Intel MFSYS25V2 User manual

Intel®Modular Server System
Technical Product Specification
Intel order number E15155-010
Revision 1.7
March, 2011
Enterprise Platforms and Services Division

Rivision History Intel® Modular Server System TPS
ii Revision 1.7
Intel order number E15155-010
Revision History
Date Revision
Number
Modifications
July, 2007 0.88 Initial release.
September, 2007 1.0 Updated the document.
February, 2008 1.1 Updated the document.
June, 2008 1.2 Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive
bay information for the Intel®Modular Server System MFSYS35.
November, 2008 1.3 Updated System Details, power and heat specifications.
June, 2009 1.4 Updated the document.
May, 2010 1.5 Removed CCC and CNCA.
December, 2010 1.6 Added MFSYS25V2 info.
March, 2011 1.7 Added CMM2 power compensation info.
Disclaimers
Information in this document is provided in connection with Intel®products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” inches or
“undefined” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
The Intel®Modular Server System may contain design defects or errors known as errata, which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of
these components when the fully integrated system is used together. It is the responsibility of the system integrator
that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters
to determine the amount of airflow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2007-2011

Intel® Modular Server System TPS Table of Contents
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Table of Contents
1. Product Overview.................................................................................................................1
2. System Overview..................................................................................................................2
2.1 Introduction..............................................................................................................2
2.2 External Chassis Features – Front..........................................................................5
2.2.1 Compute Module .....................................................................................................6
2.2.2 Storage Enclosure ...................................................................................................6
2.2.3 I/O Cooling Module..................................................................................................6
2.3 External Chassis Features – Rear...........................................................................7
2.3.1 Power Supply Module..............................................................................................7
2.3.2 I/O Slots...................................................................................................................7
2.3.3 Chassis Management Module.................................................................................8
2.3.4 Main Cooling Module...............................................................................................8
2.4 Internal Chassis Features........................................................................................8
2.4.1 Midplane Board......................................................................................................10
2.4.2 Storage Interposer Board ......................................................................................11
2.5 Mounting and Service Features.............................................................................11
2.5.1 Chassis..................................................................................................................11
2.5.2 Rails.......................................................................................................................11
2.6 Server Management ..............................................................................................11
2.6.1 Chassis Management Module...............................................................................12
2.6.2 Compute Module Management .............................................................................12
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM).............13
3. System Details....................................................................................................................14
3.1 Specifications.........................................................................................................14
3.1.1 Environmental Specifications Summary ................................................................14
3.1.2 Physical Specifications Summary..........................................................................14
3.1.3 Power Specifications Summary.............................................................................15
3.2 Chassis..................................................................................................................16
3.3 Midplane Board......................................................................................................19
3.3.1 Mechanical Outline ................................................................................................19
3.3.2 3D Renderings.......................................................................................................20
3.4 Compute Module ...................................................................................................21
3.4.1 Introduction............................................................................................................21
3.4.2 Drawings................................................................................................................22
3.5 Chassis Management Module...............................................................................22
3.5.1 Introduction............................................................................................................22
3.5.2 Mechanical Outline ................................................................................................24
3.5.3 Block Diagram .......................................................................................................25

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3.5.4 Drawings................................................................................................................26
3.5.5 Architectural Overview...........................................................................................26
3.6 Ethernet Switch Module.........................................................................................27
3.6.1 Introduction............................................................................................................27
3.6.2 Mechanical Outline ................................................................................................28
3.6.3 Block Diagram .......................................................................................................29
3.6.4 Architectural Overview...........................................................................................29
3.7 Storage Controller Module.....................................................................................30
3.7.1 Storage Subsystem Introduction............................................................................30
3.7.2 Mechanical Outline ................................................................................................30
3.7.3 Storage Controller Module View............................................................................31
3.7.4 Architectural Overview...........................................................................................31
3.8 Power Supply Module............................................................................................32
3.9 Jumpers and LEDs................................................................................................33
4. Product Regulatory Requirements...................................................................................34
4.1 Product Regulatory Compliance............................................................................34
4.1.1 Product Safety Compliance...................................................................................34
4.1.2 Product EMC Compliance - Class A Compliance..................................................34
4.1.3 Product Ecology Compliance.................................................................................34
4.1.4 Certifications/Registrations/Declarations...............................................................35
4.2 Product Regulatory Compliance Markings ............................................................35
4.3 Regulated Specified Components.........................................................................40
4.4 Electromagnetic Compatibility Notices ..................................................................41
4.4.1 FCC Verification Statement (USA) ........................................................................41
4.4.2 ICES-003 (Canada)...............................................................................................42
4.4.3 Europe (CE Declaration of Conformity) .................................................................42
4.4.4 VCCI (Japan).........................................................................................................43
4.4.5 BSMI (Taiwan).......................................................................................................43
Glossary.....................................................................................................................................45
Reference Documents..............................................................................................................48

