Intel S9200WK Series User manual

Intel® Server Products and Solutions
Intel® Server System
S9200WK
Product Family
Setup and Service Guide
Initial system setup instructions and procedures for
the installation and replacement of system components
and available Intel accessories
Rev 1.0
July 2019
S9200WK

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Intel® Server System S9200WK Product Family Setup and Service Guide
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Document Revision History
Date
Revision
Changes
July 2019
1.0
Initial release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled
hardware, software, or service activation. Learn more at Intel.com, or from the OEM or retailer.
You may not use or facilitate the use of this document in connection with any infringement or other legal
analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free
license to any patent claim thereafter drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
The products described may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a purpose, and non-infringement, as well as any warranty arising from course of
performance, course of dealing, or usage in trade.
Copies of documents which have an order number and are referenced in this document may be obtained by
calling 1-800-548-4725 or by visiting www.intel.com/design/literature.htm.
Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons located on the front panel of each compute module DO NOT turn
off the server chassis AC power. To remove power from the server chassis, you must unplug the AC power
cord from the wall outlet. Make sure the AC power cord is unplugged before you open the server chassis.
To service a compute module it is not necessary to power down the entire system. Power off only the
compute module requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the compute module and disconnect all telecommunications
systems, networks, and modems attached to it before removing it from the server chassis. Otherwise,
personal injury or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped ESD
workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the Sever Chassis
•Power down the Compute Module and remove it from the Server Chassis, remove power feed from the
Server Board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.
Liquid cooling safety guidelines:
•Make sure there are no leaks and/or damaged parts before operating the liquid cooling system.
•Do not to energize system or compute module if liquid cooling system is compromised.
•Do not attempt to perform any service before removing power to the liquid compute module, turn off
and disconnect power before disconnecting the liquid cooling quick disconnects tube connectors.
•To reduce the risk of damage to the cooling system, use care when installing or removing the liquid
compute modules.
•Avoid excessive force when connecting and disconnecting quick disconnect couplings.
•Keep liquid cooling tubing clear of pinch points when sliding server nodes.

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Important Safety Certification Standards and Transition Support Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel® server systems identified in this document are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.
Explanation of temporary restricted access location measures
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Table of Contents
1. Introduction............................................................................................................................................................... 15
1.1 The Intel® Server System S9200WK Product Family..................................................................................15
1.2 About This Document ...........................................................................................................................................15
1.3 System Overview and Feature Identification.................................................................................................15
2. System Setup............................................................................................................................................................. 18
2.1 Requirements for liquid cooled systems ........................................................................................................18
2.2 Installing the System Into a Rack.......................................................................................................................19
2.2.1 Installing the Fixed Rail Kit...................................................................................................................................19
2.2.2 Installing the Chassis Into a Rack ......................................................................................................................20
2.3 Connecting the System to a Liquid Coolant Supply....................................................................................21
2.4 Updating System Firmware .................................................................................................................................21
3. Optional Accessory Kit Integration and Service................................................................................................ 22
3.1 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key –IPC VROCSTANMOD.................................23
3.1.1 Installing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key ...................................................23
3.1.2 Removing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key .................................................23
3.2 Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key –iPC AXXRMM4LITE2............24
3.2.1 Installing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key .............................24
3.2.2 Removing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key............................24
3.3 PCIe* Add-In Card...................................................................................................................................................25
3.3.1 Installing a PCIe* Add-In Card ............................................................................................................................25
3.3.2 Removing a PCIe* Add-In Card...........................................................................................................................25
3.4 Ethernet Management Port Module (EMP Module) –iPC AXXFCEMP...................................................26
3.4.1 Installing the EMP Module...................................................................................................................................26
3.4.2 Removing the EMP Module .................................................................................................................................27
4. System Service.......................................................................................................................................................... 28
4.1 System Component Identification ....................................................................................................................29
4.2 Compute Module Replacement .........................................................................................................................33
4.2.1 Compute Module Removal..................................................................................................................................33
4.2.2 Compute Module Installation .............................................................................................................................34
4.3 Riser Assembly Replacement..............................................................................................................................35
4.3.1 Riser Assembly Removal ......................................................................................................................................35
4.3.2 Riser Assembly Installation .................................................................................................................................36
4.4 Drive Carrier Extraction, Assembly, and Installation ...................................................................................36
4.4.1 Drive Carrier Extraction.........................................................................................................................................37
4.4.2 Drive Carrier Assembly..........................................................................................................................................37
4.4.3 Drive Carrier Installation.......................................................................................................................................39
4.5 M.2 SSD Replacement...........................................................................................................................................39
4.5.1 M.2 Heat Sink Removal .........................................................................................................................................40
4.5.2 M.2 SSD Removal....................................................................................................................................................40
4.5.3 M.2 SSD Installation...............................................................................................................................................41

