Kontron ME1100 User manual


USER GUIDE
ME1100
Doc. Rev. 1.3

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
ME1100 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this manual may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the manual or any product characteristics set
out in the manual. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no
license or title under any patent, copyright or mask work rights to these products and makes no representations or
warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this manual are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this manual only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this manual is constantly
being updated in line with the technical alterations and improvements made by Kontron to the products and thus this
manual only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2016 by Kontron S&T AG
Kontron S&T Ag
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Revision History
Revision
Brief Description of Changes
Date of Issue
1.0
Preliminary release
2017-May-02
1.1
Production release
2018-Oct-31
1.2
DC PSU information added
2018-Nov-26
1.3
New information about BIOS updates in section 7
2019-Feb-25
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
Kontron, a trusted technology innovator and global solutions provider, uses its embedded market strengths to deliver
a service portfolio that helps companies break the barriers of traditional product lifecycles. Through provenproduct
expertise and collaborative, expert support, Kontron provides unparalleled peace of mind when it comes to building
and maintaining successful products.
including enhanced repair services, an extended warranty, and the
Kontron training academy visit www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this guide, discover an error, or just want to provide some feedback, please contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soonas possible and post the
revised user guide on our website.
Thank you.

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Symbols
The following symbols may be used in this manual
DANGER indicates a hazardous situation which, if not avoided, will result in death or serious
injury.
WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
CAUTION indicates a hazardous situation which, if not avoided, may result in minor or
moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger life/health and/or result in damage to material.
Please also refer to the "High-Voltage Safety Instructions" portion below in this section.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
This symbol indicates general information about the product and the user manual.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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Table of Contents
Symbols................................................................................................................................................................................................................ 4
Table of Contents...............................................................................................................................................................................................5
List of Tables........................................................................................................................................................................................................6
List of Figures......................................................................................................................................................................................................6
List of Acronyms.................................................................................................................................................................................................7
Electrostatic Discharge................................................................................................................................................................................... 8
Limited Warranty............................................................................................................................................................................................... 8
ME1100 Safety and Regulatory Information................................................................................................................................9
General Safety Warnings and Cautions................................................................................................................................................9
General Power Safety Warnings and Cautions.................................................................................................................................9
1.2.1. Elevated Operating Ambient Temperature......................................................................................................................................9
1.2.2. Reduced Air Flow.....................................................................................................................................................................................9
1.2.3. Mechanical Loading................................................................................................................................................................................9
1.2.4. Circuit Overloading................................................................................................................................................................................10
1.2.5. DC Power Supply Safety......................................................................................................................................................................10
1.2.6. Reliable Earth-Grounding...................................................................................................................................................................10
1.2.7. Regulatory Specifications....................................................................................................................................................................11
1.2.8. CE Mark......................................................................................................................................................................................................11
1.2.9. Waste Electrical and Electronic Equipment Directive................................................................................................................11
Shipping Box Contents......................................................................................................................................................................12
Recommended Optional Components...............................................................................................................................................12
Product Description...........................................................................................................................................................................13
Product Overview......................................................................................................................................................................................13
Block Diagram............................................................................................................................................................................................13
Serial Port Component Access.............................................................................................................................................................14
Physical Dimensions...............................................................................................................................................................................14
Environmental Specifications ..............................................................................................................................................................15
Feature Summary.....................................................................................................................................................................................16
Server Components.................................................................................................................................................................................18
3.7.1. Front Panel...............................................................................................................................................................................................18
3.7.2. Serial Port Connector Pinout.............................................................................................................................................................18
3.7.3. LED and Button Behavior....................................................................................................................................................................19
3.7.4. Fans and Filter .......................................................................................................................................................................................21
3.7.4.1. Cooling and Thermal Management.............................................................................................................................................22
3.7.5. Power Supply Unit................................................................................................................................................................................23
3.7.5.1. DC Power Supply Mating Cable Preparation............................................................................................................................23
3.7.6. PCIe Add-in Card...................................................................................................................................................................................25
3.7.7. Optional 2.5-in SSD..............................................................................................................................................................................28
Typical Power Consumption................................................................................................................................................................30
BMC Access...............................................................................................................................................................................................30
PCI Mapping..............................................................................................................................................................................................31
MAC Addresses.......................................................................................................................................................................................32
Interfaces.................................................................................................................................................................................................33
Description of Interface Access Methods.................................................................................................................................36
Paths to the Operating System Prompt ...........................................................................................................................................36
Paths to the ME1100 embedded IPMITOOL shell.......................................................................................................................... 37
Getting Started...................................................................................................................................................................................38

