Kontron ME1100 Operator's manual

Table of ContentTable of Content
User Documentation - ME1100
Product description
Overview
Specifications
Platform components
Product architecture
Description of system access methods
Recommended technical expertise
Getting started
Getting started - Application installation and performance benchmarking
Planning
Environmental considerations
Power consumption and power budget
Network architecture
MAC addresses
PCI mapping
Platform, modules and accessories
Material, information and software required
Hardware compatibility list
Validated operating systems
Security
Installing
Mechanical installation and precautions
ESD protections
Unboxing
Component installation and assembly
Airflow
Rack installation
Cabling
Software installation and deployment
Preparing for installation
Installing an operating system on a server
Verifying installation
Common software installation
Configuring
Configuring system access methods
Configuring and managing users
Baseboard management controller - BMC
Configuring the network time protocol - NTP
Basic BIOS option configuration
Operating
Default user names and passwords
User Documentation - ME1100User Documentation - ME1100
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Accessing platform components
Accessing the operating system of a server
Accessing the BIOS
Accessing a BMC on an ME1100
Platform power management
Monitoring
Monitoring sensors
Sensor list
Interpreting sensor data
Managing customer added sensors
Maintenance (acting)
System event log
Component replacement
Upgrading
Platform cooling and thermal management
Application ready indication via power LED
Troubleshooting
Collecting diagnostics
Factory default
Support information
Reference guides
Supported IPMI commands
Document symbols and acronyms
Safety and regulatory information
Warranty and support
Product descriptionProduct description
{This article briefly describes the physical product, features and main options.}
Table of contents
ME1100 platform
Main applications
Main features
ME1100 platformME1100 platform
The goal of multi-access edge computing is to decrease network congestion and improve the performance of applications or workloads by getting task processing closer to
the user.
Our mobile edge Xeon® D servers enable content and applications to reside closer to the edge. This allows operators to solve challenges related to restricted space and
power while reducing overall costs. The ME1100 1U platform enables edge applications based on Radio Access Network, artificial intelligence, data caching, ultra-low latency
and high-bandwidth, among others.
Main applicationsMain applications
High-performance server for multi-access edge computing (MEC)
Enabling IT and cloud-computing capabilities within the Radio Access Network (RAN)
Ideal for ultra-low latency and high-bandwidth applications
Storage and extension slot for artificial intelligence or data caching applications
Main featuresMain features
Extended operating temperature range: -40°C to 65°C
19-in 1U rackmount, 300-mm deep
Intel® Xeon® D-1500 processor series (8C, 12C)
Two embedded 10 GbE SFP network interfaces
One FHHL or FH3/4L PCIe add-in card
OverviewOverview
Children
Specifications
Platform components
Product architecture
Description of system access methods
Recommended technical expertise
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SpecificationsSpecifications
{This article details dimensions, shipping weights, environmental specifications and power consumption and lists key hardware and software features.}
Table of contents
ME1100 key hardware features
ME1100 key software features
ME1100 physical dimensions
ME1100 packaging physical dimensions
ME1100 shipping weights
ME1100 environmental specifications
ME1100 key hardware featuresME1100 key hardware features
FeatureFeature DescriptionDescription
Hardware platform High-performance server for mobile edge computing (MEC), 1U height, 300-mm deep, 19 inches wide
Hot-swappable fan tray and filter
