Intel E5345 - Xeon 2.33 GHz 8M L2 Cache 1333MHz FSB LGA771 Active Quad-Core... Guide

Document Number: 315794, Revision: 002
Quad-Core Intel® Xeon® Processor
5300 Series
Thermal/Mechanical Design Guidelines
April 2007

2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
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Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 3
Contents
1Introduction..............................................................................................................9
1.1 Objective ...........................................................................................................9
1.2 Scope ................................................................................................................9
1.3 References .........................................................................................................9
1.4 Definition of Terms ............................................................................................ 10
2 Thermal/Mechanical Reference Design.................................................................... 13
2.1 Mechanical Requirements ................................................................................... 13
2.1.1 Processor Mechanical Parameters ............................................................. 13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package............................ 14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations................... 18
2.2 Processor Thermal Parameters and Features ......................................................... 18
2.2.1 Thermal Control Circuit and TDP............................................................... 18
2.2.2 Digital Thermal Sensor............................................................................ 20
2.2.3 Platform Environmental Control Interface (PECI) ........................................ 20
2.2.4 Multiple Core Special Considerations ......................................................... 21
2.2.5 Thermal Profile ...................................................................................... 24
2.2.6 TCONTROL Definition .............................................................................. 25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5300 Series............................................................................. 26
2.2.8 Performance Targets............................................................................... 28
2.3 Characterizing Cooling Solution Performance Requirements..................................... 33
2.3.1 Fan Speed Control.................................................................................. 33
2.3.2 Processor Thermal Characterization Parameter Relationships........................ 35
2.3.3 Chassis Thermal Design Considerations ..................................................... 37
2.4 Thermal/Mechanical Reference Design Considerations ............................................ 37
2.4.1 Heatsink Solutions.................................................................................. 37
2.4.2 Thermal Interface Material....................................................................... 38
2.4.3 Summary .............................................................................................. 39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 40
2.4.5 Thermal Solution Performance Characteristics ............................................ 42
2.4.6 Thermal Profile Adherence ....................................................................... 43
2.4.7 Components Overview ............................................................................ 47
2.4.8 Boxed Active Thermal Solution for the
Quad-Core Intel® Xeon® Processor 5300 Series ........................................ 51
A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 55
A.1 Component Overview......................................................................................... 55
A.2 Thermal Solution Performance Characteristics ....................................................... 56
A.3 Thermal Profile Adherence .................................................................................. 57
B Mechanical Drawings ............................................................................................... 59
C Heatsink Clip Load Methodology .............................................................................. 85
C.1 Overview ......................................................................................................... 85
C.2 Test Preparation................................................................................................ 85
C.2.1 Heatsink Preparation .............................................................................. 85
C.2.2 Typical Test Equipment ........................................................................... 88
C.2.3 Test Procedure Examples ........................................................................ 88
C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 88
C.2.5 Preload Degradation under Bake Conditions ............................................... 89

4 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
D Safety Requirements................................................................................................91
E Quality and Reliability Requirements .......................................................................93
E.1 Intel Verification Criteria for the Reference Designs ................................................93
E.1.1 Reference Heatsink Thermal Verification ....................................................93
E.1.2 Environmental Reliability Testing ..............................................................93
E.1.3 Material and Recycling Requirements.........................................................95
F Enabled Suppliers Information.................................................................................97
F.1 Supplier Information ..........................................................................................97
F.1.1 Intel Enabled Suppliers............................................................................97
F.1.2 Additional Suppliers ................................................................................98
Figures
2-1 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3)............15
2-2 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3)............16
2-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3)............17
2-4 Processor Case Temperature Measurement Location ...............................................19
2-5 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series ............................21
2-6 Processor Core Geometric Center Locations ...........................................................23
2-7 Thermal Profile Diagram .....................................................................................24
2-8 TCONTROL Value and Digital Thermal Sensor Value Interaction................................25
2-9 TCONTROL and Thermal Profile Interaction............................................................26
2-10 Dual Thermal Profile Diagram ..............................................................................27
2-11 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300
Series ..............................................................................................................29
2-12 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series .......................30
2-13 Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series .......................31
2-14 TCONTROL and Fan Speed Control .......................................................................34
2-15 Processor Thermal Characterization Parameter Relationships ...................................36
2-16 Exploded View of CEK Thermal Solution Components..............................................40
2-17 2U+ CEK Heatsink Thermal Performance...............................................................42
2-18 1U CEK Heatsink Thermal Performance.................................................................43
2-19 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300
Series Thermal Profile A......................................................................................44
2-20 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300
Series Thermal Profile B......................................................................................45
2-21 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300
Series Thermal Profile ........................................................................................46
2-22 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300
Series Thermal Profile ........................................................................................47
2-23 Isometric View of the 2U+ CEK Heatsink...............................................................48
2-24 Isometric View of the 1U CEK Heatsink .................................................................48
2-25 CEK Spring Isometric View..................................................................................50
2-26 Isometric View of CEK Spring Attachment to the Base Board ...................................50
2-27 Boxed Active CEK Heatsink Solutions with PWM/DTS Control
(Representation Only) ........................................................................................51
2-28 Fan Cable Connection (Active CEK) ......................................................................52
A-1 Isometric View of the 1U Alternative Heatsink........................................................55
A-2 1U Alternative Heatsink Thermal Performance .......................................................56
A-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor E5300 Series Thermal Profile ................................................................57

