screws and standoffs
oIntel®CoreTM 2 Duo processor SU9400 or SL9400
oProcessor thermal solution and CPU back plate
oIntel®GS45 Express Chipset Graphics and Memory Controller Hub
(GMCH)
oGMCH (GS45) heatsink
oI/O Controller Hub 9M-Enhanced Small Form Factor (ICH9M-E SFF)
oType 2032, 3 V lithium coin cell battery
o512 MByte DDR3 Memory On-Board (1067 MT/s, 7-7-7, PC3-8500
compatible)
oPort 80 display card
oPower Supply
o80 GByte SATA Hard Disk Drive
oDVD-ROM Drive
oDisk Drive Power and SATA Cables
•One HDMI and Display Port add-in card (codename Eaglemont)
•One PCI Extension Card (codename Thimble Peak 2)
•One AC to DC Power Adapter
2.3 Additional Required Hardware (Not Included in
the Development Kit)
The following additional hardware may be necessary to operate the development
board.
VGA Monitor: Any standard VGA or multi-resolution monitor may be used. The setup
instructions in this chapter assume the use of a standard VGA monitor or LCD
monitor.
Keyboard: The development board supports both PS/2 and USB style keyboards.
Mouse: The development board supports both PS/2 and USB style pointing devices.

Getting Started
Development Kit User’s Manual 19
Hard Drives and Optical Disc Drives and cables: One SATA hard disk drive and
one SATA optical DVD Drive are included in the development kit. Up to four SATA
drives and two IDE devices (master and slave) may be connected to the development
board. An optical disc drive (included) may be used to load the OS. All these storage
devices may be attached to the board simultaneously.
Video Adapter Card: Integrated video is output from the VGA connector on the back
panel of the development board. Alternately, a standard PCI Express* video adapter
card, ADD2 card or MEC video adapter card may be used for additional display
flexibility. Please contact the respective vendors for drivers and software for adapters
not provided with this development kit. Check the BIOS and the graphics driver,
where appropriate, for the proper video output settings.
Network Adapter and cables: A Gigabit network interface is provided on the
development board. The network interface will not be operational until after all the
necessary drivers are installed. A standard PCI/PCI Express* adapter may be used in
conjunction with, or in place of, the onboard network adapter. Please contact the
respective vendors for drivers and necessary software for adapters not provided with
this development kit.
You must supply appropriate network cables to utilize the LAN connector or any other
installed network cards.
Other Devices and Adapters: The development board functions much like a
standard desktop computer motherboard. Most PC-compatible peripherals can be
attached and configured to work with the development board.
2.4 Additional Required Software (Not included in the
Development Kit)
The following additional software may be necessary to operate the development
board.
Operating System: The user must supply any needed operating system installation
files and licenses.
Application Software: The user must supply any needed application software.

Getting Started
20 Development Kit User’s Manual
2.5 Workspace Preparation
Caution: The development kit is shipped as an open system to provide flexibility in changing
hardware configurations and peripherals in a lab environment. Since the board is not in a
protective chassis, the user is required to take the following safety precautions in handling
and operating the board.
1. The power supply cord is the main disconnect device to main power (AC power).
The socket outlet should be installed near the equipment and should be readily
accessible.
2. To avoid shock, ensure that the power cord is connected to a properly wired and
grounded receptacle.
3. Ensure that any equipment to which this product will be attached is also
connected to properly wired and grounded receptacles.
4. Use a flame retardant work surface
5. Ensure a static-free work environment before removing any components from
their anti-static packaging. Wear an ESD wrist strap when handling the
development board or other development kit components. The development
board is susceptible to electrostatic discharge (ESD) damage, and such damage
may cause product failure or unpredictable operation.