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Connect the Power Supply....................................................................................................................................................................38
5.1.1. DC Power Supply....................................................................................................................................................................................38
Establish a Serial Console Connection.............................................................................................................................................38
Log In to the BMC/FRU0 of the ME1100 ...........................................................................................................................................39
Configure and Set the IP Address of BMC/FRU0 (Static or DHCP)..........................................................................................40
Enable Remote Management Usingthe IPMI Protocol...............................................................................................................40
Verify BMC/FRU0 Network Configuration........................................................................................................................................41
Optional Configurations, Monitoring and Operation .............................................................................................................42
CPU Power ON, PowerOFF and Reset...............................................................................................................................................42
Chassis ID Led Control...........................................................................................................................................................................43
Boot Order..................................................................................................................................................................................................43
OS Installation..........................................................................................................................................................................................44
Disable Remote Management Using the IPMI Protocol..............................................................................................................45
Disable a BMC LAN Interface...............................................................................................................................................................45
Performing Updates.........................................................................................................................................................................46
Update the Firmware..............................................................................................................................................................................46
Appendix A: Sensor List.................................................................................................................................................................................47
Appendix B: IPMI Command List.................................................................................................................................................................54
Appendix C: Additional Options to Configure IOL Interfaces.............................................................................................................59
Appendix D: User Application Providing Feedback to BMC ................................................................................................................61
.........................................................................................................................................70
List of Tables
Table 1: Safety compliance.............................................................................................................................................................................11
Table 2: Electromagnetic compatibility.....................................................................................................................................................11
Table 3: Chassis dimensions.........................................................................................................................................................................14
Table 4: Environmental tests and standards..........................................................................................................................................15
Table 5: Key hardware features ..................................................................................................................................................................16
Table 6: Key software features ...................................................................................................................................................................17
Table 7: ID and power LED behavior...........................................................................................................................................................19
Table 8: Status LED behavior.......................................................................................................................................................................20
Table 9: Reset button behavior...................................................................................................................................................................20
Table 10: Management LED behavior.......................................................................................................................................................20
Table 11: SFP+ LED behavior.........................................................................................................................................................................20
Table 12: Power supply rating.....................................................................................................................................................................23
Table 13: DC power supply inlet..................................................................................................................................................................23
Table 14: Mating terminals suggested for the DC power supply....................................................................................................23
Table 15: PCI mapping .....................................................................................................................................................................................31
Table 16: MAC addresses..............................................................................................................................................................................32
Table 17: Default IP addresses....................................................................................................................................................................33
Table 18: Default usernames and passwords.......................................................................................................................................35
Table 19: BMC sensor list..............................................................................................................................................................................47
Table 20: Detailed information for Kontron OEM Firmware Info.....................................................................................................51
Table 21: Supported and unsupported commands for FRU0............................................................................................................54
Table 22: Default IP addresses...................................................................................................................................................................60
List of Figures
Figure 1: Earth ground lug location.............................................................................................................................................................10
Figure 2: WEEE directive logo........................................................................................................................................................................11
Figure 3: ME1100 block diagram..................................................................................................................................................................13