Front access only (motherboard I/O, PSU, PCIe add-in card I/O, fan tray)
I/O Two 10 GbE SFP+
One USB 2.0
One RJ45 10/100/1000Base-T management port
One RJ45 serial port
One reset button
PCIe add-in card One optional FHHL or FH¾L PCIe x16 add-in card supported (power and thermal restrictions may apply)
Maximum power consumption supported is 50 W
Refer to the Hardware compatibility list
CPU Intel® Xeon® D-1500 family processors are supported, including the following processors:
Xeon® D-1548, 8 Cores @ 2.00GHz, 45W
Xeon® D-1567, 12 Cores @ 2.10GHz, 65W
Xeon® D-1559, 12 Cores @ 1.50GHz, 45W
Drive One M.2 SATA SSD up to 2280 option:
Refer to the Hardware compatibility list
Four 2.5-in SATA SSD option:
Refer to the Hardware compatibility list
Memory DDR4 DIMM with ECC
Bandwidth up to 2400 MT/s
Two memory channels
One DIMM socket per channel
Refer to the Hardware compatibility list
Power inlet One -57 VDC to -40 VDC dual input feed
Power consumption Refer to Power consumption and power budget
Fans Hot-swappable fan tray:
Fan tray contains 3 fans (standard configuration)
Fan tray contains 4 fans when 2.5-in SATA SSD option is installed
Fan filter can be removed independently from the fan tray
Automatic fan speed control
Rack mounting brackets Front or middle mount in a 19-in wide rack
ME1100 key software featuresME1100 key software features
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FeatureFeature DescriptionDescription
Platform
management
Integrated BMC – this subsystem consists of communication buses, sensors, system BIOS, and server management firmware; it supports standard
IPMI features as well as OEM (supplemental) features that are not part of IPMI
IPMI-based system monitor used for server monitoring, diagnostic and configuration
System event log
Server power consumption monitoring
Server power control
Server and component health monitoring
Fan speed monitoring
Serial over LAN console access
IPMI over LAN
Sensor data record describing all sensors and providing their readings (analog or discrete)
ACPI state synchronization: the BMC tracks ACPI state changes that are provided by the BIOS
BIOS recovery
Operating
system
Refer to the Validated operating systems
Thermal
management
Platform Environment Control Interface (PECI) for thermal management support
Memory and CPU thermal management
ME1100 physical dimensionsME1100 physical dimensions
ChassisChassis Measurements (mm [in])Measurements (mm [in]) NotesNotes
Depth 300 [11.8] Body
Width 449 [17.6] max. Body
483 [19] max. Overall width: front mounting brackets included (2 times 17.2 mm [0.7 in])
465 [18.3] Between rack mounting points
Height 43.5 [1.7] max. Body
Side clearance 70 [2.8] Between rack mounting points
Front clearance 100 [4] Recommended
Rear clearance None
ME1100 packaging physical dimensionsME1100 packaging physical dimensions
Depth (mm [in])Depth (mm [in]) Width (mm [in])Width (mm [in]) Height (mm [in])Height (mm [in])
422 [16.6] 605 [23.8] 170 [6.7]
ME1100 shipping weightsME1100 shipping weights
ComponentComponent Weight (kg)Weight (kg) Weight (lb)Weight (lb)
System weight – with two DIMM and one M.2-2280 SATA SSD 4.37 9.63
Packaging (box + foam + bag) 1.124 2.48
2.5-in SSD carrier bracket 0.206 0.45
2.5-in SATA SSD (1) 0.060 0.13
ME1100 environmental specificationsME1100 environmental specifications
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EnvironmentEnvironment SpecificationSpecification
Temperature,
operating
-40ºC to +65ºC (-40ºF to +149ºF)
The failure of one fan will not impact operation for at least 4 hours at 65˚C.
Certain limitations may apply. These limitations could be the result of the operating temperature range of installed configurable components (e.g.,
SFP+ module, SSD and PCIe add-in card). Kontron recommends using SFP+ and SSD modules with an industrial operating temperature range (-40°C
to +85°C). Another limitation can result from airflow obstruction caused by fan filter clogging and failure to follow recommended side clearances.
