Kontron COMe-bIP6RXT User manual

The information contained in this document has been carefully researched and is, to the best
of our knowledge, accurate. However, we assume no liability for any product failures or
damages, immediate or consequential, resulting from the use of the information provided
herein. Our products are not intended for use in systems in which failures of product could
result in personal injury. All trademarks mentioned herein are property of their respective
owners. All specifications are subject to change without notice.
Manual
COMe-bIP6 & COMe-bIP6RXT
Kontron
Our company network supports you worldwide with offices in Germany, Austria,
Switzerland, Great Britain and the USA. For more information please contact:
FORTEC Elektronik AG
Hauptniederlassung
Lechwiesenstr. 9
86899 Landsberg am Lech
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortecag.de
FORTEC Elektronik AG
Büro West
Hohenstaufenring 55
50674 Köln
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortecag.de
FORTEC Elektronik AG
Büro Wien
Nuschinggasse 12
A-1230 Wien
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortec.at
ALTRAC AG
(Tochter der FORTEC):
Bahnhofstraße 3
CH-5436 Würenlos
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.altrac.ch

COMe-bIP6
Document Revision 140
www.kontron.com

» Table of Contents «
1User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1. Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
Introduction........................................................................................8
.1 Product Description...................................................................................................................... 8
. Naming clarification..................................................................................................................... 8
.3 Understanding COM Express® Functionality.......................................................................................8
.4 COM Express® Documentation.........................................................................................................9
.5 COM Express® Benefits.................................................................................................................. 9
3Product Specification..........................................................................10
3.1 Module definition....................................................................................................................... 10
3. Functional Specification............................................................................................................... 1
3.3 Block Diagram COMe-bIP6............................................................................................................. 0
3.4 Block Diagram COMe-bIP6RXT........................................................................................................ 1
3.5 Accessories...............................................................................................................................
3.6 Electrical Specification................................................................................................................ 3
3.6.1 Supply Voltage........................................................................................................................... 3
3.6. Power Supply Rise Time................................................................................................................ 3
3.6.3 Supply Voltage Ripple.................................................................................................................. 3
3.6.4 Power Consumption..................................................................................................................... 3
3.6.5 ATX Mode.................................................................................................................................. 4
3.6.6 Single Supply Mode..................................................................................................................... 4
3.7 Power Control............................................................................................................................ 5
3.8 Environmental Specification......................................................................................................... 6
3.8.1 Temperature Specification............................................................................................................ 6
3.8. Humidity................................................................................................................................... 6
3.9 Standards and Certifications......................................................................................................... 7
3.10 MTBF........................................................................................................................................ 9
3.11 Mechanical Specification.............................................................................................................. 30
3.1 Module Dimensions..................................................................................................................... 31
3.13 Thermal Management, Heatspreader and Cooling Solutions.................................................................3
3.14 Onboard Fan Connector................................................................................................................ 33
4Features and Interfaces.......................................................................34
4.1 S5 Eco Mode.............................................................................................................................. 34
4. Rapid Shutdown......................................................................................................................... 35
www.kontron.com

COMe-bIP6 /
4.3 LPC.......................................................................................................................................... 37
4.4 Serial Peripheral Interface (SPI)....................................................................................................38
4.5 SPI boot.................................................................................................................................... 38
4.6 M.A.R.S.................................................................................................................................... 40
4.7 UART........................................................................................................................................ 41
4.8 Fast I C.................................................................................................................................... 4
4.9 GPIO - General Purpose Input and Output.........................................................................................43
4.10 Dual Staged Watchdog Timer......................................................................................................... 44
4.11 Intel® Fast Flash Standby™ / Rapid Start Technology™.......................................................................45
4.1 Speedstep Technology.................................................................................................................. 47
4.13 C-States.................................................................................................................................... 48
4.14 Hyper Threading......................................................................................................................... 49
4.15 Dynamic FSB Frequency Switching.................................................................................................. 50
4.16 VID-x........................................................................................................................................ 51
4.17 Intel® Turbo Boost Technology and AVX...........................................................................................5
4.18 Display Configuration..................................................................................................................53
4.19 Hybrid Graphics / Multi-monitor....................................................................................................57
4. 0 Intel® vPro™ technology.............................................................................................................. 58
4. 1 ACPI Suspend Modes and Resume Events..........................................................................................59
5System Resources...............................................................................60
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 60
5. Memory Area.............................................................................................................................. 61
5.3 I/O Address Map......................................................................................................................... 61
5.4 Peripheral Component Interconnect (PCI) Devices.............................................................................6
5.5 I C Bus..................................................................................................................................... 6
5.6 JILI I C Bus............................................................................................................................... 6
5.7 SDVO I C Bus............................................................................................................................. 6
5.8 System Management (SM) Bus.......................................................................................................63
6Connectors........................................................................................64
6.1 Connector Location..................................................................................................................... 64
7Pinout List.........................................................................................65
7.1 General Signal Description............................................................................................................ 65
7. Connector X1A Row A................................................................................................................... 66
7.3 Connector X1A Row B................................................................................................................... 68
7.4 Connector X1B Row C................................................................................................................... 70
7.5 Connector X1B Row D................................................................................................................... 7
8BIOS Operation...................................................................................74
8.1 Determining the BIOS Version........................................................................................................ 74
8. BIOS Update.............................................................................................................................. 74
8.3 Setup Guide............................................................................................................................... 76
4

