Intel D50DNP Series User manual

Intel® Server D50DNP Family
Intel® Server Board D50DNP
Intel® D50DNP Module
Intel® Server System D50DNP
Integration and Service Guide
A guide providing instructions for the insertion and extraction of
system components and available Intel accessories and spares.
Rev. 1.0
January 2023
Delivering Breakthrough Data Center System Innovation – Experience What’s Inside!

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Document Revision History
Date
Revision
Changes
January 2023
1.0
Initial public release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Copies of documents that have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, Stratix, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components voids the UL listing and other regulatory approvals of the product. It will most likely
result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons on the front panel of each module do NOT turn off the server
chassis AC power. To remove power from the server chassis, you must unplug the AC power cord from the
electrical outlet. Make sure that the AC power cord is unplugged before you open the server chassis.
To service a module, it is not necessary to power down the entire system. Power off only the module
requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices, and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the module and disconnect all telecommunications systems,
networks, and modems attached to it before removing it from the server chassis. Otherwise, personal injury
or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine
needle-nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to
remove or install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping
the wide sides can damage the contacts inside the jumper, causing intermittent problems with the function
controlled by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove
a jumper, or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can damage your computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends that the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole founders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the server chassis
•Power down the module and remove it from the server chassis, remove power feed from the server
board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place
electronic devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product performs to its published specifications. However, all computer systems are
inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Weight of the System
•Remove all installed modules from the system before attempting to install the system into the rack.
•Due to the weight of a system, Intel recommends using a mechanical lift to install system into a rack.
Or handling the system with two people supporting the system from the sides.
•If your system has rack handles installed, do not lift, or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.
Liquid Cooling Safety Guidelines
•Make sure that there are no leaks and/or damaged parts before operating the liquid-cooling system.
•Do not energize the system or any installed modules if the liquid-cooling subsystem is compromised.
•Do not attempt to perform any service to the server chassis before removing power to the system.
Turn off the modules before disconnecting the liquid-cooling quick disconnect tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid-
cooled modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep the liquid-cooling tubing clear of pinch points when installing or removing the server modules
in/from the chassis.

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Important Safety Certification Standards and Transition Support
Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel server systems identified in this service guide are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel server
products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® Server System products released in 2019 or later. Legacy Intel®
Server System products released in 2018 or earlier provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures:
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel server products
released in 2019 or later certified to this standard require restricted access locations.
Legacy Intel server products (released in 2018 or earlier) were designed with additional safeguards to meet
IEC 60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the
standard intended application use requirements. After the IEC 60950-1 standard is phased out globally and
Intel server products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Contents
1. Introduction............................................................................................................................................................... 20
1.1 About This Document ..................................................................................................................................................20
1.1.1 System Integration ........................................................................................................................................................20
1.1.2 System Service................................................................................................................................................................21
1.2 Reference Documents and Support Collaterals................................................................................................22
2. L6 Integrated System Essential System Component Installation................................................................. 23
2.1 Air Duct Removal / Installation.................................................................................................................................25
2.1.1 Air Duct Removal (Half-width Modules) ...............................................................................................................25
2.1.2 Air Duct Installation (Half-width Modules) ..........................................................................................................25
2.1.3 Air Duct Removal (D50DNP2MFALAC Module).................................................................................................26
2.1.4 Air Duct Installation (D50DNP2MFALAC Module)............................................................................................26
2.2 Processor Assembly and Installation ....................................................................................................................27
2.2.1 Heat Sinks..........................................................................................................................................................................27
2.2.2 Processor Carrier Clips ................................................................................................................................................29
2.2.3 Assembly and Installation for Standard Air-Cooled Heat Sinks ................................................................29
2.2.4 Assembly and Installation for EVAC Heat Sinks................................................................................................35
2.2.5 Assembly and Installation for Liquid-Cooled Configurations.....................................................................42
2.3 Liquid-Cooling Loop Installation (D50DNP1MHCPLC Module)..................................................................45
2.4 Memory Module Installation .....................................................................................................................................51
2.4.1 Memory Installation for Air-Cooled Modules.....................................................................................................51
2.4.2 Memory Installation for Liquid-Cooled Modules..............................................................................................52
2.5 Module Installation........................................................................................................................................................56
2.6 Power Supply Installation...........................................................................................................................................56
3. System Options / Accessory Kit Installation...................................................................................................... 57
3.1 Installing the Chassis into a Rack ............................................................................................................................57
3.1.1 Installing the Fixed Rail Kit.........................................................................................................................................58
3.1.2 Installing the Chassis into a Rack ............................................................................................................................59
3.2 Module Removal / Installation..................................................................................................................................60
3.2.1 Module Removal.............................................................................................................................................................60
3.2.2 Module Installation........................................................................................................................................................61
3.3 Air Duct Removal / Installation.................................................................................................................................61
3.3.1 Air Duct Removal (Half-width Modules) ...............................................................................................................62
3.3.2 Air Duct Installation (Half-width Modules) ..........................................................................................................62
3.3.3 Air Duct Removal (D50DNP2MFALAC Module).................................................................................................63
3.3.4 Air Duct Installation (D50DNP2MFALAC Module)............................................................................................63
3.4 Low-Profile Add-In Card Installation.....................................................................................................................64
3.4.1 Standard Riser Assembly Removal.........................................................................................................................66
3.4.2 MCIO* Riser Assembly Removal...............................................................................................................................67
3.4.3 PCIe* Add-In Card Installation..................................................................................................................................68