Temperature,
non-operating
-40ºC to +70ºC (-40ºF to +158ºF)
Humidity,
operating
5% to 95%, non-condensing
Altitude/pressure,
operating
-60 m to 1,800 m altitude without temperature de-rating
Up to 4,000 m altitude with temperature de-rating of 1 degree Celsius per 300 m above 1,800 m
Altitude/pressure,
non-operating
Up to 4,570 m
Vibration,
operating
This product meets operational random vibration
Test profile based on ETSI EN 300 019-2-3 class 3.2
5 Hz to 10 Hz at +12 dB/octave (slope up)
10 Hz to 50 Hz at 0.02 m2/s3 (0.0002 g 2 /Hz) (flat)
50 Hz to 100 Hz at -12 dB/octave (slope down)
30 minutes for each of the three axes
Vibration, non-
operating
This product meets transportation and storage random vibration
Test profile based on GR-63 clause 5.4.3, and ETSI EN 300 019-2-2 class 2.3
5 Hz to 20 Hz at 1 m2/s3 (0.01 g 2 /Hz) (flat)
20 Hz to 200 Hz at -3 dB/octave (slope down)
30 minutes for each of the three axes
Shock, operating This product meets operational shock standards
Test profile based on ETSI EN 300 019-2-3 class 3.2
11 ms half sine, 3 g, three shocks in each direction
Drop/free fall This product meets Bellcore GR-63 section 5.3
Packaged = 1,000 mm, six surfaces, three edges and four corners
Unpackaged = 100 mm, two sides and two bottom corners
Electrostatic
discharge
This product meets 8 kV contact, 15 kV air discharge using IEC 61000-4-2 test method
RoHS and WEEE This product is designed to meet China RoHS Phase 1 (self-declaration and labeling)
This product complies with EU directive 2012/19/EU (WEEE)
This product complies with RoHS directive 2011/65/EU as modified by EU 2015/863
Platform componentsPlatform components
{This article describes the platform's various components: panels, LEDs, modules, fans and power supply units.}
Table of contents
Platform front panel
Platform LEDs
Management/control plane port LEDs
Network port LEDs
Serial port connector pinout
Fans and filter
Platform front panelPlatform front panel
Platform LEDsPlatform LEDs
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ID (blue)ID (blue) Power (green)Power (green) StateState
Off Off Both power inputs DOWN or out of range for normal operation
On Off One or both power inputs UP – ACPI Software off state (S5)
Slow blink Off Platform preheating prior to server activation
Normal blink Any BMC is executing an identification request
Off Rapid blink Server processor activation complete and executing – ACPI Working state ( S0)
Off Normal blink BIOS started POST
Off Normal blink or On 1BIOS hand over to OS boot loader
Off On 1Application started/running OK
1 By default, the Power LED will "normal blink" until customer application confirms it is running by setting an I/O register bit. Via a BIOS setting, the Power LED can be set to
steady on after POST (before starting the OS/application), but the default BIOS setting leaves that task to the application.
Slow blink: 1 short pulse every 2 seconds
Normal blink: 1 pulse every second
Rapid blink: 2 pulses every second
Status (amber/red)Status (amber/red) StateState
Off No active error notification (normal operation)
Amber On Major alarm active
Red On Critical alarm active (service/maintenance is required)
Button stateButton state BehaviorBehavior
Reset button pressed CPU resets (does not affect the management controller)
Management/control plane port LEDsManagement/control plane port LEDs
Port number 3 is the platform management port.
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Management link Management link
(left – green/yellow)(left – green/yellow)
Management activity Management activity
(right – green)(right – green)
StateState
Off Off No link
Off On (no activity)
Blinking (activity)
10Base-T link established
Yellow On On (no activity)
Blinking (activity)
100Base-TX link established
Green On On (no activity)
Blinking (activity)
1000Base-T link established
Network port LEDsNetwork port LEDs
Network link/activity (green)Network link/activity (green) StateState
On Link established, no activity
Blinking Activity
Off No link
Serial port connector pinoutSerial port connector pinout
Fans and filterFans and filter
The ME1100 platform is equipped with a fan tray assembly comprised of fans and a filter. The filter can be pulled out by itself or the entire fan tray assembly (i.e., the fans
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and the filter) can be pulled out.
To service the entire fan tray: unfasten the fan screw.
To service the filter only: unfasten the filter screw and clean using oil-free compressed air.
Always replace the fan tray with the equivalent fan tray assembly (part number). Two fan tray kits are available for the ME1100 product. Fan tray with 3
fans (standard) and fan tray with 4 fans when ME1100 is configured with 2.5-in SSDs. Using the wrong fan tray may cause thermal issues in the system.
Fan air filter should be inspected on a regular basis, based on the environment of their location. The inspection could be required every 2 years (in a very
clean environment) or even every 3 months (in a slightly dusted environment). It is recommended that 3 months after the first installation, an inspection is
executed in order to assess the ?state? of the filter. Base on how the filter is clogged, the schedule for cleaning or replacement of the filter can be
established. Note that for installation done according to Telcordia NEBS requirements, filters must be replaced (R4-27 [145]) they cannot be cleaned. For
other type of installation, filters could be cleaned up to 3 times, after what they must be replaced. It is recommended to replace filter every 3 years,
replacement is required before residual dust build-up and provide air flow resistance. To clean filter you can use slightly compressed air, vacuum, and/or
rinsed them with clean water. If water is use make sure the filter is completely dry before reinstalling
Hot-swappable fan tray Hot-swappable fan tray
Hot-swappable filter tray Hot-swappable filter tray
Product architectureProduct architecture
{This article provides visual representations of the system's architecture and network interconnections as well as block diagrams.}
Table of contents
Internal connections
Network planes
Block diagram
Internal connectionsInternal connections
Network planesNetwork planes
The ME1100 platform provides 3 network planes.
