Intel NetStructure ZT 5085 12U User manual

Intel® NetStructureTM ZT 5085 12U
Redundant Host Packet Switched
Platform
Technical Product Specification
October 2004
Order Number: 273790-005

2
Technical Product Specification
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3
Technical Product Specification
Contents
1 Introduction......................................................................................................................................9
1.1 Product Definition .................................................................................................................9
1.2 Highlights..............................................................................................................................9
1.3 Standard Features..............................................................................................................11
1.3.1 Midplane Slot Assignments ...................................................................................11
1.4 Configuration Options.........................................................................................................12
1.4.1 Two CompactPCI* Bus Segments.........................................................................13
1.4.2 One Extended CompactPCI* Bus..........................................................................15
1.4.3 Redundant Host.....................................................................................................16
1.4.4 Independent Servers .............................................................................................17
1.5 Chassis Management Modules ..........................................................................................18
1.6 PICMG* 2.16 Backplane Ethernet Routing.........................................................................19
1.7 N+N Redundant Power Subsystems..................................................................................19
1.8 Cooling Architecture ...........................................................................................................19
2 Getting Started ..............................................................................................................................21
2.1 Unpacking the System........................................................................................................21
2.2 Shipping Contents ..............................................................................................................21
2.3 Installing the System...........................................................................................................23
2.3.1 Rack Mounting the System....................................................................................24
2.3.2 Grounding the System...........................................................................................24
2.3.3 Providing Power.....................................................................................................25
2.3.4 Connecting I/O Devices.........................................................................................27
2.4 Setup and Configuration.....................................................................................................28
2.4.1 CMM Configuration................................................................................................28
2.4.2 Slot Assignments...................................................................................................29
2.4.3 Setting V(I/O).........................................................................................................29
2.4.4 Disabling the Power Standby Switch.....................................................................31
3 Field Replaceable Units.................................................................................................................33
3.1 Working with Chassis Management Modules.....................................................................33
3.1.1 Installing the CMM.................................................................................................34
3.1.2 Removing the CMM...............................................................................................34
3.2 Working with Board-Level Components .............................................................................35
3.2.1 Removal and Installation of Boards.......................................................................36
3.3 Working with Power Supplies .............................................................................................39
3.3.1 Installing a Power Supply ......................................................................................40
3.3.2 Removing a Power Supply ....................................................................................42
3.4 Working with Fan Trays......................................................................................................42
3.4.1 Removing a Fan Tray ............................................................................................42
3.4.2 Installing a Fan Tray ..............................................................................................43
3.5 Working with the Midplane..................................................................................................44
3.5.1 Removing the Midplane Assembly.........................................................................44
3.5.2 Replacing the Midplane Assembly.........................................................................45
4 Power Subsystem..........................................................................................................................47
4.1 DC Power Distribution Overview ........................................................................................47