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3.4.4 Standard Riser Assembly Installation....................................................................................................................68
3.4.5 MCIO* Riser Assembly Installation .........................................................................................................................69
3.4.6 Riser Assembly Installation into Liquid-Cooled Modules.............................................................................70
3.5 Liquid-Cooled Add-In Card Installation (D50DNP1MHCPLC and D50DNP1MFALLC Modules) ..71
3.6 PCIe* Accelerator Module Add-In Card Installation (D50DNP2MFALAC Module) .............................72
3.7 2.5” U.2 Front Drive Installation...............................................................................................................................78
3.7.1 Drive Carrier Extraction................................................................................................................................................78
3.7.2 Drive Carrier Assembly ................................................................................................................................................78
3.7.3 Drive Carrier Installation .............................................................................................................................................80
3.8 M.2 SSD Installation......................................................................................................................................................81
3.8.1 Thermal Pad Installation for Air-Cooled Configurations...............................................................................81
3.8.2 M.2 SSD Installation for Air-Cooled Configurations........................................................................................82
3.8.3 M.2 SSD Heat Sink Installation for Air-Cooled Configurations...................................................................83
3.8.4 Riser Bracket Installation for Liquid-Cooled Configurations.......................................................................83
3.8.5 Thermal Pad Installation for Liquid-Cooled Configurations........................................................................84
3.8.6 M.2 SSD Installation for Liquid-Cooled Configurations.................................................................................85
3.8.7 M.2 SSD Cold Plate Installation for Liquid-Cooled Configurations ..........................................................86
3.9 Trusted Platform Module (TPM) Installation......................................................................................................87
3.10 Ethernet Management Port Module (AXXFCEMP) ...........................................................................................88
4. System Software Updates and Configuration.................................................................................................... 89
4.1 Using the BIOS Setup Utility......................................................................................................................................89
4.1.1 Entering BIOS Setup Utility........................................................................................................................................89
4.1.2 No Access to the BIOS Setup Utility.......................................................................................................................89
4.1.3 Navigating the BIOS Setup Utility............................................................................................................................89
5. System Packaging Assembly Instructions .......................................................................................................... 91
6. System / Module Features Overview ................................................................................................................... 94
6.1 System Feature Identification...................................................................................................................................94
6.2 Front Panel Feature Identification ..........................................................................................................................96
6.3 Front Control Panel and I/O Breakout Cable Feature Identification ........................................................97
6.4 System Component Identification..........................................................................................................................98
6.5 Server Board Features............................................................................................................................................... 104
6.6 Module and Chassis Specific Features............................................................................................................... 107
7. FRU Replacement ................................................................................................................................................... 111
7.1 Module Removal / Installation............................................................................................................................... 112
7.1.1 Module Removal.......................................................................................................................................................... 112
7.1.2 Module Installation..................................................................................................................................................... 112
7.2 Air Duct Removal / Installation.............................................................................................................................. 113
7.2.1 Air Duct Removal (Half Width Modules)............................................................................................................ 113
7.2.2 Air Duct Installation (Half Width Modules)....................................................................................................... 113
7.2.3Air Duct Removal (D50DNP2MFALAC Module).............................................................................................. 114
7.2.4 Air Duct Installation (D50DNP2MFALAC Module)......................................................................................... 114
7.3 Processor Replacement............................................................................................................................................ 115