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4.5.4 M.2 Heat Sink Installation ....................................................................................................................................41
4.6 System Battery Replacement..............................................................................................................................42
4.7Liquid Cooling Loop Replacement (Liquid Cooled Compute Modules Only) .....................................43
4.7.1 Liquid Cooling Loop Removal.............................................................................................................................43
4.7.2 Liquid Cooling Loop Installation........................................................................................................................45
4.8 Air Duct Replacement (Air Cooled Compute Modules Only)....................................................................46
4.8.1 Air Duct Removal.....................................................................................................................................................46
4.8.2 Air Duct Installation................................................................................................................................................46
4.9 Processor Heat Sink Replacement (Air Cooled Compute Modules Only)............................................47
4.9.1 Processor Heat Sink Removal.............................................................................................................................47
4.9.2 Processor Heat Sink Installation........................................................................................................................48
4.10 Memory (DIMM) Replacement ............................................................................................................................49
4.10.1 Air Cooled Compute Module DIMM Replacement.......................................................................................49
4.10.2 Liquid Cooled Compute Module DIMM Replacement ................................................................................50
4.11 Memory Heat Spreader Thermal Pad Replacement (Liquid Cooled Compute Modules only)......53
4.11.1 Thermal Pad Removal ...........................................................................................................................................53
4.11.2 Thermal Pad Installation ......................................................................................................................................54
4.12 Power Supply Replacement ................................................................................................................................54
4.12.1 Power Supply Removal.........................................................................................................................................54
4.12.2 Power Supply Installation....................................................................................................................................55
4.13 System Fan Replacement.....................................................................................................................................56
4.13.1 System Fan Removal .............................................................................................................................................57
4.13.2 System Fan Installation.........................................................................................................................................57
4.14 Chassis Plumbing Assembly Replacement (Liquid Cooled Systems Only)..........................................58
4.14.1 Chassis Plumbing Assembly Removal .............................................................................................................58
4.14.2 Chassis Plumbing Assembly Installation ........................................................................................................61
4.15 Power Distribution Board (PDB) Assembly Replacement..........................................................................64
4.15.1 Power Distribution Board Assembly Removal ..............................................................................................64
4.15.2 Power Distribution Board Assembly Installation..........................................................................................67
4.16 Internal Chassis Rail Replacement....................................................................................................................70
4.16.1 Internal Chassis Rail Removal.............................................................................................................................70
4.16.2 Internal Chassis Rail Installation........................................................................................................................71
5. System Packaging Assembly Instructions .......................................................................................................... 72
Appendix A. Getting Help.......................................................................................................................................... 77
Appendix B. General Memory Population Rules.................................................................................................. 78
Appendix C. System Status LED State Definitions............................................................................................... 81
Appendix D. POST Code Diagnostic LED Decoder............................................................................................... 83
Appendix E. POST Code Errors ................................................................................................................................ 90
Appendix F. Safety Instructions............................................................................................................................. 100
Appendix G. Additional References ...................................................................................................................... 110
Appendix H. Glossary ............................................................................................................................................... 111

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List of Figures
Figure 1. Liquid cooled system back view................................................................................................................................15
Figure 2. Air cooled system back view......................................................................................................................................15
Figure 3. Compute module identification –4 node system with 1U compute modules...........................................16
Figure 4. Compute module identification –2 node systems with 2U compute modules.........................................16
Figure 5. 1U compute module front panel feature identification.....................................................................................16
Figure 6. 2U compute module front panel feature identification.....................................................................................17
Figure 7. Front control panel features.......................................................................................................................................17
Figure 8. I/O breakout cable connector identification .........................................................................................................17
Figure 9. Securing the front of the rack rail .............................................................................................................................19
Figure 10. Securing the back of the rail.....................................................................................................................................20
Figure 11. Installing the chassis into the rack .........................................................................................................................20
Figure 12. Liquid cooling supply and return connections...................................................................................................21
Figure 13. Installing the Intel® VROC Upgrade Key ...............................................................................................................23
Figure 14. Removing the Intel® VROC Upgrade Key..............................................................................................................23
Figure 15. Installing the Intel® RMM4 Lite Key........................................................................................................................24
Figure 16. Removing the Intel® RMM4 Lite Key ......................................................................................................................24
Figure 17. Installing an add-in card............................................................................................................................................25
Figure 18. Removing an add-in card ..........................................................................................................................................25
Figure 19. Removing the EMP Bay Filler Blank .......................................................................................................................26
Figure 20. Installing the EMP module/blank ...........................................................................................................................26
Figure 21. Removing the EMP module/blank..........................................................................................................................27
Figure 22. Server chassis component identification.............................................................................................................29
Figure 23. 1U liquid cooled compute module component identification......................................................................30
Figure 24. 2U liquid cooled compute module component identification......................................................................31
Figure 25. 2U air cooled compute module component identification............................................................................32
Figure 26. Removing a compute module..................................................................................................................................33
Figure 27. Installing a compute module ...................................................................................................................................34
Figure 28. Removing a riser assembly .......................................................................................................................................35
Figure 29. Installing a riser assembly.........................................................................................................................................36
Figure 30. Drive carrier extraction from the chassis..............................................................................................................37
Figure 31. 2.5” drive carrier assembly – drive/drive blank removal ................................................................................37
Figure 32. 2.5” drive carrier assembly – drive installation into the carrier ....................................................................38
Figure 33. 2.5” drive carrier assembly – alignment features..............................................................................................38
Figure 34. Drive carrier installation into the chassis.............................................................................................................39
Figure 35. Removing the M.2 heat sink .....................................................................................................................................40
Figure 36. Removing the M.2 SSD...............................................................................................................................................40
Figure 37. Installing the M.2 SSD.................................................................................................................................................41
Figure 38. Removing the M.2 heat sink .....................................................................................................................................41
Figure 39. Removing the system battery ..................................................................................................................................42
Figure 40. Installing the system battery....................................................................................................................................42