Intel® Modular Server System TPS List of Figures
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List of Figures
Figure 1. Intel®Modular Server System MFSYS25 Wiring Diagram.............................................3
Figure 2. Intel®Modular Server System MFSYS35 Wiring Diagram.............................................4
Figure 3. Front View of Server Platform........................................................................................5
Figure 4. Rear View of Server Platform........................................................................................7
Figure 5. View of Intel®Modular Server System MFSYS25 System Board Connectivity..............9
Figure 6. View of Intel®Modular Server System MFSYS35 System Board Connectivity............10
Figure 7. Server Management Connectivity................................................................................12
Figure 8. Front View of Empty Intel®Modular Server System MFSYS25...................................16
Figure 9. Front View of Empty Intel®Modular Server System MFSYS35...................................17
Figure 10. Rear View of Empty Intel®Modular Server System MFSYS25..................................18
Figure 11. Rear View of Empty Intel®Modular Server System MFSYS35..................................18
Figure 12. Midplane Board Mechanical Outline (Front View) .....................................................19
Figure 13. Front View of Midplane Board ...................................................................................20
Figure 14. Rear View of Midplane Board....................................................................................21
Figure 15. Front View of Compute Module.................................................................................22
Figure 16. Chassis Management Module Board Outline (Top View)..........................................24
Figure 17. Chassis Management Module Block Diagram...........................................................25
Figure 18. Chassis Management Module 2 Block Diagram........................................................26
Figure 19. Front View of Chassis Management Module.............................................................26
Figure 20. Ethernet Switch Module Mechanical Outline (Top View)...........................................28
Figure 21. Ethernet Switch Module Block Diagram ....................................................................29
Figure 22. Mechanical Outline of Storage Controller Module Board...........................................30
Figure 23. Front View of Storage Controller Module...................................................................31

List of Tables Intel® Modular Server System TPS
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List of Tables
Table 1. Server Platform Feature List...........................................................................................2
Table 2. Environmental Specifications Summary .......................................................................14
Table 3. Physical Specifications of Chassis................................................................................14
Table 4. Physical Dimensions of Hardware Components...........................................................15
Table 5. Power Budget of Hardware Components .....................................................................15
Table 6. Power and Heat Dissipation Specifications of Chassis.................................................15

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Intel® Modular Server System TPS Product Overview
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1. Product Overview
This product specification details the features of the Intel®Modular Server System. This product
is designed to serve the small to medium business environment. Primary design considerations
include ease of use, reliability, low cost, modularity, and remote management.
The following three versions of the Intel®Modular Server System are available:
Intel®Modular Server System MFSYS25
Intel®Modular Server System MFSYS25V2
Intel®Modular Server System MFSYS35
Note: All references in the document to MFSYS25 are for both MFSYS25 and MFSYS25V2.
Exceptions will call out either MFSYS25 or MFSYS25V2.
The Intel®Modular Server System MFSYS25/MFSYS35 supports up to six dual-processor
compute modules, or a total of 12 Multi-Core Intel®Xeon®5000 sequence processors. The
chassis also incorporates features that clearly distinguish it as an easy-to-use and highly
available server platform. Building on previous server platforms, the Intel®Modular Server
System MFSYS25/MFSYS35 includes redundant storage and networking, in addition to the
enterprise features of hot-swap power, cooling, and hard disk drives. Advanced server
management features remotely monitor and manage the server.
This document is organized into four sections:
Section 1: Product Overview
This section provides an overview of the product.
Section 2: System Overview
This section provides an overview of the system hardware.
Section 3: System Details
This section provides details of the various hardware components specific to the
server platform.
Section 4: Product Regulatory Requirements
This section describes system compliance to regulatory specifications.

