Intel Core 2 Duo Processor User manual

Order Number: 318476-001US
Intel®CoreTM 2 Duo Processor and
Intel ®Q35 Express Chipset
Development Kit
User’s Manual
October 2007

Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
2Order Number: 318476-001US
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Copyright © 2007, Intel Corporation. All Rights Reserved.

Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
October 2007 User’s Manual
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Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Contents
1.0 About This Manual .....................................................................................................6
1.1 Content Overview................................................................................................6
1.2 Text Conventions ................................................................................................6
1.3 Glossary of Terms and Acronyms...........................................................................7
1.4 Support Options..................................................................................................8
1.4.1 Electronic Support Systems .......................................................................8
1.4.2 Additional Technical Support......................................................................8
1.5 Product Literature ...............................................................................................8
2.0 Development Kit Hardware Features .......................................................................10
2.1 Intel® Q35 Express Chipset Development Kit Overview..........................................10
2.2 System Block Diagram.......................................................................................11
2.3 Development Kit Inventory Checklists ..................................................................12
2.4 Processor Support .............................................................................................14
2.5 System Memory................................................................................................ 14
2.5.1 Dual Channel (Interleaved) Mode Configurations ........................................15
2.5.2 Single Channel (Asymmetric) Mode Configurations......................................17
2.6 Back-Panel Connectors.......................................................................................18
2.6.1 Audio-Connectors...................................................................................18
2.6.2 RJ-45 LAN Connector with Integrated LEDs................................................19
2.6.3 USB Port...............................................................................................19
2.6.4 Coaxial S/PDIF In/Out Connector..............................................................19
2.6.5 eSATA Port............................................................................................19
2.7 Debug Features.................................................................................................20
2.7.1 Extended Debug Probe (XDP)...................................................................20
2.7.2 Power LEDs ...........................................................................................20
2.7.3 Port 80 POST Code LEDs .........................................................................20
2.7.4 Voltage Reference ..................................................................................21
2.8 Development Kit Major Connectors and Jumpers.................................................... 21
2.8.1 Jumper Functions...................................................................................22
2.8.2 USB 2.0 Front Panel ...............................................................................22
2.8.3 1394a Header........................................................................................ 22
2.9 SPI Removal / Installation Technique...................................................................23
2.9.1 SPI Device Removal................................................................................24
2.9.2 SPI Device Installation............................................................................24
3.0 Setting Up and Configuring the Development Kit .....................................................26
3.1 Overview .........................................................................................................26
3.2 Installing Board Standoffs .................................................................................. 26
3.3 BTX Heatsink Setup with SRM............................................................................. 28
3.3.1 SRM Alignment on any BTX Board ............................................................28
3.4 Board Setup and Configuration before Boot...........................................................30
3.5 Post Codes Definitions........................................................................................ 32
3.5.1 Normal Post Codes ................................................................................. 32
Figures
1 Board Features........................................................................................................11
2 Intel® Q35 Express Chipset Development Kit block diagram..........................................12
3 Memory Channel and DIMM Configuration ...................................................................15
4 Dual Channel (Interleaved) Mode Configuration with 2x DIMMs ......................................16
5 Dual Channel (Interleaved) Mode Configuration with 3x DIMMs ......................................16