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7.3.1 Processor Replacement for Standard Air-Cooled Heat Sinks.................................................................. 115
7.3.2 Processor Replacement for EVAC Heat Sink ................................................................................................... 123
7.3.3 Processor Replacement for Liquid-Cooled Configurations ...................................................................... 132
7.4 Memory Module Replacement .............................................................................................................................. 141
7.4.1 Memory Replacement for Air-Cooled Modules.............................................................................................. 141
7.4.2 Memory Replacement for Liquid-Cooled Modules....................................................................................... 142
7.5Riser Card and PCIe Add-In Card Replacement ............................................................................................. 146
7.5.1 Standard Riser Assembly Removal...................................................................................................................... 148
7.5.2 MCIO* Riser Assembly Removal............................................................................................................................ 148
7.5.3 PCIe* Add-In Card Replacement........................................................................................................................... 149
7.5.4 Standard Riser Assembly Installation................................................................................................................. 150
7.5.5 MCIO* Riser Assembly Installation ...................................................................................................................... 151
7.5.6 Riser Assembly Installation into Liquid-Cooled Modules.......................................................................... 152
7.6 M.2 SSD Replacement............................................................................................................................................... 153
7.6.1 M.2 SSD and Heat Sink Replacement for Air-Cooled Configurations................................................... 153
7.6.2 M.2 SSD and Cold Plate Replacement for Liquid-Cooled Configurations .......................................... 155
7.7 Liquid-Cooling Loop Replacement (D50DNP1MHCPLC Module)........................................................... 158
7.8 Add-In Card Replacement for Liquid-Cooled Modules (D50DNP1MHCPLC and
D50DNP1MFALLC Modules) ......................................................................................................................................................... 167
7.9 PCIe* Accelerator Module Add-In Card Replacement (D50DNP2MFALAC Module) ...................... 168
7.10 PCIe* Accelerator Module Riser Card Replacement (D50DNP2MFALAC Module) .......................... 173
7.11 PCIe* Accelerator Module Power Connector Board Replacement (D50DNP2MFALAC Module)
177
7.12 Power Supply Replacement ................................................................................................................................... 180
7.13 Server Board Replacement ..................................................................................................................................... 181
7.14 System Fan Replacement ........................................................................................................................................ 183
7.15 Power Distribution Board (PDB) Assembly Replacement .......................................................................... 186
7.16 Internal Chassis Rail Replacement....................................................................................................................... 190
7.17 System Battery Replacement................................................................................................................................. 192
Appendix A. Getting Help ........................................................................................................................................ 193
Appendix B. Memory Population Rules................................................................................................................ 194
B.1 DDR5 DIMM Population Rules ............................................................................................................................... 194
B.2 Intel® Optane™ Persistent Memory 300 Series Module Rules.................................................................. 194
B.3 Recommended Memory Configurations ........................................................................................................... 195
B.3 Intel® DDR5 DIMM Support Disclaimer .............................................................................................................. 197
Appendix C. System Status LED State Definitions............................................................................................. 198
Appendix D. Onboard Configuration and Service Jumpers............................................................................. 201
Appendix E. POST Code Diagnostic LEDs............................................................................................................ 202
E.1 Early POST Memory Initialization MRC Diagnostic Codes......................................................................... 203
E.2 BIOS POST Progress Codes.................................................................................................................................... 205
Appendix F. POST Error Codes .............................................................................................................................. 209
F.1 POST Error LED Codes.............................................................................................................................................. 215

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F.2 Processor Initialization Error Summary............................................................................................................. 217
Appendix G. Product Safety – Multi-Language ................................................................................................... 218
Appendix H. Glossary ............................................................................................................................................... 234

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List of Figures
Figure 1. System Directional Reference...........................................................................................................................................24
Figure 2. Removing the Air Duct (Half-width Modules).............................................................................................................25
Figure 3. Installing the Air Duct (Half-width Modules)...............................................................................................................25
Figure 4. Removing the Air Duct (D50DNP2MFALAC Module)...............................................................................................26
Figure 5. Installing the Air Duct (D50DNP2MFALAC Module) ................................................................................................26
Figure 6. 1U Supported Standard Processor Heat Sinks .........................................................................................................27
Figure 7. 1U Supported EVAC Processor Heat Sinks.................................................................................................................27
Figure 8. 2U Heat Sinks...........................................................................................................................................................................28
Figure 9. 1U Heat Sinks Installed in Module.................................................................................................................................. 28
Figure 10. Supported Processor Carrier Clips...............................................................................................................................29
Figure 11. Processor Components and Processor Socket Reference Diagram with Standard Heat Sink ...........30
Figure 12. Installing the Processor Carrier Clip onto the Processor – Part 1...................................................................31
Figure 13. Installing the Processor Carrier Clip onto the Processor – Part 2...................................................................31
Figure 14. Heat Sink Handling .............................................................................................................................................................32
Figure 15. Processor Heat Sink Anti-tilt Wires in the Outward Position............................................................................32
Figure 16. Aligning Pin 1 Indicator.....................................................................................................................................................33
Figure 17. Socket Protective Cover Removal ................................................................................................................................33
Figure 18. PHM Alignment with the Socket Assembly..............................................................................................................34
Figure 19. PHM Installation onto the Server Board....................................................................................................................34
Figure 20. Tighten Heat Sink Fasteners...........................................................................................................................................35
Figure 21. Processor Components and Processor Socket Reference Diagram with EVAC Heat Sink...................36
Figure 22. Installing the Processor Carrier Clip onto the Processor – Part 1...................................................................37
Figure 23. Installing the Processor Carrier Clip onto the Processor – Part 2...................................................................37
Figure 24. Handling Heat Sink .............................................................................................................................................................38
Figure 25. Processor Heat Sink Anti-tilt Wires in the Outward Position............................................................................38
Figure 26. Pin 1 Indicator Alignment ................................................................................................................................................39
Figure 27. Removing a Riser Assembly............................................................................................................................................39
Figure 28. Socket Protective Cover Removal ................................................................................................................................40
Figure 29. PHM Alignment with the Socket Assembly..............................................................................................................40
Figure 30. PHM Installation onto the Server Board....................................................................................................................41
Figure 31. Tighten EVAC Heat Sink Extension..............................................................................................................................41
Figure 32.Installing a Riser Assembly...............................................................................................................................................42
Figure 33. Installing the Processor Carrier Clip onto the Processor – Part 1...................................................................43
Figure 34. Installing the Processor Carrier Clip onto the Processor – Part 2...................................................................43
Figure 35. Socket Protective Cover Removal ................................................................................................................................44
Figure 36. Align Processors and Processor Carrier Clips with Sockets..............................................................................44
Figure 37. Screws to be removed before the installation........................................................................................................45
Figure 38. Liquid-Cooling Loop Components...............................................................................................................................46
Figure 39. Assembling the Manual Applicator..............................................................................................................................46