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
A-4 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5300 Series Thermal Profile ................................................................ 58
B-1 2U CEK Heatsink (Sheet 1 of 4)........................................................................... 60
B-2 2U CEK Heatsink (Sheet 2 of 4)........................................................................... 61
B-3 2U CEK Heatsink (Sheet 3 of 4)........................................................................... 62
B-4 2U CEK Heatsink (Sheet 4 of 4)........................................................................... 63
B-5 CEK Spring (Sheet 1 of 3) .................................................................................. 64
B-6 CEK Spring (Sheet 2 of 3) .................................................................................. 65
B-7 CEK Spring (Sheet 3 of 3) .................................................................................. 66
B-8 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 1 of 6) ............................................................... 67
B-9 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 2 of 6) ............................................................... 68
B-10 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 3 of 6) ............................................................... 69
B-11 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 4 of 6) ............................................................... 70
B-12 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 5 of 6) ............................................................... 71
B-13 Baseboard Keepout Footprint Definition and Height Restrictions
for Enabling Components (Sheet 6 of 6) ............................................................... 72
B-14 1U CEK Heatsink (Sheet 1 of 4)........................................................................... 73
B-15 1U CEK Heatsink (Sheet 2 of 4)........................................................................... 74
B-16 1U CEK Heatsink (Sheet 3 of 4)........................................................................... 75
B-17 1U CEK Heatsink (Sheet 4of 4)............................................................................ 76
B-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)........................................... 77
B-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)........................................... 78
B-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)........................................... 79
B-21 1U Alternative Heatsink (1 of 4) .......................................................................... 80
B-22 1U Alternative Heatsink (2 of 4) .......................................................................... 81
B-23 1U Alternative Heatsink (3 of 4) .......................................................................... 82
B-24 1U Alternative Heatsink (4 of 4) .......................................................................... 83
C-1 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View..................... 86
C-2 Load Cell Installation in Machined Heatsink Base Pocket - Side View......................... 87
C-3 Preload Test Configuration.................................................................................. 87

6 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Tables
1-1 Reference Documents.......................................................................................... 9
1-2 Terms and Descriptions ......................................................................................10
2-1 Processor Mechanical Parameters Table ................................................................13
2-2 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300
Series Thermal Management Features ..................................................................22
2-3 Processor Core Geometric Center Dimensions ........................................................23
2-4 Intel Reference Heatsink Performance Targets for the
Quad-Core Intel® Xeon® Processor X5300 Series..................................................32
2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon®
Processor E5300 Series ......................................................................................32
2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon®
Processor L5300 Series.......................................................................................33
2-7 Fan Speed Control, TCONTROL and DTS Relationship..............................................34
2-8 CEK Heatsink Thermal Mechanical Characteristics...................................................49
2-9 Recommended Thermal Grease Dispense Weight ...................................................49
2-10 Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution) ................................52
2-11 Fan Cable Connector Pin Out (Active CEK).............................................................53
A-1 1U Alternative Heatsink Thermal Mechanical Characteristics ....................................56
B-1 Mechanical Drawing List......................................................................................59
C-1 Typical Test Equipment.......................................................................................88
E-1 Use Conditions Environment................................................................................94
F-1 Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series
Intel Reference Solution .....................................................................................97
F-2 Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series
Intel Reference Solution .....................................................................................99