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Contents
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
4Order Number: 318476-001US
6 Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................17
7 Single Channel (Asymmetric) Mode Configuration with 1x DIMM .....................................17
8 Single Channel (Asymmetric) Mode Configuration with 3x DIMMs....................................18
9 Back-panel Connectors..............................................................................................18
10 LAN Connector LED locations......................................................................................19
11 ITP-XDP Connector location (J2BC) .............................................................................20
12 Major Jumper and Header Locations............................................................................21
13 Location for 1394a Header and USB Front Panel ...........................................................23
14 SPI Socket with Retaining Clip....................................................................................24
15 SPI Device Installation ..............................................................................................25
16 Intel® Q35 Development Kits ....................................................................................26
17 Mounting Hole Locations............................................................................................27
18 Mounting the Standoff for BTX Heatsink.......................................................................28
19 Casing with “Support and Retention Module”................................................................28
20 BTX board alignment on SRM.....................................................................................29
21 Heatsink Alignment...................................................................................................29
22 Tightening Heatsink on the SRM and Board..................................................................30
23 CPU Fan location ......................................................................................................31
24 2x12 Standard power supply and 2x2 power supply ......................................................32
Tables
1 Definition ................................................................................................................. 7
2 Intel Literature Centers .............................................................................................. 9
3 Development Kit Hardware Items ...............................................................................12
4 Development Kit Board Specification...........................................................................13
5 Internal I/O headers.................................................................................................13
6 Supported Intel Technologies.....................................................................................13
7 Additional Features...................................................................................................14
8 LAN Connector LED status .........................................................................................19
9 Voltage Reference detail............................................................................................21
10 Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit Board
Jumpers Description .................................................................................................22
11 USB Front Panel.......................................................................................................22
12 1394a Header..........................................................................................................23

Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
October 2007 User’s Manual
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Revision History—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Revision History
Date Revision Description
October 2007 001 Initial release

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
6Order Number: 318476001US
1.0 About This Manual
This user’s manual describes the use of the Intel®Q35 Express Chipset Development
Kit. This manual has been written for OEMs, system evaluators, and embedded system
developers. All jumpers, headers, LED functions, and their locations on the board,
along with subsystem features and POST codes, are defined in this document.
For the latest information about the Intel®Q35 Express Chipset Development Kit
reference platform, visit:
http://developer.intel.com/design/intarch/devkits/
index.htm?iid=embed_body+devkits
For design documents related to this platform, such as schematics and layout, please
contact your Intel Representative.
1.1 Content Overview
Chapter 1.0, “About This Manual”
This chapter contains a description of conventions used in this manual. The last few
sections explain how to obtain literature and contact customer support.
Chapter 2.0, “Development Kit Hardware Features”
This chapter provides information on the development kit features and the board
capability. This includes the information on board component features, jumper settings,
pin-out information for connectors and overall development kit board capability.
Chapter 3.0, “Setting Up and Configuring the Development Kit”
This chapter provides instructions on how to configure the evaluation board and
processor assembly by setting BTX heatsink, jumpers, connecting peripherals,
providing power, and configuring the BIOS.
1.2 Text Conventions
The following notations may be used throughout this manual.
# The pound symbol (#) appended to a signal name indicates that
the signal is active low.
Variables Variables are shown in italics. Variables must be replaced with
correct values.
Instructions Instruction mnemonics are shown in uppercase. When you are
programming, instructions are not case-sensitive. You may use
either upper-case or lower-case.
Numbers Hexadecimal numbers are represented by a string of
hexadecimal digits followed by the character H. A zero prefix is
added to numbers that begin with A through F. (For example, FF