4
Technical Product Specification
4.1.1 DC Systems...........................................................................................................48
4.2 DC System Redundancy....................................................................................................48
4.3 AC Systems........................................................................................................................49
4.4 Power Budgeting ................................................................................................................49
4.4.1 Redundant Power Feeds and Power Supplies......................................................50
4.5 Power Supply Capacity and Multiple Voltages...................................................................50
4.5.1 CMMs and Fan Trays............................................................................................50
4.5.2 Cooling Capacity....................................................................................................51
4.6 Power Input.........................................................................................................................51
4.6.1 Power Feed Interface ............................................................................................51
4.7 Power Trays........................................................................................................................52
4.7.1 Power Standby Switch Disable Jumper.................................................................53
4.8 Power Supplies...................................................................................................................53
4.8.1 AC Input Power Supplies.......................................................................................53
4.8.2 DC Input Power Supplies.......................................................................................53
4.9 Midplane Power Distribution...............................................................................................54
4.9.1 V(I/O) Segmentation..............................................................................................54
5 Cooling Subsystem........................................................................................................................55
5.1 Fan Trays............................................................................................................................55
5.1.1 Blowers..................................................................................................................56
5.1.2 Control Board.........................................................................................................56
5.1.3 Managing Fan Trays..............................................................................................57
5.1.4 Fan Tray Status LED.............................................................................................57
5.2 Intake Grill with Air Filter.....................................................................................................58
5.2.1 Replacing the Air Filter ..........................................................................................59
A Specifications................................................................................................................................61
A.1 Physical and Mechanical Specification...............................................................................61
A.2 Environmental Specifications..............................................................................................62
A.3 Electrical Specifications......................................................................................................63
A.3.1 Universal Midplane................................................................................................64
A.3.2 Midplane Connectors and Devices........................................................................64
A.3.3 Logic Ground Isolation Capacitors.........................................................................66
A.3.4 Sensors and Thresholds........................................................................................67
A.4 MTBF Prediction.................................................................................................................70
A.5 Connectors.........................................................................................................................70
A.6 Slot Arrangement................................................................................................................72
A.6.1 Multi-Purpose Slot P1/P2 Interfaces......................................................................74
A.6.2 Peripheral Slot P1/P2 Interfaces............................................................................78
A.6.3 PCI-Less Slot P1/P2 Interfaces.............................................................................79
A.6.4 Node Slot P3 Interface...........................................................................................82
A.6.5 Standard Fabric Slot P3/P4/P5 Interfaces.............................................................83
A.6.6 H.110 P4/P5 Interface ...........................................................................................87
A.6.7 P4/P5 Rear Panel I/O Interface.............................................................................88
A.7 CMM Slot P1/P2/P3 Interfaces...........................................................................................89
A.7.1 CMM Slot P1 Interface...........................................................................................89
A.7.2 CMM Slot P2 Interface...........................................................................................90
A.7.3 CMM Slot P3 Interface...........................................................................................90
B Power Supplies/Hot Swap Circuitry...............................................................................................93

5
Technical Product Specification
B.1 The Power Supply Perspective...........................................................................................93
B.2 Intel® NetStructure™ Power Supplies................................................................................93
C Data Sheet Reference...................................................................................................................95
C.1 CompactPCI*......................................................................................................................95
C.2 User Documentation...........................................................................................................95
D Warranty Information.....................................................................................................................97
D.1 Intel®NetStructure™ Compute Boards & Platform Products Limited Warranty.................97
D.1.1 Returning a Defective Product (RMA)....................................................................97
D.1.2 For the Americas ...................................................................................................98
D.1.3 For EMEA ..............................................................................................................98
D.1.4 For APAC...............................................................................................................98
E Customer Support .......................................................................................................................101
E.1 Technical Support and Return for Service Assistance .....................................................101
E.2 Sales Assistance ..............................................................................................................101
F Agency Approvals........................................................................................................................103
F.1 CE Certification.................................................................................................................103
F.2 Safety................................................................................................................................103
F.3 Emissions Test Regulations .............................................................................................103
F.3.1 EN 50081-1 Emissions ........................................................................................103
F.3.2 EN 55024 Immunity .............................................................................................104
F.4 Regulatory Information .....................................................................................................104
F.4.1 FCC (USA)...........................................................................................................104
F.4.2 Industry Canada (Canada) ..................................................................................104
F.5 Product Safety Information...............................................................................................105
F.5.1 AC and/or DC Power Safety Warning (AC and/or DC Powered Units)................106
F.5.2 Rack Mount Enclosure Safety .............................................................................106
Figures
1 Features (Front)..........................................................................................................................10
2 Features (Rear) ..........................................................................................................................11
3 ZT 5085 Midplane Slot Assignments (Front) ..............................................................................12
4 Two CompactPCI* Bus Segments..............................................................................................14
5 Two Independent CompactPCI* Bus Segments.........................................................................15
6 One Extended CompactPCI* Bus Configuration ........................................................................16
7 Redundant Hosts Controlling Two CompactPCI* Bus Segments...............................................17
8 ZT 5085 Independent Server Configuration ...............................................................................18
9 ZT 5085 Example System (front)...............................................................................................22
10 ZT 5085 Example System (Rear)..............................................................................................23
11 ZT 5085 AC Power Input Panel (P1)..........................................................................................25
12 ZT 5085 DC Power Input Panel (P2)..........................................................................................27
13 ZT 5085 BD_SEL# Jumper Locations........................................................................................29
14 ZT 5085 V(I/O) Shunt Locations.................................................................................................31
15 Power Standby Switch Disable Jumper Locations .....................................................................32
16 Injector/Ejector Operation (Board-Level Components)...............................................................33
17 Power Supply Orientation...........................................................................................................39
18 Injector/Ejector Operation (Power Supplies)...............................................................................41
19 Fan Tray Installation/Removal....................................................................................................43