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Figure 4: Serial port component access...................................................................................................................................................14
Figure 5: ME1100 front view..........................................................................................................................................................................18
Figure 6: Serial port pinout............................................................................................................................................................................18
Figure 7: Server LEDs and Button................................................................................................................................................................19
Figure 8: Hot-swappable fan tray ..............................................................................................................................................................21
Figure 9: Hot-swappable filter tray............................................................................................................................................................21
Figure 10: Temperature management......................................................................................................................................................22
Figure 11: DC Power Supply Cable Preparation and Connection......................................................................................................24
Figure 12: Rear mounting bracket position for a FH3/4L PCIe add-in card..................................................................................25
Figure 13: Rear mounting bracket position for a FHHL PCIe add-in card......................................................................................25
Figure 14: PCIe riser card and front plate adaptor assembly...........................................................................................................26
Figure 15: PCIe add-in card installation in ME1100............................................................................................................................... 27
Figure 16: Assembled PCIe card.................................................................................................................................................................. 27
Figure 17: 2.5-in SSD installation in a carrier bracket..........................................................................................................................28
Figure 18: SSD carrier bracket insertion...................................................................................................................................................29
Figure 19: SSD carrier bracket attachment.............................................................................................................................................29
Figure 20: Default IP addresses in an ME1100 server .........................................................................................................................33
Figure 21: Diagram of interface paths with a serial console connection......................................................................................34
Figure 22: Diagram of interface paths with a management networking connection ..............................................................35
Figure 23: Default IP addresses in a ME1100 server............................................................................................................................60
List of Acronyms
ACPI
Advanced Configuration & Power
Interface
BMC
Baseboard Management Controller
CLI
Command-Line Interface
DHCP
Dynamic Host Configuration Protocol
EMC
Electromagnetic Compatibility
ETSI
European Telecommunications
Standards Institute
FH3/4L
Full-height, three-quarter length
FHHL
Full-height, half length
FRU
Field Replaceable Unit
IOL
IPMI Over-LAN
IPMI
Intelligent Platform Management
Interface
KCS
Keyboard Controller Style
LPC
Low Pin Count
MAT
Maximum Ambient Temperature
MEC
Mobile Edge Computing
NCSI
Network Communications Services
Interface
PCH
Platform Controller Hub
PCIe
PCI-Express
PECI
Platform Environment Control Interface
PXE
Preboot eXecution Environment
RAN
Radio Access Network
RDP
Remote Desktop
SEL
System Event Log
SFP+
Small Form-factor Pluggable that
supports data rates up to 10.0 Gbps
SOC
System on a Chip
SOL
Serial Over LAN
SSH
Secure Shell
WEEE
Waste Electrical and Electronic
Equipment

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Electrostatic Discharge
ESD Sensitive Device!
ME1100 Mobile Edge servers are sensitive to electrostatic discharge (ESD). Users must take
the appropriate precautions when handling ESD-sensitive devices.
Limited Warranty
Please refer to the full terms and
https://www.kontron.com/support-and-services/rma/canada/standard_warranty_policy_canada.pdf.

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ME1100 Safety and Regulatory Information
Before working with SYMKLOUD products or performing instructions described in this guide
or other SYMKLOUD guides, read the safety and warning information in this section.
Assembly instructions in this guide must be followed to ensure and maintain compliance
with existing product certifications and approvals. Use only the described, regulated
components specified in this guide. Use of other products/components will void the CSA
certification and other regulatory approvals of the product and will most likely result in
non-compliance with product regulations in the region(s) in which the product is sold.
General Safety Warnings and Cautions
To prevent a fire or shock hazard, do not expose this product to rain or moisture. The chassis
should not be exposed to dripping or splashing liquids and no objects filled with liquids
should be placed on the chassis cover.
General Power Safety Warnings and Cautions
This product usually has more than one power supply cord. Disconnect all power supply
cords before servicing to avoid electric shock.
Installation of this product must be performed in accordance with national wiring codes and
conform to local regulations.
1.2.1. Elevated Operating Ambient Temperature
If this product is installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack
environment may be greater than the ambient temperature of the room. Therefore, be careful to install the product in
an environment that is compatible with the maximum ambient temperature specified by the manufacturer
(MAT =65oC).
1.2.2. Reduced Air Flow
Do not compromise onthe amount of air flow required for safe operation wheninstalling this product in a rack (see
side clearances in Section 3.3).
1.2.3. Mechanical Loading
Do not load the equipment unevenly when mounting this product in a rack as it may create hazardous conditions.

