Laird WB50NBT User manual

User Guide
WB50NBT
Version 1.0

WB50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
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REVISION HISTORY
Version
Date
Notes
Approver
1.0
29 Mar 2016
Initial Version
Connie Lin

WB50NBT
Hardware Integration Guide
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CONTENTS
Scope ..........................................................................................................................................................................4
Specifications..............................................................................................................................................................4
Absolute Maximum Ratings ...................................................................................................................................9
Recommended Operating Conditions and DC Power Electrical Characteristics....................................................9
Power on Sequence............................................................................................................................................. 10
DC Electrical Characteristics (3.3 V signal level).............................................................................................. 10
Pin Definitions ......................................................................................................................................................... 11
Mechanical Specification......................................................................................................................................... 15
Regulatory ............................................................................................................................................................... 16
Certified Antennas............................................................................................................................................... 16
FCC and IC Regulatory ............................................................................................................................................. 16
FCC....................................................................................................................................................................... 17
Federal Communication Commission Interference Statement....................................................................... 17
End Product Labeling....................................................................................................................................... 18
Manual Information to the End User .............................................................................................................. 18
Industry Canada................................................................................................................................................... 18
Industry Canada Statement............................................................................................................................. 18
Antenna Information....................................................................................................................................... 19
Radiation Exposure Statement........................................................................................................................ 19
Déclaration d'exposition aux radiations.......................................................................................................... 20
End Product Labeling....................................................................................................................................... 20
Plaque signalétique du produit final ............................................................................................................... 20
Manual Information to the End User .............................................................................................................. 20
Manuel d'information à l'utilisateur final........................................................................................................ 21
European Union Regulatory .................................................................................................................................... 21
EU Declarations of Conformity................................................................................................................................ 21
WB50NBT............................................................................................................................................................. 21
Ordering Information .............................................................................................................................................. 22
General Comments.............................................................................................................................................. 22
Labeling Requirements.................................................................................................................................... 23

WB50NBT
Hardware Integration Guide
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wi-fi
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© Copyright 2016 Laird. All Rights Reserved
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SCOPE
This document describes key hardware aspects of the Laird WB50NBT
wireless bridge module. This document is intended to assist device
manufacturers and related parties with the integration of this module
into their host devices. Data in this document are drawn from a number
of sources including data sheets for the Laird SSD50NBT, QUALCOMM
Atheros AR6004, CSR CSR8811, and Atmel ATSAMA5D31A.
Because the LAIRD WB50NBT is currently in development stage, this
document is preliminary and the information in this document is subject
to change. Please contact Laird to obtain the most recent version of this
document –http://ews-support.lairdtech.com.
SPECIFICATIONS
Feature
Description
Physical Interface
Pitch: 0.5 mm
Kyocera (AVX) –P/N: 245046120600829+
Mating part:
Kyocera (AVX) –P/N:145046120640829+
Stacking height = 4.0 mm
Note: See mounting for mating connector options.
Ethernet Interface
(3.3 V signal level)
10/100 Mbps RMII (Reduced Media Independent Interface)
Asynchronous Serial
Port Interfaces
(3.3 V signal level)
Four-wire UART with hardware handshaking (up to 921,600 baud)
Full mode UART with synchronous clock to support USART interface
SPI Interface
(3.3 V signal level)
Five Wire, Master and Slave modes supported with two chip select
USB Interfaces
One USB device port with high speed/full speed/low speed data rates
Two USB host ports with high speed/full speed/low speed data rates
Two Wire Interface
(3.3V signal level)
Two-wire I2C (Inter-IC)
Debug Interface
Two-wire UART (console) for debug purpose
Digital GPIO
(3.3 V signal level)
Six digital General Purpose I/O (GPIO)
PCM interface
13-bit or 16-bit linear, 8-it μ-law or A-law companded sample formats
Antenna Interface
2 Hirose U.FL connectors for Wi-Fi (Main/AUX) and BT (AUX only) separately,
50 ohm
Wi-Fi Interface
Qualcomm Atheros AR6004 2x2 802.11 a/b/g/n on 20/40 MHz bandwidth
Bluetooth Interface
CSR CSR8510 Bluetooth 4.0 dual-mode (EDR+BLE)
Processor Chip Set
Atmel 536 MHz ARM 9, P/N ATSAMA5D31A
Operating System
Embedded Linux, 4.1 kernel

