Kontron COMe-bHL6 User manual

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COMe-bHL6
Document Revision 2.1

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» Table of Contents «
1User Information................................................................................................ 6
1.1 Revision History ................................................................................................................................................. 6
1.2 About This Document .......................................................................................................................................... 6
1.3 Copyright Notice ................................................................................................................................................. 6
1.4 Trademarks ......................................................................................................................................................... 6
1.5 Standards ........................................................................................................................................................... 6
1.6 Warranty ............................................................................................................................................................. 7
1.7 Technical Support ............................................................................................................................................... 7
2Introduction....................................................................................................... 8
2.1 Product Description ............................................................................................................................................ 8
2.2 Naming clarification ........................................................................................................................................... 8
2.3 Understanding COM Express® Functionality ....................................................................................................... 9
2.4 COM Express® Documentation .......................................................................................................................... 10
2.5 COM Express® Benefits ..................................................................................................................................... 10
3Product Specification ....................................................................................... 11
3.1 Module definition ..............................................................................................................................................11
3.2 Functional Specification ................................................................................................................................... 12
3.3 Block Diagram................................................................................................................................................... 21
3.4 Accessories ....................................................................................................................................................... 22
3.5 Electrical Specification ..................................................................................................................................... 23
3.5.1 Supply Voltage.................................................................................................................................................. 23
3.5.2 Power Supply Rise Time..................................................................................................................................... 23
3.5.3 Supply Voltage Ripple ....................................................................................................................................... 23
3.5.4 Power Consumption .......................................................................................................................................... 23
3.5.5 ATX Mode .......................................................................................................................................................... 24
3.5.6 Single Supply Mode........................................................................................................................................... 24
3.6 Power Control ................................................................................................................................................... 25
3.7 Environmental Specification ............................................................................................................................. 26
3.7.1 Temperature Specification ................................................................................................................................ 26
3.7.2 Humidity........................................................................................................................................................... 26
3.8 Standards and Certifications ............................................................................................................................. 27
3.9 MTBF ................................................................................................................................................................. 29
3.10 Mechanical Specification .................................................................................................................................. 30
3.11 Module Dimensions........................................................................................................................................... 31
3.12 Thermal Management, Heatspreader and Cooling Solutions ............................................................................. 32
3.13 Onboard Connectors ......................................................................................................................................... 33
3.13.1 FAN Connector J6 - PCB bottom ........................................................................................................................ 33
3.13.2 CPU JTAG connector J3 - PCB bottom ................................................................................................................ 34
3.13.3 CPLD Debug connector J7 - PCB top .................................................................................................................. 34
4Features and Interfaces....................................................................................35
4.1 S5 Eco Mode...................................................................................................................................................... 35

4
COMe-bHL6 /
4.2 Rapid Shutdown................................................................................................................................................ 36
4.3 LPC.................................................................................................................................................................... 38
4.4 Serial Peripheral Interface (SPI) ....................................................................................................................... 39
4.5 SPI boot............................................................................................................................................................ 39
4.6 M.A.R.S..............................................................................................................................................................41
4.7 UART ................................................................................................................................................................. 42
4.8 Fast I2C............................................................................................................................................................. 43
4.9 Dual Staged Watchdog Timer............................................................................................................................. 44
4.10 Intel® Fast Flash Standby™ / Rapid Start Technology™ .................................................................................... 45
4.11 Speedstep Technology ...................................................................................................................................... 47
4.12 C-States ............................................................................................................................................................ 48
4.13 Hyper Threading ............................................................................................................................................... 49
4.14 Dynamic FSB Frequency Switching .................................................................................................................... 50
4.15 VID-x..................................................................................................................................................................51
4.16 Intel® Turbo Boost Technology and AVX .................................................................................................................52
4.17 Display Configuration ....................................................................................................................................... 53
4.18 Hybrid Graphics / Multi-monitor ....................................................................................................................... 56
4.19 Intel® Wireless Display ..................................................................................................................................... 57
4.20 Intel® vPro™ technology .................................................................................................................................. 59
4.21 ACPI Suspend Modes and Resume Events .......................................................................................................... 60
5System Resources..............................................................................................61
5.1 Interrupt Request (IRQ) Lines ............................................................................................................................61
5.2 Memory Area..................................................................................................................................................... 62
5.3 I/O Address Map ............................................................................................................................................... 62
5.4 Peripheral Component Interconnect (PCI) Devices............................................................................................ 63
5.5 Internal I2C Bus................................................................................................................................................ 63
5.6 External I2C Bus................................................................................................................................................ 63
5.7 System Management (SM) Bus .......................................................................................................................... 64
6Connectors .......................................................................................................65
6.1 Connector Location........................................................................................................................................... 65
7Pinout List........................................................................................................66
7.1 General Signal Description................................................................................................................................ 66
7.2 Connector X1A Row A ........................................................................................................................................ 67
7.3 Connector X1A Row B ........................................................................................................................................ 69
7.4 Connector X1B Row C ........................................................................................................................................ 71
7.5 Connector X1B Row D........................................................................................................................................ 73
8BIOS Operation................................................................................................. 75
8.1 Determining the BIOS Version........................................................................................................................... 75
8.2 BIOS Update ..................................................................................................................................................... 75
8.3 POST Codes ....................................................................................................................................................... 75