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Figure 40. Applying Thermal Gap Filler...........................................................................................................................................47
Figure 41. Installing Liquid-Cooling Loop.......................................................................................................................................48
Figure 42. Securing the Processor Cold Plates.............................................................................................................................49
Figure 43. Removing Liquid-Cooling Loop Carrier......................................................................................................................49
Figure 44. Securing Liquid-Cooling Loop .......................................................................................................................................50
Figure 45. Tube Ties Position Adjustment .....................................................................................................................................50
Figure 46. DIMM Blank Removal.........................................................................................................................................................51
Figure 47. Memory Module Installation...........................................................................................................................................52
Figure 48. Memory Cooling Kit............................................................................................................................................................53
Figure 49. DIMM Latch Tool Location...............................................................................................................................................53
Figure 50. Attaching Thermal Pad to DIMM PMIC.......................................................................................................................54
Figure 51. Installing DIMM for Liquid-Cooled Module ..............................................................................................................54
Figure 52. Mylar and DIMM clip installation...................................................................................................................................55
Figure 53. Installing a Module..............................................................................................................................................................56
Figure 54. Installing the Power Supply ............................................................................................................................................56
Figure 55. System Directional Reference........................................................................................................................................57
Figure 56. Securing the Front of the Rail.........................................................................................................................................58
Figure 57. Securing the Back of the Rail..........................................................................................................................................58
Figure 58. Installing the Chassis into the Rack .............................................................................................................................59
Figure 59. Removing a Module............................................................................................................................................................60
Figure 60. Installing a Module..............................................................................................................................................................61
Figure 61. Removing the Air Duct (Half-width Modules)..........................................................................................................62
Figure 62. Installing the Air Duct (Half-width Modules)............................................................................................................62
Figure 63. Removing the Air Duct (D50DNP2MFALAC Module)............................................................................................63
Figure 64. Installing the Air Duct (D50DNP2MFALAC Module)..............................................................................................63
Figure 65. Riser 1 and Riser 2 in 1U Compute Module..............................................................................................................64
Figure 66. 1U MCIO* Riser .....................................................................................................................................................................65
Figure 67. 1U Standard Riser ...............................................................................................................................................................65
Figure 68. 2U Riser Assembly and Riser Card Features ............................................................................................................66
Figure 69. Removing a Riser Assembly with Standard Riser Card........................................................................................66
Figure 70. Removing the Screws for MCIO Riser Assembly ....................................................................................................67
Figure 71. Tilting the MCIO* Riser Assembly.................................................................................................................................67
Figure 72. Installing an Add-In Card .................................................................................................................................................68
Figure 73. Installing a Standard Riser Assembly into the Chassis........................................................................................68
Figure 74. Installing the MCIO Riser Assembly.............................................................................................................................69
Figure 75. Securing the MCIO* Riser Assembly............................................................................................................................69
Figure 76. Air-Cooled PCIe* Accelerator Module ........................................................................................................................72
Figure 77. PCIe* Accelerator Module Riser Assembly ...............................................................................................................72
Figure 78. PCIe* Accelerator Module Riser Card 1 Front View...............................................................................................73
Figure 79. PCIe* Accelerator Module Riser Card 2 Front View...............................................................................................73
Figure 80. Replacing the Add-In Card Metal Bracket.................................................................................................................74
Figure 81. Removing the PCIe* Accelerator Module Riser Assembly..................................................................................74