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Feature
Description
Memory
64 MB LPDDR
Storage
128 MB SLC NAND flash
Input Voltage
Requirements
VDD_BU: +3.3 VDC +/-5% (Backup)
VCC3_3: +3.2V (Min) +3.46V (Max)
Note: Voltage ripple must be less than 30 mV.
Current Consumption
Note: These current
consumption
measurements were
taken using Linux kernel
version 4.1.
Note: Standby refers to
the radio operating while
connected to an AP but
not transmitting or
receiving.
Mode
3.3 V
Average Current
Maximum Current
802.11a
Transmit
TBD
TBD
Receive
TBD
TBD
Standby
TBD
TBD
802.11b
Transmit
TBD
TBD
Receive
TBD
TBD
Standby
TBD
TBD
802.11g
Transmit
TBD
TBD
Receive
TBD
TBD
Standby
TBD
TBD
802.11n (2.4 GHz)
Transmit
TBD
TBD
Receive
TBD
TBD
Standby
TBD
TBD
802.11n (5 GHz)
Transmit
TBD
TBD
Receive
TBD
TBD
Standby
TBD
TBD
Sleep
N/A
TBD
TBD
Operating Temperature
-30° to +85°C (-22°F to 185°F)
Operating Humidity
10 to 90% (non-condensing)
Storage Temperature
-30° to 85°C (-22° to 185°F)
Storage Humidity
10 to 90% (non-condensing)
Maximum Electrostatic
Discharge
Conductive 4KV; Air coupled 8KV follow EN61000-4-2
Length/Width/Thickness
47 mm x 37 mm x 4.9 mm
Note: Length, width, and thickness measurements include the metal
shielding.
Weight
TBD g (TBD oz.)

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Feature
Description
Mounting
Connector and through holes.
Refer to Mechanical Specifications for additional information.
Recommended:
Connector:
Pitch: 0.5 mm, 120 pin Kyocera (AVX) P/N:245046120600829+
Mating part:
Kyocera (AVX) P/N:145046120630829+, Stacking height: 3.0 mm
Kyocera (AVX) P/N:145046120635829+, Stacking height: 3.5 mm
Kyocera (AVX) P/N:145046120640829+, Stacking height: 4.0 mm
Kyocera (AVX) P/N:145046120645829+, Stacking height: 4.5 mm
Stand-off for 4.0 mm stacking height:
EMI STOP P/N:F40M20-401126D4BM
http://www.emistop.com; [email protected]om
Wi-Fi Media
Direct Sequence-Spread Spectrum (DSSS)
Complementary Code Keying (CCK)
Orthogonal Frequency Divisional Multiplexing (OFDM)
Wi-Fi Media Access
Protocol
Carrier sense multiple access with collision avoidance (CSMA/CA)
Network Architecture
Infrastructure and ad hoc
Wi-Fi Standards
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n,
802.11r
Wi-Fi Data Rates
Supported
802.11a (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b (DSSS, CCK): 1, 2, 5.5, 11 Mbps
802.11g (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM,HT20,MCS 0-15):
Full Guard Interval: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65, 78, 104, 117 Mbps
Short Guard Interval: 1.2, 14.4, 21.7, 28.9, 29.9, 43.3, 57.8, 65, 72.2, 86.7, 115.6,
130, 144.4 Mbps
Modulation
BPSK @ 1, 6,9, 6.5, 7.2,13 and 14.4 Mbps
QPSK @ 2, 12, 18, 13, 14.4,19.5, 21.7, 26, 28.9, 39,43.3 Mbps
CCK @ 5.5 and 11 Mbps
16-QAM @ 24, 36,26, 29.9,39,43.3,52,57.8,78,86.7 Mbps
64-QAM @ 48,54,52, 57.8, 58.5, 65,72.2,104.0,115.6,117.0,130.0,144.4 Mbps
802.11n Spatial Streams
2X2 MIMO (Multiple Input, Multiple Output)
Regulatory Domain
Support
FCC (Americas, Parts of Asia, and Middle East)
ETSI (Europe, Middle East, Africa, and Parts of Asia)
MIC (Japan) (formerly TELEC)
KC (Korea) (formerly KCC)
2.4 GHz Frequency
Bands
ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.473 GHz
MIC: 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz
2.4 GHz Operating
Channels
ETSI: 13 (3 non-overlapping)
FCC: 11 (3 non-overlapping)
MIC: 14 (4 non-overlapping)
KC: 13 (3 non-overlapping)

