Kontron SYMKLOUD MS2900 User manual

» User’s Guide «
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Kontron SYMKLOUD MS2900 Platform
Document revision 1.5

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User’s Guide
» Table of Contents «
1User Information ..............................................................................................................................5
1.1 Kontron User Documentation .................................................................................................................................. 5
1.2 Copyright Notice ...................................................................................................................................................... 5
1.3 Quality Standards..................................................................................................................................................... 5
1.4 Warranty................................................................................................................................................................... 5
1.5 Technical Support .................................................................................................................................................... 5
2About this Guide ...............................................................................................................................6
3SYMKLOUD MS2900 Safety Information ...........................................................................................7
3.1 General Safety Warnings and Cautions.................................................................................................................... 7
3.2 General Power Safety Warnings and Cautions......................................................................................................... 7
3.3 DC Power Supply Safety............................................................................................................................................ 8
3.4 Rack Installation Safety........................................................................................................................................... 8
3.4.1 Elevated Operating Ambient Temperature ..................................................................................................... 9
3.4.2 Reduced Air Flow............................................................................................................................................. 9
3.4.3 Mechanical Loading ........................................................................................................................................ 9
3.4.4 Circuit Overloading ......................................................................................................................................... 9
3.4.5 Reliable Earth-Grounding............................................................................................................................... 9
4The SYMKLOUD MS2900 Platform ...................................................................................................10
4.1 Feature Summary ................................................................................................................................................... 11
4.2 Block Diagram ........................................................................................................................................................ 12
4.3 System Components............................................................................................................................................... 12
4.3.1 Chassis Front Panel ....................................................................................................................................... 12
4.3.1 MS2900 Hot-Swappable Components .......................................................................................................... 14
4.3.2 System Control Panel .................................................................................................................................... 14
4.3.3 MSH8900 Hub Modules................................................................................................................................. 16
4.3.4 System Fans................................................................................................................................................... 17
4.3.5 Chassis Rear Panel ........................................................................................................................................ 18
4.3.6 Processor Nodes............................................................................................................................................ 19
4.3.7 Uplink/Stacking Module ............................................................................................................................... 20
4.3.8 Power Supply Units ....................................................................................................................................... 21
4.4 Supported Operating Systems ............................................................................................................................... 25
4.5 Mechanical Specifications ..................................................................................................................................... 25
4.5.1 Physical Dimensions ..................................................................................................................................... 25
4.5.2 Shipping Weights.......................................................................................................................................... 26
4.5.3 Rack Mounting Equipment............................................................................................................................ 27
4.5.4 Environmental Specifications....................................................................................................................... 28

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4.5.5 Regulatory Specifications............................................................................................................................. 29
4.5.6 CE Mark.......................................................................................................................................................... 29
4.5.7 Waste Electrical and Electronic Equipment Directive (WEEE Directive) ...................................................... 29
5Platform Management ....................................................................................................................30
5.1 System Manager & System Monitor ....................................................................................................................... 30
5.1.1 Platform Health Monitoring ......................................................................................................................... 31
5.2 Management Subsystems ...................................................................................................................................... 31
5.2.1 Platform Management .................................................................................................................................. 31
5.2.2 Cooling and Thermal Management ............................................................................................................... 32
5.2.3 Power............................................................................................................................................................. 34
5.3 Buttons, Connectors and LEDs............................................................................................................................... 35
5.3.1 LED Indicators............................................................................................................................................... 35
5.3.2 Cable Connections......................................................................................................................................... 39

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» Table of Figures «
Figure 1: Earth Ground Lug Location .................................................................................................................................... 7
Figure 2: DC Power Supply Connector Polarity...................................................................................................................... 8
Figure 3: Integrated Software and Hardware Components ................................................................................................ 10
Figure 4: MS2900 System Block Diagram ............................................................................................................................ 12
Figure 5: Front View ............................................................................................................................................................. 13
Figure 6: System Control Panel ........................................................................................................................................... 14
Figure 7: Hot-Swappable hub module................................................................................................................................. 16
Figure 8: Hot-Swappable System Fan Module..................................................................................................................... 17
Figure 9: Rear View .............................................................................................................................................................. 18
Figure 10: Hot-Swappable Processor Nodes ....................................................................................................................... 19
Figure 11: Hot-Swappable Uplink Module .......................................................................................................................... 20
Figure 12: Hot-Swappable Power Supplies ......................................................................................................................... 21
Figure 13: Attaching Slide Rails for Rear Mounting............................................................................................................ 27
Figure 14: Main Page Overview............................................................................................................................................ 30
Figure 15: Air Path Through the System.............................................................................................................................. 33
Figure 16: Front and Rear Panel LEDs ................................................................................................................................. 35
Figure 17: Rear Uplink Ports................................................................................................................................................ 39
Figure 18: RJ-45 to DB-9 Console Adapter ......................................................................................................................... 39

