JETWAY R3399X-2C Series User manual

R3399X-2C /R3399XL-2C Series
User’s Manual
P/N: G03-R3399-F
Revision: 1.0
Release date: April 27, 2020
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
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i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
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ii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................................... iii
USER’S NOTICE.................................................................................................................................... iv
MANUAL REVISION INFORMATION................................................................................................ iv
ITEM CHECKLIST..................................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD.........................................................................................1
1-2 SPECIFICATION.................................................................................................................... 2
1-3 PRODUCT DIAGRAM........................................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 REAR I/O CONNECTORS.................................................................................................... 7
2-2 INTERNAL CONNECTORS, HEADERS AND JUMPERS..............................................8
TABLE OF CONTENT
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iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
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iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition April 27, 2020
Item Checklist
Motherboard
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1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Rockchip®RK3399 6-core 2.0GHz: Rockchip®ARM Cortex A72(Dual Core) +
Cortex A53(Quad Core)
Onboard 2GB/1333MHz DDR3L DRAM
Onboard 16GB Flash ROM (Max 64GB)
Support WIFI and BlueTooth
1*Realtek GbE; 1*Realtek 10/100Mbps LAN (Optional to R3399X-2C)
3* UART +1*RS232 +1*Debug
2* USB 3.0 (1* OTG Co-lay with USB 3.0); 6*USB 2.0
1*HDMI 2.0; 1*eDP; 1*24-bits dual channel LVDS (Optional to R3399X-2C)
Support HDMI-in (Optional to R3399X-2C)
Support 4K H.264/H.265 video decoding, up to 60fp 10 bits coding
Support 1080P H.264 format video encoding
1*Micro SD card slot (Max 256GB)
Support Android 7.1, Debian9.0
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2
1-2 Specification
Spec
Description
From Factor
102 * 146mm
CPU
Rockchip®RK3399 6-core 2.0GHz:
Rockchip®ARM Cortex A72(Dual Core) +Cortex A53(Quad Core)
PMU
Rockchip®RK808-D PMU
Memory
Onboard 2GB/1333MHz DDR3L DRAM
Storage
Onboard 16GB EMMC Flash ROM (Max. 64GB)
Expansion
1* Micro SD (TF) Card Socket (Max 64GB)
1* SIM Card Holder
1* Full-size Mini PCIe slot by USB interface (R3399X-2C)
Network
1* Realtek RTL8211E-VB 10/100/1000Mbps LAN
1* Realtek RTL8152B-VB-CG 10/100Mbps LAN (R3399X-2C)
1* AMPAK AP6356S 802.11 a/b/g/n/ac 2.4/5G WIFI and BT-V4.1
Audio
Integrated with Realtek ALC5640 2-CH HD audio chip
Rear I/O
1* 12V DC-In Power Jack
1* HDMI-In Port & 1* HDMI-Out Port
2* USB 3.0 Port (Top one co-lay OTG function)
2* USB 2.0 Port + 1* RJ-45 Port (R3399XL-2C)
or 2* RJ-45 Port (R3399X-2C)
1* Audio Jack (Line-Out & MIC Combo)
Internal I/O
1* Power Switch & Recover Button Connector
1* Reset Button Connector
1* CPUFAN Connector
3* UART, 1* RS232, 1* Debug
2* USB 2.0 Header (R3399XL-2C)or 3 * USB 2.0 header
(R3399X-2C)
1* Speaker Connector (3W Amplifier)
1* GPIO & I2C Combo Header Block
1* GPIO_VCC Jumper
1* MIPI CSI Connector(R3399X-2C)
1* eDP Header
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3
1* EDP_VCC Jumper
1* LVDS Header &1* Inverter Connector(R3399X-2C)
1* LVDS_BKLT Jumper(R3399X-2C)
1* LVDS_POWER Jumper(R3399X-2C)
1-3 Product Diagram
Rear IO Panel Diagram
R3399X-2C:
R3399XL-2C:
HDMI-In
Port
HDMI-Out
Port
HDMI-Out
Port
USB 3.0 Port
*USB 2.0 Port
USB 3.0 Port
*LAN2
RJ-45 Port
(10/100Mbps)
LAN
RJ-45 Port
(10/100/1000Mbps)
12V DC-in
Power Jack
12V DC-in
Power Jack
Line-Out & MIC
Combo Jack
Line-Out & MIC
Combo Jack
LAN
RJ-45 Port
(10/100/1000Mbps)
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4
Motherboard Internal Diagram
Top View:
SPK:
Speaker
*LVDS:
LVDS Header
*INVERTER:
LVDS Inverter
UART5:
UART TTL
UART4:
UART TTL/RS232
(Default: UART TTL)
UART3:
RS232/UART TTL
(Default: RS232)
DEBUG:
Debug
UART1:
UART TTL/RS485
(Default: UART TTL)
FAN:
CPUFAN
JP8:
Power Switch
& Recover
RESETKEY:
Reset
EDP:
EDP Port Header
Wi-Fi & Bluetooth
Chip
J9100:
Micro_SD (TF)
Card Socket
FP_USB2:
USB 2.0 Port
FP_USB3:
USB 2.0 Port
*FP_USB20:
USB 2.0 Port
*CSI:
MIPI CSI
*CON18:
Mini-PCIE Slot
GPIO:
GPIO & I2C
Header
GPIO_VCC
*LVDS_BKLT
*LVDS_POWER
EDP_VCC
EMMC
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5
*Note: The product diagrams are for illustration purpose only and mostly come from Model R3399X-2C,
unless otherwise noted. Differences from R3399X-2C &R3399XL-2C are listed as below:
Optional Item
R3399X-2C
R3399XL-2C
Mini-PCIE Slot
1
N/A
MiPi CSI
1
N/A
LVDS
1
N/A
LVDS Inverter
1
N/A
LVDS_BKLT
1
N/A
LVDS_POWER
1
N/A
RJ-45
1*Giga +1*Mega
1*Giga
USB 2.0
6*Internal
2* Rear +4*Internal
Bottom View:
SIM1 (Bottom):
SIM Card Socket
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