COMe-bHL6 / User Information
5
8.4 Setup Guide ...................................................................................................................................................... 75
8.5 BIOS Setup.........................................................................................................................................................76
8.5.1 Main...................................................................................................................................................................76
8.5.2 Advanced .......................................................................................................................................................... 83
8.5.3 Security .......................................................................................................................................................... 125
8.5.4 Boot................................................................................................................................................................ 127
8.5.5 Exit ................................................................................................................................................................. 128

6
COMe-bHL6 / User Information
1User Information
1.1 Revision History
Version Brief Description of Change Date of Issue
110 Initial version
2.0
Removed ADA-LVDS-DVI 18-bit and 24-bit accessories
Updates SM bus 8-bit address information for the hardware monitor
Included a Revision History table
2017-Aug-10
2.1 Updates SPI Flash manufacturer information 2019-April-12
1.2 About This Document
This document provides information about products from Kontron S&T AG and/or its subsidiaries also known as
Kontron within this user guide. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is supplied “as-is”
and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.3 Copyright Notice
Copyright © 2003-2018 Kontron S&T AG
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron. Kontron is trademark or registered trademark of Kontron S&T AG.
1.4 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.5 Standards
Kontron is ISO certified.

7
COMe-bHL6 / User Information
1.6 Warranty
For this Kontron product warranty for defects in material and workmanship exists as long as the warranty period,
beginning with the date of shipment, lasts. During the warranty period, Kontron will decide on its discretion if defective
products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron will not be responsible for any defects or damages to other products not supplied by Kontron that are caused
by a faulty Kontron product.
1.7 Technical Support
Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed to make our
product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

8
COMe-
bHL6 / Introduction
2Introduction
2.1 Product Description
The brand new application-ready COMe-bHL6 offers increased performance density and up to twice the graphics
performance compared to its predecessors. Up to three independent, daisy-chained displays with up to 4K resolution are
supported to create stunning user experiences. Further to this, DirectX® 11.1 and OpenGL 4.0 support paves the way for
compelling visuals when videos, graphics and interactive content are being displayed. By integrating the new Intel® AVX2
and OpenCL 1.2, Kontron’s new Computer-on-Modules additionally not only provide an increase in floating-point
performance they also possess improved parallel processing capacities. Typical application areas can be found in markets
such as digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as
industrial plant and machine line control on shop floor- and control room-level.
Engineers can immediately commence with evaluating these new benchmark Computer-on-Modules on all Kontron COM
Express® pin-out type 6-compliant starter kits.
The Kontron COM Express® pin-out type 6 COMe-bHL6 module is available in several different variants ranging from the
cost-optimized low-power processor versions up to quad-core Intel® Core™ i7 processors with up to 4x 2.4 GHz. The
modules are designed with the Intel® Mobile QM87 chipset, host up to 16 GB DDR3L RAM and support 7 PCI Express x1
lanes and 1 PEG x16 interface which is also compatible to standard PCI Express devices. Less complex peripherals can be
connected via SPI and LPC. Additional dedicated features include 3x SATA 6Gb/s ports, 1 SATA 3Gb/s port, as well as
Gigabit Ethernet, 4 USB 3.0 ports, 4 USB 2.0 and 2 serial ports. The Kontron COMe-bHL6 features comprehensive display
support with 3x dual mode DisplayPort++ which can also output, HDMI, DVI and DisplayPort 1.2. Industrial applications
benefit from the watchdog and real-time clock. The module supports an 8.5-20V wide-range power supply. The support of
smart batteries via MARS and the standardized embedded application programming interface EAPI round off the feature
set and provide engineers with a comprehensive service package that eases system development as well as system
programming.
For customers wanting to instantly leverage the new graphics and computing power in their existing designs based on
individual carrier boards, Kontron also offers standardized migration support services to accelerate the design-in phase
and thus achieve fastest field deployment.
The Kontron COM Express® basic Computer-on-Module COMe-bHL6 supports the full Windows OS portfolio along with
Linux and VxWorks.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