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Figure 82. Lifting the Flap up on the Front Side of the Riser Assembly.............................................................................75
Figure 83. Removing the Original Metal Bracket .........................................................................................................................75
Figure 84. Installing the Accelerator Add-In Card in the Riser Assembly..........................................................................76
Figure 85. Securing the Accelerator Add-In Card in the Riser Assembly ..........................................................................76
Figure 86. Installing the PCIe* Accelerator Module Riser Assembly ...................................................................................77
Figure 87. Connecting the Add-In Card Power Cable................................................................................................................77
Figure 88. Drive Carrier Extraction from the Chassis .................................................................................................................78
Figure 89. 2.5” Drive / Blank Removal..............................................................................................................................................78
Figure 90. 2.5” Drive Installation into the Carrier ........................................................................................................................79
Figure 91. 2.5” Drive Carrier Alignment Features........................................................................................................................79
Figure 92. Drive Carrier Installation into the Chassis.................................................................................................................80
Figure 93. Attaching thermal pad to SSD........................................................................................................................................81
Figure 94. Installing M.2 SSD................................................................................................................................................................82
Figure 95. Installing M.2 Heat Sink ....................................................................................................................................................83
Figure 96. M.2 SSD cold plate kit........................................................................................................................................................84
Figure 97. Installing the Thermal Interface Material Pads on M.2 SSD..............................................................................85
Figure 98. Installing the M.2 SSD........................................................................................................................................................85
Figure 99. Installing the M.2 cold Plate............................................................................................................................................86
Figure 100. Installing the Trusted Platform Module (TPM).....................................................................................................87
Figure 101. Removing the EMP Blank ..............................................................................................................................................88
Figure 102. Installing the EMP Module/Blank...............................................................................................................................88
Figure 103. Module Identification for Four Half-Width Module System Configuration..............................................94
Figure 104. Module Identification for Two Half-Width Module System Configuration ..............................................94
Figure 105. Module Identification for Three Half-Width module System Configuration...........................................94
Figure 106. Module Identification for One Full-Width Module System Configuration ...............................................95
Figure 107. Module Identification for Two Full-Width Module System Configuration ...............................................95
Figure 108. Liquid-Cooled System Rear View...............................................................................................................................95
Figure 109. Air-Cooled System Rear View......................................................................................................................................96
Figure 110. 1U Compute Module Front Panel Feature Identification.................................................................................96
Figure 111. 2U Management Module Front Panel Feature Identification.........................................................................96
Figure 112. Intel® Data Center GPU Max Series Accelerator Module Feature Identification.....................................97
Figure 113. 2U PCIe* Accelerator Module Front Panel Feature Identification................................................................97
Figure 114. Front Control Panel Features ......................................................................................................................................97
Figure 115. I/O Breakout Cable Connector Identification........................................................................................................98
Figure 116. Air-Cooled Server Chassis Component Identification.......................................................................................98
Figure 117. Liquid-Cooled Server Chassis Component Identification ...............................................................................99
Figure 118. 1U Liquid-Cooled Compute Module Component Identification ..................................................................99
Figure 119. 1U Air-Cooled Compute Module Component Identification....................................................................... 100
Figure 120. 2U Management Module Component Identification...................................................................................... 101
Figure 121. Intel® Data Center GPU Max Series Accelerator Module Component Identification......................... 102
Figure 122. 2U PCIe* Accelerator Module Component Identification............................................................................. 103
Figure 123. Intel® Server Board D50DNP1SB Feature Identification ............................................................................... 106

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Figure 124. Onboard LED Location ................................................................................................................................................ 106
Figure 125. Removing a Module ...................................................................................................................................................... 112
Figure 126. Installing a Module........................................................................................................................................................ 112
Figure 127. Removing the Air Duct................................................................................................................................................. 113
Figure 128. Installing the Air Duct................................................................................................................................................... 113
Figure 129. Removing the Air Duct (D50DNP2MFALAC Module)...................................................................................... 114
Figure 130. Installing the Air Duct (D50DNP2MFALAC Module)........................................................................................ 114
Figure 131. Processor Heat Sink Handling.................................................................................................................................. 115
Figure 132. PHM Assembly Removal from Processor Socket............................................................................................. 116
Figure 133. Reinstall the Socket Cover......................................................................................................................................... 117
Figure 134. Processor Removal from PHM Assembly............................................................................................................ 117
Figure 135. Processor Carrier Clip Removal from PHM Assembly.................................................................................... 118
Figure 136. Installing Processor Carrier Clip onto Processor – Part 1............................................................................. 118
Figure 137. Installing Processor Carrier Clip onto Processor – Part 2............................................................................. 119
Figure 138. Processor Heat Sink Handling.................................................................................................................................. 119
Figure 139. Processor Heat Sink Anti-tilt Wires in the Outward Position...................................................................... 120
Figure 140. Pin 1 Indicator of Processor Carrier Clip.............................................................................................................. 120
Figure 141. Socket Protective Cover Removal........................................................................................................................... 121
Figure 142. PHM Alignment with Socket Assembly ................................................................................................................ 121
Figure 143. PHM Installation onto Server Board ...................................................................................................................... 122
Figure 144. Tighten Heat Sink Fasteners..................................................................................................................................... 122
Figure 145. Processor EVAC Heat Sink Handling ..................................................................................................................... 123
Figure 146. Removing a Riser Assembly ...................................................................................................................................... 124
Figure 147. Loosen EVAC Heat Sink Fasteners ......................................................................................................................... 124
Figure 148. PHM Assembly Removal from Processor Socket............................................................................................. 125
Figure 149. Reinstall the Socket Cover......................................................................................................................................... 125
Figure 150. Processor Removal from PHM Assembly............................................................................................................ 126
Figure 151. Processor Carrier Clip Removal from PHM Assembly.................................................................................... 126
Figure 152. Installing Processor Carrier Clip onto Processor – Part 1............................................................................. 127
Figure 153. Installing Processor Carrier Clip onto Processor – Part 2............................................................................. 127
Figure 154. Processor Heat Sink Handling.................................................................................................................................. 128
Figure 155. Processor Heat Sink Anti-tilt Wires in the Outward Position...................................................................... 128
Figure 156. Pin 1 Indicator of Processor Carrier Clip.............................................................................................................. 129
Figure 157. Socket Protective Cover Removal........................................................................................................................... 129
Figure 158. PHM Alignment with Socket Assembly ................................................................................................................ 130
Figure 159. PHM Installation onto Server Board ...................................................................................................................... 130
Figure 160. Tighten EVAC Heat Sink Extension ........................................................................................................................ 131
Figure 161.Installing a Riser Assembly ......................................................................................................................................... 131
Figure 162. Removing Screws on Top of Processor Cold Plate ......................................................................................... 132
Figure 163. Removing the Velcro* Tape in the Middle of the Cold Plates..................................................................... 132
Figure 164. Loosening Processor Cold Plate Fasteners ........................................................................................................ 133
Figure 165. Removing Processor Cold Plate .............................................................................................................................. 133

