Intel E7500 Guide

Intel®E7500 Chipset
Design Guide
E7500 Memory Controller Hub (MCH) Thermal and Mechanical
Design Guidelines
February 2002
Document Number: 298647-001
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2Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Information in this document is provided in connection with Intel®products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel®E7500 chipset MCH may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
www.intel.com
or call 1-800-548-4725
Intel, Xeon, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2002 Intel Corporation

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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents..........................................................................................10
2 Packaging Technology ......................................................................................................11
3 Thermal Simulation............................................................................................................13
4 Thermal Specifications......................................................................................................15
4.1 Power....................................................................................................................15
4.2 Die Temperature...................................................................................................15
5 Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements..........................................................................17
5.1.1 90° Angle Attach Methodology..............................................................17
5.1.2 0° Angle Attach Methodology................................................................18
5.2 Power Simulation Software...................................................................................20
6 Reference Thermal Solutions............................................................................................21
6.1 Operating Environment.........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly..................................................................................23
6.3.1 Heatsink Orientations............................................................................25
6.3.2 Extruded Heatsink Profiles....................................................................26
6.3.3 Mechanical Interface Material ...............................................................27
6.3.4 Thermal Interface Material ....................................................................27
6.3.5 Heatsink Clip.........................................................................................27
6.3.6 Clip Retention Anchors..........................................................................28
6.3.7 Board Level Component Keep-out Dimensions....................................28
6.4 Reliability Requirements .......................................................................................30
Appendix A: Thermal Solution Component Suppliers............................................................................31
Appendix B: Mechanical Drawings.........................................................................................................33

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4Intel®E7500 MCH Thermal and Mechanical Design Guidelines
Figures
Figure 1. Thermal Design Process......................................................................................8
Figure 2. Intel®E7500 MCH Package Dimensions (Side View)........................................11
Figure 3. Intel®E7500 MCH Package Dimensions (Top View).........................................12
Figure 4. 90° Angle Attach Methodology...........................................................................18
Figure 5. 0° Angle Attach Methodology (Top View)...........................................................19
Figure 6. 0° Angle Attach Heatsink Modifications..............................................................19
Figure 7. Thermal Solution Decision Flowchart.................................................................20
Figure 8. Reference Heatsink Volumetric Envelope for the Intel®MCH............................22
Figure 9. Reference Thermal Solution Assembly..............................................................23
Figure 10. Reference Thermal Solution Assembly (Side View).........................................24
Figure 11. Reference Thermal Solution (Top View)..........................................................24
Figure 12. Preferred Heatsink Orientation.........................................................................25
Figure 13. Extruded Heatsink Profile.................................................................................26
Figure 14. Alternate Tall Heatsink Profile..........................................................................26
Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27
Figure 16. Heatsink Retention Mechanism Layout............................................................28
Figure 17. Retention Mechanism Component Keep-out Zones ........................................29
Figure 18. Intel®MCH Heatsink Assembly........................................................................34
Figure 19. Intel®MCH Heatsink Clip..................................................................................35
Tables
Table 1. Intel®E7500 MCH Thermal Specifications..........................................................15
Table 2. Reliability Requirements......................................................................................30
Table 3. Complete Thermal Solution Kits..........................................................................31
Table 4. Extruded Heatsinks .............................................................................................31
Table 5. Interface Materials...............................................................................................32
Table 6. Attach Hardware..................................................................................................32

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Revision History
Revision
Number Description Date
-001 Initial Release. February 2002

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Introduction
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 7
1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated
using improved system cooling, selective use of ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within functional limits. The functional temperature limit is the range within
which the electrical circuits can be expected to meet specified performance requirements.
Operation outside the functional limit can degrade system performance, cause logic errors, or
cause component and/or system damage. Temperatures exceeding the maximum operating limits
may result in irreversible changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heatsink can be varied to balance size and space
constraints with acoustic noise.
The goal of this document is to provide an understanding of the operating limits of the
Intel®E7500 chipset MCH and describe a reference thermal solution. Properly designed solutions
provide adequate cooling to maintain the MCH die temperatures within thermal specifications.
This is accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the MCH die
temperature within the range recommended in this document, the system designer can ensure the
proper functionality, performance, and reliability of the chipset.
This document addresses thermal design and specifications for the MCH component only. For
thermal design information on other chipset components, refer to the respective component
datasheet. For the P64H2, refer to the Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and
Mechanical Design Guidelines.

Introduction
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8Intel®E7500 MCH Thermal and Mechanical Design Guidelines
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided to the
system designer. Figure 1 illustrates the design process implicit to this document and the tools
appropriate for each step.
Figure 1. Thermal Design Process
Step 1: Thermal Simulation
- Thermal Models
- Thermal Model Users
Guide
Step 2: Heatsink Selection
- Thermal Reference
- Mechanical Reference
Step 3: Thermal Validation
- Thermal Testing Software
- Software Users Guide
Therm_Design_Proc

Introduction
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Intel®E7500 MCH Thermal and Mechanical Design Guidelines 9
1.2 Definition of Terms
Term Definition
BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and
molding compound.
ICH3-S I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC
interface, USB, ATA-33, and other legacy functions.
MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH Memory Controller Hub. The chipset component that contains the processor interface
and the memory interface.
FC-BGA Flip Chip Ball Grid Array. A packaging technology used for the MCH.
P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
Tcase-nhs The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
Tdie-nhs The maximum die temperature without any package thermal solution. This temperature
is measured at the geometric center of the top of the package die.
Tdie-hs The maximum die temperature with the reference thermal solution attached. This
temperature is measured at the geometric center of the top of the package die.
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target
power level.

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10 Intel®E7500 MCH Thermal and Mechanical Design Guidelines
1.3 Reference Documents
Document Document
Number
Intel®Xeon™ Processor Thermal Design Guidelines
http://www.intel.com/design/Xeon/guides/298348.htm 298348
Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines 298648
Intel®Xeon™ Processor with 512 KB L2 Cache and Intel®E7500 Chipset Platform
Design Guide 298649
Intel®E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) 290730
Intel®82801CA I/O Controller Hub 3 (ICH3-S) Datasheet 290733
Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet 290732
BGA/OLGA Assembly Development Guide Note 1
Thermal Design Suggestions for various form factors
http://www.formfactors.org
NOTES:
1. Contact your Intel Field Sales representative.