COMe-bIP6 /
8.4 POST Codes................................................................................................................................ 76
8.4.1 Start AMI® Aptio Setup Utility.......................................................................................................76
8.5 BIOS Setup................................................................................................................................ 78
8.5.1 Main........................................................................................................................................ 78
8.5. Advanced.................................................................................................................................. 80
8.5.3 Chipset................................................................................................................................... 11
8.5.4 Boot....................................................................................................................................... 1 8
8.5.5 Security.................................................................................................................................. 130
8.5.6 Save & Exit............................................................................................................................... 13
5

COMe-bIP6 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 003- 014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/ and Personal System/ are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
6

COMe-bIP6 / User Information
1.5 arranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
7

COMe-bIP6 / Introduction
2 Introduction
2.1 Product Description
Kontron's Computer-on-Module for COM Express® basic with 3rd Generation of Intel® Core(TM) Series. With support for
Pin-out Type and Type 6, Kontron's module covers both the need for latest interface technology and the need to extend
life-time for existing baseboard designs.
The 3rd Intel® Core Generation increases efficiency and performance per watt ratio which is a result of the innovative
nm 3-D Tri-Gate.
With USB 3.0, SATA 6Gb/s and PCI Express Gen 3, COMe-bIP6 offers incredible data transfer. Additionally, note the
outstanding visual computing performance with up to 3 independent displays and support for DirectX® 11 and OCL 1.1.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (1 5mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames ( ) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 0pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO shared w/GPIO 1x optional 1x optional - 1x optional
UART (2-wire COM) - x - x
FAN PWM out - 1x - 1x
8

COMe-bIP6 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bIP6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9

COMe-bIP6 / Product Specification
3 Product Specification
3.1 Module definition
The COM Express® basic sized Computer-on-Module COMe-bIP6 (CCR6) follows pin-out Type 6 and is compatible to PICMG
specification COM.0 Rev .0. The COMe-bIP6 based on latest Chief River platform is available in different variants to cover
the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor PCH Memory Graphics TPM
380 1-0000- 3-4 COMe-bIP6 i7-3615QE Intel® Core™ i7-3615QE QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000- 1-4 COMe-bIP6 i7-361 QE Intel® Core™ i7-361 QE QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000- 5- COMe-bIP6 i7-3555LE Intel® Core™ i7-3555LE QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000-17- COMe-bIP6 i7-3517UE Intel® Core™ i7-3517UE QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000- 7- COMe-bIP6 i5-3610ME Intel® Core™ i5-3610ME QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000- 4- COMe-bIP6 i3-31 0ME Intel® Core™ i3-31 0ME QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000-16- COMe-bIP6 i3-3 17UE Intel® Core™ i3-3 17UE QM77 xDDR3-1600 HD4000 Infineon SLB9635TT
380 1-0000- -1 COMe-bIP6 10 0E Intel® Celeron® 10 0E HM76 xDDR3-1600 HD Infineon SLB9635TT
380 1-0000-14-1 COMe-bIP6 1047UE Intel® Celeron® 1047UE HM76 xDDR3-1600 HD Infineon SLB9635TT
380 1-0000-15-0 COMe-bIP6 9 7UE Intel® Celeron® 9 7UE HM76 xDDR3-1600 HD Infineon SLB9635TT
Extended temperature grade modules (E1, -25°C to 75°C operating)
Product Number Product Name Processor PCH Memory Graphics TPM
380 1-0000- 1-4EXT COMe-bIP6 i7-361 QE E1 Intel® Core™ i7-361 QE QM77 xDDR3-1600 HD4000 -
380 1-0000-17- EXT COMe-bIP6 i7-3517UE E1 Intel® Core™ i7-3517UE QM77 xDDR3-1600 HD4000 -
The COMe-bIP6 is available for extended temperature range. General capability was tested for following options:
» CPU: all
» Memory: E memory only 97015-xxxx-16-
» TPM: Atmel AT97SC3 04-U A1A-10 optional
» VCC: 1 V only, no support for Wide-Range Input
Industrial temperature grade modules ( T, -40°C to 85°C operating)
Modules for industrial temperature range are available project based only, please contact your local sales or support for
further details.
Product Number Product Name Processor PCH TPM
380 1-0000-xx-x COMe-bIP6 All QM77 or HM76 Atmel AT97SC3 04 optional
The COMe-bIP6 is available for industrial temperature range by screening. General capability was tested for following
options:
» CPU: all
» Memory: E memory only 97015-xxxx-16-
» TPM: Atmel AT97SC3 04-U A1A-10 optional
» VCC: 1 V only, no support for Wide-Range Input
10