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Network planesNetwork planes DescriptionDescription Speed (GbE)Speed (GbE) Component accessComponent access Default network schemeDefault network scheme
Management plane The management plane carries platform
administrative traffic. This plane is used to
support hardware management, configuration
and health/thermal/power monitoring.
1 BMC DHCP
Control plane The control plane carries customer application
signalling traffic. This plane is used to control
customer applications.
1 Server DHCP
Data plane The data plane carries customer data
application traffic. This plane is used to deliver
service to end users.
10 Server, BMC DHCP
Block diagramBlock diagram
This block diagram summarizes the connections within the platform.
Description of system access methodsDescription of system access methods
{This article lists interface access methods and their intended uses based on various use cases.}
Table of contents
Paths to the operating system
Paths to the BIOS
Paths to the management interface (BMC)
To configure, monitor and troubleshoot the ME1100 platform and its components, several interfaces can be used:
Operating system Operating system – through the management plane, control plane, data plane or the serial port of the platform
BIOS BIOS – through the management plane or the serial port of the platform
Management interface (BMC) Management interface (BMC) – through the management plane and the data plane of the platform
NOTE: NOTE: The management plane and the control plane of the ME1100 platform are physically accessible through the front RJ45 connector.
Paths to the operating systemPaths to the operating system
To access the operating system through one of the paths, refer to Accessing the operating system of a server .
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Paths to the operating systemPaths to the operating system
Path descriptionPath description Main reasons for useMain reasons for use
KVM KVM
This is the recommended path for first time out-of-the-box system configuration.This is the recommended path for first time out-of-the-box system configuration.
Fail-safe path to access the server if any elements (OS, BIOS, etc.) get misconfigured.
Accessible from the management plane.
Initial OS installation
OS network interface configuration
OS video access
Remote access to the OS
Unable to establish an SSH session to the OS
SSH/RDP/Customer application protocolsSSH/RDP/Customer application protocols
Ideal path once OS installation and OS network interface configurations have been performed.
Accessible from the control plane and the data plane.
Operating the platform under normal operation
Remote access to the OS
Serial ov Serial ov er LAN (SOL)er LAN (SOL)
Accessible from the management plane .
OS network interface configuration
Unable to establish an SSH session to the OS
OS serial console access
Serial console (physical connection) Serial console (physical connection)
Fail-safe path to access all server components when elements (OS, BMC BIOS, etc.) get
misconfigured.
Accessible from the physical port.
Initial OS network interface configuration
No configuration performed on BMCs
Troubleshooting
Paths to the BIOSPaths to the BIOS
To access the BIOS through one of the paths, refer to Accessing the BIOS .
Paths to the BIOSPaths to the BIOS
Path descriptionPath description Main reasons for useMain reasons for use
KVM KVM
This is the recommended path for first time out-of-the-box system configuration.This is the recommended path for first time out-of-the-box system configuration.
Fail-safe path to access the server if any elements (OS, BIOS, etc.) get misconfigured.
Accessible from the management plane.
Initial BIOS configuration
BIOS video access
Serial over LAN (SOL)Serial over LAN (SOL)
Accessible from the management plane.
Initial BIOS configuration
BIOS serial console access
OS network interfaces not configured, but BMC network
access is available
Serial console (physical connection) Serial console (physical connection)
Fail-safe path to access all server components when elements (OS, BMC BIOS, etc.) get
misconfigured.
Accessible from the physical port.
Initial BIOS configuration
No configuration performed on BMCs
Troubleshooting
RedfishRedfish
This is the ideal path for automated monitoring/control script once the platform has been configured
for the first time.
Accessible from the management plane.
Remote server monitoring
Remote server control
Paths to the management interface (BMC)Paths to the management interface (BMC)
To access the management interface (BMC) through one of the paths, refer to Accessing a BMC on an ME1100 .
Paths to the management interface (BMC)Paths to the management interface (BMC)
Path descriptionPath description Main reasons for useMain reasons for use
BMC Web UIBMC Web UI
This is the recommended path for first time out-of-the-box system configuration.This is the recommended path for first time out-of-the-box system configuration.