9
COMe-
bHL6 / Introduction
2.3 Understanding COM Express®Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO shared w/GPIO 1x optional 1x optional - 1x optional
UART (2-wire COM) - 2x - 2x
FAN PWM out - 1x - 1x

COMe-
bHL6 / Introduction
10
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bHL6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

11
COMe-bHL6 / Product Specification
3Product Specification
3.1 Module definition
The COM Express® basic sized Computer-on-Module COMe-bHL6 (BHL6 / BBL6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-bHL6 based on latest Shark Bay Mobile platform is available in different
variants to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G
38025-0000-18-7 COMe-bHL6 i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1
38025-0000-16-7 COMe-bHL6 i7-4850EQ Intel® Core™ i7-4850EQ 47W QM87 4 3 1
38025-0000-24-7 COMe-bHL6 i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1
38025-0000-29-5 COMe-bHL6 i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1
38025-0000-27-5 COMe-bHL6 i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1
38025-0000-18-5 COMe-bHL6 i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1
38025-0000-16-5 COMe-bHL6 i5-4402E Intel® Core™ i5-4402E 25W QM87 4 3 1
38025-0000-26-3 COMe-bHL6 i3-4110E Intel® Core™ i3-4110E 37W HM86 2 2 2
38025-0000-24-3 COMe-bHL6 i3-4100E Intel® Core™ i3-4100E 37W HM86 2 2 2
38025-0000-18-3 COMe-bHL6 i3-4112E Intel® Core™ i3-4112E 25W HM86 2 2 2
38025-0000-16-3 COMe-bHL6 i3-4102E Intel® Core™ i3-4102E 25W HM86 2 2 2
38025-0000-22-1 COMe-bHL6 2000E Intel® Celeron 2000E 37W HM86 2 2 2
38025-0000-15-1 COMe-bHL6 2002E Intel® Celeron 2002E 25W HM86 2 2 2
Extended temperature grade modules (E1, -25°C to 75°C operating) and
Industrial temperature grade modules (XT, -40°C to 85°C operating)
The COMe-bHL6 is available for extended and industrial temperature range. General capability was tested for following
options:
» CPU: all
» Memory: E2 DDR3L memory only 97015-xxxx-16-3
» VCC: 12V only, no support for Wide-Range Input
The RXT product line includes modules with following featureset:
» industrial grade temperature range (-40 to +85°C) by screening
» ECC Memory support (97016-xxxx-16-3)
» Kontron Rapid Shutdown support
Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G
38026-0000-18-7 COMe-bHL6RXT i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1
38026-0000-24-7 COMe-bHL6RXT i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1
38026-0000-29-5 COMe-bHL6RXT i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1
38026-0000-27-5 COMe-bHL6RXT i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1
38026-0000-18-5 COMe-bHL6RXT i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1
Please contact your local sales for further information and MOQ for RXT modules

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COMe-bHL6 / Product Specification
3.2 Functional Specification
Processor
The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell-H (Halo) / Crystal Well) CPU family with
37.5x32mm package size (BGA1364 socket) supports:
» Intel® Turbo Boost Technology 2.01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory Access
» Intel® Flex Memory Access
» Integrated Intel® HD Graphics with Dynamic Frequency
Optional available (with customized BIOS, Evaluation Copy on request):
» Intel® vPRO™ Technology including:
» Intel® Active Management Technology (AMT)
» Intel® Trusted Execution Technology (TXT)
» Advanced Encryption Standard Instructions (AES-NI)

13
COMe-bHL6 / Product Specification
The integrated Intel® HD Graphics 5200/4600 supports:
» GraphicsTechnology GT3 with 40 Execution Units (HD5200)
» GraphicsTechnology GT2 with 20 Execution Units (HD4600)
» Intel® Quick Sync Video
» Intel® InTru™ 3D Technology
» Intel® Wireless Display
» Intel® Flexible Display Interface (Intel® FDI)
» Intel® Clear Video HD Technology
» Intel® Graphics Render C-State RC6
» Intel® Smart 2D Display Technology (S2DDT)
» 3 simultaneous displays (Win7/8 and Linux)
» Hybrid Multi Monitor with 2 internal and 2 external displays
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback (incl. PAVP)
The integrated Intel® HD Graphics supports:
» GraphicsTechnology GT1 with 10 Execution Units
» Dual Display
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback (incl. PAVP)