COMe-bIP6 / Product Specification
R T products
The RXT product line includes modules with following featureset:
» industrial (-40 to +85°C) or extended (- 5 to +75°C) grade temperature range by screening
» ECC Memory support
» Kontron Rapid Shutdown support
Product Number Product Name Processor PCH Memory Graphics TPM Temperature grade
380 4-0000- 1-4 COMe-bIP6RXT i7-361 QE Intel® Core™ i7-361 QE QM77 xDDR3-1600 ECC HD4000 Atmel AT97SC3 04 -40 to +85°C
380 4-0000- 5- COMe-bIP6RXT i7-3555LE Intel® Core™ i7-3555LE QM77 xDDR3-1600 ECC HD4000 Atmel AT97SC3 04 -40 to +85°C
380 4-0000-17- COMe-bIP6RXT i7-3517UE Intel® Core™ i7-3517UE QM77 xDDR3-1600 ECC HD4000 Atmel AT97SC3 04 -40 to +85°C
Please contact your local sales for further information and MOQ for RXT modules.
The COMe-bIP6RXT is available project based only
11

COMe-bIP6 / Product Specification
3.2 Functional Specification
Processor
The nm Intel® 3rd Gen Core™ i7/i5/i3/Celeron® embedded (Ivy Bridge) CPU family with 31x 4mm package size
(FCBGA10 3 socket) supports:
» Intel® Turbo Boost Technology .01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» AES New Instructions (AES-NI)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory Access
» Intel® Flex Memory Access
» Integrated Intel® HD Graphics with Dynamic Frequency
» Configurable Thermal Design Power (cTDP)
Optional available (with customized BIOS):
» Intel® vPRO™ Technology including:
» Intel® Active Management Technology (AMT)
» Intel® Trusted Execution Technology (TXT)
12

COMe-bIP6 / Product Specification
The integrated Intel® HD Graphics 4000 supports:
» GraphicsTechnology GT1 with 6 Execution Units
» GraphicsTechnology GT with 16 Execution Units
» Intel® Quick Sync Video
» Intel® InTru™ 3D Technology
» Intel® Wireless Display
» Intel® Flexible Display Interface (Intel® FDI)
» Intel® Clear Video HD Technology
» 3 simultaneous displays in Windows 7 & Linux
» Hybrid Multi Monitor
» Video Decode for AVC/H. 64/VC-1/MPEG-
» Video Encode for AVC/H. 64/MPEG-
» Blu-ray Playback
The integrated Intel® HD 500 Graphics supports:
» GraphicsTechnology GT1 with 6 Execution Units
» Dual Display
» Video Decode for AVC/H. 64/VC-1/MPEG-
» Video Encode for AVC/H. 64/MPEG-
» Blu-ray Playback
13

