Kemppi Oy
CONTENTS
1. READ THIS FIRST........................................................................................................................................... 1
2. GENERAL......................................................................................................................................................... 2
3. TECHNICAL INFORMATION........................................................................................................................... 2
3.1. Technical data........................................................................................................................................... 2
3.2. Wiring diagram.......................................................................................................................................... 3
3.3. Construction.............................................................................................................................................. 4
3.4. Assembly................................................................................................................................................... 5
3.4.1. S 400 Z001 main circuit card structure.............................................................................................. 6
3.4.2. S 500 Z001 main circuit card structure.............................................................................................. 7
3.4.3. P001 Panel card structure ................................................................................................................. 8
3.5. Description of operation............................................................................................................................ 9
3.6. Setup functions and error codes............................................................................................................. 10
3.6.1. Setup functions and menu............................................................................................................... 10
3.6.2. Error codes and error log menu....................................................................................................... 11
3.6.2.1. Using error log.......................................................................................................................... 11
3.6.2.2. Erasing error log....................................................................................................................... 12
3.6.3. Calibration menu.............................................................................................................................. 12
4. SERVICE INSTRUCTIONS............................................................................................................................ 14
4.1. Measurements and tests......................................................................................................................... 14
4.1.1. Z001 Main circuit card ..................................................................................................................... 14
4.1.1.1. Primary rectifier ........................................................................................................................ 14
4.1.1.2. IGBT ......................................................................................................................................... 14
4.1.1.3. Overheat protection.................................................................................................................. 16
4.1.2. Secondary rectifier........................................................................................................................... 17
4.1.3. Cooling fans..................................................................................................................................... 17
4.1.4. Safety tests...................................................................................................................................... 17
4.2. Semiconductor installation...................................................................................................................... 18
4.2.1. Rectifier and IGBT modules............................................................................................................. 18
4.2.2. Secondary rectifier........................................................................................................................... 18
4.2.3. Secondary power rail....................................................................................................................... 18
4.3. Calibration procedure.............................................................................................................................. 19
4.4. Final testing............................................................................................................................................. 20
4.4.1. Load bank test ................................................................................................................................. 20
4.4.2. Test welding..................................................................................................................................... 21
5. NOTES ........................................................................................................................................................... 22