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Figure 166. Reinstall the Socket Cover......................................................................................................................................... 134
Figure 167. Processor Removal from Processor Carrier Clip and Processor Cold Plate ......................................... 134
Figure 168. Processor Carrier Clip Removal from Processor Cold Plate........................................................................ 135
Figure 169. Installing Processor Carrier clip onto Processor – Part 1 ............................................................................. 135
Figure 170. Installing Processor Carrier Clip onto Processor – Part 2............................................................................. 136
Figure 171. Socket Protective Cover Removal........................................................................................................................... 136
Figure 172. Processor Installation onto Server Board ........................................................................................................... 137
Figure 173. Assembling the Manual Applicator ........................................................................................................................ 137
Figure 174. Applying Center VR Thermal Gap Filler................................................................................................................ 138
Figure 175. Reinstalling Processor Cold Plate........................................................................................................................... 138
Figure 176. Securing Processor Cold Plate................................................................................................................................. 139
Figure 177. Installing the Velcro* Tape in the Middle of the Cold Plates....................................................................... 139
Figure 178. Installing the Screws on Top of Processor Cold Plate ................................................................................... 140
Figure 179. Removing the Memory Module from an Air-Cooled System ...................................................................... 141
Figure 180. Installing the Memory Module in an Air-Cooled System .............................................................................. 142
Figure 181. DIMM Latch Tool Location ......................................................................................................................................... 142
Figure 182. Removing the DIMM Clips.......................................................................................................................................... 143
Figure 183. Removing the Memory Module from a Liquid-Cooled System.................................................................. 143
Figure 184. Attaching Thermal Pad to DIMM PMIC ................................................................................................................. 144
Figure 185. Installing DIMM for Liquid-Cooled Module......................................................................................................... 144
Figure 186. Mylar and DIMM clip installation............................................................................................................................. 145
Figure 187. 1U MCIO* Riser Card..................................................................................................................................................... 146
Figure 188. 1U Standard Riser Card............................................................................................................................................... 147
Figure 189. 2U Riser Assembly and Riser Card Features ...................................................................................................... 147
Figure 190. Removing Riser Assembly.......................................................................................................................................... 148
Figure 191. Removing Screws for MCIO Riser Assembly ...................................................................................................... 148
Figure 192. Tilting MCIO* Riser Assembly................................................................................................................................... 149
Figure 193. Add-In Card Removal................................................................................................................................................... 149
Figure 194. Add-In Card Installation.............................................................................................................................................. 150
Figure 195. Installing Standard Riser Assembly into Chassis.............................................................................................. 150
Figure 196. Installing the MCIO Riser Assembly....................................................................................................................... 151
Figure 197. Securing the MCIO* Riser Assembly...................................................................................................................... 151
Figure 198. Removing Air-Cooled M.2 Heat Sink ..................................................................................................................... 153
Figure 199. Removing Air-Cooled M.2 SSD................................................................................................................................. 153
Figure 200. Installing Air-Cooled M.2 SSD .................................................................................................................................. 154
Figure 201. Installing Air-Cooled M.2 Heat Sink ....................................................................................................................... 154
Figure 202. Removing M.2 Cold Plate ........................................................................................................................................... 155
Figure 203. Removing Liquid-Cooled M.2 SSD ......................................................................................................................... 155
Figure 204. Installing Thermal Interface Material (TIM) on M.2 SSD................................................................................ 156
Figure 205. Installing M.2 SSD.......................................................................................................................................................... 157
Figure 206. Installing M.2 Cold Plate ............................................................................................................................................. 157
Figure 207. Liquid-Cooling Loop Components......................................................................................................................... 158