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History
§
Reference
Number
Revision
Number Description Date
315794 001 • Initial release of the document. November 2006
315794 002
•AddedQuad-CoreIntel®Xeon®Processor L5300 Series
• Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design
chapter
• Add mechanical drawings Figures B-21 – B-24
April 2007

8 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 9
Introduction
1Introduction
1.1 Objective
The purpose of this guide is to describe the reference thermal solution and design
parameters required for Quad-Core Intel® Xeon® Processor 5300 Series. The
Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of the
product. These processors are performance-optimized and provide optimal overall
performance. The Quad-Core Intel® Xeon® Processor E5300 Series refers to the 80W
TDP skus of the product. These processors are rack-optimized and provide optimal
performance per watt. The Quad-Core Intel® Xeon® Processor L5300 Series refers to
the 50W TDP skus of the product. These processors are rack-optimized and provide
optimal power efficiency. Unless other stated, all reference to “Quad-Core Intel®
Xeon® Processor 5300 Series” in this document pertain to the Quad-Core Intel®
Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and
Quad-Core Intel® Xeon® Processor L5300 Series. It is also the intent of this document
to comprehend and demonstrate the processor cooling solution features and
requirements. Furthermore, this document provides an understanding of the processor
thermal characteristics, and discusses guidelines for meeting the thermal requirements
imposed on the entire life of the processor. The thermal/mechanical solutions described
in this document are intended to aid component and system designers in the
development and evaluation of processor compatible thermal/mechanical solutions.
1.2 Scope
The thermal/mechanical solutions described in this document pertain to a solution(s)
intended for use with the Quad-Core Intel® Xeon® Processor 5300 Series in 1U, 2U,
2U+ and workstation form factors systems. This document contains the mechanical
and thermal requirements of the processor cooling solution. In case of conflict, the data
in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet supersedes any data
in this document. Additional information is provided as a reference in the appendices.
1.3 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents (Sheet 1 of 2)
Document Comment
European Blue Angel Recycling Standards http://www.blauer-engel.de
Intel®Xeon®Processor Family Thermal Test Vehicle User's Guide See Note at bottom table.
Intel®Xeon®Processor Thermal Design Guidelines http://developer.intel.com/
LGA771 Socket Mechanical Design Guide See Note following table.
LGA771 SMT Socket Design Guidelines See Note following table.
LGA771 Daisy Chain Test Vehicle User Guide See Note following table.
Quad-Core Intel® Xeon® Processor-Based Servers Platform Design
Guide (PDG)
See Note following table.
Stoakley Platform Design Guide (PDG) See Note following table.
PECI Feature Set Overview See Note following table

Introduction
10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
1.4 Definition of Terms
Platform Environment Control Interface(PECI) Specification See Note following table
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet See Note following table.
Quad-Core Intel® Xeon® Processor 5300
Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and
ProE* format)
Available electronically
Quad-Core Intel® Xeon® Processor 5300
Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*)
Available electronically
Quad-Core Intel® Xeon® Processor 5300
Series_Package_Thermal_Models (in Flotherm* and Icepak*)
Available electronically
Conroe and Woodcrest Processor Family BIOS Writer’s Guide (BWG) See Note following table.
Thin Electronics Bay Specification (A Server System Infrastructure (SSI)
Specification for Rack Optimized Servers
www.ssiforum.com
Table 1-1. Reference Documents (Sheet 2 of 2)
Document Comment
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor replaces the Tdiode in previous products and uses the same
sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature
value represents the number of degrees below the TCC activation temperature.
MSR The processor provides a variety of model specific registers that are used to control and
report on processor performance. Virtually all MSRs handle system related functions and
are not accessible to an application program.
FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values to
ensure their systems are compatible with future processor releases.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
LGA771 Socket The Quad-Core Intel® Xeon® Processor 5300 Series interface to the baseboard through
this surface mount, 771 Land socket. See the LGA771 Socket Mechanical Design Guide
for details regarding this socket.
PMAX The maximum power dissipated by a semiconductor component.
PECI A proprietary one-wire bus interface that provides a communication channel between
Intel processor and chipset components to external thermal monitoring devices, for use
in fan speed control. PECI communicates readings from the processors Digital Thermal
Sensor. PECI replaces the thermal diode available in previous processors.
ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. Heat source should always be specified for Ψmeasurements.
ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total
Package Power.
ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS– TLA) / Total Package Power.
TCASE The case temperature of the processor, measured at the geometric center of the topside
of the IHS.