6
Technical Product Specification
20 Midplane Assembly Retention Screw Locations.........................................................................44
21 Replacing the Midplane Assembly .............................................................................................45
22 ZT 5085 Power Distribution Overview (DC System) ..................................................................48
23 Power Trays ...............................................................................................................................52
24 ZT 5085 Midplane Power Distribution ........................................................................................54
25 Airflow.........................................................................................................................................55
26 Fan Tray Mezzanine Jumper......................................................................................................57
27 Intake Grill and Air Filter.............................................................................................................59
28 Rack Mount ................................................................................................................................62
29 ZT 5085 Backplane Connector Locations (Front).......................................................................65
30 ZT 5085 Backplane Connector Locations (Rear) .......................................................................66
31 ZT 5085 Logic Ground Isolation Capacitor Locations ................................................................67
32 ZT 5085 Connector Locations (Front and Rear).........................................................................71
33 ZT 5085 Slot Arrangement .........................................................................................................73
Tables
1 V(I/O) Related Slot Capabilities..................................................................................................30
2 V(I/O) Configuration Options ......................................................................................................30
3 Power Tray J7 Jumper Configurations .......................................................................................32
4 ZT 5085 Slot Definitions .............................................................................................................35
5 ZT 5085 Power Fault Tolerance Matrix (DC)..............................................................................49
6 ZT 5085 Power Fault Tolerance Matrix (AC)..............................................................................49
7 ZT 5085 Budget by Voltage using 250W Power Supplies..........................................................50
8 AC Input Specifications ..............................................................................................................53
9 DC Input Specifications..............................................................................................................54
10 Delta* Blower Motor Specifications ............................................................................................56
11 Fan Tray Health/Status LED States ...........................................................................................58
12 Chassis Dimensions...................................................................................................................61
13 Chassis Environmental Specifications........................................................................................63
14 ZT 5085 Connector Assignments...............................................................................................64
15 Sensor Default Thresholds.........................................................................................................67
16 MTBF Prediction on ZT 5085 DC ...............................................................................................70
17 Slot Arrangement.......................................................................................................................73
18 ZT 5085 Slot Interfaces..............................................................................................................74
19 Slot P1 Pin Assignments ............................................................................................................75
20 Multi-Purpose Slot P2 Pin Assignments.....................................................................................76
21 CompactPCI* Peripheral Slot P1 Pin Assignments....................................................................78
22 CompactPCI* Peripheral Slot P2 Pin Assignments....................................................................79
23 CompactPCI* PCI-Less Slot P1 Pin Assignments......................................................................80
24 CompactPCI* PCI-Less Slot P2 Pin Assignments.....................................................................81
25 Node Slot P3 Pin Assignments...................................................................................................82
26 Standard Fabric Board P3 Pin Assignments..............................................................................83
27 Standard Fabric Board P4 Pin Assignments..............................................................................84
28 Standard Fabric Board P5 Pin Assignments..............................................................................84
29 Midplane Ethernet Connections .................................................................................................86
30 H.110 P4 Pin Assignments.........................................................................................................87
31 H.110 P5 Pin Assignments.........................................................................................................88
32 P1 Connector CMM Pin Assignments ........................................................................................89
33 P2 Connector CMM Pin Assignments ........................................................................................90
34 P2 Connector CMM Slot 9 Pin Assignments..............................................................................90

7
Technical Product Specification
35 P3 Connector CMM Pin Assignments ........................................................................................90
Revision History
Date Revision Description
October 2004 005 Clarified slot and midplane arrangement; updated product
return shipping information.
May 2004 004 Changed value on slot interface table.
July 2003 003 Name changes, filler panel info and synch up with
documentation.
July 2003 002 Updated Customer Support and Warranty Information
September 2002 001 Initial Release of this document