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1User Information
1.1 Kontron User Documentation
This document provides information about products from Kontron and/or its subsidiaries. No warranty of suitability, purpose, or
fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the
information contained within is supplied “as-is” and it is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third
parties are concerned.
1.2 Copyright Notice
Copyright © 2016 Kontron America Inc.
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission from Kontron.
1.3 Quality Standards
Kontron is certified to ISO 9000 Quality Standards.
1.4 Warranty
This Kontron product is warranted against defects in material and workmanship for the warranty period from the date of
shipment. During the warranty period, Kontron will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or
maintenance.
Kontron will not be responsible for any defects or damages to other products not supplied by Kontron that are caused by a faulty
Kontron product.
1.5 Technical Support
Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed to making
our product easy to use and will help you use our products in your solutions.
Please consult our web site (www.kontron.com) for the latest product documentation, utilities, drivers, and support contacts.

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2About this Guide
The Kontron SYMKLOUD MS2900 Platform User’s Guide is the central manual in the MS2900 documentation set. It covers all
the features of the platform and provides links and references to other documents in the set for more detailed information about
all the system components.
The topics covered in this User’s Guide are:
»Safety information
»Feature summary and block diagram
»Component overview
»Physical specifications
»Environmental and regulatory specifications
»System management –thermal, power, cables and connectors
For more detailed information on these topics or additional features of the MS2900 platform, see all the available
documentation and drivers on the Kontron web site http://www.kontron.com/

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3SYMKLOUD MS2900 Safety Information
Caution! The SYMKLOUD MS2900 Platform is ESD sensitive equipment. Users must observe precautions for handling
electrostatic discharge sensitive devices. Also review the following safety instructions before you handle the equipment.
WARNING : Although you may be using this guide or another resource as a reference, before working with SYMKLOUD products,
pay close attention to the safety information in this section. Assembly instructions in this guide must be followed to ensure and
maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified
in this guide. Use of other products/components will void the CSA certification and other regulatory approvals of the product and
will most likely result in non-compliance with product regulations in the region(s) in which the product is sold.
Read all caution and warning statements in this section before performing any of the instructions elsewhere in this guide or other
SYMKLOUD MS2900 platform documentation.
3.1 General Safety Warnings and Cautions
WARNING: To prevent a fire or shock hazard, do not expose this product to rain or moisture. The chassis should not be exposed to
dripping or splashing liquids and no objects filled with liquids should be placed on the chassis cover.
CAUTION: The MS2900 switch and the processor nodes inside the MS2900 system contain CR2032-type lithium batteries. There
is a risk of explosion if the batteries are replaced by an incorrect type.
Dispose of used batteries according to the battery manufacturer’s instructions.
3.2 General Power Safety Warnings and Cautions
NOTE: This equipment operates over the marked voltage and frequency range without requiring manual setting of any selector
switches.
WARNING: The power button on the system does not turn off system power. To remove power from the system, you must unplug
each power cord from the wall outlet or the power supply.
CAUTION: This unit usually has more than one power supply cord. Disconnect all power supply cords before servicing to avoid
electric shock.
CAUTION: Equipment must be connected to protective earth ground with a minimum 6 AWG cable using the supplied double lug
terminal.
Figure 1: Earth Ground Lug Location
CAUTION: Installation of this product must be in accordance with national wiring codes and conform to local regulations. Different
types of line cord sets may be used for connections to the mains supply circuit and must comply with the electrical code
requirements of the country of use.
CAUTION: The AC power supply plug is intended to serve as a power disconnect device. The socket outlet must be installed near
the equipment and must be easily accessible.

