Intel E7500 Guide

Intel®E7500 Chipset
Design Guide
E7500 Memory Controller Hub (MCH) Thermal and Mechanical
Design Guidelines
February 2002
Document Number: 298647-001
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2Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Information in this document is provided in connection with Intel®products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel®E7500 chipset MCH may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
www.intel.com
or call 1-800-548-4725
Intel, Xeon, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2002 Intel Corporation

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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents..........................................................................................10
2 Packaging Technology ......................................................................................................11
3 Thermal Simulation............................................................................................................13
4 Thermal Specifications......................................................................................................15
4.1 Power....................................................................................................................15
4.2 Die Temperature...................................................................................................15
5 Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements..........................................................................17
5.1.1 90° Angle Attach Methodology..............................................................17
5.1.2 0° Angle Attach Methodology................................................................18
5.2 Power Simulation Software...................................................................................20
6 Reference Thermal Solutions............................................................................................21
6.1 Operating Environment.........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly..................................................................................23
6.3.1 Heatsink Orientations............................................................................25
6.3.2 Extruded Heatsink Profiles....................................................................26
6.3.3 Mechanical Interface Material ...............................................................27
6.3.4 Thermal Interface Material ....................................................................27
6.3.5 Heatsink Clip.........................................................................................27
6.3.6 Clip Retention Anchors..........................................................................28
6.3.7 Board Level Component Keep-out Dimensions....................................28
6.4 Reliability Requirements .......................................................................................30
Appendix A: Thermal Solution Component Suppliers............................................................................31
Appendix B: Mechanical Drawings.........................................................................................................33

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4Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Figures
Figure 1. Thermal Design Process......................................................................................8
Figure 2. Intel®E7500 MCH Package Dimensions (Side View)........................................11
Figure 3. Intel®E7500 MCH Package Dimensions (Top View).........................................12
Figure 4. 90° Angle Attach Methodology...........................................................................18
Figure 5. 0° Angle Attach Methodology (Top View)...........................................................19
Figure 6. 0° Angle Attach Heatsink Modifications..............................................................19
Figure 7. Thermal Solution Decision Flowchart.................................................................20
Figure 8. Reference Heatsink Volumetric Envelope for the Intel®MCH............................22
Figure 9. Reference Thermal Solution Assembly..............................................................23
Figure 10. Reference Thermal Solution Assembly (Side View).........................................24
Figure 11. Reference Thermal Solution (Top View)..........................................................24
Figure 12. Preferred Heatsink Orientation.........................................................................25
Figure 13. Extruded Heatsink Profile.................................................................................26
Figure 14. Alternate Tall Heatsink Profile..........................................................................26
Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27
Figure 16. Heatsink Retention Mechanism Layout............................................................28
Figure 17. Retention Mechanism Component Keep-out Zones ........................................29
Figure 18. Intel®MCH Heatsink Assembly........................................................................34
Figure 19. Intel®MCH Heatsink Clip..................................................................................35
Tables
Table 1. Intel®E7500 MCH Thermal Specifications..........................................................15
Table 2. Reliability Requirements......................................................................................30
Table 3. Complete Thermal Solution Kits..........................................................................31
Table 4. Extruded Heatsinks .............................................................................................31
Table 5. Interface Materials...............................................................................................32
Table 6. Attach Hardware..................................................................................................32

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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 5
Revision History
Revision
Number Description Date
-001 Initial Release. February 2002

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Introduction
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 7
1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated
using improved system cooling, selective use of ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within functional limits. The functional temperature limit is the range within
which the electrical circuits can be expected to meet specified performance requirements.
Operation outside the functional limit can degrade system performance, cause logic errors, or
cause component and/or system damage. Temperatures exceeding the maximum operating limits
may result in irreversible changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heatsink can be varied to balance size and space
constraints with acoustic noise.
The goal of this document is to provide an understanding of the operating limits of the
Intel®E7500 chipset MCH and describe a reference thermal solution. Properly designed solutions
provide adequate cooling to maintain the MCH die temperatures within thermal specifications.
This is accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the MCH die
temperature within the range recommended in this document, the system designer can ensure the
proper functionality, performance, and reliability of the chipset.
This document addresses thermal design and specifications for the MCH component only. For
thermal design information on other chipset components, refer to the respective component
datasheet. For the P64H2, refer to the Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and
Mechanical Design Guidelines.