14
COMe-bHL6 / Product Specification
CPU Features
Intel® Core™ Core™ Core™ Core™ Core™ Core™ Core™ Celeron@ Celeron@
-i7-4860EQ i7-4850EQ i7-4700EQ i5-4400E i5-4402E i3-4100E i3-4102E 2000E 2002E
# of Cores 4 4 4 2 2 2 2 2 2
# of Threads 8 8 8 4 4 4 4 2 2
TDP Core frequency (HFM) 1800MHz 1600MHz 2400MHz 2700MHz 1600MHz 2400MHz 1600MHz 2200MHz 1500MHz
Max Turbo Frequency 1 core 3200MHz 3200MHz 3400MHz 3300MHz 2700MHz - - - -
Max Turbo all cores 2600MHz 2600MHz 2800MHz 3200MHz 2600MHz - - - -
LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz
Bus/Core Ratio 8 - 20 8 - 16 8 - 24 8 - 27 8 - 16 8 - 24 8 - 16 8 - 22 8 - 15
TjMax 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C
Thermal Design Power
(TDP/PL1)
47W 47W 47W 37W 25W 37W 25W 37W 25W
cTDP-Down - - 37W - - - - - -
cTDP-Down Core frequency - - 1700MHz - - - - - -
Power Limit 2 (PL2 max) 58.75W 58.75W 58.75/46.25
W
46.25W 31.25W 46.25W 31.25W 46.25W 31.25W
C-States C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7
eDRAM 128MB
1.6GHz
128MB
1.6GHz
- - - - - - -
Smart Cache 6MB 6MB 6MB 3MB 3MB 3MB 3MB 2MB 2MB
Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066
Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600
Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB
# of Memory Channels 2 2 2 2 2 2 2 2 2
Graphics Model Iris Pro 5200
Iris Pro 5200 HD4600 HD4600 HD4600 HD4600 HD4600 HD HD
GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz
GFX Base Frequency 650MHz 750MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz
GFX Turbo Frequency 1000MHz 1000MHz 1000MHz 1000MHz 900MHz 900MHz 900MHz 900MHz 900MHz
GFX Technology GT3e 40EU GT3e 40EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT1 10EU GT1 10EU
GFX Func/Phys Cores 3/3 3/3 2/2 2/2 2/2 2/2 2/2 1/2 1/2
Quick Sync Video Yes Yes Yes Yes Yes Yes Yes - -
InTru™ 3D Yes Yes Yes Yes Yes Yes Yes - -
Wireless Display Yes Yes Yes Yes Yes Yes Yes - -
Clear Video HD Yes Yes Yes Yes Yes Yes Yes - -
vPRO™ (optional) Yes Yes Yes Yes Yes - - - -
TXT (optional) Yes Yes Yes Yes Yes - - - -
AES-NI (optional) Yes Yes Yes Yes Yes - - - -
VT-x Yes Yes Yes Yes Yes - - - -
VT-d Yes Yes Yes Yes Yes - - - -
PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 2.0 Gen 2.0

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COMe-bHL6 / Product Specification
Intel® Core™ Core™ Core™ Core™
-i5-4410E i5-4422E i3-4110E i3-4112E
# of Cores 2 2 2 2
# of Threads 4 4 4 4
TDP Core frequency (HFM) 2900MHz 1800MHz 2600MHz 1800MHz
Max Turbo Frequency 1 core Note 1 2900MHz - -
Max Turbo all cores Note 1 2800MHz - -
LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz
Bus/Core Ratio 8 - 29 8 - 16 8 - 24 8 - 16
TjMax 100°C 100°C 100°C 100°C
Thermal Design Power
(TDP/PL1)
37W 25W 37W 25W
cTDP-Down - - - -
cTDP-Down Core frequency - - - -
Power Limit 2 (PL2 max) 46.25W 31.25W 46.25W 31.25W
C-States C0-C7 C0-C7 C0-C7 C0-C7
eDRAM - - - -
Smart Cache 3MB 3MB 3MB 3MB
Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066
Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600
Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB
# of Memory Channels 2 2 2 2
Graphics Model HD4600 HD4600 HD4600 HD4600
GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz
GFX Base Frequency 400MHz 400MHz 400MHz 400MHz
GFX Turbo Frequency 1000MHz 900MHz 900MHz 900MHz
GFX Technology GT2 20EU GT2 20EU GT2 20EU GT2 20EU
GFX Func/Phys Cores 2/2 2/2 2/2 2/2
Quick Sync Video Yes Yes Yes Yes
InTru™ 3D Yes Yes Yes Yes
Wireless Display Yes Yes Yes Yes
Clear Video HD Yes Yes Yes Yes
vPRO™ (optional) Yes Yes - -
TXT (optional) Yes Yes - -
AES-NI (optional) Yes Yes Yes Yes
VT-x Yes Yes Yes Yes
VT-d Yes Yes - -
PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0