Accessible from the management plane and data plane .
Remote server control and monitoring
OS video access
Firmware upgrades
IPMI over LAN (IOL) IPMI over LAN (IOL)
This is a good path for automated monitoring/control script once the platform has been configured
for the first time.
Accessible from the management plane and data plane .
Remote server control and monitoring
Firmware upgrades
IPMI via KCSIPMI via KCS
Accessible from the local operating system.
Local access to the BMC from the operating system for server
monitoring
Initial BMC configuration
RedfishRedfish
This is the ideal path for automated monitoring/control script once the platform has been configured
for the first time.
Accessible from the management plane.
Remote server monitoring
Remote server control
SNMPSNMP
This is the ideal path for automated monitoring/control script once the platform has been configured
for the first time.
Accessible from the management plane.
Remote server monitoring
Remote server control
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Recommended technical expertiseRecommended technical expertise
{This article describes the technical knowledge required to fully leverage the platform capabilities.}
Platforms are networking devices.
It is recommended that you identify the appropriate upstream topology with the help of the IT/network personnel managing the upstream network hardware and
configuration. This will facilitate the process down the road.
IP addresses will also need to be assigned based on known MAC addresses, so appropriate IT expertise is required.
Getting startedGetting started
Children
Getting started - Application installation and performance benchmarking
[Content under creation] Getting started - Platform configuration and application mass deployment
[Content under creation] Getting started - Platform and application mass management
Getting started - Application installation and performance benchmarkingGetting started - Application installation and performance benchmarking
{This article provides step-by-step instructions to get a customer application installed for the first time in a lab environment and to get ready for application performance
benchmarking.}
Table of contents
Safety and regulatory
Introduction
Assumptions
Unboxing the platform
What's in the box
Planning
Material and information required
PCIe add-in card
Power cables and tooling
Rack installation material
Network cables and modules
Network infrastructure
Software required
Installing a PCIe add-in card in an ME1100
Opening the enclosure
Adjusting the PCIe add-in card space length to three-quarter length
Adjusting the PCIe add-in card rear mounting bracket
Connecting the PCIe add-in card
Installing a thermal probe for the PCIe add-in card
Locating the thermal probe connection
Installing the thermal probe
Closing the enclosure
Racking the platform
Connecting the network cables
Building and connecting the power cables
Material required
Procedure
Confirming network links are established
Discovering or configuring the platform management IP address
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Accessing the BIOS using a serial console (physical connection)
Prerequisites
Port location
Access procedure
Accessing the BMC network configuration menu
Discovering the DHCP management IP address
Configuring a static management IP address
Preparing for operating system installation
Installing an operating system
Prerequisites
Browser considerations
Connecting to the Web UI of the BMC
Changing the user name and password
Launching the KVM
Mounting the operating system image via virtual media
Accessing the BIOS setup menu
Selecting the boot order from boot override
Completing operating system installation
(Optional) Changing the boot order in the BIOS menu
Verifying operating system installation
Benchmarking an application
Monitoring platform sensors using the Web UI
Managing PCIe add-in card temperature for system cooling
Accessing the Web UI
Configuring the PCIe add-in card temperature sensor thresholds
Safety and regulatorySafety and regulatory
Before working with this product or performing instructions described in the getting started section or in other sections, read the Safety and regulatory
information section pertaining to the product. Assembly instructions in this documentation must be followed to ensure and maintain compliance with
existing product certifications and approvals. Use only the described, regulated components specified in this documentation. Use of other
products/components will void the CSA certification and other regulatory approvals of the product and will most likely result in non-compliance with
product regulations in the region(s) in which the product is sold.
IntroductionIntroduction
This getting started section describes the network integration, platform access and operating system installation steps required to start operating an ME1100 platform
equipped with one PCIe add-in card provided by the customer and 4 SSD drives and used to leverage two segregated network links (one for the management plane and one
for the data plane).
This use case is based on a simplified architecture with one management plane and one data plane.
To visualize the complete platform architecture or for further details, refer to Product architecture .