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11
Introduction
§
TCASE_MAX The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
TCONTROL A processor unique value for use in fan speed control mechanisms. TCONTROL is a
temperature specification based on a temperature reading from the processor’s Digital
Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control
implementation. TCONTROL = -TOFFSET
.
TOFFSET An offset value from the TCC activation temperature value specified in the processor
data sheet and TCONTROL =-TOFFSET
. This value is programmed into each processor
during manufacturing and can be obtained by reading the
IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the
Conroe and Woodcrest Processor Family BIOS Writer’s Guide (BWG).
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory
specifications under normal operating conditions, and with a thermal solution that
satisfies the processor thermal profile specification.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TLA The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Introduction
12 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13
Thermal/Mechanical Reference Design
2Thermal/Mechanical Reference
Design
This chapter describes the thermal/mechanical reference design for Quad-Core Intel®
Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor X5300 Series is the
performance-optimized processor with a front side bus speed of 1066 MHz or
1333 MHz. Quad-Core Intel® Xeon® Processor E5300 Series is a rack-optimized
processor with a front side bus speed of 1066 MHz or 1333 MHz. Both Quad-Core
Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300
Series are targeted for the full range of form factors (2U, 2U+ and 1U/volumetrically
constrained). The Quad-Core Intel® Xeon® Processor L5300 Series is a
power-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. The
Quad-Core Intel® Xeon® Processor L5300 Series is targeted for volumetrically
constrained form factors (1U, server blades and embedded servers).
2.1 Mechanical Requirements
The mechanical performance of the processor cooling solution must satisfy the
requirements described in this section.
2.1.1 Processor Mechanical Parameters
Notes:
1. Refer to drawings in Appendix B.
2. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
and LGA771 Socket Mechanical Design Guide supersede targets listed in Ta bl e 2 - 1 above.
3. These socket limits are defined in the LGA771 Socket Mechanical Design Guide.
4. These package handling limits are defined in the Quad-Core Intel® Xeon® Processor 5300 Series
Datasheet.
5. Shear load that can be applied to the package IHS.
6. Tensile load that can be applied to the package IHS.
7. Torque that can be applied to the package IHS.
Table 2-1. Processor Mechanical Parameters Table
Parameter Minimum Maximum Unit Notes
Volumetric Requirements
and Keepouts
1
Static Compressive Load 3
Static Board Deflection 3
Dynamic Compressive Load 3
Tra nsient Be nd 3
Shear Load 70
311
lbf
N
2,4,5
Tensile Load 25
111
lbf
N
2,4,6
Tor s i o n Loa d 35
3.95
in*lbf
N*m
2,4,7