COMe-bIP6 / Product Specification
Intel® Core™ Core™ Core™ Core™ Core™ Core™ Core™ Celeron® Celeron® Celeron®
- i7-3615QE i7-3612QE i7-3555LE i7-3517UE i5-3610ME i3-3120ME i3-3217UE 1020E 1047UE 927UE
# of Cores 4 4 1
# of Threads 8 8 4 4 4 4 4 1
TDP Core frequency (HFM) 2300MHz 2100MHz 2500MHz 1700MHz 2700MHz 2400MHz 1600MHz 2200MHz 1400MHz 1500MHz
Max Turbo Frequency 3300MHz 3100MHz 3 00MHz 800MHz 3300MHz - - - - -
LFM/LPM Frequency 1 00MHz 1 00MHz 800MHz 800MHz 800MHz 800MHz 800MHz 1 00MHz 800MHz 800MHz
Bus/Core Ratio 1 - 3 1 - 1 8- 5 8-17 8- 7 8- 4 8-16 1 - 8-14 8-15
Nominal TDP 45W 35W 5W 17W 35W 35W 17W 35W 17W 17W
Power Limit (PL max) 60W 44W 44W 4W 44W - - - - -
cTDP-Down - - - 14W
(800MHz)
- - 14W
(800MHz)
- - -
cTDP-Up - - - 5W
( . GHz)
- - 17W
(1.6GHz)
- - -
Lithography nm nm nm nm nm nm nm nm nm nm
C-States C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C3 C0-C3 C0-C3
Smart Cache 6MB 6MB 4MB 4MB 3MB 3MB 3MB MB MB 1MB
Min Memory Type DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066
Max Memory Type DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600
Max Memory Size 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB
# of Memory Channels
Graphics Model HD4000 HD4000 HD4000 HD4000 HD4000 HD4000 HD4000 HD HD HD
GFX Base Frequency 650MHz 650MHz 550MHz 350MHz 650MHz 650MHz 350MHz 650MHz 350MHz 350MHz
GFX Max Dynamic Frequ. 1000MHz 1000MHz 1000MHz 1000MHz 1100MHz 900MHz 900MHz 1000MHz 900MHz 900MHz
GFX Technology GT 16EU GT 16EU GT 16EU GT 16EU GT 16EU GT 16EU GT 16EU GT1 6EU GT1 6EU GT1 6EU
Quick Sync Video Yes Yes Yes Yes Yes Yes Yes - - -
InTru™ 3D Yes Yes Yes Yes Yes Yes Yes - - -
Wireless Display Yes Yes Yes Yes Yes Yes Yes - - -
Clear Video HD Yes Yes Yes Yes Yes Yes Yes - - -
vPRO™ (optional) Yes Yes Yes Yes Yes - - - - -
TXT (optional) Yes Yes Yes Yes Yes - - - - -
AES-NI Yes Yes Yes Yes Yes - - - - -
VT-x Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
VT-d Yes Yes Yes Yes Yes - - - - -
PCI Express Graphics Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen .0 Gen .0 Gen .0 Gen .0 Gen .0
The Driver Default PL is 1. 5 x cTDP
14

COMe-bIP6 / Product Specification
Memory
Sockets x DDR3 SO-DIMM
Memory Type DDR3-1333/1600 (ECC on RXT Ver.)
Maximum Size x8GB
Technology Dual Channel
Chipset
The 65nm Intel® 7-Series Platform Controller Hub Panther Point supports:
» PCI Express Revision .0
» PCI Express Configurations x1, x , x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® Active Management Technology 8.0 (optional)
» Intel® Anti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
PCH comparison
Feature QM77 HM76
TDP 4.1W 4.1W
Rapid Storage YES YES
USB 3.0 YES YES
Wireless Display YES YES
3 Displays YES YES
VT-d YES NO
vPRO YES NO
AMT 8.0 YES NO
TXT YES NO
SATA RAID YES NO
The Intel® vPro Technology including Trusted Execution Technology (TXT) and Active
Management Technology (AMT) is not supported by default on COMe-bIP6. Please contact
your local sales or support for custom BIOS variants supporting vPro.
15