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1.2.4. Circuit Overloading
Do not overload the circuits when connecting this product to the supply circuit as this canadversely affect
overcurrent protection and supply wiring. Check the supply equipment nameplate ratings for correct use.
1.2.5. DC Power Supply Safety
ME1100 servers equipped with a DC power supply must be installed in a restricted access area. When powered by DC
current, this equipment must be protected by a listed branch circuit protector with a maximum 20 A rating. The DC
source must be electrically isolated from any hazardous AC source by double or reinforced insulation.
The DC power supply is protected from reverse polarity by internal diodes and will not
operate at all if wired incorrectly.
This equipment is designed for the earth grounded conductor (return) in the DC supply
circuit to be connected to the earth grounding conductor on the equipment (ground lug).
All of the following conditions must be met:
1. This equipment shall be connected directly to the d.c. supply system earthing electrode conductor or to a
bonding jumper from an earthing terminal bar or bus to which the d.c. supply system earthingelectrode
conductor is connected.
2. This equipment shall be located in the same immediate area (such as adjacent cabinets) as any other equipment
that has a connection between the earthed conductor of the same d.c. supply circuit and the earthing conductor,
and also the point of earthing of the d.c. system. The d.c. system shall not be earthed elsewhere.
3. The d.c. supply source shall be located within the same premises as this equipment.
4. Switching or disconnecting devices shall not be in the earthed circuit conductor betweenthe d.c. source and the
point of the connection of the earthing electrode conductor.
1.2.6. Reliable Earth-Grounding
Always maintain reliable grounding of rack-mounted equipment.
Figure 1: Earth ground lug location

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1.2.7. Regulatory Specifications
The ME1100 server meets the requirements of the following regulatory tests and standards:
Table 1: Safety compliance
USA/Canada
This product is marked cCSAus
Europe
This product complies with the Low Voltage Directive, 2014/35/EU and
EN 60590-1
International
This product has a CB report and certificate to IEC 60950-1
Table 2: Electromagnetic compatibility
USA/Canada
This product meets FCC Part 15/ICES-003 Class A. It is designed to meet
GR-1089 and GR-63.
Europe
This product complies with the Electromagnetic Compatibility Directive
2014/30/EU and EN 300 386. The GPS version complies with Radio
Equipment Directive 2014/53/EU, EN 301 489-1 and EN 303 413.
International
This product complies with CISPR 32 Class A and CISPR 24.
1.2.8. CE Mark
The CE marking on this product indicates that it is in compliance with the applicable European Union Directives: Low
Voltage, EMC, Radio Equipment and RoHS requirements.
1.2.9. Waste Electrical and Electronic Equipment Directive
This product contains electrical or electronicmaterials. If not disposed of properly, these materials may have
potential adverse effects on the environment and human health. The presence of this logoon the product means it
should not be disposed of as unsorted waste and must be collected separately.
Dispose of this product according to the appropriate local rules, regulations and laws.
Figure 2: WEEE directive logo

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Shipping Box Contents
Server
One-page document with a QR code referring
to online documentation
Kontron products have a QR code. This code provides the following information: serial number, part number, batch ID,
and MAC address.
Recommended Optional Components
RJ45 to DB9 serial adaptor
Kontron part number: 1015-9404
Note: The serial console port is compatible
with Cisco 72-3383-01
Refer to Section 5/ for basic initial system connection.

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Product Description
Product Overview
ME1100 is a 1U rackmount, short depth (300mm), Xeon D-1500 server withtwo 10GbE SFP+ network interfaces,
optional SATA storage and a PCIe extension slot. The ME1100 server is designed for Telco Edge virtual infrastructures
and could be used with Kubernetes Kontron platforms.
The ME1100 is targeted for high-performance servers used in mobile edge computing (MEC) applications like Radio
Access Network (RAN), Artificial Intelligence or Data Caching.
An operating system must be loaded on the CPU engine for the system to be operational.
Kontron products have a QR code. This code will provide the following information: serial
number, part number, batch ID, and base MAC address.
To obtain the latest document version or to consult other SYMKLOUD documents, visit the
SYMKLOUD portal at Symkloud.com.
Block Diagram
Figure 3: ME1100 block diagram