8
Technical Product Specification

9
Technical Product Specification
Introduction
Introduction 1
This chapter provides an overview of the ZT 5085 system. It includes a product definition and
summaries of the system's hardware and software features. This chapter is useful for comparing the
features of the ZT 5085 to the needs of a specific application.
1.1 Product Definition
The Intel®NetStructure™ ZT 5085 12U Redundant Host Packet Switched Platform is one of
several telecom building blocks from Intel, providing OEM equipment designers with carrier-
grade, standards-based, high availability solutions built on the PICMG* 2.16 specification. This
high-capacity CompactPCI* platform features 18 node slots and a redundant infrastructure (fabric,
management, power, and cooling) making it ideal for carrier-grade telecom and Internet
applications. Beyond its high availability features, the ZT 5085 is highly modular, scalable, and
serviceable. It is compatible with the Intel®NetStructure™ family of packet switched backplane
products, and is designed to operate with third-party boards meeting the PICMG* 2.16
specifications.
Hot-swappable system components provide built-in redundancy to simplify replacement and
minimize service time. Redundant chassis management modules enable customers to manage
multiple processor boards and conduct chassis diagnostics remotely for enhanced system
reliability. Two 6U slots are reserved for PICMG* 2.16 standard fabric boards (Ethernet switches).
The ZT 5085 platform routes Ethernet signals across the midplane without the use of cables;saving
time in setup, maintenance,and repair, and eliminating the thermal challenges of traditional cabling
methods.
1.2 Highlights
•High Capacity - 12U, 19-inch rack-mount enclosure
— 21 slots (18 node slots, two fabric slots, and two 3U Chassis Management slots)
— Efficient front-to-rear cooling
— Up to 50 W per node slot, 80 W per fabric slot power and cooling
Note: With 250 W supplies, the ZT 5085 can support an average of 40 W per node slot and 60 W per
fabric slot, with a maximum of 50 W per node slot and 80 W per fabric slot.See Chapter 4, “Power
Subsystem,” for details.
•High Availability - Delivering “five-nines” availability
— Redundant modules for fault recovery:
—Multi-Purpose slots supporting two CompactPCI* bus segments
—Redundant System Slot
—Two PICMG* 2.16 10/100/1000 fabric slots supporting hot-swappable boards
—Two hot-swappable IPMI-based Chassis Management Modules

10 Technical Product Specification
Introduction
—N+1 hot-swappable fan trays for cooling
—N+N hot-swappable, load-sharing 250 W AC or DC power supplies
—N+N power input
•Highly Flexible - Multiple midplane configuration options
— 16 node slots support 64-bit/33 MHz PCI operation
— Two node slots with no PCI connection
— Two CompactPCI bus segments with H.110 support
— 21 rear-panel I/O slots (18 node slots, two fabric slots, and two 3U CMM slots)
•Highly Manageable - IPMI-based redundant Chassis Management Modules (optional)
— Unique star topology for management buses increases reliability and security
•Highly Scalable - Flexibility to scale processors, I/O boards, power and cooling
•Standards and Compatibility - Interoperable with processor boards, peripherals, switches
and sub-components from multiple manufacturers
— 6U PICMG* 2.16-compliant midplane
— Designed for NEBS Level 3 and FCC Class B
— PICMG* 2.9 IPMI-based management
Figure 1. Features (Front)
Redundant
Chassis
Management
Modules
18 Node
Slots
Mounting
Flange
ESD Ground
Jack
Three Removable
N+1 Fan Trays
Removable
Grill with Filter
Eight 3U
Power Supplys
(behind grill)
Redundant
Ethernet
Switches

11
Technical Product Specification
Introduction
1.3 Standard Features
The ZT 5085 is a basic platform building block, designed to support PICMG* 2.16-compliant
processor boards, switches, and peripherals. The platform consists of:
•Rugged 12U chassis, designed for NEBS Level 3
•21-slot PICMG 2.16-compliant midplane (two 6U fabric slots, 18 6U node slots, and two 3U
management slots)
•Two redundant IPMI-based Chassis Management Modules
•Eight N+N Redundant, load-sharing 250 W AC or 350 W DC 47-pin connector modular
power supplies
•Three hot swappable fan trays with three blowers each (nine blowers total)
•Card cage supports standard CompactPCI* keying
1.3.1 Midplane Slot Assignments
The ZT 5085 midplane features 21 6U slots.
Figure 2. Features (Rear)
B2729-02
B2 B1
A2 A1
Cooling System
Exhaust
21 Rear Panel
I/O Slots
Power Input
Cover
ESD Ground Jack
Power Standby
Switch

