Intel D50DNP Series User manual

Intel® Server D50DNP Family
Intel® Server Board D50DNP
Intel® D50DNP Module
Intel® Server System D50DNP
Integration and Service Guide
A guide providing instructions for the insertion and extraction of
system components and available Intel accessories and spares.
Rev. 1.0
January 2023
Delivering Breakthrough Data Center System Innovation – Experience What’s Inside!

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Document Revision History
Date
Revision
Changes
January 2023
1.0
Initial public release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Copies of documents that have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, Stratix, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components voids the UL listing and other regulatory approvals of the product. It will most likely
result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons on the front panel of each module do NOT turn off the server
chassis AC power. To remove power from the server chassis, you must unplug the AC power cord from the
electrical outlet. Make sure that the AC power cord is unplugged before you open the server chassis.
To service a module, it is not necessary to power down the entire system. Power off only the module
requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices, and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the module and disconnect all telecommunications systems,
networks, and modems attached to it before removing it from the server chassis. Otherwise, personal injury
or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine
needle-nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to
remove or install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping
the wide sides can damage the contacts inside the jumper, causing intermittent problems with the function
controlled by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove
a jumper, or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can damage your computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends that the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole founders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the server chassis
•Power down the module and remove it from the server chassis, remove power feed from the server
board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place
electronic devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product performs to its published specifications. However, all computer systems are
inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Weight of the System
•Remove all installed modules from the system before attempting to install the system into the rack.
•Due to the weight of a system, Intel recommends using a mechanical lift to install system into a rack.
Or handling the system with two people supporting the system from the sides.
•If your system has rack handles installed, do not lift, or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.
Liquid Cooling Safety Guidelines
•Make sure that there are no leaks and/or damaged parts before operating the liquid-cooling system.
•Do not energize the system or any installed modules if the liquid-cooling subsystem is compromised.
•Do not attempt to perform any service to the server chassis before removing power to the system.
Turn off the modules before disconnecting the liquid-cooling quick disconnect tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid-
cooled modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep the liquid-cooling tubing clear of pinch points when installing or removing the server modules
in/from the chassis.

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Important Safety Certification Standards and Transition Support
Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel server systems identified in this service guide are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel server
products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® Server System products released in 2019 or later. Legacy Intel®
Server System products released in 2018 or earlier provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures:
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel server products
released in 2019 or later certified to this standard require restricted access locations.
Legacy Intel server products (released in 2018 or earlier) were designed with additional safeguards to meet
IEC 60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the
standard intended application use requirements. After the IEC 60950-1 standard is phased out globally and
Intel server products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Contents
1. Introduction............................................................................................................................................................... 20
1.1 About This Document ..................................................................................................................................................20
1.1.1 System Integration ........................................................................................................................................................20
1.1.2 System Service................................................................................................................................................................21
1.2 Reference Documents and Support Collaterals................................................................................................22
2. L6 Integrated System Essential System Component Installation................................................................. 23
2.1 Air Duct Removal / Installation.................................................................................................................................25
2.1.1 Air Duct Removal (Half-width Modules) ...............................................................................................................25
2.1.2 Air Duct Installation (Half-width Modules) ..........................................................................................................25
2.1.3 Air Duct Removal (D50DNP2MFALAC Module).................................................................................................26
2.1.4 Air Duct Installation (D50DNP2MFALAC Module)............................................................................................26
2.2 Processor Assembly and Installation ....................................................................................................................27
2.2.1 Heat Sinks..........................................................................................................................................................................27
2.2.2 Processor Carrier Clips ................................................................................................................................................29
2.2.3 Assembly and Installation for Standard Air-Cooled Heat Sinks ................................................................29
2.2.4 Assembly and Installation for EVAC Heat Sinks................................................................................................35
2.2.5 Assembly and Installation for Liquid-Cooled Configurations.....................................................................42
2.3 Liquid-Cooling Loop Installation (D50DNP1MHCPLC Module)..................................................................45
2.4 Memory Module Installation .....................................................................................................................................51
2.4.1 Memory Installation for Air-Cooled Modules.....................................................................................................51
2.4.2 Memory Installation for Liquid-Cooled Modules..............................................................................................52
2.5 Module Installation........................................................................................................................................................56
2.6 Power Supply Installation...........................................................................................................................................56
3. System Options / Accessory Kit Installation...................................................................................................... 57
3.1 Installing the Chassis into a Rack ............................................................................................................................57
3.1.1 Installing the Fixed Rail Kit.........................................................................................................................................58
3.1.2 Installing the Chassis into a Rack ............................................................................................................................59
3.2 Module Removal / Installation..................................................................................................................................60
3.2.1 Module Removal.............................................................................................................................................................60
3.2.2 Module Installation........................................................................................................................................................61
3.3 Air Duct Removal / Installation.................................................................................................................................61
3.3.1 Air Duct Removal (Half-width Modules) ...............................................................................................................62
3.3.2 Air Duct Installation (Half-width Modules) ..........................................................................................................62
3.3.3 Air Duct Removal (D50DNP2MFALAC Module).................................................................................................63
3.3.4 Air Duct Installation (D50DNP2MFALAC Module)............................................................................................63
3.4 Low-Profile Add-In Card Installation.....................................................................................................................64
3.4.1 Standard Riser Assembly Removal.........................................................................................................................66
3.4.2 MCIO* Riser Assembly Removal...............................................................................................................................67
3.4.3 PCIe* Add-In Card Installation..................................................................................................................................68