16
COMe-bHL6 / Product Specification
Memory
Sockets 2x DDR3 SO-DIMM
Memory Type DDR3L-1600 (ECC on RXT Ver.)
Maximum Size 2x8GB
Technology Dual Channel
Chipset
The 32nm Intel® 8-Series Platform Controller Hub Lynx Point supports:
» PCI Express Revision 2.0
» PCI Express Configurations x1, x2, x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® Active Management Technology 9.0 (optional)
» Intel® Anti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
PCH comparison
Feature QM87 HM86
TDP 2.7W 2.7W
USB 3.0 (USB 2.0 compatible) YES (4x on COMe) YES (2x on COMe)
USB 2.0 YES (4x on COMe) YES (6x on COMe)
SATA 6Gb/s (Gen3) YES (3x on COMe) YES (2x on COMe)
SATA 3Gb/s (Gen2) YES (1x on COMe) YES (2x on COMe)
Wireless Display YES YES
3 Displays simultaneously YES YES
Rapid Storage AHCI, RAID 0/1/5/10 AHCI only
VT-d YES NO
vPRO YES with custom BIOS NO
AMT YES with custom BIOS NO
TXT YES with custom BIOS NO
The Intel® vPro Technology including Trusted Execution Technology (TXT), Active
Management Technology (AMT) and Encryption AES-NI is not supported by default on
COMe-bHL6. Please contact your local sales or support for custom BIOS variants supporting
vPro.

17
COMe-bHL6 / Product Specification
HighSpeed I/O Port Configuration
-QM87 I/O HM86 I/O COMe-bHL6 with QM87 COMe-bHL6 with HM86
Port1 USB3 #1 USB3 #1 USB #0 = USB3.0 USB #0 = USB3.0
Port2 USB3 #2 USB3 #2 USB #1 = USB3.0 USB #1 = USB3.0
Port3 USB3 #5 - USB #2 = USB3.0 -
Port4 USB3 #6 - USB #3 = USB3.0 -
-USB2 USB2 USB #4-7 = USB 2.0 USB #2-7 = USB 2.0
Port5 USB3 #3 or PCIe #1 USB3 #3 or PCIe #1 PCIe #0 PCIe #0
Port6 USB3 #4 or PCIe #2 USB3 #4 or PCIe #2 PCIe #1 PCIe #1
Port7 PCIe #3 PCIe #3 PCIe #2 PCIe #2
Port8 PCIe #4 PCIe #4 PCIe #3 PCIe #3
Port9 PCIe #5 PCIe #5 PCIe #4 PCIe #4
Port10 PCIe #6 PCIe #6 PCIe #5 PCIe #5
Port11 PCIe #7 PCIe #7 PCIe #6 PCIe #6
Port12 PCIe #8 PCIe #8 LAN/PCIe #7 LAN/PCIe #7
Port13 SATA3 #4 or PCIe #1 SATA3 #4 SATA #0 = SATA 6Gb/s SATA #0 = SATA 6Gb/s
Port14 SATA3 #5 or PCIe #2 SATA3 #5 SATA #1 = SATA 6Gb/s SATA #1 = SATA 6Gb/s
Port15 SATA3 #0 SATA2 #0 SATA #2 = SATA 6Gb/s SATA #2 = SATA 3Gb/s
Port16 SATA3 #1 - - -
Port17 SATA2 #2 SATA2 #2 SATA #3 = SATA 3Gb/s SATA #3 = SATA 3Gb/s
Port18 SATA2 #3 - - -
Graphics Core
The integrated Intel® HD/HD4600/HD5200 (Gen7.5) supports:
Graphics Core Render Clock GT1/GT2/GT3; Base clock: 400/200 MHz; GT Turbo: up to 1000 MHz
Execution Units / Pixel Pipelines GT3: 40EU / GT2: 20EU / GT1: 10EU
Max Graphics Memory 1720MB
GFX Memory Bandwidth (GB/s) 25.6
GFX Memory Technology DVMT
API (DirectX/OpenGL) 11.1 / 4.0 + OCL 1.2
Shader Model 5.0
Hardware accelerated Video MPEG2, VC-1, AVC, Blu-ray (+3D)
Independent/Simultaneous Displays 3
Display Port DP 1.2 / eDP 1.3
HDCP support HDCP 1.4a
Monitor output
CRT max Resolution 1920x1200
TV out: -
LVDS
LVDS Bits/Pixel 1x18/24, 2x18/24 with DP2LVDS
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1920x1200
PWM Backlight Control: YES
Supported Panel Data: JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics 1x PEG 3.0/2.0
Digital Display Interface DDI1 DP++
Digital Display Interface DDI2 DP++
Digital Display Interface DDI3 DP++
Maximum Resolution on DDI HDMI: 4096x2304, DP: 3840x2160