12 Technical Product Specification
Introduction
Slot 1 is dedicatied to two 3U Chassis Managment Modules (CMMs-Intel® NetStructure™
ZT7102).
Slots 2 and 21 are dedicated to 6U PICMG* 2.16-compliant Ethernet switches (fabric boards).Slots
3 through 18 are PICMG 2.16-compliant node slots, each supporting a 33 MHz, 32/64-bit
CompactPCI* bus interface. Slots 19 and 20 are PICMG 2.16-compliant node slots without
CompactPCI interfaces.
Slots 3 through 8 and 13 through 18 have H.110 compliant telephony bus.
All slots support IEEE 1101.11-style, 80 mm deep transition cards in the rear-panel I/O section
directly behind the midplane. Each CompactPCI bus, each fabric slot, and the pair of PCI-less slots
can be independantly configured for 3.3 V or 5 V V(I/O) operation (see Section 2.4.3, “Setting V(I/
O)” on page 29).
1.4 Configuration Options
The ZT 5085 can accommodate multiple configurations. Refer to the following illustrations for
examples.
Figure 3. ZT 5085 Midplane Slot Assignments (Front)
Switch
Slot
Switch Slot
221
34567810
911 12 13 14 18 19 20
15 16 17
1A
1B
CMM
Slots
PCI-Less
Node Slots
PICMG 2.16 Node Slots
CompactPCI Slots

13
Technical Product Specification
Introduction
1.4.1 Two CompactPCI* Bus Segments
The ZT 5085 can be used in a configuration that supports two independent CompactPCI* bus
segments. Segment 1 consists of slots 3-9 and 11. Segment 2 consists of slots 10 and 12-18.
Each segment includes two multi-purpose slots:
•Segment 1: Slots 9 and 11
•Segment 2: Slots 10 and 12
Multi-purpose slots for each segment are interleaved to support Redundant Host mode (See
Section 1.4.3, “Redundant Host” on page 16).
The two segments can be used independently by installing a system slot board in one multi-purpose
slot per segment. Peripheral boards may then be used in the additional multi-purpose slots.
Each segment also includes six peripheral slots:
•Segment 1: Slots 3-8
•Segment 2 Slots 13-18
These 12 peripheral slots support a single H.110 Computer Telephony bus spanning slots 3 through
8 and 13 through 18.
If using two segments, it is recommended that the System Master boards occupy either 9 and 10, or
11 and 12.

14 Technical Product Specification
Introduction
Figure 4. Two CompactPCI* Bus Segments
2 21
3 4 5 6 7 8 912 13 14 18 19 20
15 16 17
1A
1B
H.110 Bus
Peripheral Slots Peripheral Slots
CompactPCI
Segment 2
CompactPCI
Segment 1
CompactPCI
Segment 2
Multi-Purpose Slots
CompactPCI Segment 1
Multi-Purpose Slots
CompactPCI
CompactPCI
Com
Com
pac
pac
PC
P
Segment 2
Segment 2
e
e
me
e
t
t
CompactPCI
CompactPCI
Com
Com
pac
pac
PC
P
Segment 1
Segment 1
e
e
me
e
t

15
Technical Product Specification
Introduction
1.4.2 One Extended CompactPCI* Bus
The ZT 5085 can be used in a configuration that supports one “extended” bus. The extended bus is
comprised of two bus segments that are bridged to become part of the same bus hierarchy. By
bridging the two bus segments together, one system master can control 14 peripheral slots.
The CompactPCI* segments can be bridged together with a bridge mezzanine board mated to a
system master processor board (for example, ZT 4901 and ZT 5524). This two-board complex can
be installed in slots 9 and 10, or slots 11 and 12 to bridge CompactPCI bus segments 1 and 2.
Figure 5. Two Independent CompactPCI* Bus Segments
221
34567813 14 18 19 20
15 16 17
1A
1B
Segment 2 System Slot Board Segment 1 System Slot Board
912
CompactPCI
Segment 2
CompactPCI
Segment 1

16 Technical Product Specification
Introduction
1.4.3 Redundant Host
The ZT 5085 can serve as a PICMG* 2.16 compliant High Availability platform for two
Redundant Host processor boards. Intel’s Redundant Host architecture incorporates a second
system master board, a Redundant Host, which can take over bus ownership in the event of a
primary system master board failure. This allows the failed board to be replaced without
interruption of service. Resource management and data base information is synchronized between
the processor boards via 100 Mbps Ethernet.
For more information about Intel’s High Availability architecture and development of Redundant
Host drivers, refer to the High Availability Software for the Intel®NetStructure™ ZT 4901
Technical Product Specification.
Figure 6. One Extended CompactPCI* Bus Configuration
221
345678912 13 14 18 19 20
15 16 17
1A
1B
CompactPCI
Bus
CompactPCI
Bus
CompactPCI
Bus
Host Processor Board Bridge Mezzanine Board