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3.4.4 Standard Riser Assembly Installation....................................................................................................................68
3.4.5 MCIO* Riser Assembly Installation .........................................................................................................................69
3.4.6 Riser Assembly Installation into Liquid-Cooled Modules.............................................................................70
3.5 Liquid-Cooled Add-In Card Installation (D50DNP1MHCPLC and D50DNP1MFALLC Modules) ..71
3.6 PCIe* Accelerator Module Add-In Card Installation (D50DNP2MFALAC Module) .............................72
3.7 2.5” U.2 Front Drive Installation...............................................................................................................................78
3.7.1 Drive Carrier Extraction................................................................................................................................................78
3.7.2 Drive Carrier Assembly ................................................................................................................................................78
3.7.3 Drive Carrier Installation .............................................................................................................................................80
3.8 M.2 SSD Installation......................................................................................................................................................81
3.8.1 Thermal Pad Installation for Air-Cooled Configurations...............................................................................81
3.8.2 M.2 SSD Installation for Air-Cooled Configurations........................................................................................82
3.8.3 M.2 SSD Heat Sink Installation for Air-Cooled Configurations...................................................................83
3.8.4 Riser Bracket Installation for Liquid-Cooled Configurations.......................................................................83
3.8.5 Thermal Pad Installation for Liquid-Cooled Configurations........................................................................84
3.8.6 M.2 SSD Installation for Liquid-Cooled Configurations.................................................................................85
3.8.7 M.2 SSD Cold Plate Installation for Liquid-Cooled Configurations ..........................................................86
3.9 Trusted Platform Module (TPM) Installation......................................................................................................87
3.10 Ethernet Management Port Module (AXXFCEMP) ...........................................................................................88
4. System Software Updates and Configuration.................................................................................................... 89
4.1 Using the BIOS Setup Utility......................................................................................................................................89
4.1.1 Entering BIOS Setup Utility........................................................................................................................................89
4.1.2 No Access to the BIOS Setup Utility.......................................................................................................................89
4.1.3 Navigating the BIOS Setup Utility............................................................................................................................89
5. System Packaging Assembly Instructions .......................................................................................................... 91
6. System / Module Features Overview ................................................................................................................... 94
6.1 System Feature Identification...................................................................................................................................94
6.2 Front Panel Feature Identification ..........................................................................................................................96
6.3 Front Control Panel and I/O Breakout Cable Feature Identification ........................................................97
6.4 System Component Identification..........................................................................................................................98
6.5 Server Board Features............................................................................................................................................... 104
6.6 Module and Chassis Specific Features............................................................................................................... 107
7. FRU Replacement ................................................................................................................................................... 111
7.1 Module Removal / Installation............................................................................................................................... 112
7.1.1 Module Removal.......................................................................................................................................................... 112
7.1.2 Module Installation..................................................................................................................................................... 112
7.2 Air Duct Removal / Installation.............................................................................................................................. 113
7.2.1 Air Duct Removal (Half Width Modules)............................................................................................................ 113
7.2.2 Air Duct Installation (Half Width Modules)....................................................................................................... 113
7.2.3Air Duct Removal (D50DNP2MFALAC Module).............................................................................................. 114
7.2.4 Air Duct Installation (D50DNP2MFALAC Module)......................................................................................... 114
7.3 Processor Replacement............................................................................................................................................ 115