AssumptionsAssumptions
The scenario described in this getting started section is based on the following assumptions:
The network connections of the system are as follows:
One management plane (red line) via the RJ45 management port
One data plane (green line) via the SFP+ port 1
One serial c onnection via the RJ45 serial port to obtain or configure the BMC management IP address
The default IPv4 scheme is DHCP, but it can be configured as static in the BIOS setup menu
The preferred method to obtain or configure the BMC management IP address is through a serial console (physical connection)
The preferred OS installation method is through the KVM
The preferred access method is through the Web UI
PCIe add-in card temperature is monitored using a thermal probe installed in the platform
Unboxing the platformUnboxing the platform
What's in the boxWhat's in the box
The ME1100 platform box includes one ME1100 edge computing 1U platform.one ME1100 edge computing 1U platform.
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Step_1 Carefully remove the platform from its packaging.
Step_2 Remove the plastic film from the platform. Failure to do so may affect platform airflow efficiency, thus resulting in poor cooling capabilities.Failure to do so may affect platform airflow efficiency, thus resulting in poor cooling capabilities.
NOTE: NOTE: Additional material may be required to proceed with installation and configuration (refer to Material and information required for more information).
PlanningPlanning
Material and information requiredMaterial and information required
PCIe add-in cardPCIe add-in card
Item_1 One T8 Torx screwdriver
Item_2 One 3-mm flat-head screwdriver
Item_3 One T10 Torx screwdriver
Item_4 One tie wrap, if the PCIe add-in card is a FH3/4L
Item_5 One thermal probe for temperature monitoring (if physical temperature monitoring is chosen)
Power cables and toolingPower cables and tooling
Item_1 Crimp lugs:
Two or four Molex insulated spade crimp lugs for 14-16 wire gauge (19131-0023)
OROR
Two or four Panduit insulated ring crimp lugs for 10-12 wire gauge (EV10-6RB-Q)
Item_2 Black stranded wire to build the power cable based on the length required:
14 AWG insulation diameter max.: 4.40 mm [0.175 in] for Molex crimp lugs
OROR
12 AWG insulation diameter max.: 5.8 mm [0.23 in] for Panduit crimp lugs
Item_3 Red stranded wire to build the power cable based on the length required:
14 AWG insulation diameter max.: 4.40 mm [0.175 in] for Molex crimp lug
OROR
12 AWG insulation diameter max.: 5.8 mm [0.23 in] for Panduit crimp lug
Item_4 One hand crimp tool:
Molex Premium Grade Hand Crimp Tool (640010100)
OROR
Panduit Hand Crimp Tool (638130400)
Item_5 One 8 AWG ground cable based on the length required
item_6 One ground lug right angle, 8 AWG (Kontron P/N 1064-4226)
item_7 One hand crimp tool, Panduit CT-1700
Item_8 8 mm wrench or equivalent tool
Rack installation materialRack installation material
Item_1 Racking fasteners (rack specific)
Network cables and modulesNetwork cables and modules
Relevant section:Relevant section:
Hardware compatibility list
Item_1 One SFP or SFP+ data plane module and cable
SFP/SFP+ optical modules (SX, LX, SR, LR) with compatible optical cable
Item_2 One RJ45 Ethernet management plane cable
Item_3 One RJ45 serial connection cable
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Network infrastructureNetwork infrastructure
Two IP addresses:
One management plane IP
One data plane IP
Software requiredSoftware required
Item_1 A community version of ipmitool ipmitool is installed on a remote computer to enable remote monitoring—it is recommended to use ipmitool version 1.8.18.
Item_2 A terminal emulator such as puTTY puTTY is installed on a remote computer.
Item_3 A hardware detection tool such as pciutils pciutils is installed on the local server to view information about devices connected to the server PCI buses .
> You now have the material and software required. Proceed with the installation of the PCIe add-in card.> You now have the material and software required. Proceed with the installation of the PCIe add-in card.
Installing a PCIe add-in card in an ME1100Installing a PCIe add-in card in an ME1100
ESD sensitive device! ESD sensitive device!
This equipment is sensitive to static electricity. Care must therefore be taken during all handling operations and inspections of this product in order to
ensure product integrity at all times.
This product usually has more than one power supply cord. Disconnect all power supply cords before servicing to avoid electric shock.
Opening the enclosure Opening the enclosure
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Step_1 Remove the 4 screws in the back using a T8 Torx screwdriver.
Step_2 Remove the 2 screws on top using a T8 Torx screwdriver .
Step_3 On both sides of the unit, insert a flat-head screwdriver in the cavity shown, and slightly s lide
the cover to the back to release it.