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Serial Port Component Access
When connecting to the serial interface, a multiplexing functionality (see Section 3.12) can establish a link with one of
the following components:
Baseboard Management Controller (BMC)
Server (CPU)
Figure 4: Serial port component access
Physical Dimensions
Table 3: Chassis dimensions
Chassis
Measurements (mm [in])
Notes
Depth
300 mm [11.811 in]
Body
Width
Standard 482.6 mm [19 in] rack
(including ear brackets)
Body
Height
43.5 mm [1.713 in, 1U] MAX
Body
Front
clearance
100 mm [4 in]
Recommended
Side
clearance
70 mm [ 2.756 in]
Recommended
Rear
clearance
None
Weight
5,5 kg
Configuration:
2x UDIMM memory and 1x M.2
SSD, 4x 2.5in SSD, no PCIe card
(packaging included)

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Environmental Specifications
Table 4: Environmental tests and standards
Environment
Specification
Temperature, operating
0ºC to 65ºC (32ºF to 149ºF)
The failure of one fan will not impact operation for at least 4 hours at 65 .
Certain limitations may apply. These limitations could be the result of the
operating temperature range of installed configurable components (e.g., SFP+
module, SSD and PCIe card). Kontron recommends using SFP+ and SSD modules
with an industrial operating temperature range. Another limitation can result from
airflow obstruction caused by fan filter clogging and failure to follow
recommended side clearances.
Temperature, non-operating
-40ºC to 70ºC (-40ºF to 158ºF)
Humidity, operating
This product is designed to meet a test profile based on Telcordia GR-63, ETSI EN
300 019-2-3 class 3.1E, 5% to 93% non-condensing at 40ºC.
Humidity, non-operating
(Transportation)
This product is designed to meet a test profile based on ETSI EN 300 019-2-2 class
2.3, to 93% (long term), 90% to100% (short term) at 40 ºC.
Humidity, non-operating
(storage)
This product is designed to meet a test profile based on ETSI EN 300 019-2-1 class
1.2, to 93% (long term), condensing to 100% (short term) at 30 ºC.
Altitude/pressure, operating
-60 m to 1,800 m altitude without temperature de-rating
Up to 4,000 m altitude with temperature de-rating of 1 degree Celsius per 300 m
above 1,800 m
Altitude/pressure, non-
operating
Up to 4,570 m
Vibration, operating
This product meets operational swept sine vibration
Test profile based on GR-63 clause 5.4.2, and ETSI EN 300 019-2-3 class 3.2
5 Hz to 200 Hz at 0.2 g
This product meets operational random vibration
Test profile based on ETSI EN 300 019-2-3 class 3.2
5 Hz to 10 Hz at +12 dB/octave (slope up)
10 Hz to 50 Hz at 0.02 m2/s3 (0.0002 g2/Hz) (flat)
50 Hz to 100 Hz at -12 dB/octave (slope down)
30 minutes for each of the three axes
Vibration, non-operating
This product meets transportationand storage swept sine vibration
Test profile based on ETSI EN 300 019-2-1 class 1.2
5 Hz to 200 Hz at 0.2 g
This product meets transportationand storage random vibration
Test profile based on GR-63 clause 5.4.3, and ETSI EN 300 019-2-2 class 2.3
5 Hz to 20 Hz at 1 m2/s3 (0.01 g2/Hz) (flat)
20 Hz to 200 Hz at -3 dB/octave (slope down)
30 minutes for each of the three axes
Shock, operating
This product meets operational shock standards
Test profile based on ETSI EN 300 019-2-3 class 3.2
11 ms half sine, 3 g, three shocks in each direction
Shock, non-operating
This product meets transportationand storage half sine shock
Test profile based on ETSI EN 300 019-2-2 class 3.2
6 ms half sine, 18 g, 100 shocks in each direction
Drop/free fall
This product meets Bellcore GR-63 section 5.3
Packaged = 1,000 mm, six surfaces, three edges and four corners
Unpackaged = 100 mm, two sides and two bottom corners