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Figure 208. Removing Screws on Liquid-Cooling Loop......................................................................................................... 158
Figure 209. Installing the Liquid-Cooling Loop Carrier.......................................................................................................... 159
Figure 210. Loosening Processor Cold Plates ........................................................................................................................... 159
Figure 211. Removing Liquid-Cooling Loop............................................................................................................................... 160
Figure 212. Processor Removal from Processor Carrier Clip and Processor Cold Plate ......................................... 160
Figure 213. Processor Carrier Clip Removal from Processor Cold Plate........................................................................ 161
Figure 214. Installing Processor Carrier clip onto Processor – Part 1 ............................................................................. 161
Figure 215. Installing Processor Carrier Clip onto Processor – Part 2............................................................................. 162
Figure 216. Align Processors and Processor Carrier Clips with Sockets ........................................................................ 162
Figure 217. Assembling the Manual Applicator ........................................................................................................................ 163
Figure 218. Applying Center VR Thermal Gap Filler................................................................................................................ 163
Figure 219. Installing Liquid-Cooling Loop................................................................................................................................. 164
Figure 220. Securing the Processor Cold Plates....................................................................................................................... 165
Figure 221. Removing the Liquid-Cooling Loop Carrier........................................................................................................ 165
Figure 222. Securing the Liquid-Cooling Loop.......................................................................................................................... 166
Figure 223. Disconnecting Add-In Card Power Cable ............................................................................................................ 168
Figure 224. Removing PCIe Accelerator Module Riser Assembly...................................................................................... 168
Figure 225. Lifting Flap on Front Side of Riser Assembly..................................................................................................... 169
Figure 226. Detaching Accelerator Add-In Card from Riser Assembly ........................................................................... 169
Figure 227. Removing Accelerator Add-In Card from Riser Assembly............................................................................ 170
Figure 228. Replacing Add-In Card Metal Bracket ................................................................................................................... 170
Figure 229. Installing Accelerator Add-In Card in Riser Assembly.................................................................................... 171
Figure 230. Securing the Accelerator Add-In Card in the Riser Assembly..................................................................... 171
Figure 231. Installing PCIe* Accelerator Module Riser Assembly...................................................................................... 172
Figure 232. Connecting Add-In Card Power Cable .................................................................................................................. 172
Figure 233. Disconnecting Riser Card Power Cable ................................................................................................................ 173
Figure 234. Disconnecting External MCIO* Cable .................................................................................................................... 173
Figure 235. Accelerator Riser Assembly Rear Bracket Removal ........................................................................................ 174
Figure 236. Accelerator Riser Card Removal.............................................................................................................................. 174
Figure 237. Accelerator Riser Card Installation......................................................................................................................... 175
Figure 238. Accelerator Riser Assembly Rear Bracket Installation ................................................................................... 175
Figure 239. Connecting MCIO* Cables.......................................................................................................................................... 176
Figure 240. Connecting Riser Card Power Cables.................................................................................................................... 176
Figure 241. Disconnecting Riser Card Power Cables .............................................................................................................. 177
Figure 242. PCIe* Accelerator Module Power Connector Board Removal..................................................................... 178
Figure 243. PCIe* Accelerator Module Power Connector Board Installation................................................................ 178
Figure 244. Connecting the Riser Card Power Cables ............................................................................................................ 179
Figure 245. Removing Power Supply............................................................................................................................................. 180
Figure 246. Installing Power Supply .............................................................................................................................................. 180
Figure 247. Server Board Removal ................................................................................................................................................. 181
Figure 248. Server Board Installation............................................................................................................................................ 182
Figure 249. System Fan Configuration in Liquid-Cooled System...................................................................................... 183

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Figure 250. System Fan Configuration in Air-Cooled System............................................................................................. 183
Figure 251. 60-mm System Fan iPC FCXX60MMACFAN....................................................................................................... 184
Figure 252. Removing System Fan ................................................................................................................................................. 185
Figure 253. Installing System Fan ................................................................................................................................................... 185
Figure 254. Removing Back Cover .................................................................................................................................................. 186
Figure 255. Disconnecting System Fan Power Cables ........................................................................................................... 187
Figure 256. Removing Power Distribution Board ..................................................................................................................... 187
Figure 257. Installing the Power Distribution Board............................................................................................................... 188
Figure 258. Connecting System Fan Power Cables ................................................................................................................. 189
Figure 259. Securing Back Cover..................................................................................................................................................... 189
Figure 260. Removing Internal Chassis Rail................................................................................................................................ 190
Figure 261. Installing Internal Chassis Rail.................................................................................................................................. 191
Figure 262. Removing System Battery.......................................................................................................................................... 192
Figure 263. Installing System Battery............................................................................................................................................ 192
Figure 264. Front Control Panel Features ................................................................................................................................... 198
Figure 265. Jumper Block Location................................................................................................................................................ 201
Figure 266. Intel® Light-Guided Diagnostics - POST Code LED Location....................................................................... 202
Figure 267. POST Error LED Location ........................................................................................................................................... 215