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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
is shown as 0FFH.) Decimal and binary numbers are
represented by their customary notations (That is, 255 is a
decimal number and 1111 1111 is a binary number). In some
cases, the letter B is added for clarity.
Units of Measure The following abbreviations are used to represent units of
measure:
GByte gigabytes
KByte kilobytes
MByte megabytes
MHz megahertz
W watts
V volts
Signal Names Signal names are shown in uppercase. When several signals
share a common name, an individual signal is represented by
the signal name followed by a number, while the group is
represented by the signal name followed by a variable (n). For
example, the lower chip-select signals are named CS0#, CS1#,
CS2#, and so on; they are collectively called CSn#. A pound
symbol (#) appended to a signal name identifies an active-low
signal. Port pins are represented by the port abbreviation, a
period, and the pin number (e.g., P1.0).
1.3 Glossary of Terms and Acronyms
This section defines conventions and terminology used throughout this document.
Table 1. Definition (Sheet 1 of 2)
Term Description
ADD2 Card
Advanced Digital Display Card – 2nd Generation. This card provides digital display options
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
Express* connector but uses the multiplexed SDVO interface. The card adds Video In
capabilities to platform. This Advanced Digital Display Card will not work with an Intel
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
an ADD2 supported system, but video in capabilities will not work.
ACPI Advanced Configuration and Power Interface
Core The internal base logic in the (G)MCH
DDR2 A second generation Double Data Rate SDRAM memory technology
DMI (G)MCH-IntelÆICH9 Direct Media Interface
DVI Digital Video Interface. Specification that defines the connector and interface for digital
displays.
FSB Front Side Bus. FSB is synonymous with Host or processor bus
GMA 3100 Intel® Graphic Media Accelerator 3100
IntelÆICH9
Eighth generation I/O Controller Hub component that contains additional functionality
compared to previous ICHs. The I/O Controller Hub component contains the primary PCI
interface, LPC interface, USB2, ATA-100, and other I/O functions. It communicates with
the (G)MCH over a proprietary interconnect called DMI.
IGD Internal Graphics Device.
LVDS Low Voltage Differential Signaling. A high speed, low power data transmission standard
used for display connections to LCD panels.

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
8Order Number: 318476001US
1.4 Support Options
1.4.1 Electronic Support Systems
Intel’s site on the World Wide Web (http://www.intel.com/) provides up-to-date
technical information and product support. This information is available 24 hours per
day, 7 days per week, providing technical information whenever you need it.
Product documentation is provided online in a variety of web-friendly formats at:
(http://developer.intel.com/)
1.4.2 Additional Technical Support
If you require additional technical support, please contact your field sales
representative or local distributor.
1.5 Product Literature
Product literature can be ordered from the following Intel literature centers:
MCH
Memory Controller Hub component that contains the processor interface, DRAM
controller, and x16 PCI Express* port (typically, the external graphics interface). It
communicates with the I/O controller hub (Intel ICH9) and other I/O controller hubs over
the DMI interconnect. In this document MCH refers to the Intel® Q35 MCH component.
MEC Media Expansion Card, also known as ADD2+ card. Refer to ADD2+ term for description.
PCI Express*
Third Generation input/output graphics attach called PCI Express* Graphics. PCI Express*
is a high-speed serial interface whose configuration is software compatible with the
existing PCI specifications. The specific PCI Express* implementation intended for
connecting the (G)MCH to an external Graphics Controller is a x16 link and replaces AGP.
Primary PCI The Primary PCI is the physical PCI bus that is driven directly by the ICH9 component. Communication between Primary PCI and the (G)MCH occurs over DMI. Note that the
Primary PCI bus is not PCI Bus 0 from a configuration standpoint.
SDVO
Serial Digital Video Out (SDVO). SDVO is a digital display channel that serially transmits
digital display data to an external SDVO device. The SDVO device accepts this serialized
format and then translates the data into the appropriate display format (i.e., TMDS,
LVDS, TV-Out). This interface is not electrically compatible with the previous digital
display channel - DVO. For the 82Q965 GMCH, it will be multiplexed on a portion of the
x16 graphics PCI Express* interface.
SDVO Device Third party codec that uses SDVO as an input. May have a variety of output formats,
including DVI, LVDS, HDMI, TV-out, etc.
SMI System Management Interrupt. SMI is used to indicate any of several system conditions (such as, thermal sensor events, throttling activated, access to System Management
RAM, chassis open, or other system state related activity).
Rank A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a
single side of a DIMM.
Table 1. Definition (Sheet 2 of 2)
Term Description
ADD2 Card
Advanced Digital Display Card – 2nd Generation. This card provides digital display options
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
Express* connector but uses the multiplexed SDVO interface. The card adds Video In
capabilities to platform. This Advanced Digital Display Card will not work with an Intel
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
an ADD2 supported system, but video in capabilities will not work.