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7.3.1 Processor Replacement for Standard Air-Cooled Heat Sinks.................................................................. 115
7.3.2 Processor Replacement for EVAC Heat Sink ................................................................................................... 123
7.3.3 Processor Replacement for Liquid-Cooled Configurations ...................................................................... 132
7.4 Memory Module Replacement .............................................................................................................................. 141
7.4.1 Memory Replacement for Air-Cooled Modules.............................................................................................. 141
7.4.2 Memory Replacement for Liquid-Cooled Modules....................................................................................... 142
7.5Riser Card and PCIe Add-In Card Replacement ............................................................................................. 146
7.5.1 Standard Riser Assembly Removal...................................................................................................................... 148
7.5.2 MCIO* Riser Assembly Removal............................................................................................................................ 148
7.5.3 PCIe* Add-In Card Replacement........................................................................................................................... 149
7.5.4 Standard Riser Assembly Installation................................................................................................................. 150
7.5.5 MCIO* Riser Assembly Installation ...................................................................................................................... 151
7.5.6 Riser Assembly Installation into Liquid-Cooled Modules.......................................................................... 152
7.6 M.2 SSD Replacement............................................................................................................................................... 153
7.6.1 M.2 SSD and Heat Sink Replacement for Air-Cooled Configurations................................................... 153
7.6.2 M.2 SSD and Cold Plate Replacement for Liquid-Cooled Configurations .......................................... 155
7.7 Liquid-Cooling Loop Replacement (D50DNP1MHCPLC Module)........................................................... 158
7.8 Add-In Card Replacement for Liquid-Cooled Modules (D50DNP1MHCPLC and
D50DNP1MFALLC Modules) ......................................................................................................................................................... 167
7.9 PCIe* Accelerator Module Add-In Card Replacement (D50DNP2MFALAC Module) ...................... 168
7.10 PCIe* Accelerator Module Riser Card Replacement (D50DNP2MFALAC Module) .......................... 173
7.11 PCIe* Accelerator Module Power Connector Board Replacement (D50DNP2MFALAC Module)
177
7.12 Power Supply Replacement ................................................................................................................................... 180
7.13 Server Board Replacement ..................................................................................................................................... 181
7.14 System Fan Replacement ........................................................................................................................................ 183
7.15 Power Distribution Board (PDB) Assembly Replacement .......................................................................... 186
7.16 Internal Chassis Rail Replacement....................................................................................................................... 190
7.17 System Battery Replacement................................................................................................................................. 192
Appendix A. Getting Help ........................................................................................................................................ 193
Appendix B. Memory Population Rules................................................................................................................ 194
B.1 DDR5 DIMM Population Rules ............................................................................................................................... 194
B.2 Intel® Optane™ Persistent Memory 300 Series Module Rules.................................................................. 194
B.3 Recommended Memory Configurations ........................................................................................................... 195
B.3 Intel® DDR5 DIMM Support Disclaimer .............................................................................................................. 197
Appendix C. System Status LED State Definitions............................................................................................. 198
Appendix D. Onboard Configuration and Service Jumpers............................................................................. 201
Appendix E. POST Code Diagnostic LEDs............................................................................................................ 202
E.1 Early POST Memory Initialization MRC Diagnostic Codes......................................................................... 203
E.2 BIOS POST Progress Codes.................................................................................................................................... 205
Appendix F. POST Error Codes .............................................................................................................................. 209
F.1 POST Error LED Codes.............................................................................................................................................. 215