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Environment
Specification
Electrostatic discharge
This product meets 8 kV contact, 15 kV air discharge using IEC 61000-4-2 Test
Method
RoHS
This product is designed to meet China RoHS Phase 1 (self-declaration and
labeling)
This product complies with EU directive 2002/96/EC (WEEE)
This product complies with RoHS directive 2011/65/EU
Feature Summary
Table 5: Key hardware features
Feature
Description
Hardware platform
High-performance server for mobile edge computing (MEC)
1U height, 300mm deep, 19 inches wide
Hot-swappable fan tray and filter
Front access only (motherboard I/O, PSU, PCIe card I/O, fan tray)
I/O
Two 10GbE SFP+
One USB 2.0
One RJ45 10/100/1000Base-T management port
One RJ45 serial port
One reset button
PCIe add-in card
One optional FH/HL or FH/¾L PCIe x16 card supported (power and
thermal restrictions may apply)
The maximum power consumption supported is 50 W
Refer to the Hardware Compatibility List available on
Symkloud.com
CPU
Intel® Xeon® D-1500 family processors are supported, including
(but not limited to) the following processors:
Xeon D-1548, 8 Cores @ 2.00GHz, 45W
Xeon D-1567, 12 Cores @ 2.10GHz, 65W
Xeon D-1559, 12 Cores @ 1.50GHz, 45W
SSD
One M.2 SSD option:
Refer to the Hardware Compatibility List available on
Symkloud.com
Four 2.5-in SSD option:
Refer to the Hardware Compatibility List available on
Symkloud.com
Memory
DDR4 DIMM with ECC
Bandwidth up to 2400 MT/s
Two memory channels
One DIMM socket per channel
Refer to the Hardware Compatibility List available on
Symkloud.com
Power supplies
PSU: One -57 VDC to -40 VDC dual input feed

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Feature
Description
Fans
Hot-swappable fan tray:
Fan tray contains 3 fans (standard configuration)
Fan tray contains 4 fans when 2.5-in SSD option is
installed
Fan filter can be removed independently from the fan tray
Fan speed control
Support
Product life cycle support for 3 to 5 years
Table 6: Key software features
Feature
Description
Server management
Integrated BMC this subsystem consists of communication buses,
sensors, system BIOS, and server management firmware; itsupports
standard IPMI features as well as OEM (supplemental) features that
are not part of IPMI
IPMI-based system monitor used for servermonitoring, diagnostic
and configuration
System event log
Server power consumption monitoring
Server power control
Server and component health monitoring
Fan speed monitoring
Serial Over LAN console access
IPMI Over LAN
Sensor data record describing all sensors and providing their readings
(analog or discrete)
ACPI state synchronization: the BMC tracks ACPI state changes that
are provided by the BIOS
BIOS recovery
Operating system
Refer to the Hardware Compatibility List available on Symkloud.com
Thermal management
Platform Environment Control Interface (PECI) for thermal
management support
Memory and CPU thermal management

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Server Components
3.7.1. Front Panel
Figure 5: ME1100 front view
3.7.2. Serial Port Connector Pinout
Figure 6: Serial port pinout

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3.7.3. LED and Button Behavior
Figure 7: Server LEDs and Button
Table 7: ID and power LED behavior
State
ID1(blue)
Power (green)
Both power inputs DOWN or out of range for normal operation
OFF
OFF
One or both power inputs UP ACPI S5 state
ON
OFF
Powering up ACPI S0 state
OFF
Rapid Blink (2 Hz)
BIOS started POST
OFF
Normal Blink (1 Hz)
BIOS hand over to OS boot loader
OFF
Normal Blink (1 Hz)
or ON2
Application started/running OK
OFF
ON2
1The ID LED can be made to blink at any time if a (manual) request is sent to the BMC (refer to Section 6.2).
2A BIOS optional setting can opt to set the Power LED steady ONafter POST (before starting the OS/application), but
the default BIOS setting is to leave that task to the application.

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Table 8: Status LED behavior
State
Status (amber/red)
No active error notification (normal operation)
OFF
Major alarm active
Amber ON
Critical alarm active (service/maintenance is required)
Red ON
Table 9: Reset button behavior
State
Behavior
Reset button pressed
CPU resets (does not affect the Management Controller)
Table 10: Management LED behavior
State
Management link
(left green/yellow)
Management activity
(right green)
No link
OFF
OFF
1000Base-T link established
Green ON
ON (no activity)
Blinking (activity)
10/100Base-TX link established
Yellow ON
ON (no activity)
Blinking (activity)
Table 11: SFP+ LED behavior
State
SFP+ (green)
Link established, no activity
ON (Speed 10/1 Gbps)
Activity
Blinking (Speed 10/1 Gbps)
No link
OFF