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3.3 DC Power Supply Safety
WARNING: An MS2900 platform equipped with DC power must be installed in a restricted access area. This equipment when
powered by DC current must be protected by a listed branch circuit protector with a maximum 50 A rating. The DC source must be
electrically isolated from any hazardous AC source by double or reinforced insulation.
WARNING: The DC power supply does not have polarity markings. Use the supplied DC power mating connector with a wire and
polarities as shown in Figure 2
Figure 2: DC Power Supply Connector Polarity
Pin (Input)
Name
Description
1
Vin+
Input positive
2
Vin-
Input negative
3
PE
Ground
Use 8 AWG wires at a minimum for connection to the DC power source
NOTE: the DC power supply is reverse polarity protected by internal diodes and will not operate at all if wired incorrectly.
WARNING: This equipment is designed to permit connecting the earth grounded conductor on the DC supply circuit to the earth
grounding conductor on the equipment (MS2900 DC-equipped version only).
To make this connection, all of the following conditions must be met:
1. This equipment must be connected either directly to the DC supply system grounding electrode conductor or to a
bonding jumper from a grounding terminal bar or bus to which the DC supply system earth grounding electrode is
connected.
2. This equipment must be located in the same immediate area (such as adjacent cabinets) as any other equipment that
has a connection between:
a. the same DC supply circuit’s earth-grounded conductor and the earth-grounding conductor, and also
b. at the point of grounding for the DC system. The DC system cannot be grounded anywhere else.
3. The DC power supply source must be located within the same premises as the equipment.
4. The grounded circuit conductor between the DC source and the grounding electrode conductor’s point of contact
cannot be used for switching or disconnecting devices.
3.4 Rack Installation Safety
The following sections cover important guidelines and considerations for safely installing this equipment in a cabinet or rack.

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3.4.1 Elevated Operating Ambient Temperature
If this equipment is installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack environment
may be greater than room ambient. Therefore, be careful to install the equipment in an environment that is compatible with the
maximum ambient temperature (TMA=55oC) specified by the manufacturer.
3.4.2 Reduced Air Flow
When installing this equipment in a rack, do not compromise the amount of air flow required for safe operation.
3.4.3 Mechanical Loading
When mounting this equipment in a rack, be careful not to create a hazardous condition by loading the equipment unevenly.
The system comes with rear mounting flanges already in place on both sides of the chassis. Rails that fit in these flanges also
come in the box
NOTE: Because the heaviest components in the chassis, i.e., the processor nodes and power supplies, are in the rear, using the
slide rails and L-brackets for rear mounting is strongly recommended. This method will provide the most stable and secure
cabinet/rack installation.
For information about installing the MS2900 system in a rack, see Section 4.5.3: Rack Mounting Equipment.
3.4.4 Circuit Overloading
When connecting this equipment to the supply circuit, be sure not to overload the circuits, as this can adversely affect overcurrent
protection and the supply wiring. Check the supply equipment nameplate ratings when addressing this concern.
3.4.5 Reliable Earth-Grounding
Always maintain reliable grounding of rack-mounted equipment. Particular attention should be given to supply connections other
than direct connections to the branch circuit (e.g. when using power strips).

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4The SYMKLOUD MS2900 Platform
This chapter describes the main features of the Kontron MS2900 platform. It provides an overview and block diagram of the
product, a list of the platform features, and also covers the mechanical, environmental, and regulatory specifications.
The Kontron SYMKLOUD MS2900 Platform is a fully integrated cloud computing infrastructure platform that uses a modular
hardware and software design to provide excellent performance, energy savings, and ease of system management. The MS2900
platform supports high-availability features such as hot-swappable hubs (for the switch/ShMC), processor nodes, fans, and
power supplies. The platform scales from one to nine processor nodes per system to multiple stacked systems in a cabinet/rack.
The MS2900 platform also includes integrated System Monitor software and specialized management software/firmware for
individual components such as the switch(es), etc. Figure 3 illustrates the flexible integrated features for this cloud computing
solution.
Figure 3: Integrated Software and Hardware Components