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Feature
Description
5 GHz Frequency Bands
ETSI: 5.15 GHz to 5.35 GHz
5.47 GHz to 5.725 GHz
FCC: 5.15 GHz to 5.35 GHz
5.47 GHz to 5.725 GHz
5.725 GHz to 5.825 GHz
MIC: 5.15 GHz to 5.35 GHz
KC: 5.15 GHz to 5.35 GHz
5.725 GHz to 5.825 GHz
5 GHz Operating
Channels
ETSI: 19 non-overlapping
FCC: 25 non-overlapping
MIC: 8 non-overlapping
KC: 12 non-overlapping
Maximum Transmit
Power
Note: Transmit power on
each channels varies
according to individual
country regulations. All
values for lowest data
rate is nominal, +/-2
dBm.
Others are +/-2.5dBm
Note: HT40 –40 Mhz-
wide channels
HT20 –20 MHz-wide
channel
802.11a
6 Mbps
17 dBm (50.1 mW)
54 Mbps
14 dBm (25.1 mW)
802.11b
1 Mbps
17 dBm (50.1 mW)
11 Mbps
17 dBm (50.1 mW)
802.11g
6 Mbps
17 dBm (50.1 mW)
54 Mbps
14 dBm (25.1 mW)
802.11n (2.4 GHz)
6.5 Mbps (MCS0)
17 dBm (50.1 mW)
65 Mbps (MCS7)
13 dBm (20 mW)
802.11n (5 GHz)
6.5 Mbps (MCS0; HT20)
17 dBm (50.1 mW)
65 Mbps (MCS7;HT20)
13 dBm (20 mW)
(MCS0; HT40)
14 dBm (25.1 mW)
(MCS7; HT40)
11 dBm (12.5 mW)
Bluetooth
1 Mbps 6 dBm (3.98 mW)
2 Mbps 6 dBm (3.98 mW)
3 Mbps 3 dBm (1.99 mW)
Typical Receiver
Sensitivity
Note: All values
nominal, +/-3 dBm.
Variant by channels.
802.11a:
6 Mbps
-92 dBm
54 Mbps
-74 dBm (PER <= 10%)
802.11b:
1 Mbps
-94 dBm
11 Mbps
-87 dBm (PER <= 8%)
802.11g:
6 Mbps
-91 dBm
54 Mbps
-74 dBm (PER <= 10%)
802.11n (2.4 GHz)
MCS0 Mbps
-91 dBm
MCS7 Mbps
-71 dBm

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Hardware Integration Guide
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Feature
Description
802.11n (5 GHz HT20)
MCS0 Mbps
MCS7 Mbps
-92 dBm
-71 dBm
Bluetooth:
1 Mbps
-83 dBm (1DH1)
2 Mbps
-75 dBm (3DH5)
3 Mbps
-86 dBm
Security
Standards
Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)
Encryption
Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)
Encryption Key Provisioning
Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic
802.1X Extensible Authentication Protocol Types
EAP-FAST
EAP-TLS
EAP-TTLS
PEAP-GTC
PEAP-MSCHAPv2
PEAP-TLS
LEAP
Compliance
Note: Pursuing MIC
and KC certifications is
currently TBD.
ETSI Regulatory Domain
EN 300 328 (Wi-Fi)
EN 300 328 v1.8.1 (BT 2.1)
EN 301 489-1
EN 301 489-17
EN 301 893
EN 60950-1
EU 2002/95/EC (RoHS)
FCC Regulatory Domain
FCC 15.247 DTS –802.11b/g (Wi-Fi) –2.4 GHz
FCC 15.407 UNII –802.11a (Wi-Fi) –5 GHz
FCC 15.247 DSS –BT 2.1
Industry Canada
RSS-247 –802.11a/b/g/n (Wi-Fi) –2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz
RSS-247 –BT 2.1