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Figure 41. Removing the cross head screws............................................................................................................................43
Figure 42. Removing the T-20 screws .......................................................................................................................................43
Figure 43. Removing the liquid cooling loop...........................................................................................................................44
Figure 44. Securing the cross head screws..............................................................................................................................45
Figure 45. Securing the T-20 screws..........................................................................................................................................45
Figure 46. Removing the air duct.................................................................................................................................................46
Figure 47. Installing the air duct ..................................................................................................................................................46
Figure 48. Removing the processor heat sink.........................................................................................................................47
Figure 49. Installing the processor heat sink...........................................................................................................................48
Figure 50. Removing the DIMM in an air cooled system......................................................................................................49
Figure 51. Installing the DIMM in an air cooled system .......................................................................................................49
Figure 52. Locating and retrieving the memory replacement tool ..................................................................................50
Figure 53. Removing the DIMM retention clips.......................................................................................................................51
Figure 54. Removing the DIMM in a liquid cooled system..................................................................................................51
Figure 55. Installing the DIMM in a liquid cooled system....................................................................................................52
Figure 56. Installing the DIMM retention clips ........................................................................................................................52
Figure 57. Removing a DIMM thermal pad...............................................................................................................................53
Figure 58. Installing a DIMM thermal pad.................................................................................................................................54
Figure 59. Removing the power supply.....................................................................................................................................54
Figure 60. Installing the power supply ......................................................................................................................................55
Figure 61. System Fan Configuration - Liquid cooled system...........................................................................................56
Figure 62. System Fan Configuration - Air cooled system.................................................................................................56
Figure 63. Removing the system fan..........................................................................................................................................57
Figure 64. Installing the system fan............................................................................................................................................57
Figure 65. Removing the quick connect fillers........................................................................................................................58
Figure 66. Removing the quick connect screws .....................................................................................................................59
Figure 67. Removing quick connect covers .............................................................................................................................59
Figure 68. Removing the back cover..........................................................................................................................................59
Figure 69. Removing the chassis plumbing assembly..........................................................................................................60
Figure 70. Installing the chassis plumbing assembly ...........................................................................................................61
Figure 71. Installing quick connect covers...............................................................................................................................62
Figure 72. Securing the quick connect couplings to the covers .......................................................................................62
Figure 73. Installing the quick connect fillers .........................................................................................................................63
Figure 74. Securing the back cover.............................................................................................................................................63
Figure 75. Removing the back cover..........................................................................................................................................64
Figure 76. Disconnecting the system fan power cables.......................................................................................................65
Figure 77. Removing the power distribution board ..............................................................................................................66
Figure 78. Installing the power distribution board................................................................................................................67
Figure 79. Connecting system fan power cables....................................................................................................................68
Figure 80. Securing the back cover.............................................................................................................................................69
Figure 81. Removing the internal chassis rail..........................................................................................................................70
Figure 82. Installing the internal chassis rail ...........................................................................................................................71

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Figure 83. DIMM population for liquid cooled compute modules with 8 DIMMs of up to 32GB capacity..........78
Figure 84. DIMM population for liquid cooled compute modules with 8 DIMMs of 64GB capacity .....................79
Figure 85. DIMM population for air cooled compute modules with 8 DIMMs..............................................................79
Figure 86. DIMM population for liquid and air cooled compute modules with 16 DIMMs ......................................80
Figure 87. POST diagnostic LED identification .......................................................................................................................83