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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Table 2. Intel Literature Centers
Location Telephone Number
U.S. and Canada 1-800-548-4725
U.S. (from overseas) 708-296-9333
Europe (U.K.) 44(0)1793-431155
Germany 44(0)1793-421333
France 44(0)1793-421777
Japan (fax only) 81(0)120-47-88-32

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
10 Order Number: 318476001US
2.0 Development Kit Hardware Features
This chapter describes the features of the Intel® Q35 Development Kit. These
recommendations would largely apply to other designs incorporating Intel® Q35
chipset. This documentation should be used in conjunction with the datasheets,
specification updates and platform design guides for the Intel® I/O Controller Hub 9
(ICH9) Family and the Intel® Q35 Express Chipset. Contact your Intel representative
for the availability of these documents.
2.1 Intel® Q35 Express Chipset Development Kit Overview
Figure 1 shows overview of the major features present on the development kit board.
Refer to next page for system block diagram of the development kit’s motherboard.

Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
2.2 System Block Diagram
This section will document the common features that are applicable to the Intel®
CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit. Figure 2
shows a simple block diagram of the development kit.
Figure 1. Board Features
PCI Slot
SPI EEPROM
(Secondary)
SPI EEPROM
(Primary)
PCI Express
x16 Graphics
Slot
Intel® I/O
Controller Hub
(ICH)
SATA Port
PCI Express
x1 Slot
2x12
Standard
Power Supply
2-DIMM per channel DDR2
667/800 (Channel-B) 2-DIMM per channel DDR2
667/800 (Channel-A)
2x2 Standard
Power Supply
Intel® Q35 Memory
Controller Hub (MCH)
LGA775 Processor
Socket
Port 80 LED Display
Power Button
Reset button

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
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2.3 Development Kit Inventory Checklists
This section describes major hardware items which should be available on this
development kit.
Figure 2. Intel® Q35 Express Chipset Development Kit block diagram
Table 3. Development Kit Hardware Items
1x 4-Layer Micro-BTX form factor (targeted dimensions: 10.5” x 10.4”) motherboard
1x Intel® CoreTM 2 Duo E6400 Processors in the LGA775 Socket
2x 1 GBytes DDR2 800 DIMM
1x BTX Heatsink with fan
1x CD-ROM contain chipset drivers (this include Intel® GMA3100 driver)
8x hex standoffs and 4x screws for bench top usage

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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Table 4. Development Kit Board Specification
1 PCI Express x16, 2 PCIe x1, 1 PCI expansion slots
1394a
• 1 front panel headers for support of 1 port
• 1 back panel port
Universal Serial Bus 2.0
• 2 front panel headers for support of 4 ports
• 1 internal header for support of 2 ports
• 6 back panel ports
6 SATA 3 Gb/sec ports (1 port used for eSATA)
Table 5. Internal I/O headers
2x5 Front Panel I/O header
2x7 Front Panel audio header
1x2 Chassis intrusion header
3 four-wire fan headers
2x8 High Definition audio header
Table 6. Supported Intel Technologies (Sheet 1 of 2)
Technology Features/support Reference Documentation
Intel® Active Management
Technology with System
Defense feature (Intel®
ICH8 DO only)
• Enables remote, down-the-wire management
of out-of-band networked systems regardless
of system state, helping improve efficiency,
asset management and system security and
availability.
• System Defense Feature can help block
incoming software attacks, isolate a device
from the network if infected, and proactively
alert embedded system vendors if critical
software agents are missing.
http://www.intel.com/technology/
platform-technology/intel-amt/
Intel® Graphics Media
Accelerator 3000
• Dual independent display expands viewable
workspace for devices such as point-of-sale
terminals with two monitors.
• Provides next-generation graphics
performance for advanced embedded
operating systems.
• Delivers richer visual color and picture clarity
without the need for additional discrete
graphics cards.
http://www.intel.com/products/chipsets/
gma3000/demo/demo.html