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4.1 Feature Summary
Table 1 lists the key features of the MS2900 platform.
For up-to-date details of available Nodes, power supplies and other configurable options, please refer to the Symkloud Ordering
Guide.
Table 1: Key Features
Feature
Description
Hardware Layer
Hardware Platform
Ruggedized modular platform design
2U height, 21 inches deep
Up to nine hot-swappable processor modules
One or two hot-swappable hubs
Up to two hot-swappable rear uplink modules
Redundant management ports
Five hot-swappable fans for front to back
cooling
Dual redundant AC or DC hot-swappable power
supplies
Processor Node options
(for each processor node)
Many configurable options exist across the various Processor
Nodes available for the Symkloud platform (Single- or Dual-CPU,
up to 32GB memory, GbE or 10G backplane Ethernet, on-board
storage, etc.)
See the Ordering Guide for a complete list of available Node
models and options, or refer to the manual of the specific MSP
node for more details.
Power Supplies
two hot-swappable power supply units (AC or DC), 12 VDC
output, 80 PLUS® silver or better efficiency
Fans
Five hot-swappable and redundant fans for uninterrupted front-
to-back cooling
Switching Interface
Up to two hot-swappable MSH8900 hubs
(See the MSH8900 Hub Module User’s Guide for more
information.)
Network Interfaces
High uplink capacity;
4x 10GbE ports, SFP+ (front or rear)
8x 1GbE ports, RJ-45
Management interface
2x 1GbE ports, RJ-45
2x serial port, RJ-45
Software Layer
System Management
System Monitor
Dedicated System Manager
Remote management for diagnostics and AMT provisioning
One-click updates for streamlined maintenance
Switch Management
Integrated BMC with IPMI and KVM
Switch Web GUI
Support
Product life cycle support for 5 –7 years
Compliance/Regulatory
Meets the following environmental, safety, and EMC
requirements:
EN 300 019 (meets)
Telcordia GR-63 (designed to meet)
Telcordia SR-3580 level 3 (designed to meet)
Telcordia GR-1089 (designed to meet)
EN 300 386 (meets)
IEC/EN/CSA/UL 60950-1 (meets) FCC Part 15 (meets)
(**Some limitations may apply, depending on the configuration)

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4.2 Block Diagram
Figure 4 is the block diagram, which shows the internal connections among the components as well as how signals are routed.
Figure 4: MS2900 System Block Diagram
*Dual connectors to the backplane fabric interface have one 10GbE connector and one 1GbE connector each.
4.3 System Components
The modular design of the MS2900 platform makes all of the key system components hot-swappable, whether accessible from
the front or rear external chassis panel.
4.3.1 Chassis Front Panel
Figure 5 shows the features and accessible components on the MS2900 system front panel.

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Figure 5: Front View
Component
Description
1
Management 1GbE RJ-45 port (Switch/ShMC 1)
(Marked “MNGT” on the Hub 1 faceplate)
2
Serial Console RJ-45 port (Switch/ShMC 1)
3
SFP+ stacking port (Switch/ShMC 1)
(Marked ‘’1’’ on the Hub 1 faceplate)
4
10GbE SFP+ uplink port (Switch/ShMC 1)
(Marked ‘’2’’ on the Hub 1 faceplate)
5
Quad GbE RJ-45 ports (Switch/ShMC 1)
(Marked “3”, “4”, “5”, and “6” on the Hub 1 faceplate)
6
Management GbE RJ-45 port (Switch/ShMC 2)
(Marked “MNGT” on the Hub 2 faceplate)
7
Console RJ-45 port (Switch/ShMC 2)
8
SFP+ stacking port (Switch/ShMC 2)
(Marked ‘’1’’ on the Hub 2 faceplate)
9
10GbE SFP+ uplink port (Switch/ShMC 2)
(Marked ‘’2’’ on the Hub 2 faceplate)
10
Quad GbE RJ-45 ports (Switch/ShMC 2)
(Marked “3”, “4”, “5”, and “6” on the Hub 2 faceplate)

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4.3.1 MS2900 Hot-Swappable Components
Table 2: Hot-Swappable Components
ID
Description
Location
Quantity
Hub
MSH8900 hub module
Front
2
Fan
Fan module
Front
5
Hub Uplink
Uplink module
Rear
2
Node
Node module
Rear
9
PSU
Power supply unit
Rear
2
4.3.2 System Control Panel
The control panel is the main health and status interface for the whole platform. Figure 6 shows the features on the control panel.
Figure 6: System Control Panel
Feature
Description
1
Power button
2
Power LED (green)
3
ESD connection
4
Minor alarm LED (amber)
5
Major alarm LED (red)
6
Critical alarm LED (red)
7
Chassis ID LED (blue)
Chassis Power Button functionality

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Current State
Short Press
Long press (>4 seconds)
Power OFF
(Standby)
Chassis is
powered.
PWR Led off and
ID Led ON (Blue)
Power on “Active” and “Stand-By” hub.
PWR Led will start to blink during the transition.
“Active” hub waits 30 seconds for switch to be up
and running.
“Active” Hub sends power on command to all nodes.
Once all nodes and hubs reach the M4 State (power
on) the PWR Led is turned on (green).
Nothing happens
Power ON
Chassis is
powered
PWR Led ON
(green) and ID
Led OFF.
“Active” Hub sends graceful shutdown to all nodes.
PWR Led will start to blink during the transition to the
“Power Off”state.
Wait for all nodes in the chassis to reach the M1
State (power off).*
Send graceful shutdown to “Stand-By” hub.
Perform graceful shutdown of “Active” hub.
Hub sends immediate power off command to all
nodes.
Hub Sends immediate power off to “Stand-By” hub.
Power off “Active” hub.
Once all nodes and hubs reach the M1 State (power
off) the PWR Led is turned off.
Power State
Transition
Nothing happens
Nothing happens
*Note: The node’s BMC waits up to 5 minutes for the OS to shut down the CPU engine before forcing a power off.