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List of Tables
Table 1. System status LED state definitions ..........................................................................................................................81
Table 2. POST progress code LED example ............................................................................................................................83
Table 3. MRC progress codes .......................................................................................................................................................85
Table 4. MRC fatal error codes.....................................................................................................................................................86
Table 5. POST progress codes.....................................................................................................................................................87
Table 6. POST Error Codes and Messages...............................................................................................................................90
Table 7. Product family reference collaterals ...................................................................................................................... 110

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1. Introduction
1.1 The Intel® Server System S9200WK Product Family
The Intel® Server System S9200WK is a density-optimized, rack-mounted, 2U, multi-node product family
that is designed to support high-density, high-performance computing environments in both liquid and air
cooled configurations. Each system within the Intel Server System S9200WK product family includes
independent, pre-configured compute modules that allow for a power-on ready installation.
1.2 About This Document
This setup and service guide provides system integrators and service technicians guidance for the setup,
configuration, upgrade, and future maintenance of the Intel Server System S9200WK product family.
Refer to Appendix G for the complete list of documentation available. For the latest revision of this
document go to http://www.intel.com/support.
1.3 System Overview and Feature Identification
The illustrations on the following pages provide a quick reference identifying the key features of this server
product family.
Figure 1. Liquid cooled system back view
Figure 2. Air cooled system back view

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Figure 3. Compute module identification –4 node system with 1U compute modules
Figure 4. Compute module identification –2 node systems with 2U compute modules
Figure 5. 1U compute module front panel feature identification

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Figure 6. 2U compute module front panel feature identification
Figure 7. Front control panel features
Figure 8. I/O breakout cable connector identification

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2. System Setup
Each server system within the Intel® Server System S9200WK product family includes power supplies,
cooling components, rack mounting accessories, and configurable compute modules that include memory,
storage, and network components. Refer to the Intel® Server System S9200WK Product Family Configuration
Guide for a complete list of available options.
This chapter provides service personnel the information necessary to set up the Intel Server System
S9200WK product family. Illustrations identify the system features and procedures to install the system in a
rack environment and prepare it for use. The system comes fully assembled containing all components
necessary to be fully functional, so that once the system is physically set up in the operating environment
and updated to the latest available firmware version, it is ready for use.
Before Setting Up or Servicing the Intel® Server System S9200WK
Before working with this server product, observe the safety and ESD precautions found in the beginning of
this guide.
System Directional Reference
All references to left, right, front, top, and bottom assume the reader is facing the front of the chassis and
front of a compute module.
2.1 Requirements for liquid cooled systems
The liquid cooled systems within the Intel® Server System S9200WK product family are designed to operate
while being connected to a non-Intel coolant distribution unit that supports Staubli* SCG 06 quick connect
couplings.
Server Chassis
Compute Module
Front

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2.2 Installing the System Into a Rack
Before following the instructions in this section, remove all compute modules from the server chassis (see
Section 4.2.1). If the rail kit is already installed, proceed to Section 2.2.2.
2.2.1 Installing the Fixed Rail Kit
The Intel® Server System S9200WK product family includes a fixed rail kit that serves as a shelf for the
system upon installation into the rack. When a system is installed onto the fixed rails, it can be secured to
both the rail and the rack through a pair of thumbscrews on the front of the system.
Figure 9. Securing the front of the rack rail
1. Remove the chassis rail kit from the packaging. Locate the rail, either left or right, and align the rail
guides with the slots in the front of the rack (see Letter A).
2. Insert the rail guides into their respective rack slots while pressing on the clip (see Letter B).
3. Release the clip once the guides are fully inserted into the rack (see Letter C).

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Figure 10. Securing the back of the rail
4. Extend and align the rear guides with their slots in the back of the rack (see Letter D).
5. Insert the rail guides into their respective rack slots while pressing on the clip (see Letter E).
6. Release the clip once the guides are fully inserted into the rack (see Letter F).
7. Repeat this process with the opposite rail.
2.2.2 Installing the Chassis Into a Rack
Important Safety Note: Due to the weight of a fully configured system, Intel® recommends using a
mechanical lift to aid with the installation of the system into the rack, and/or to use at least two people to
install the system into the rack, or remove all installed compute modules from the system before attempting
to install the system into the rack.
Figure 11. Installing the chassis into the rack
1. Insert the chassis onto the rails and slide it back to the rear of the rack (see Letter A).
2. Tighten the thumbscrews located on the chassis handles to secure the chassis to the rack (see Letter
B).
3. If removed, install the compute modules into the chassis (see Section 4.2).