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
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2.4 Processor Support
The Intel®Q35 Development Kit supports the following processors in the LGA775
Socket with FSB of 800/1067/1333 MHz.
These processors, with long-life support are also supported by this development kit:
•Intel
®CoreTM 2 Duo E6400 (Included in the development kit)
•Intel
®CoreTM 2 Duo E4300
•Intel
®Pentium®Dual-Core Processor E2160
•Intel
®Celeron®440
Refer to this link for other processors which is also supported by Intel® Q35 Express
Chipset.
http://developer.intel.com/products/chipsets/Q35_Q33/index.htm
2.5 System Memory
The Intel® Q35 Express Chipset supports two types of memory organization. These are
interleaved mode and asymmetric mode. The Q35 supports:
Listed here are the summary of the system memory supported.
Intel® Fast Memory Access
• Helps improve system performance by
optimizing use of available memory
bandwidth and reducing latency of memory
access by monitoring all pending read/write
requests; allows safe and efficient
overlapping of commands on all system bus
interfaces.
http://www.intel.com/products/chipsets/
q965_q963/demo/demo.html
Intel® Matrix Storage
Technology (Intel® ICH8
DO only)
• With a second hard drive added, provides
quicker access to digital photo, video and
data files with RAID 0, 5 and 10, and greater
data protection against a hard disk drive
failure with RAID 1, 5 and 10.
http://www.intel.com/design/chipsets/
matrixstorage_sb.htm
Intel® High Definition Audio
• Enables premium digital sound and delivers
advanced features such as multiple audio
streams and jack re-tasking.
• Support for microphone array enables
enhanced voice capture for high-quality input
to voice-driven activities.
http://www.intel.com/design/chipsets/
hdaudio.htm
Table 7. Additional Features
6 Analog audio connectors and 2 digital audio connectors
Piezo speaker for BIOS POST codes
BIOS configuration jumper
Clear CMOS jumper
Power Button
Reset Button
XDP connector
Table 6. Supported Intel Technologies (Sheet 2 of 2)
Technology Features/support Reference Documentation

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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
• Non-ECC DDR2 (667/800)
• 512Mb, 1Gb and 2Gb technology
• 4 DIMMs, 4GB maximum per channel, 8GB total memory
•Dual channel (Interleaved) mode. This mode offers the highest throughput for real
world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs is used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs is
used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
2.5.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM 0 sockets of both channels are populated with identical DIMMs.
Figure 3. Memory Channel and DIMM Configuration
Channel A DIMM 0
Channel A DIMM 1
Channel B DIMM 0
Channel B DIMM 1

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
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Figure 5 shows a dual channel configuration using 3 DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM 0 socket of Channel B.
Figure 6 shows a dual channel configuration using 4 DIMMs. In this example, the
combined capacity of the 2x DIMMs in Channel A equals the combined capacity of the
2x DIMMs in Channel B. Also, the DIMMs are matched between DIMM 0 and DIMM 1 of
both channels.
Figure 4. Dual Channel (Interleaved) Mode Configuration with 2x DIMMs
Figure 5. Dual Channel (Interleaved) Mode Configuration with 3x DIMMs

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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
2.5.2 Single Channel (Asymmetric) Mode Configurations
Figure 7 shows a single channel configuration using 1x DIMM. In this example, only the
DIMM 0 socket of Channel A is populated. Channel B is not populated.
Figure 8 shows a single channel configuration using 3x DIMMs. In this example, the
combined capacity of the 2x DIMMs in Channel A does not equal the capacity of the
single DIMM in the DIMM 0 socket of Channel B.
Figure 6. Dual Channel (Interleaved) Mode Configuration with 4x DIMMs
Figure 7. Single Channel (Asymmetric) Mode Configuration with 1x DIMM

