Intel S9200WK Series User manual

Intel® Server Products and Solutions
Intel® Server System
S9200WK
Product Family
Setup and Service Guide
Initial system setup instructions and procedures for
the installation and replacement of system components
and available Intel accessories
Rev 1.0
July 2019
S9200WK

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Intel® Server System S9200WK Product Family Setup and Service Guide
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Document Revision History
Date
Revision
Changes
July 2019
1.0
Initial release.

Intel® Server System S9200WK Product Family Setup and Service Guide
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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled
hardware, software, or service activation. Learn more at Intel.com, or from the OEM or retailer.
You may not use or facilitate the use of this document in connection with any infringement or other legal
analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free
license to any patent claim thereafter drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
The products described may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a purpose, and non-infringement, as well as any warranty arising from course of
performance, course of dealing, or usage in trade.
Copies of documents which have an order number and are referenced in this document may be obtained by
calling 1-800-548-4725 or by visiting www.intel.com/design/literature.htm.
Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

Intel® Server System S9200WK Product Family Setup and Service Guide
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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons located on the front panel of each compute module DO NOT turn
off the server chassis AC power. To remove power from the server chassis, you must unplug the AC power
cord from the wall outlet. Make sure the AC power cord is unplugged before you open the server chassis.
To service a compute module it is not necessary to power down the entire system. Power off only the
compute module requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the compute module and disconnect all telecommunications
systems, networks, and modems attached to it before removing it from the server chassis. Otherwise,
personal injury or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped ESD
workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the Sever Chassis
•Power down the Compute Module and remove it from the Server Chassis, remove power feed from the
Server Board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

Intel® Server System S9200WK Product Family Setup and Service Guide
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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Liquid cooling safety guidelines:
•Make sure there are no leaks and/or damaged parts before operating the liquid cooling system.
•Do not to energize system or compute module if liquid cooling system is compromised.
•Do not attempt to perform any service before removing power to the liquid compute module, turn off
and disconnect power before disconnecting the liquid cooling quick disconnects tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid
compute modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep liquid cooling tubing clear of pinch points when sliding server nodes.

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Important Safety Certification Standards and Transition Support Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel® server systems identified in this document are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Table of Contents
1. Introduction............................................................................................................................................................... 15
1.1 The Intel® Server System S9200WK Product Family..................................................................................15
1.2 About This Document ...........................................................................................................................................15
1.3 System Overview and Feature Identification.................................................................................................15
2. System Setup............................................................................................................................................................. 18
2.1 Requirements for liquid cooled systems ........................................................................................................18
2.2 Installing the System Into a Rack.......................................................................................................................19
2.2.1 Installing the Fixed Rail Kit...................................................................................................................................19
2.2.2 Installing the Chassis Into a Rack ......................................................................................................................20
2.3 Connecting the System to a Liquid Coolant Supply....................................................................................21
2.4 Updating System Firmware .................................................................................................................................21
3. Optional Accessory Kit Integration and Service................................................................................................ 22
3.1 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key –IPC VROCSTANMOD.................................23
3.1.1 Installing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key ...................................................23
3.1.2 Removing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key .................................................23
3.2 Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key –iPC AXXRMM4LITE2............24
3.2.1 Installing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key .............................24
3.2.2 Removing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key............................24
3.3 PCIe* Add-In Card...................................................................................................................................................25
3.3.1 Installing a PCIe* Add-In Card ............................................................................................................................25
3.3.2 Removing a PCIe* Add-In Card...........................................................................................................................25
3.4 Ethernet Management Port Module (EMP Module) –iPC AXXFCEMP...................................................26
3.4.1 Installing the EMP Module...................................................................................................................................26
3.4.2 Removing the EMP Module .................................................................................................................................27
4. System Service.......................................................................................................................................................... 28
4.1 System Component Identification ....................................................................................................................29
4.2 Compute Module Replacement .........................................................................................................................33
4.2.1 Compute Module Removal..................................................................................................................................33
4.2.2 Compute Module Installation .............................................................................................................................34
4.3 Riser Assembly Replacement..............................................................................................................................35
4.3.1 Riser Assembly Removal ......................................................................................................................................35
4.3.2 Riser Assembly Installation .................................................................................................................................36
4.4 Drive Carrier Extraction, Assembly, and Installation ...................................................................................36
4.4.1 Drive Carrier Extraction.........................................................................................................................................37
4.4.2 Drive Carrier Assembly..........................................................................................................................................37
4.4.3 Drive Carrier Installation.......................................................................................................................................39
4.5 M.2 SSD Replacement...........................................................................................................................................39
4.5.1 M.2 Heat Sink Removal .........................................................................................................................................40
4.5.2 M.2 SSD Removal....................................................................................................................................................40
4.5.3 M.2 SSD Installation...............................................................................................................................................41