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4.3.3 MSH8900 Hub Modules
The MS2900 platform supports two hot-swappable hub modules installed from the front of the chassis. Each Hub modules
includes both a Shelf Manager (ShMC) module and an Ethernet Switch (with 24x GbE + 4x 10GbE and associated PHYs).
The Hub 1 module is installed by default with the system. The Hub 2 module is optional. Adding a second hub gives the platform
the following configurable capabilities:
»ShMC function: active-standby
»Switch function: active-active
Figure 5 shows the locations of the hubs on the front panel and the I/O connections on both Hub 1 and Hub 2 faceplates.
Figure 9, “Rear View” shows the location of the uplink connections on the rear panel of the chassis. The 10GbE uplink ports can
be used for high-speed connections to switch/ShMC Hub 1 and switch/ShMC Hub 2 instead of the front panel 10GbE ports.
The main functions of the hub modules are:
»Chassis shelf manager functions such as fans controls, system monitoring and reporting
»Web interface and IPMI 2.0 management
»Redundancy and hot-swap management
»Power management
»One-click updates
»Stacking support
»Chassis switching functions among all system components
Figure 7 shows the location on the chassis front panel of the hot-swappable hub modules.
Figure 7: Hot-Swappable hub module
NOTE: See the Kontron SYMKLOUD MSH8900 Hub Module User’s Guide on the Kontron web site at http://www.kontron.com/
for detailed information about this subsystem .

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4.3.4 System Fans
There are five hot-swappable system fans on the MS2900 platform. Each fan module consists of a single 60x60x38mm fan, its
housing, lock, and status LED. Figure 8 shows the location of the system fans on the chassis front panel.
For information about cooling and thermal management within the MS2900 platform, see Section 5.2.2, “Cooling and Thermal
Management“.
Figure 8: Hot-Swappable System Fan Module

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4.3.5 Chassis Rear Panel
Figure 9 shows the features and accessible components on the rear panel of the chassis.
Figure 9: Rear View
Feature
Description
1
Rear-Uplink ports (with 2x MSU8900)
- Hub 2 Uplink ports (top): port 1 stacking, port 2 uplink
- Hub 1 Uplink ports (bottom): port 1 stacking, port 2 uplink
2
Up to nine processor subsystem nodes, slots 1 –9
NOTES: 1) Slots 7 and 9 have one 10GbE port, see lines 5 and 6
2) Unpopulated slots ship with blank filler modules
3 & 4
AC or DC power supply unit (PSU 1 & 2)
5 & 6
Slots 7 & 9; with 3x GbE and 1x 10GbE ports

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4.3.6 Processor Nodes
Up to nine processor nodes can be installed in the rear of the chassis. Figure 9, “Rear View”shows the node numbering. Filler
modules are used in all slots that do not have processor nodes installed.
Figure 10 shows a hot-swappable processor node being removed from the chassis rear panel.
Figure 10: Hot-Swappable Processor Nodes
NOTE: See the Kontron SYMKLOUD MSP8000/MSP8001 Processor Node User’s Guide or the MSP8020 Processor Node User’s
Guide on the Kontron web site at www.kontron.com for detailed information about this subsystem .
The MS2900 platform provides one internal 10GbE connection to each slot 7 (from Hub 1) & slot 9 (from Hub 2) (when used with
10G-enabled nodes). See Figure 9, “Rear View”for these slot locations.

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4.3.7 Uplink/Stacking Module
The MS2900 platform provides for two optional uplink/stacking modules, one for each hub, accessible from the rear panel of the
chassis. Figure 11 shows the location of the two slots (one for each hub). If a slot is not used for an uplink module, there is a
blank filler module in the slot.
Figure 11: Hot-Swappable Uplink Module
The key features of the uplink module are:
»Two SFP+ cages
»Status LEDs
»Electrically hot swappable
NOTE: When using optical SFP+ modules in Uplink Modules, the chassis alignment bracket may prevent easily pulling or closing
the SFP+ release clamp. Pulling out the whole Uplink Module to release the SFP+ module is suggested.