Thermal/Mechanical Reference Design
14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package
The Quad-Core Intel® Xeon® Processor 5300 Series is packaged using the flip-chip
land grid array (FC-LGA6) package technology. Please refer to the Quad-Core Intel®
Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in
Figure 2-1, Figure 2-2 and Figure 2-3 provide the mechanical information for Quad-
Core Intel® Xeon® Processor 5300 Series. The stackup height of the processors in the
socket is shown in Appendix B. The drawing is superseded with the drawing in the
processor Datasheet, should there be any conflicts. Integrated package/socket stackup
height information is provided in the LGA771 Socket Mechanical Design Guide.
The package includes an integrated heat spreader (IHS). The IHS transfers the non-
uniform heat from the die to the top of the IHS, out of which the heat flux is more
uniform and spreads over a larger surface area (not the entire IHS area). This allows
more efficient heat transfer out of the package to an attached cooling device. The IHS
is designed to be the interface for contacting a heatsink. Details can be found in the
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet.
The processor connects to the baseboard through a 771-land surface mount socket. A
description of the socket can be found in the LGA771 Socket Mechanical Design Guide.
The processor package and socket have mechanical load limits that are specified in the
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket
Mechanical Design Guide. These load limits should not be exceeded during heatsink
installation, removal, mechanical stress testing, or standard shipping conditions. For
example, when a compressive static load is necessary to ensure thermal performance
of the Thermal Interface Material (TIM) between the heatsink base and the IHS, it
should not exceed the corresponding specification given in the LGA771 Socket
Mechanical Design Guide.
The heatsink mass can also add additional dynamic compressive load to the package
during a mechanical shock event. Amplification factors due to the impact force during
shock must be taken into account in dynamic load calculations. The total combination
of dynamic and static compressive load should not then exceed the processor/socket
compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide
during a vertical shock. It is not recommended to use any portion of the processor
substrate as a mechanical reference or load-bearing surface in either static or dynamic
compressive load conditions.

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 15
Thermal/Mechanical Reference Design
Figure 2-1. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3)

Thermal/Mechanical Reference Design
16 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Figure 2-2. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3)

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 17
Thermal/Mechanical Reference Design
Figure 2-3. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3)

Thermal/Mechanical Reference Design
18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series
Considerations
An attachment mechanism must be designed to support the heatsink since there are no
features on the LGA771 socket to directly attach a heatsink. In addition to holding the
heatsink in place on top of the IHS, this mechanism plays a significant role in the
robustness of the system in which it is implemented, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the
heatsink. TIMs, especially ones based on phase change materials, are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Refer to Section 2.4.2 and Section 2.4.7.2 for information on tradeoffs
made with TIM selection. Designs should consider possible decrease in applied
pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and
vibration events. The mechanical requirements of the attach mechanism depend on
the weight of the heatsink and the level of shock and vibration that the system
must support. The overall structural design of the baseboard and system must be
considered when designing the heatsink attach mechanism. Their design should
provide a means for protecting LGA771 socket solder joints as well as preventing
package pullout from the socket.
Note: The load applied by the attachment mechanism must comply with the package and
socket specifications, along with the dynamic load added by the mechanical shock and
vibration requirements, as identified in Section 2.1.1.
A potential mechanical solution for heavy heatsinks is the direct attachment of the
heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized
rather than solely relying on the baseboard strength. In addition to the general
guidelines given above, contact with the baseboard surfaces should be minimized
during installation in order to avoid any damage to the baseboard.
The Intel reference design for Quad-Core Intel® Xeon® Processor 5300 Series is using
such a heatsink attachment scheme. Refer to Section 2.4 for further information
regarding the Intel reference mechanical solution.
2.2 Processor Thermal Parameters and Features
2.2.1 Thermal Control Circuit and TDP
The operating thermal limits of the processor are defined by the Thermal Profile. The
intent of the Thermal Profile specification is to support acoustic noise reduction through
fan speed control and ensure the long-term reliability of the processor. This
specification requires that the temperature at the center of the processor IHS, known
as (TCASE) remains within a certain temperature specification. For illustration,
Figure 2-4 shows the measurement location for the Quad-Core Intel® Xeon®
Processor 5300 Series package. Compliance with the TCASE specification is required to
achieve optimal operation and long-term reliability (See the Intel®Xeon®Dual and
Multi Processor Family Thermal Test Vehicle User's Guide for Case Temperature
definition and measurement methods).