Introduction
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8Intel®E7500 MCH Thermal and Mechanical Design Guidelines
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided to the
system designer. Figure 1 illustrates the design process implicit to this document and the tools
appropriate for each step.
Figure 1. Thermal Design Process
Step 1: Thermal Simulation
- Thermal Models
- Thermal Model Users
Guide
Step 2: Heatsink Selection
- Thermal Reference
- Mechanical Reference
Step 3: Thermal Validation
- Thermal Testing Software
- Software Users Guide
Therm_Design_Proc

Introduction
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 9
1.2 Definition of Terms
Term Definition
BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and
molding compound.
ICH3-S I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC
interface, USB, ATA-33, and other legacy functions.
MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH Memory Controller Hub. The chipset component that contains the processor interface
and the memory interface.
FC-BGA Flip Chip Ball Grid Array. A packaging technology used for the MCH.
P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
Tcase-nhs The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
Tdie-nhs The maximum die temperature without any package thermal solution. This temperature
is measured at the geometric center of the top of the package die.
Tdie-hs The maximum die temperature with the reference thermal solution attached. This
temperature is measured at the geometric center of the top of the package die.
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target
power level.

Introduction
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10 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
1.3 Reference Documents
Document Document
Number
Intel®Xeon™ Processor Thermal Design Guidelines
http://www.intel.com/design/Xeon/guides/298348.htm 298348
Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines 298648
Intel®Xeon™ Processor with 512 KB L2 Cache and Intel®E7500 Chipset Platform
Design Guide 298649
Intel®E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) 290730
Intel®82801CA I/O Controller Hub 3 (ICH3-S) Datasheet 290733
Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet 290732
BGA/OLGA Assembly Development Guide Note 1
Thermal Design Suggestions for various form factors
http://www.formfactors.org
NOTES:
1. Contact your Intel Field Sales representative.

Packaging Technology
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 11
2 Packaging Technology
The E7500 chipset consists of three individual components: E7500 MCH, 82870P2 P64H2, and
82801CA ICH3-S. The E7500 MCH utilizes a 42.5 mm, 6-layer FC-BGA package shown in
Figure 3 and Figure 2. For information on the P64H2 package, refer to the Intel®82870P2
PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines and the Intel®
82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet. For information on the ICH3-S package,
refer to the Intel®82801CA I/O Controller Hub 3 (ICH3-S) Datasheet.
Figure 2. Intel®E7500 MCH Package Dimensions (Side View)
1.10 ± 0.10 mm
Die Substrate
0.60 ± 0.10 mm Seating Plane
Package_Dimensions_Side
1.940 ± 0.150 mm
0.20 –C–
See note 3.
NOTES:
1. All dimensions are in millimeters.
2. Substrate thickness and package overall height are thicker than standard 492-L PBGA.
3. Primary datum –C– and seating plane are defined by the spherical crowns of the solder balls.
4. All dimensions and tolerances conform to ANSI Y14.5M–1982.

Packaging Technology
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12 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Figure 3. Intel®E7500 MCH Package Dimensions (Top View)
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
E
C
B
A
101620 3579
111315
19 4618 81214
22 21
24 23 26 25
28 27
30 29
31
32
(n)x 0.025 Min
Metal Edge
(n)x 0.790 ± 0.025
Solder Resist Opening
(n)x 0.650 ± 0.040
Detail A
00.071 L C
00.200 L C A S B
33 1
2
1.270
20.320
40.640
2x 42.500 ±0.100
0.200 A B
1.270
21.250
Detail A
MCH_Pkg_TopView
17
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M–1982.

Thermal Simulation
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 13
3 Thermal Simulation
Intel provides thermal simulation models of the MCH and associated user’s guides to aid system
designers in simulating, analyzing, and optimizing their thermal solutions in an integrated system-
level environment. The models are for use with the commercially available Computational Fluid
Dynamics (CFD)-based thermal analysis tool “FLOTHERM*” (version 3.1 or higher) by
Flomerics* Inc. Contact your Intel Field Sales representative to order the thermal models and
user’s guides.

Thermal Simulation
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Thermal Specifications
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 15
4 Thermal Specifications
4.1 Power
See Table 1 for TDP specifications for the E7500 MCH. FC-BGA packages have poor heat
transfer capability into the board and have minimal thermal capability without thermal solutions.
Intel recommends that system designers plan for one or more heatsinks when using the E7500
chipset.
4.2 Die Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below
the values specified for the MCH in Table 1. System or component level thermal solutions are
required to maintain die temperatures below the maximum temperature specifications. Refer to
Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 1. Intel®E7500 MCH Thermal Specifications
Parameter Maximum
Tdie-hs 102 °C
TDP 9.0 W
NOTE: Tdie-hs is defined as the maximum die temperature with the reference thermal solution attached.