18
COMe-bHL6 / Product Specification
PEG Configuration
The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-bHL6 supports following PEG Port configuration when used as PCI Express Interface:
» 1×16
» 1×8
» 1×4
» 1×2
» 1×1
The internal PCI Express controller can be re-configured to support up to 3 PCIe ports on PEG16 interface. The PEG lane
splitting is configurable in setup:
» 1×16 (lanes #0-15)
» 2×8 (lanes #0-7 + #8-15)
» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)
Storage
onboard SSD -
SD Card support -
IDE Interface -
Serial-ATA up to 3x SATA 6Gb/s, 1x SATA 3Gb/s
SATA AHCI NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
SATA RAID 0, 1, 5, 10 (QM87 only)
With splitted ports, Port2 (#8-15 or #8-11) and Port3 (#12-15) cannot have more lanes
active as Port1 (#0-7) has
If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a RAID Setup connect at least two hard drives
and enable RAID support in BIOS Advanced/HDD Settings. After reboot, setup your RAID
configuration in the new setup item “Addon Devices”

19
COMe-bHL6 / Product Specification
Connectivity
USB 2.0 8x USB 2.0
USB 3.0 up to 4x USB 3.0
USB Client -
PCI -
PCI External Masters -
PCI Express 7x PCIe x1 Gen 2.0
Max PCI Express 8x PCIe without LAN
PCI Express x2/x4 configuration YES (Softstrap option)
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® i218-LM (Clarkville)
PCI Express Configuration
By default, the COMe-bHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5 Port #6 Port #7*
Configuration 0 x1 x1 x1 x1 x1 x1 x1 x1
Configuration 1 x2 x1 x1 x1 x1 x1 x1
Configuration 2 x2 x2 x1 x1 x1 x1
Configuration 3 x2 x2 x2 x1 x1
Configuration 4 x2 x2 x2 x2
Configuration 5 x4 x1 x1 x1 x1
Configuration 6 x4 x2 x1 x1
Configuration 7 x4 x2 x2
Configuration 8 x4 x4
Ethernet
The Intel® i218-LM (Clarkville) ethernet supports:
» Jumbo Frames - 9K
» MACsec IEEE 802.1 AE
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
» IEEE1588
Misc Interfaces and Features
Supported BIOS Size/Type 16MB SPI
Audio HD Audio + DisplayPort dual stream
Onboard Hardware Monitor Nuvoton NCT7802Y
Trusted Platform Module Atmel AT97SC3204-U2A1A-10
Miscellaneous 2x UART / PWM FAN / eDP optional
-*PCIe Port #7 is available without Ethernet Controller only
-Configuration 0 is the default setting
-Configuration 3 & Configuration 5 are available in UEFI download package on EMD
Customer Section

COMe-bHL6 / Product Specification
20
Kontron Features
External I2C Bus Fast I2C, MultiMaster capable
Smart Battery (M.A.R.S.) support YES
Embedded API KEAPI3
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support YES
Supply Voltage 8.5V - 20V
ACPI ACPI 4.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc Power Management cTDP @ i7-4700EQ
Power Consumption and Performance
Full Load Power Consumption 17 - 48W
Kontron Performance Index 32645 - 100815
Kontron Performance/Watt 1723 - 3105
Detailed Power Consumption measurements and benchmarks for CPU, Graphics and Memory
are available in Application Note KEMAP054 at EMD Customer Section.