COMe-bIP6 / Product Specification
Graphics Core
The integrated Intel® HD4000 (Gen7) supports:
Graphics Core Render Clock GT1 /GT ; Base clock: 350/650 MHz; GT Turbo: up to 1000 MHz
Execution Units / Pixel Pipelines GT : 16EU / GT1: 6EU
Max Graphics Memory 17 0MB
GF Memory Bandwidth (GB/s) 5.6
GF Memory Technology DVMT
API (Direct /OpenGL) 11 / 3.0 + OCL1.1
Shader Model 5.0
Hardware accelerated Video MPEG , VC-1, AVC, Blu-ray (+3D)
Independent/Simultaneous Displays 3
Display Port DP 1.1a / eDP
HDCP support HDCP 1.4
Monitor output
CRT max Resolution 048x1536
TV out: -
LVDS
LVDS Bits/Pixel 1x18/ 4, x18/ 4
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 19 0x1 00
PWM Backlight Control: YES
Supported Panel Data: JILI /JILI3/EDID/DID
Display Interfaces
Discrete Graphics 1x PEG 3.0/ .0
Digital Display Interface DDI1 DP++/SDVOB
Digital Display Interface DDI2 DP++
Digital Display Interface DDI3 DP++/eDP
Maximum Resolution on DDI 560x1600
PEG Configuration
The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-bIP6 supports following port configuration when used as PCI Express Interface:
» 1×16
» 1×8
» 1×4
» 1×
» 1×1
The internal PCI Express controller can be re-configured to support up to 3 PCIe ports. The following port configurations
are available via hardware strap options (customized article):
» ×8 (lanes #0-7 + #8-15)
» 1×8 + ×4 (lanes #0-7 + #8-11 + #1 -15)
16

COMe-bIP6 / Product Specification
Storage
onboard SSD -
SD Card support -
IDE Interface -
Serial-ATA x SATA 6Gb/s, x SATA 3Gb/s
SATA AHCI NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
SATA RAID 0, 1, 5, 10, MATRIX (QM77 only)
If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a RAID enable RAID support in BIOS Chipset/SATA
settings, connect at least two hard drives and enter the RAID Option ROM by pressing
'CTRL'+'I'
17

COMe-bIP6 / Product Specification
Connectivity
USB 2.0 8x USB .0
USB 3.0 4x USB 3.0
USB Client -
PCI -
PCI External Masters -
PCI Express 7x PCIe x1 Gen
Max PCI Express 8x PCIe without LAN
PCI Express x2/x4 configuration YES (Softstrap option)
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 8 579LM (Lewisville)
Due to internal chipset configuration the Panther Point only supports up to 4 USB Hubs
PCI Express Configuration
By default, the COMe-bIP6 supports x1 PCIexpress lane configuration only. Following x /x4 configurations are available
via Management Engine Softstrap Options with a customized BIOS version.
PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5 Port #6 Port #7*
Configuration0 x1 x1 x1 x1 x1 x1 x1 x1
Configuration1 x x1 x1 x1 x1 x1 x1
Configuration x x x1 x1 x1 x1
Configuration3 x x x x1 x1
Configuration4 x x x x
Configuration5 x4 x1 x1 x1 x1
Configuration6 x4 x x1 x1
Configuration7 x4 x x
Configuration8 x4 x4
- *PCIe Port #7 is available without Ethernet Controller
- Configuration0 (default) and Configuration5 (modified FlashDescriptor) are provided in
BIOS download package available on EMD Customer Section
Ethernet
The Intel® 8 579LM (Lewisville) ethernet supports:
» Jumbo Frames
» MACsec IEEE 80 .1 AE
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
18

COMe-bIP6 / Product Specification
Misc Interfaces and Features
Supported BIOS Size/Type 8MB SPI
Audio HD Audio + DisplayPort dual stream
Onboard Hardware Monitor Nuvoton NCT780 Y
Trusted Platform Module Infineon SLB9635TT / Atmel AT97SC3 04
Miscellaneous x UART / PWM FAN
Kontron Features
External I2C Bus Fast I C, MultiMaster capable
M.A.R.S. support YES
Embedded API KEAPI1 / KEAPI
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support YES
Supply Voltage 8.5V - 0V
ACPI ACPI 4.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc Power Management cTDP@17W i3/i7, Rapid Shutdown @ RXT Ver.
Power Consumption and Performance
Full Load Power Consumption 10 - 58W
Kontron Performance Index 18 89 - 76117
Kontron Performance/Watt 1319 - 740
*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo .0
Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
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