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List of Tables
Table 1. Intel® Server D50DNP Family Reference Documents and Support Collaterals ............................................22
Table 2. Intel® D50DNP Modules........................................................................................................................................................23
Table 3. BIOS Setup: Keyboard Commands ..................................................................................................................................90
Table 4. Intel® Server Board D50DNP1SB Feature Set........................................................................................................... 104
Table 5. 1U Compute Module Specific Features....................................................................................................................... 107
Table 6. 2U Management Module Specific Features............................................................................................................... 108
Table 7. Intel® Data Center GPU Max Series Accelerator Specific Features .................................................................. 108
Table 8. PCIe* Accelerator Module Specific Features............................................................................................................. 109
Table 9. Intel® Server Chassis / Intel® Server System D50DNP Feature Set.................................................................. 110
Table 10. Intel® Optane™ Persistent Memory 300 Series Module Support................................................................... 195
Table 11. DDR5 SDRAM DIMMs Compatible with Intel® Optane™ PMem Modules.................................................... 195
Table 12. Standard DDR5 DIMM per Socket Population Configurations ....................................................................... 196
Table 13. DDR5 SDRAM DIMM and Intel® Optane™ PMem 300 Series Module per Socket Population
Configurations................................................................................................................................................................................. 196
Table 14. DDR5 DIMM Attributes Table for “Identical” and “Like” DIMMs..................................................................... 197
Table 15. Power / Sleep LED Functional States........................................................................................................................ 198
Table 16. Intel® D50DNP Module Status LED State Definitions......................................................................................... 199
Table 17. Diagnostic LED Code Example ..................................................................................................................................... 202
Table 18. Memory Reference Code (MRC) Progress Codes ................................................................................................. 203
Table 19. MRC Fatal Error Codes..................................................................................................................................................... 204
Table 20. POST Progress Codes...................................................................................................................................................... 205
Table 21. POST Error Messages and Handling.......................................................................................................................... 210
Table 22. POST Error LED Codes .................................................................................................................................................... 216
Table 23. Integrated BMC POST Error LED Codes ................................................................................................................... 216
Table 24. Mixed Processor Configurations Error Summary................................................................................................. 217

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1. Introduction
The Intel® Server D50DNP Family includes products that are designed to support demanding high-
performance computing (HPC) and artificial intelligence (AI) applications and workloads. Building blocks in
the product family allow custom development of server systems using an Intel developed server board or
density optimized Intel® D50DNP Module options. The product family also includes fully integrated 2U rack
mount, multi-module systems. The product family supports the 4th Gen Intel® Xeon® Scalable family or Intel®
Xeon® CPU Max Series processors. Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable
processor families are not supported.
For details on all system and module features, refer to the Intel® Server D50DNP Family Technical Product
Specification. For related documents, see Table 1.
Notes:
•In this document, the Intel® D50DNP Modulesterm refers to all module types supported by the Intel®
Server D50DNP Family: compute module, management module, Intel® Data Center GPU Max Series
accelerator module, and PCIe* accelerator module.
•In this service guide, the 4th Gen Intel® Xeon® Scalable processor family or Intel® Xeon® CPU Max Series
may be referred to simply as “processor”.
1.1 About This Document
This integration and service guide provides system integrators and service technicians with instructions for
the installation and removal of system components. The document also describes available Intel accessories
supported by this server system.
The document is organized into two parts. The first part (Chapters 2 through 5) is focused on the installation
of system components and accessories into an L6 or L9 integrated server system.
Note: An L6 integrated system requires essential components to be installed in order to make it power-on
ready. An L9 integrated system is power-on ready but may require additional options or accessories to be
installed to enable specific system features.
The second part (Chapters 6, 7, and appendices A–F) is focused on system service. This section provides the
service technician with valuable system information and procedures necessary to successfully identify and to
replace a faulty system component.
1.1.1 System Integration
Chapter 2: L6 System Integration – Essential System Components. This chapter contains installation
procedures for the following system components: processors, memory, and power supply
Chapter 3: L9 System Integration. This chapter has the Installation procedures for system options and
accessories
Chapter 4: System Software Update and Configuration. This is a short overview of the the system software
stack installed on new Intel servers and where to get the latest revisions.
Chapter 5: System Packaging Assembly Instructions.This chapter contains the packing instructions for
shipments of fully integrated systems