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4.5.4 M.2 Heat Sink Installation ....................................................................................................................................41
4.6 System Battery Replacement..............................................................................................................................42
4.7Liquid Cooling Loop Replacement (Liquid Cooled Compute Modules Only) .....................................43
4.7.1 Liquid Cooling Loop Removal.............................................................................................................................43
4.7.2 Liquid Cooling Loop Installation........................................................................................................................45
4.8 Air Duct Replacement (Air Cooled Compute Modules Only)....................................................................46
4.8.1 Air Duct Removal.....................................................................................................................................................46
4.8.2 Air Duct Installation................................................................................................................................................46
4.9 Processor Heat Sink Replacement (Air Cooled Compute Modules Only)............................................47
4.9.1 Processor Heat Sink Removal.............................................................................................................................47
4.9.2 Processor Heat Sink Installation........................................................................................................................48
4.10 Memory (DIMM) Replacement ............................................................................................................................49
4.10.1 Air Cooled Compute Module DIMM Replacement.......................................................................................49
4.10.2 Liquid Cooled Compute Module DIMM Replacement ................................................................................50
4.11 Memory Heat Spreader Thermal Pad Replacement (Liquid Cooled Compute Modules only)......53
4.11.1 Thermal Pad Removal ...........................................................................................................................................53
4.11.2 Thermal Pad Installation ......................................................................................................................................54
4.12 Power Supply Replacement ................................................................................................................................54
4.12.1 Power Supply Removal.........................................................................................................................................54
4.12.2 Power Supply Installation....................................................................................................................................55
4.13 System Fan Replacement.....................................................................................................................................56
4.13.1 System Fan Removal .............................................................................................................................................57
4.13.2 System Fan Installation.........................................................................................................................................57
4.14 Chassis Plumbing Assembly Replacement (Liquid Cooled Systems Only)..........................................58
4.14.1 Chassis Plumbing Assembly Removal .............................................................................................................58
4.14.2 Chassis Plumbing Assembly Installation ........................................................................................................61
4.15 Power Distribution Board (PDB) Assembly Replacement..........................................................................64
4.15.1 Power Distribution Board Assembly Removal ..............................................................................................64
4.15.2 Power Distribution Board Assembly Installation..........................................................................................67
4.16 Internal Chassis Rail Replacement....................................................................................................................70
4.16.1 Internal Chassis Rail Removal.............................................................................................................................70
4.16.2 Internal Chassis Rail Installation........................................................................................................................71
5. System Packaging Assembly Instructions .......................................................................................................... 72
Appendix A. Getting Help.......................................................................................................................................... 77
Appendix B. General Memory Population Rules.................................................................................................. 78
Appendix C. System Status LED State Definitions............................................................................................... 81
Appendix D. POST Code Diagnostic LED Decoder............................................................................................... 83
Appendix E. POST Code Errors ................................................................................................................................ 90
Appendix F. Safety Instructions............................................................................................................................. 100
Appendix G. Additional References ...................................................................................................................... 110
Appendix H. Glossary ............................................................................................................................................... 111

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List of Figures
Figure 1. Liquid cooled system back view................................................................................................................................15
Figure 2. Air cooled system back view......................................................................................................................................15
Figure 3. Compute module identification –4 node system with 1U compute modules...........................................16
Figure 4. Compute module identification –2 node systems with 2U compute modules.........................................16
Figure 5. 1U compute module front panel feature identification.....................................................................................16
Figure 6. 2U compute module front panel feature identification.....................................................................................17
Figure 7. Front control panel features.......................................................................................................................................17
Figure 8. I/O breakout cable connector identification .........................................................................................................17
Figure 9. Securing the front of the rack rail .............................................................................................................................19
Figure 10. Securing the back of the rail.....................................................................................................................................20
Figure 11. Installing the chassis into the rack .........................................................................................................................20
Figure 12. Liquid cooling supply and return connections...................................................................................................21
Figure 13. Installing the Intel® VROC Upgrade Key ...............................................................................................................23
Figure 14. Removing the Intel® VROC Upgrade Key..............................................................................................................23
Figure 15. Installing the Intel® RMM4 Lite Key........................................................................................................................24
Figure 16. Removing the Intel® RMM4 Lite Key ......................................................................................................................24
Figure 17. Installing an add-in card............................................................................................................................................25
Figure 18. Removing an add-in card ..........................................................................................................................................25
Figure 19. Removing the EMP Bay Filler Blank .......................................................................................................................26
Figure 20. Installing the EMP module/blank ...........................................................................................................................26
Figure 21. Removing the EMP module/blank..........................................................................................................................27
Figure 22. Server chassis component identification.............................................................................................................29
Figure 23. 1U liquid cooled compute module component identification......................................................................30
Figure 24. 2U liquid cooled compute module component identification......................................................................31
Figure 25. 2U air cooled compute module component identification............................................................................32
Figure 26. Removing a compute module..................................................................................................................................33
Figure 27. Installing a compute module ...................................................................................................................................34
Figure 28. Removing a riser assembly .......................................................................................................................................35
Figure 29. Installing a riser assembly.........................................................................................................................................36
Figure 30. Drive carrier extraction from the chassis..............................................................................................................37
Figure 31. 2.5” drive carrier assembly – drive/drive blank removal ................................................................................37
Figure 32. 2.5” drive carrier assembly – drive installation into the carrier ....................................................................38
Figure 33. 2.5” drive carrier assembly – alignment features..............................................................................................38
Figure 34. Drive carrier installation into the chassis.............................................................................................................39
Figure 35. Removing the M.2 heat sink .....................................................................................................................................40
Figure 36. Removing the M.2 SSD...............................................................................................................................................40
Figure 37. Installing the M.2 SSD.................................................................................................................................................41
Figure 38. Removing the M.2 heat sink .....................................................................................................................................41
Figure 39. Removing the system battery ..................................................................................................................................42
Figure 40. Installing the system battery....................................................................................................................................42