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
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2.6 Back-Panel Connectors
Figure 9 shows back-panel connectors for the development kit.
2.6.1 Audio-Connectors
This development kit board supports up to 7.1-channel audio configuration. It is
backward compatible with 5.1, 2.1 and stereo (2-channel) audio configuration as well.
Line In Jack (Light Blue)
This audio jack is used to for line in devices, including some optical devices.
Line Out Jack (Light Green)
This audio jack is used for line out devices. It’s used in 2.1, 5.1 and 7.1 channel- audio
configuration. It can be used for headphone and stereo speaker as well.
Mic In Jack (Pink)
This audio jack is use for microphone input.
Figure 8. Single Channel (Asymmetric) Mode Configuration with 3x DIMMs
Figure 9. Back-panel Connectors
1394a Port RJ-45 LAN Port
Side
Speaker
Out Line-in Jack
Rear
Speaker
Out
USB Port
(Total 6
Ports) eSATA Port VGA Analog
Display
S/PDIF IN
S/PDIF OUT Center/
Sub
Woofer
Speaker
Out Jack
Mic In Jack
Line-out
Jack

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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Center/Subwoofer Speaker Out Jack (Orange)
This audio jack is used to connect to center/subwoofer speakers in a 5.1 and 7.1-
channel audio configuration.
Rear Speaker Out (Black)
This audio jack is used to connect to rear speakers in a 5.1 and 7.1-channel audio
configuration.
Side Speaker Out (Gray)
This audio jack is used to connect to side speakers for 7.1-channel audio configuration
only.
2.6.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 10). Table 8
describes the LED states when the board is powered up and the Gigabit LAN subsystem
is operating.
2.6.3 USB Port
The USB port supports the USB 1.1/2.0 specification.
2.6.4 Coaxial S/PDIF In/Out Connector
This connector provides digital audio input and output from external audio system that
supports digital coaxial audio. Ensure that the audio system provides a coaxial digital-
in/out connector.
2.6.5 eSATA Port
This development kits support the first generation eSATA port.
Figure 10. LAN Connector LED locations
Table 8. LAN Connector LED status
LED Color LED State Condition
Left Green
Off LAN link is not established
On LAN link is established
Blinking LAN activity is occurring
Right
N/A Off 10 Mbits/sec data rate is selected
Green On 100 Mbits/sec data rate is selected
Yellow On 1000 Mbits/sec data rate is selected

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
Intel®CoreTM 2 Duo Processor and Intel ®Q35 Express Chipset Development Kit
User’s Manual October 2007
20 Order Number: 318476001US
2.7 Debug Features
2.7.1 Extended Debug Probe (XDP)
The reference board provides a JTAG-compliant test access port (TAP) for attachment
of an XDP connector. The XDP connector and associated circuitry enable the use of the
ITP for the particular processor to interrupt the boot sequence and view processor
status.
The XDP connector is located on the backside of the board at location J2BC. Refer to
Figure 11 to the XDP connector location. Take notes that ITP-XDP SSA connector is
needed. Refer to diagram below for the ITP-XDP SSA connector.
2.7.2 Power LEDs
Power LEDs on the board indicate when standby power is being applied to the standby
planes. When lit they indicate that no DIMM modules should be inserted or removed. To
install or replace DIMM modules insure that AC power to the power supply is removed
by unplugging the AC power cord from the power supply or placing the switch on the
power supply to the open position.
Caution: Removing DIMM modules when the standby power LEDs is lit could result in damage to
the memory devices on those modules.
2.7.3 Port 80 POST Code LEDs
Two LEDs display the POST codes output from Port 80 to indicate the progress of the
boot sequence or display the POST code of the last operation successfully completed
during the boot sequence. Please refer to Section 3.4 for more information on Port 80
code reference.
Figure 11. ITP-XDP Connector location (J2BC)
ITP-XDP
Connector
ITP-XDP SSA Connector is
needed in order to
connect to ITP-XDP2/3
tools