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2. System Overview
This section provides an overview of the features of the Intel®Modular Server System
MFSYS25/MFSYS35.
2.1 Introduction
The platform supports up to six compute modules, up to fourteen hot-swap 2.5-inch SAS hard
disk drives in the Intel®Modular Server System MFSYS25, or up to six hot-swap 3.5-inch
SAS/SATA hard disk drives in the Intel®Modular Server System MFSYS35, an integrated server
management module, redundant Ethernet switches, and redundant storage controllers. The
server ships configured for rack mounting, but may be mounted in a pedestal configuration.
The following table lists and briefly describes the features of the Intel® Modular Server System
MFSYS25/MFSYS35.
Table 1. Server Platform Feature List
Feature Description
Compact, high-density
system Rack-mount server with a height of 6U (10.5 inches) and a depth of 28 inches (706 mm)
Configuration flexibility Shared storage hard drive bay supporting up to fourteen (14) 2.5-inch SAS hard drives in
the Intel®Modular Server System MFSYS25 and up to six (6) 3.5-inch SAS/SATA hard
drives in the Intel®Modular Server System MFSYS35.
Up to six (6) compute modules.
Optional secondary Ethernet switch module.
Optional secondary storage controller.
Serviceability Tool-less design features.
Front access to optional hot-swap hard disk drives.
Rear access to I/O slots, cooling, and hot-swap power supplies.
Status and fault indicator LEDs.
Front viewable compute module ID LEDs.
Color-coded parts to identify hot-swap and non-hot-swap serviceable components.
Availability Four 1000-W power supplies in a redundant (3+1) configuration with separate power cords.
Up to six compute modules.
Redundant networking and storage.
Redundant cooling.
Manageability Remote management.
Extensive system sensors and monitoring.
Remote diagnostics support through serial and LAN ports.
Web management console.
KVM console redirection.
The front of each individual compute module provides video, USB, a power button, and
status LEDs that allow local monitoring and managing of the individual compute module.

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Feature Description
Cooling The cooling subsystem consists of three cooling zones.
I/O module cooling
Hard drives and power supplies
Compute modules
Each cooling zone contains dedicated hot-swap fan modules.
Each fan module contains a status LED to indicate a fan failure.
The front- and rear-accessible fan modules connect directly to the system midplane board.
Easy to use Full system management through Web browser.
Configuration wizards assist in setup of storage and network.
Figure 1. Intel®Modular Server System MFSYS25 Wiring Diagram

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Figure 2. Intel®Modular Server System MFSYS35 Wiring Diagram

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2.2 External Chassis Features – Front
Figure 3 shows the front view of the platform with all modules populated.
A
AF002657
C
B
D
Item Description
A Compute modules (six)
B Storage enclosure:
14 hot-swap 2.5-inch SAS hard disk drives – Intel®Modular
Server System MFSYS25 only
6 hot-swap 3.5-inch SAS/SATA hard disk drives – Intel®
Modular Server System MFSYS35 only
C I/O cooling module
D System Fault LED (amber)
Figure 3. Front View of Server Platform

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2.2.1 Compute Module
The Intel® Modular Server System MFSYS25/MFSYS35 supports up to six compute modules.
Each of these general-purpose servers provides the following minimum features:
Processor(s)
Memory
Integrated Baseboard management controller
Network interface
Each server connects to the chassis management module, storage controllers and switch
modules through the midplane board. The midplane also distributes the 12V power from the
power supplies to the compute modules. The servers connect to the shared storage (14 SAS
drives in the Intel®Modular Server System MFSYS25 and six SAS/SATA drives in the Intel®
Modular Server System MFSYS35) through the storage controller(s) in the rear of the chassis.
See the individual Intel® Compute Module Technical Product Specification for model-specific
information about your compute module(s).
2.2.2 Storage Enclosure
The Intel® Modular Server System MFSYS25/MFSYS35 supports an optional hard disk drive
storage enclosure and has the following minimum features:
Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel®Modular Server System
MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel® Modular Server
System MFSYS35
At least one storage controller in an I/O slot
Because hard disk drives have different cooling, power, and vibration characteristics, Intel
validates specific hard disk drive types in the platforms. See the Intel® Modular Server System
Tested Hardware and Operating System List for a list of qualified drives.
2.2.3 I/O Cooling Module
The I/O cooling module consists of six fans that operate in a (3 + 3) cooling redundancy in a
hot-swap module with power and failure indicators. These fans provide cooling for all I/O
modules. This module is accessible from the front of the system even though it cools the I/O
modules in the rear of the system.