Step_4 Apply pressure on the cover with your hands to release it from the casing.
Step_5 Make sure the EMI shield brackets are in their appropriate position. They should not fall in the
chassis.
Adjusting the PCIe add-in card space length to three-quarter lengthAdjusting the PCIe add-in card space length to three-quarter length
The maximum form factor of the optional PCIe add-in card is full-height, three-quarter length (FH3/4L). T8 and T10 Torx screwdrivers, cutting pliers and a tie wrap are
required.
NOTE: NOTE: The unit's default configuration is set for a full-height, half-length ( FHHL ) PCIe add-in card. If your PCIe add-in card is FHHL , skip to Connecting the PCIe add-in card .
Adjusting the PCIe add-in card rear mounting bracketAdjusting the PCIe add-in card rear mounting bracket
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Step_1 Cut the tie wrap holding the power cable. Be careful not to cut one of the wires.
Step_2 Remove the PCIe rear mounting bracket from the enclosure by removing the screw with a
T8 Torx screwdriver.
Step_3 Move the PCIe rear mounting bracket to the desired position and fasten the screw with a T8
Torx screwdriver .
Step_4 Reattach the power cable using a tie wrap as shown in the picture.
Connecting the PCIe add-in cardConnecting the PCIe add-in card
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Step_1 Disconnect the PCIe riser by removing the 2 screws with a T8 Torx screwdriver.
Step_2 Install the PCIe add-in card onto the PCIe riser.
Mount the front plate adapter onto the PCIe add-in card's L-bracket.
Fasten the front plate adapter screw to the L-bracket using a T10 Torx screwdriver (6 lbf·in
torque).
Step_3 Remove the 2 mounting screws from the rear mounting bracket using a T8 Torx screwdriver.
Carefully insert the PCIe add-in card assembly into the unit by fastening the following 6 screws:
2 T8 Torx screws for the riser card onto the server motherboard (4 lbf·in torque)
2 T8 Torx screws for the PCIe add-in card into the rear mounting bracket (4 lbf·in torque)
2 T10 Torx captive screws into the front plate (6 lbf·in torque)
Installing a thermal probe for the PCIe add-in cardInstalling a thermal probe for the PCIe add-in card
Locating the thermal probe connectionLocating the thermal probe connection
Installing the thermal probeInstalling the thermal probe
Relevant sections:Relevant sections:
Managing customer added sensors
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Platform cooling and thermal management
Monitoring sensors
Step_1 Install the thermal probe in the connector as prescribed in the thermal probe specifications.
Step_2 Affix the NTC thermistor to the PCIe card.
Typically, thermistors are installed between the fins of the PCIe card heatsink. Do not forget to use glue that can withstand the temperature.
NOTE: NOTE: Configuration will be performed once the platform is operational (thresholds, specific software configurations, etc.).
Closing the enclosureClosing the enclosure
Step_1 Align the cover lock mechanisms with the cutouts on the chassis
and slide it toward the front to fasten it into place.
Step_2 Insert the 4 T8 Torx screws in the back and the 2 T8 Torx screws
on top without turning them, making sure the holes on the cover
and the holes on the chassis are properly aligned.
NOTE: NOTE: Tightening screws into unaligned holes will damage the
threads.
Step_3 Tighten the 6 screws using a T8 Torx screwdriver to lock the cover
in place.
Racking the platformRacking the platform
The airflow of the platform goes from right to left, facing front. Ensure there is no physical obstruction that would hinder proper airflow when choosing a location for the
platform in the rack.
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Step_1 Choose a location for the platform in the rack.
Step_2 Insert the platform in the rack.
Step_3 Fasten the platform to the rack using the appropriate fasteners.
Step_4 If a ground lug is installed, remove the 2 nuts and washers from the ground lug studs. Take out the ground lug.
Step_5 Strip 19 mm (0.75 in) of the 8 AWG ground cable.
Step_6 Insert the 8 AWG ground cable in the ground lug. Crimp the lug on the cable using an appropriate hand crimp tool
(e.g. Panduit CT-1700 crimp tool set at: Color Code = Red; Die Index No. = P21).
Step_7 Install the ground lug on the studs, fastening with the 2 nuts and washers.
NOTE: NOTE: The thread of the two chassis ground lugs is M5x0.8.
> You are now ready to connect the network and power cables and start platform configuration.> You are now ready to connect the network and power cables and start platform configuration.