17
Technical Product Specification
Introduction
1.4.4 Independent Servers
TheZT 5085 can be used in a configuration that supports 18 independent servers communicating
over the PICMG* 2.16 Ethernet midplane (slots 3-20).
Figure 7. Redundant Hosts Controlling Two CompactPCI* Bus Segments
2 21
3 4 5 6 7 8 13 14 18 19 20
15 16 17
1A
1B
Host Processor Board
Redundant Host Processor Board
Bridge Mezzanine Board
Bridge Mezzanine Board

18 Technical Product Specification
Introduction
Note: Due to the midplane's CompactPCI* bus segments, some limitations exist with regard to system
slots. Refer to Section 3.2, “Working with Board-Level Components” on page 35 and Section 3.2.1,
“Removal and Installation of Boards” on page 36 for details.
1.5 Chassis Management Modules
The ZT 7102 is the central management component for all Intel®NetStructure™ platforms that are
PICMG 2.16-compliant, including the ZT 5085. It uses standards-based interfaces, allowing
management of third-party IPMI-based products within an Intel NetStructure platform. It
communicates with the components in the ZT 5085 via point-to-point IPMB buses in a unique star
topology to achieve comprehensive, highly available, and secure management.
The ZT 5085 supports two redundant ZT 7102s that operate in active/hot standby modes. Two
redundant PICMG 2.16 switches must be installed for two redundant CMMs to fully synchronize.
Synchronization of data exchanged via the IPMB connection occurs without the dual switches, but
100% synchronization requires both switches.
Figure 8. ZT 5085 Independent Server Configuration
B3478-01
)
*
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$
"
" # $ % & ' 
CMMs
Independent Servers
Switch
Switch

19
Technical Product Specification
Introduction
1.6 PICMG* 2.16 Backplane Ethernet Routing
PICMG* 2.16-compliant, in-chassis switches minimize external wiring, thus improving density
and reliability.
As listed in Appendix A under “Standard Fabric Slot P3/P4/P5 Interfaces” on page 83:
•Ports 1-18 correspond to chassis slots 3-20.
•For each node board, port “A” connects to the switch in slot 2, and port “B” connects to the
switch in slot 21.
•The switch in slot 2, port 19 connects to CMM1A, and the switch in slot 21, port 19 connects
to CMM1B (refer to the ZT 7102 Chassis Management Module Technical Product
Specification for instructions on enabling the CMM port on the backplane).
•Link Port “f” provides a link between the switches in slots 2 and 21.
•Ethernet Fabric boards typically provide uplinks via front- and/or rear-panel connectors.
1.7 N+N Redundant Power Subsystems
The ZT 5085 supports a redundant, scalable power solution, allowing up to eight standard
CompactPCI* 3U x 8HP power supplies.The power supplies are divided into two separate power
subsystems. Each power subsystem supports N+N redundant power supplies and receives input
power from redundant DCor ACinputs. This is critical in Central Office locations where two power
plants deliver redundant DC input into High Availability devices. The two power subsystems in the
ZT 5085 maintain isolation of these inputs (no diode ORing), to ensure that failure of one power
input does not affect the second power input.
1.8 Cooling Architecture
The ZT 5085 platform is designed to cool a maximum of 50 W per slot for the node slots, and 80
W per slot forthe fabric slots. It houses three fan trays that are hot swappable, and serviceable from
the front. Each tray spans the distance from front to back of the chassis. Each tray houses three
blowers: one in the front, one in the midsection, and one in the rear. The front and middle blowers
are responsible for cooling the front card cage area, and the rear blower is responsible for cooling
the power supplies and the rear card cage area. The middle blower also provides airflow for the rear
area if a rear blower fails. This combination of three trays with three blowers each provides N+1
redundant cooling for the entire chassis.
Refer to Chapter 5, “Cooling Subsystem” for more information about the ZT 5085's cooling
architecture.

20 Technical Product Specification
Introduction