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16 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
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Thermal Metrology
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 17
5 Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques of measuring the
MCH die temperature. Section 5.1 provides guidelines on how to accurately measure the MCH die
temperatures. Section 5.2 contains information on running an application program that will
emulate anticipated maximum thermal design power. The flowchart in Figure 7 offers useful
guidelines for thermal performance and evaluation.
5.1 Die Temperature Measurements
To ensure functionality and reliability, the MCH is specified for proper operation when Tdie is
maintained at or below their respective maximum temperatures listed in Table 1. The surface
temperature at the geometric center of the die corresponds to Tdie. Measuring Tdie requires special
care to ensure an accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding local ambient
air can introduce error in the measurements. The measurement errors could be due to a poor
thermal contact between the thermocouple junction and the surface of the package, heat loss by
radiation and/or convection, conduction through thermocouple leads, or contact between the
thermocouple cement and the heatsink base (if a heatsink is used). To minimize these measurement
errors, the following approaches are recommended for thermocouple attach.
5.1.1 90° Angle Attach Methodology
1. Use 36 gauge or smaller diameter K-type thermocouples.
2. Ensure that the thermocouple has been properly calibrated.
3. Attach the thermocouple bead or junction to the top surface of the die in the center using high
thermal conductivity cement. It is critical that the thermocouple bead makes contact with
the die.
4. The thermocouple should be attached at a 90° angle if no interference exists between the
thermocouple wire and retention mechanism (see Figure 4). This is the preferred method and
is recommended for use with both bare packages as well as packages employing a thermal
solution.
5. The hole size through the heatsink base to route the thermocouple wires out should be no
larger than 3.3 mm (0.13 in.) in diameter.
6. Make sure no contact exists between the thermocouple cement and heatsink base. This contact
will affect the thermocouple reading.

Thermal Metrology
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18 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Figure 4. 90° Angle Attach Methodology
90° Angle Attach
3.3 mm (0.13 in.)
Diameter Hole
Thermocouple Bead
Die
Substrate
Heatsink
Thermocouple Wire
NOTE: Not to scale.
5.1.2 0° Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter hole centered on bottom of the heatsink base. The milled
hole should be approximately 1.5 mm (0.06 in.) deep.
2. Mill a 1.3 mm (0.05 in.) wide slot, 0.5 mm (0.02 in.) deep, from the centered hole to one edge
of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 6).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using high thermal conductivity cement. During this step, make sure
no contact is present between the thermocouple cement and the heatsink base because any
contact will affect the thermocouple reading. It is critical that the thermocouple bead
makes contact with the die (see Figure 5).
6. Attach heatsink assembly to the MCH, and route thermocouple wires out through the milled
slot.

Thermal Metrology
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 19
Figure 5. 0° Angle Attach Methodology (Top View)
Cement +
Thermocouple Bead
angle_attach_1
Thermocouple Wire
Die
Substrate
NOTE: Not to scale.
Figure 6. 0° Angle Attach Heatsink Modifications
Angle_Attach_Heatsink_Mod
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
NOTE: Not to scale.

Thermal Metrology
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20 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
5.2 Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on a
MCH when used in conjunction with an Intel®Xeon™ processor with 512-KB L2 cache. The
combination of the Intel®Xeon™ processor with 512-KB L2 cache and the higher bandwidth
capability of the E7500 chipset enables new levels of system performance. To assess the thermal
performance of an MCH thermal solution under “worst-case realistic application” conditions, Intel
has developed a software utility that operates the chipset at near worst-case power dissipation.
The utility has been developed solely for testing customer thermal solutions at near the thermal
design power. Figure 7 shows a decision flowchart for determining thermal solution needs. Real
future applications may exceed the thermal design power limit for transient time periods. For
power supply current requirements under these transient conditions, refer to each component’s
datasheet for the ICC (Max Power Supply Current) specification.Contact your Intel Field Sales
representative to obtain a copy of this software.
Figure 7. Thermal Solution Decision Flowchart
Start
Therm_Flowchart
Attach device to
board using
normal reflow
process
Attach thermocouples
using recommended
methodology. Setup
the system in the
desired configuation.
Run the power
program and
monitor the
device die
temperature.
Tdie >
Specification?
End
No
Yes
Heatsink
requied
Select
heatsink