Connecting the network cablesConnecting the network cables
Connect the network cables according to the image below:
1. Connect one RJ45 cable to port 3 for the management plane.
2. Connect one SFP or SFP+ cable to port 1 for the data plane.
Building and connecting the power cablesBuilding and connecting the power cables
Installation of this product must be performed in accordance with national wiring codes and conform to local regulations.
Material requiredMaterial required
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Kontron suggests using crimp lugs (ring or spade crimp lug, straight, isolated, UL94V-0) on the power cables. Connect the appropriate cable to the appropriate polarity.
Kontron suggests the following wire gauges for -48V DC and RTN: 14 AWG or 12 AWG.
DescriptionDescription QuantityQuantity Manufacturer P/NManufacturer P/N LinkLink
Crimp lugs:
Molex insulated spade crimp lugs for 14-16 wire gauge
Panduit insulated ring crimp lugs for 10-12 wire gauge
2 (or 4 for
redundancy)
19131-0023
or equivalent
Molex product catalog
Part details
EV10-6RB-Q
or equivalent
Panduit product catalog
Part drawing
Black stranded wire to build the power cable based on the length
required:
14 AWG insulation diameter max.: 4.40 mm [ 0.175 in] for Molex
crimp lugs
12 AWG insulation diameter max.: 5.8 mm [0.23 in] for Panduit
crimp lugs
Length required
Red stranded wire to build the power cable based on the length
required:
14 AWG insulation diameter max.: 4.40 mm [ 0.175 in] for Molex
crimp lug
12 AWG insulation diameter max.: 5.8 mm [0.23 in] for Panduit
crimp lug
Length required
Hand crimp tool:
Molex Premium Grade Hand Crimp Tool
Panduit Hand Crimp Tool
1 640010100
or equivalent
Molex product catalog
Application tooling specification sheet
CT-460
or equivalent
Panduit product catalog
Application tooling specification sheet
ProcedureProcedure
Step_1 Strip 6 mm [0.236 in] from the end of a black stranded 14 AWG wire (for Molex crimp lug 19131-0023) or 8 mm [0.315 in] from the end of a black stranded 12
AWG wire (for Panduit crimp lug EV10-6RB-Q).
Step_2 Strip 6 mm [0.236 in] from the end of a red stranded 14 AWG wire (for Molex crimp lug 19131-0023) or 8 mm [0.315 in] from the end of a red stranded 12 AWG
wire (for Panduit crimp lug EV10-6RB-Q).
Step_3 Insert each wire in a crimp lug. Follow the crimp lug manufacturer's procedure, using the appropriate hand crimp tool as specified in the Application tooling
specification sheet of the tool.
Step_4 Bend the crimp lugs to a 45° angle as shown in the image.
Step_5 Remove the screw from the terminal block RTN "B" location.
Step_6 Insert the crimped red wire in the RTN "B" location as shown in the image.
Step_7 Screw the crimp lug in place.
Step_8 Remove the screw from the terminal block -48V DC "B" location.
Step_9 Insert the crimped black wire in the -48V DC "B" location as shown in the image.
Step_10 Screw the crimp lug in place.
Step_11 (Optional) If redundancy is required, repeat steps 1 to 10 for a second set of cables. They are to be installed in
the -48V DC and RTN "A" locations.
Step_12 Put the plastic terminal cover back in place once all the cables are screwed in place.
NOTE: NOTE: The power supply is reverse polarity protected. The unit will power on as soon as external power is
applied (green power LED).
If the ambient temperature is below 10°C below 10°C and no sensor has exceeded its temperature thresholds, the fans will be on standby (not running and making no
sound). Above that 10°C boundary 10°C boundary , the fans will spin at 8% of their maximum capacity.
Refer to Platform cooling and thermal management for more information about fan behavior over the entire operating temperature range.
> You are now ready to start platform configuration.> You are now ready to start platform configuration.
Confirming network links are establishedConfirming network links are established
Once the ME1100 power LED is green ON green ON (normal blink or ON), confirm LAN connection with the management plane and data plane:
The right LED on Port 3 (management) should be green ONgreen ON
The LED on SFP or SFP+ Port 1 should be green ONgreen ON
Refer to Platform components for more information about LED location and behavior.
If LED behavior is not as expected, refer to your IT personnel to review upstream network status (the top-of-rack switch port might be disabled).
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