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19
Thermal/Mechanical Reference Design
To ease the burden on thermal solutions, the Thermal Monitor feature and associated
logic have been integrated into the silicon of the processor. One feature of the Thermal
Monitor is the Thermal Control Circuit (TCC). When active, the TCC lowers the
processor temperature by reducing power consumption. This is accomplished through a
combination of Thermal Monitor and Advanced Thermal Monitor (TM2). Thermal
Monitor modulates the duty cycle of the internal processor clocks, resulting in a lower
effective frequency. When active, the TCC turns the processor clocks off and then back
on with a predetermined duty cycle. Thermal Monitor 2 activation adjusts both the
processor operating frequency (via the bus multiplier) and input voltage (via the VID
signals). Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
for further details on TM and TM2.
PROCHOT# is designed to assert at or a few degrees higher than maximum TCASE
(as specified by the thermal profile) when dissipating TDP power, and can not be
interpreted as an indication of processor case temperature. This temperature delta
accounts for processor package, lifetime, and manufacturing variations and attempts to
ensure the Thermal Control Circuit is not activated below maximum TCASE when
dissipating TDP power. There is no defined or fixed correlation between the PROCHOT#
assertion temperature and the case temperature. However, with the introduction of the
Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series,
the DTS reports a relative temperature delta below the PROCHOT# assertion
temperature (see Section 2.2.2 for more details on the Digital Thermal Sensor).
Thermal solutions must be designed to the processor specifications (i.e Thermal Profile)
and can not be adjusted based on experimental measurements of TCASE, PROCHOT#,
or Digital Thermal Sensor on random processor samples.
By taking advantage of the Thermal Monitor features, system designers may reduce
thermal solution cost by designing to the Thermal Design Power (TDP) instead of
maximum power. TDP should be used for processor thermal solution design targets.
TDP is not the maximum power that the processor can dissipate. TDP is based on
measurements of processor power consumption while running various high power
applications. This data set is used to determine those applications that are interesting
Figure 2-4. Processor Case Temperature Measurement Location

Thermal/Mechanical Reference Design
20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
from a power perspective. These applications are then evaluated in a controlled
thermal environment to determine their sensitivity to activation of the thermal control
circuit. This data set is then used to derive the TDP targets published in the processors
Datasheet. The Thermal Monitor can protect the processors in rare workload excursions
above TDP. Therefore, thermal solutions should be designed to dissipate this target
power level. The thermal management logic and thermal monitor features are
discussed in extensive detail in the Quad-Core Intel® Xeon® Processor 5300 Series
Datasheet.
In addition, on-die thermal management features called THERMTRIP# and FORCEPR#
are available on the Quad-Core Intel® Xeon® Processor 5300 Series. They provide a
thermal management approach to support the continued increases in processor
frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5300
Series Datasheet for guidance on these thermal management features.
2.2.2 Digital Thermal Sensor
The Quad-Core Intel® Xeon® Processor 5300 Series include on-die temperature
sensor feature called Digital Thermal Sensor (DTS). The DTS uses the same sensor
utilized for TCC activation. Each individual processor is calibrated so that TCC activation
occurs at a DTS value of 0. The temperature reported by the DTS is the relative offset
in PECI counts below the onset of the TCC activation temperature and hence is
negative. Changes in PECI counts are roughly linear in relation to temperature changes
in degrees Celsius. For example, a change in PECI count by ‘1’ represents a change in
temperature of approximately 1°C. However, this linearity cannot be guaranteed as the
offset below TCC activation exceeds 20-30 PECI counts. Also note that the DTS will not
report any values above the TCC activation temperature, it will simply return 0 in this
case.
The DTS also facilitates the use of multiple thermal sensors within the processor
without the burden of increasing the number of thermal sensor signal pins on the
processor package. Operation of multiple DTS will be discussed more detail in
Section 2.2.4. Also, the DTS utilizes thermal sensors that are optimally located when
compared with thermal diodes available with legacy processors. This is achieved as a
result of a smaller foot print and decreased sensitivity to noise. These DTS benefits will
result in more accurate fan speed control and TCC activation. The DTS application in
fan speed control will be discussed more detail in Section 2.3.1.
2.2.3 Platform Environmental Control Interface (PECI)
The PECI interface is designed specifically to convey system management information
from the processor (initially, only thermal data from the Digital Thermal Sensor). It is a
proprietary single wire bus between the processor and the chipset or other health
monitoring device. The PECI specification provides a specific command set to discover,
enumerate devices, and read the temperature. For an overview of the PECI interface,
please refer to PECI Feature Set Overview. For more detail information on PECI, please
refer to Platform Environment Control Interface (PECI) Specification and Quad-Core
Intel® Xeon® Processor 5300 Series Datasheet.