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Hardware Integration Guide
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Feature
Description
Certifications
Note: These
certifications are
pending.
Wi-Fi Alliance
802.11a, 802.11b, 802.11g , 802.11n
WPA Enterprise
WPA2 Enterprise
Cisco Compatible Extensions (Version 4)
Warranty
Five Year Limited Lifetime
All specifications are subject to change without notice
Absolute Maximum Ratings
Parameter
Comments
Conditions
Min.
Typ.
Max.
Unit
Input Voltage
3.3V VCC pin
With respect to ground
-0.3
-
3.8
V
I/O pin
-0.3
-
3.8
V
RF input
Maximum RF input from
the antenna port
(reference to 50 ohm)
+10
dBm
Note: Voltage operated over the maximum limit may cause permanent damage to the device. These are
stress ratings only; functional operation of the device at these or any other conditions beyond
those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions and DC Power Electrical Characteristics
Parameter
Comments
Conditions
Min.
Typ.
Max.
Unit
Supply Voltage
VCC3_3/VDD BU
Referred to GND
3.2
3.3
3.46
V
Voltage Ripple
VCC3_3/VDD BU
Referred to GND
-
-
30
mV
Recommend Voltage
Supply Current Rating
VCC3_3
VDD_BU
-
-
2000
10
mA
DC Output Current
I/O pin
3.3 V signal level
-
-
8
mA
Voltage Rise Time
At power on
3.3 V / 3.3 VBU
-
-
0.5
ms
Operating Current
WLAN
sub-system
Continuous receive
-
TBD
-
mA
Continuous transmit
-
TBD
-
Bluetooth
sub-system
Continuous receive
-
TBD
-
mA
Continuous transmit
-
TBD
-
CPU
sub-system
Varies with system
load
-
TBD
-
mA
Operating
Temperature
-30
-
+85
°C

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Power on Sequence
Notes: Apply the 3.3 V (backup and system) at the same time.
The CPU implements the internal POR (Power-On-Reset) and guarantees that the power sources reach
their target values prior to the release of POR.
DC Electrical Characteristics (3.3 V signal level)
I/O
Indicates whether the signal is input or output state.
PU/PD
Indicates whether Pull-Up, Pull-Down, or nothing is enabled.
ST
Indicates if Schmitt Trigger is enabled.
TR
Tri-state
GPIO [1-6]
PIO, I, PU, ST
LED [0-2]
PIO, I, PU, ST
STAT_0; STAT_1
PIO, I, PU, ST
SHDN
O
NRST
I, PU, ST
BINT
I, PU, ST
WKUP
I,PU, ST
DDM; DDP; HDMA; HDPA; HDMB; HDPB
O, PD
E_TXEN; E_TX [0-1]; E_RXER; E_RX [0-1]; E_MDC;
PIO, I, PU, ST
E_MDIO; E_CRSDV; E_REFCK; E_RST_L; E_INT
TBD
BT_PCM_OUT; BT_PCM_IN; BT_PCM_SYNC; BT_PCM_CLK
TBD
XPABIAS50; XPABIAS51; XPABIAS20; XPABIAS21
TBD
AR6004_GPIO38
TBD
LTE_ACTIVE
TBD
LTE_FRAME_SYNC
TBD
WCN_PRIORITY
TBD
Parameter
Conditions
Min.
Typ.
Max.
Unit
VIL
Input Low-Level Voltage
-0.3
-
0.8
V
VIH
Input High-Level Voltage
2.0
-
3.6
V
VOL
Output Low-Level Voltage
-
-
0.4
V
VOH
Output High-Level Voltage
2.9
-
-
V
VHYS
Schmitt trigger Hysteresis
0.34
-
-
V
RPULLUP
Pull-up/Pull-down Resistance
45
100
130
KΩ
IO
Output Current
-
-
8
mA