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2.3 External Chassis Features – Rear
The following figure shows the rear view of the platform with all modules populated.
AF002564
C
B
D
E
A
Item Description
A Power supply units (four, 3+1)
B Main cooling modules (required)
C Ethernet switch modules
D Storage controllers
E Management module (required)
Figure 4. Rear View of Server Platform
2.3.1 Power Supply Module
Four hot-swap power supply modules are installed in the right rear of the chassis. Each supply
has its own AC input power connector and is rated at 1000 W over an input range of 100-240
VAC. Each power supply includes two fans that provide cooling for optional hot-swap
disk drives.
See Section 3.8 for more details on the power supply module.
2.3.2 I/O Slots
The middle-rear of the chassis can accommodate up to four expansion modules. See the
following sections for a description of the two I/O modules currently offered.
2.3.2.1 Ethernet Switch Module
The chassis can accommodate up to two hot-swap Ethernet switch modules. Each switch has
ten uplink ports on the rear panel in addition to two ports routed to each compute module. One

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switch module is the minimum configuration for external networking, with a second switch
module allowing network redundancy.
See Section 3.6 for a description of this module.
2.3.2.2 Storage Controller Module
The chassis can accommodate up to two hot-swap storage controller modules to support the
external hard disks in the front storage enclosure. One storage controller is the minimum
configuration, with a second storage controller allowing storage controller redundancy. Storage
controller failures are automatically detected and hard drive access is maintained through the
operational storage controller.
See Section 3.7 for a description of this system.
2.3.3 Chassis Management Module
The chassis management module or chassis management module 2, installed in the middle-
rear of the chassis amid the four I/O slots, provides an Internet browser interface that allows for
configuration and management of the entire Intel®Modular Server System
MFSYS25/MFSYS35. This module is not redundant, but the system continues to operate
normally should this module fail although any changes to the system configuration cannot be
made until the failed chassis management module is replaced.
Note: The chassis management module 2 is for Intel®Modular Server System
MFSYS25V2 only.
See Section 3.5 for a description of this module.
2.3.4 Main Cooling Module
Two hot-swap cooling modules are installed on the left rear of the chassis. Each cooling module
contains two redundant fans that operate in a (1+1) cooling redundancy. Cooling module 1
cools compute modules 1-3; cooling module 2 cools compute modules 4-6.
2.4 Internal Chassis Features
The following figures provide an internal view of how the Intel®Modular Server System
MFSYS25/MFSYS35 system boards are connected.

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Item Description
A Server board
B 14-drive backplane
C Interposer board (connects drive backplane to midplane)
D I/O fan controller
E Midplane board
F Compute module fan controllers
G Storage controller boards
H Switch module boards
I Chassis management module board
Figure 5. View of Intel®Modular Server System MFSYS25 System Board Connectivity

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Item Description
A Server board
B 6-drive backplane
C Interposer board (connects drive backplane to midplane)
D I/O fan controller
E Midplane board
F Compute module fan controllers
G Storage controller boards
H Switch module boards
I Chassis management module board
Figure 6. View of Intel®Modular Server System MFSYS35 System Board Connectivity
2.4.1 Midplane Board
The midplane board mounts vertically in the middle of the system and provides power and I/O
signaling, both high-speed and low-speed, to all chassis subassemblies and options. This board
is considered to be a part of the chassis and cannot be replaced. For this reason, there are no
active components on this board.

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2.4.2 Storage Interposer Board
The interposer board mounts vertically in the front left of the system and connects the midplane
to the hot-swap backplane in the storage enclosure. Each compute module connects to the
storage controller with a non-RAID SAS controller, with the storage controller providing the
RAID functionality.
2.5 Mounting and Service Features
2.5.1 Chassis
The platform utilizes a standard 19-inch EIA chassis, 6U high by 28 inches deep. The chassis
can be rack-mounted or used as a pedestal system. Rack mounting the platform requires a
space of 6U high by 19 inches wide by 34 inches deep, with additional six inches required for
cable management. When used in a rack, the chassis may be mounted with an optional rail kit.
Pedestal operation requires the installation of six rubber feet to the bottom of the chassis.
The 6U height is defined by standard EIA rack units, where 1U equals 1.75 inches. The 28-inch
depth is measured from the front mounting flange to the back of the I/O slots. This
measurement does not include cables or the bezel.
2.5.2 Rails
The platform accommodates rails to mount the chassis into a standard 19-inch rack. The Intel®
Modular Server System MFSYS25/MFSYS35 uses fixed rails. All customer-accessible
components provide either front or rear access. The rails attach to the rack using a tool-less
mechanism. The system rests on the shelves of the rails and attaches to the rack using the
integrated thumbscrews on the front flanges of the system. No loose hardware is needed.
2.6 Server Management
The management of all components in the system can be done through the chassis
management module. This module provides a browser-based management interface that allows
the configuration and management of all modules. As a part of the compute module
manageability, the chassis management module provides remote access (such as connectivity
through Ethernet) to Keyboard-VDU-Mouse (KVM), USB media and serial console.
The management subsystem conforms to the IPMI v2.0 Specification for communication within
the chassis (such as between the chassis management module and other system components).
SNMP is supported by the chassis management module for external system management.

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SWITCH
SWITCH
STORAGE
STORAGE
MANAGEMENT
10/100 Ethernet
10/100MbpsEthernet
PSU
PSU
PSU
PSU SYSTEM FAN MODULE
SYSTEM FAN MODULE
I/O FAN MODULE
I2C BUS_0 I2C BUS_1
I2C BUS_1
I2CBUS_0
I2CBUS_0
I2CBUS_0
I2CBUS_1
I2CBUS_1
I2C BUS_2
I2CBUS_2
I2CBUS_2
Clear Bay:
Chassis Management
Connections
I2C BUSSES
7 Busses
5 Used w/ SMB
I2CBUS_2
I2CBUS_3
I2CBUS_4
HDD Backplane
NVMEM
FRU
I2C BUS
I2C BUS
10/100Mbps
Ethernet
INTERPOSER
SAS EXPANDER
SAS EXPANDER
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
Ethernet
VLAN in-band
Ethernet
VLAN in-band
Ethernet
VLAN in-band
Ethernet
VLAN in-band
Ethernet
VLAN in-band
Ethernet
VLAN in-band
SPI Bus
SPI BUS
Figure 7. Server Management Connectivity
2.6.1 Chassis Management Module
The main controller in the chassis management module is an Intel®XScale IXP425
microcontroller or an Intel®EP80579 Integrated Processor that runs Linux to provide a robust
operating environment. The service processor provides IPMI communication within the system
in addition to the user interface used to manage the system over Ethernet.
See Section 3.5 for a description of this board.
2.6.2 Compute Module Management
Each compute module contains an Integrated Baseboard Management Controller (BMC) that is
responsible for all management local to the module, including power control, reset, sensor
reading, remote KVM, remote media and remote serial console. The Integrated BMC also
gathers events to be stored in the server event log. However, the compute module’s Integrated
BMC is managed by the chassis management module and must communicate with the chassis
management before providing any of these management features.
This architecture allows the chassis management module to control the security of all
components in the system.

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2.7 Reliability, Availability, Serviceability, Usability, Manageability
(RASUM)
The platform supports the following reliability, availability, serviceability, usability and
manageability (RASUM) features:
Reliability features
oVoltage and temperature monitoring throughout the system
Availability features
oHot-plug compute modules
oHot-spare compute modules
oRedundant hot-swap power supply modules
oRedundant hot-swap system fans
oHot-swap SAS hard drives
oOptional teaming and failover Ethernet ports
Serviceability features
oTool-less installation and removal of major sub-assemblies
oColor-coded parts to identify serviceable components
- Green: To identify hot-swap or hot-plug components
- Blue: To identify non-hot-swap components
oCompute module ID buttons and LEDs
oLED indicators for system health, configured options, and activity
Usability features
oTool-less design features
oExternal access to hot-swap hard disk drives, power supplies, LEDs and
switches
oFront viewable compute module ID LEDs
oColor-coded parts to identify hot-swap and non-hot-swap serviceable
components
Manageability features
oRemote management through serial and LAN
oIPMI 2.0 compliance
oRemote management through KVM and dedicated LAN
All subsystems are connected by a server management I2C bus to satisfy the system
RASUM requirements.